CN101295108A

CN101295108A - Soft roasting method

Info

Publication number: CN101295108A
Application number: CNA200810098497XA
Authority: CN
Inventors: 黄郁升; 童元鸿; 戴嘉萱; 杉浦规生
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2008-05-28
Filing date: 2008-05-28
Publication date: 2008-10-29
Anticipated expiration: 2028-05-28
Also published as: CN101295108B

Abstract

The invention relates to a soft baking method which comprises the following steps: a substrate is heated by a heating plate, wherein, the heating plate is provided with at least one thimble for supporting the substrate; when the substrate is heated, the position where the thimble supports the substrate is changed. In the invention, the position where the thimble supports the substrate is changed when heating is carried out, and the thimble is not contacted with the same position of the glass substrate for a long time; therefore, the problem of uneven film thickness after drying caused by overhigh local temperature on the glass substrate can be avoided.

Description

Soft roasting method

Technical field

The invention relates to a kind of processing procedure of flat-panel screens, and particularly relevant for a kind of soft roasting method that is applied to make flat-panel screens.

Background technology

In LCD, alignment film is one of key element of control display quality.Alignment film generally is on the pixel electrode, in order to the orientation of control liquid crystal molecule, and provides the tilt angle (pretilt angle) of required liquid crystal molecule.

The manufacturing of tradition alignment film is to adopt the roller printing technology, and so-called roller printing technology utilizes roller that orientation liquid is coated on the glass substrate exactly, and then dries the solvent in the orientation liquid, to solidify to form alignment film.The roller maintenance is difficult for, orientation liquid expends problems such as too much but this roller printing technology has, and therefore relevant industry replaces traditional roller printing technology with ink-jet printing technology gradually.

Ink-jet printing technology utilizes ink gun and nozzle that orientation liquid is sprayed on the glass substrate exactly, and heat drying forms alignment film again.Yet the employed orientation liquid of ink-jet printing technology viscosity is lower, therefore usually can produce the phenomenon of uneven thickness behind heat drying.The main cause of this phenomenon is: the non-uniform temperature that the fabricator is applied when heat drying make the orientation liquid of subregion be dried to alignment film, but other parts is still liquid situation.Replenish those dry zones because these liquid orientation liquid can flow spontaneously, therefore often allow the alignment film of high-temperature area blocked up after drying.Because the phenomenon of this uneven thickness can seriously undermine the display quality of LCD, the fabricator of therefore relevant industry there's no one who doesn't or isn't is devoted to address this problem.

Summary of the invention

The object of the present invention is to provide a kind of soft roasting method, it is in heated substrates, and the position of thimble supporting substrate can change to some extent, to avoid the producing too high phenomenon of local temperature on the substrate.

The object of the present invention is achieved like this, and a kind of soft roasting method comprises the following step: with the heating plate heated substrates.Wherein, above-mentioned heating plate has at least one thimble supporting substrate.In addition, in heated substrates, the position of thimble supporting substrate can change to some extent.

From the above mentioned, the position of thimble support glass substrate can change when heating to some extent among the present invention, and therefore same position that can the Long contact time glass substrate can effectively avoid the problem of the dry caudacoria thickness ununiformity that causes because of local temperature is too high on the glass substrate.

Description of drawings

Figure 1A-1D illustrates the synoptic diagram according to the soft roasting method of one embodiment of the invention.

Fig. 2 A-2C illustrates the synoptic diagram according to the soft roasting method of another embodiment of the present invention.

Fig. 3 A-3D illustrates the synoptic diagram according to the soft roasting method of yet another embodiment of the invention.

Drawing reference numeral:

110: glass substrate

120: orientation liquid

130: thimble

140: lifting mechanism

A: arrow

P: point

Embodiment

General soft roasting method is to come heated substrates with heating plate mostly, and the wet film on the dry solidification substrate thus.And for the position of fixing base in heating process, need be provided with a plurality of thimbles mostly on the general heating plate and come supporting substrate.Yet because these thimbles can be directly conducted to the heat that heating plate produced on the substrate, so substrate and thimble position contacting tend to have higher temperature than other zone.By above-mentioned prior art as can be known, the phenomenon of this temperature inequality will cause dry back to produce the problem of thickness inequality.Therefore, the following embodiment of the present invention will disclose a kind of soft roasting method, and it is in heated substrates, and the position of thimble supporting substrate can change to some extent, to avoid the producing too high phenomenon of local temperature on the substrate.

The present invention is a kind of soft roasting method, and this method comprises the following step:

(1) with the heating plate heated substrates, wherein heating plate has at least one thimble supporting substrate.

(2) in heated substrates, change the position of thimble supporting substrate.

Below will how specifically to implement above-mentioned step (2) for three embodiment explanations.In following three embodiment, substrate for example can be the glass substrate that is coated with orientation liquid, the semiconductor substrate that is coated with photoresistance or other is coated with the substrate that wet film needs heat drying.Below explanation is to be example with the glass substrate 110 (shown in Figure 1A-3D) that is coated with orientation liquid 120, to clearly demonstrate embodiments of the invention.

Embodiment 1

Figure 1A-1D illustrates the synoptic diagram according to the soft roasting method of one embodiment of the invention.As shown in the figure, the user can coat orientation liquid 120 on the glass substrate 110 earlier, and then this glass substrate 110 is placed on the thimble 130 of heating plate, and utilize heating plate glass substrate 110 (illustrating) as Figure 1A, make