CN101295652A - Manufacture process method for packaging by soft plate, carrying device for manufacture process - Google Patents
Manufacture process method for packaging by soft plate, carrying device for manufacture process Download PDFInfo
- Publication number
- CN101295652A CN101295652A CNA2007101077231A CN200710107723A CN101295652A CN 101295652 A CN101295652 A CN 101295652A CN A2007101077231 A CNA2007101077231 A CN A2007101077231A CN 200710107723 A CN200710107723 A CN 200710107723A CN 101295652 A CN101295652 A CN 101295652A
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- China
- Prior art keywords
- soft board
- carrier
- manufacturing
- encapsulates
- adhesive tape
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a manufacture process by using a soft plate to carry out sealing and a carrying tool for realizing the manufacture process. Before the soft plate enters a crystal bonding procedure, the carrying tool is mounted in the periphery of the soft plate so as to enhance the intensity of the soft plate; then the soft plate enters a crystal bonding and routing machine platform used for a hard plate to carry out the procedures of crystal bonding and routing; as the machine platform used for the hard plate has a larger acting force like a suction and a pressure than the machine platform for a soft plate, the invention can effectively prevent excursion or damage of the soft plate during the manufacture processes of crystal bonding and routing or deformation of the soft plate during a baking process by pre-mounting the carrying tool on the soft plate.
Description
Technical field
The present invention relates to a kind of encapsulation procedure of using soft board, particularly a kind of encapsulation procedure of using soft board on the hardboard process work bench carries out the manufacturing method thereof of canned program.
Background technology
Many passive components or miniature circuit module are arranged at present,, entered the encapsulation epoch of flat miniaturization as wireless communication module.Printed circuit board (PCB) (hereinafter to be referred as hardboard) that these modules mostly will be thicker or thin soft circuit board (hereinafter to be referred as soft board) cooperate this support plate to carry out semiconductor packages chip, thereby make electronic component product as chip support plate.
In general, hardboard thickness is about more than the 0.3mm, and soft board or thin plate then are respectively 0.2mm or below the 0.12mm.The early stage manufacturer that produces above-mentioned miniaturized electric sub-component can be provided with earlier with a plurality of hardboards 60 and carry out the processing procedure usefulness board 50 of chip 70 encapsulation (as point gum machine, glutinous brilliant machine, wire bonder etc.), as shown in Figure 4, because to the miniaturization that more becomes of the dimensional requirement of electronic building brick, when redevelopment application soft board carries out Chip Packaging, because the thickness of soft board is obviously thinner than the hardboard, if soft board 61 is applied in the board 50 that uses hardboard to encapsulate, can be because active forces such as board suction or pressure be bigger, make when soft board and chip 70 carry out fabrication steps such as a glue or glutinous crystalline substance or routing, skew or damage easily, or when entering apparatus for baking, this soft board Yin Wendu is higher and be out of shape.
With the offset phenomenon, the former distance of two soft boards is D1, behind a glue, glutinous crystalline substance or routing and be offset, with peripheral film distance be D2, can cause the anchor point skew, and glue or chip can't be arranged on the corresponding position, the qualification rate that this method is made product is less than half that make product percent of pass with hardboard.Current, electronic building brick is tending towards miniaturization, and manufacturer mostly still encapsulates with the hardboard board at present, and the low production qualification rate that is if things go on like this caused is that all manufacturers are unwilling to see, therefore must reinvest the board of buying with the soft board encapsulation.But this can reduce the income of manufacturer.Therefore, effectively utilize the board that encapsulates with hardboard at present, will help manufacturer to prolong the service time of board.
Summary of the invention
Main purpose of the present invention provides a kind of processing procedure that soft board encapsulates and carrier of realizing this processing procedure used, and uses the soft board encapsulation on the board that encapsulates with hardboard, and guarantees the high product qualification rate.
In order to achieve the above object, the processing procedure that encapsulates with soft board of the present invention comprises the steps:
At least one soft board and a carrier are provided, and the thickness of each soft board is less than 0.2mm, and a plurality of assemblies district is arranged on each soft board, and each assembly district comprises circuit and chip carrier;
Carrier is combined in the peripheral position top of soft board;
With chip adhesive on the chip carrier of soft board;
Solder joint on the chip is electrically connected step with the soft board circuit;
Soft board is carried out manufacture procedure of adhesive together with chip; And
Corresponding each assembly zone position cuts out a plurality of electronic building bricks.
The carrier of using for the processing procedure of soft board encapsulation of the present invention comprises:
Framework, the centre position of this framework have a middle opening at least, and the bulk of this framework middle opening and soft board mate mutually; And
Adhesive tape, the outside of this thermosetting adhesive tape is bonded in the said frame periphery, and the inner edge that protrudes near the middle opening of said frame.
In the above-mentioned manufacturing method thereof, before soft board is carried out the glutinous brilliant processing procedure of a glue, prepare a carrier, soft board is placed in this carrier, the soft board periphery is combined with this carrier, to strengthen the bulk strength and the weight of soft board, like this, when soft board enters the stronger encapsulation board of pressure or suction, just can avoid the offset orientation point, or damage, or in the baking processing procedure, be out of shape because of board pressure is excessive.Therefore, the present invention can be used to soft board the board that uses hardboard to encapsulate, and can guarantee that product qualification rate reaching is more than 90%.
Description of drawings
The three-dimensional exploded view that Fig. 1 combines with two soft boards for carrier one preferred embodiment of the present invention.
The stereo appearance figure that Fig. 2 combines with two soft boards for carrier of the present invention.
Fig. 3 is processing flow figure of the present invention.
Fig. 4 sticks brilliant offset schematic diagram for the glutinous brilliant board that soft board is used for use hardboard to encapsulate.
Among the figure,
10 carriers, 11 frameworks
111 middle openings, 12 adhesive tapes
121 outside 122 inside
13 location holes, 20 soft boards
21 element regions, 22 circuits
23 wafer holder, 50 hardboards are with sticking brilliant machine
60 hardboards, 61 soft boards
70 wafers
Embodiment
See also Fig. 1, Fig. 1 is carrier 10 first preferred embodiments of the present invention, comprise the framework 11 and the adhesive tape 12 that have a middle opening 111 at least, the outside 121 of this adhesive tape 12 is bonded in framework 11 peripheries, inner 122 then protrude from the edge of this framework 11 near middle openings 111, and these framework middle opening 111 bulks and soft board 20 mate mutually.In the present embodiment, on the one hand, the corresponding respectively rectangle soft board 20 of this framework 11 and adhesive tape 12 has two separate rectangular middle openings 111, and wherein this framework 11 protrudes partly adhesive tape 12 near middle opening 111 positions; Wherein, the material of this framework is copper or metal.On the other hand, for cooperating the board design, the framework of this carrier is provided with location hole 13 and uses for the board location.Again on the one hand, this adhesive tape 12 is bonded in soft board 20 on the framework 11 by mode of heating for the thermosetting adhesive tape.
See also shown in Figure 2ly, Fig. 2 is the stereogram of above-mentioned carrier 10 in conjunction with two correspondingly-sized soft boards 20.Because middle opening 111 couplings of soft board 20 sizes and carrier 10, and soft board 20 peripheries are protruding with partly adhesive tape 12 near middle opening 111, when this carrier 10 is positioned over two parallel when keeping flat on two soft boards 20 that are certain intervals, 12 inner 122 meetings of protrusion adhesive tape are peripheral overlapping with soft board 20, because software 20 peripheries generally do not have circuit or chip carrier, these overlapping software 20 peripheries that make are bonded on this carrier 10 with adhesive tape 12; If use thermosetting adhesive tape 12 then need further heat, just can make the framework 11 of this carrier 10 and two soft boards 20 bonding.
And, the assembly district 21 of a plurality of arranged is arranged on above-mentioned each software 20, each assembly district 21 comprises circuit 22 and chip carrier 23.
Please consult shown in Figure 3ly in conjunction with Fig. 2, Fig. 3 carries out the processing flow figure of Chip Packaging for the present invention with soft board, and this flow process may further comprise the steps:
At least one soft board 20 is provided, and the thickness of each soft board 20 is less than 0.2mm, and comprises a plurality of assemblies district 21 on each soft board, and each assembly district 21 comprises circuit 22 and chip carrier 23;
Carrier 10 is provided;
This carrier 10 is combined on the peripheral position of corresponding soft board 20;
With chip adhesive on the chip carrier of soft board;
Solder joint on the chip and soft board circuit are carried out the routing Connection Step;
Soft board is carried out manufacture procedure of adhesive together with chip; And
Corresponding each assembly zone position cuts out a plurality of electronic building bricks.
Above-mentionedly may further comprise the steps in conjunction with carrier 10 and soft board 20:
As shown in the above description, the present invention is before the some glue of soft board and chips incorporate, glutinous brilliant processing procedure, prepare a carrier, carrier is combined with the soft board peripheral position downwards, make this soft board strengthen bulk strength and weight by this carrier, when the soft board that combines carrier enters the stronger encapsulation board of pressure or suction, can avoid soft board offset orientation point, or damage because of board pressure is excessive.Therefore, carrier provided by the invention and the manufacturing method thereof that utilizes this carrier help to make the processing procedure qualification rate to reach more than 90% on the board that soft board is used to use hardboard to encapsulate the time really.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. manufacturing method thereof that encapsulates with soft board, this method comprises the steps:
At least one soft board and a carrier are provided, and the thickness of each soft board is less than 0.2mm, and a plurality of assemblies district is arranged on each soft board, and each assembly district comprises circuit and chip carrier;
Carrier is combined in the peripheral position top of soft board;
With chip adhesive on the chip carrier of soft board;
Solder joint on the chip is electrically connected step with the soft board circuit;
Soft board is carried out manufacture procedure of adhesive together with chip; And
Corresponding each assembly zone position cuts out a plurality of electronic building bricks.
2. the manufacturing method thereof that encapsulates with soft board as claimed in claim 1 is characterized in that, in conjunction with carrier and soft board step, with adhesive tape soft board is adhered on the carrier.
3. the manufacturing method thereof that encapsulates with soft board as claimed in claim 1 is characterized in that, in conjunction with carrier and soft board step, at carrier and the bonding thermosetting adhesive tape of soft board joint, to this thermosetting adhesive tape heating, carrier is connected with soft board then.
4. as claim 1, the 2 or 3 described manufacturing method thereofs that encapsulate with soft board, it is characterized in that, in above-mentioned electrical connection step, the solder joint on the chip is electrically connected with corresponding line by the routing processing procedure.
5. carrier that the manufacturing method thereof that encapsulates with soft board is used comprises:
Framework, the centre position of this framework have a middle opening at least, and the bulk of this framework middle opening and soft board mate mutually; And
Adhesive tape, the outside of this thermosetting adhesive tape is bonded in the said frame periphery, and the inner edge that protrudes near the middle opening of said frame.
6. the carrier of using as the manufacturing method thereof that encapsulates with soft board as described in the claim 5 is characterized in that this framework comprises two independent middle openings.
7. the carrier of using as the manufacturing method thereof that encapsulates with soft board as described in claim 5 or 6 is characterized in that a plurality of location holes are arranged on the described framework.
8. the carrier of using as the manufacturing method thereof that encapsulates with soft board as described in the claim 5 is characterized in that described soft board and middle opening are rectangular.
9. the carrier of using as the manufacturing method thereof that encapsulates with soft board as described in claim 5 or 6 is characterized in that described adhesive tape is the thermosetting adhesive tape.
10. the carrier of using as the manufacturing method thereof that encapsulates with soft board as described in the claim 9 is characterized in that described soft board and middle opening are rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101077231A CN101295652A (en) | 2007-04-28 | 2007-04-28 | Manufacture process method for packaging by soft plate, carrying device for manufacture process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101077231A CN101295652A (en) | 2007-04-28 | 2007-04-28 | Manufacture process method for packaging by soft plate, carrying device for manufacture process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101295652A true CN101295652A (en) | 2008-10-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101077231A Pending CN101295652A (en) | 2007-04-28 | 2007-04-28 | Manufacture process method for packaging by soft plate, carrying device for manufacture process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101295652A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039329A (en) * | 2017-03-22 | 2017-08-11 | 上海凯虹科技电子有限公司 | For the method for packing and packaging body of the small-sized package body of thin substrate |
-
2007
- 2007-04-28 CN CNA2007101077231A patent/CN101295652A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039329A (en) * | 2017-03-22 | 2017-08-11 | 上海凯虹科技电子有限公司 | For the method for packing and packaging body of the small-sized package body of thin substrate |
| CN107039329B (en) * | 2017-03-22 | 2019-12-17 | 上海凯虹科技电子有限公司 | packaging method of small-size package body for thin substrate and package body |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |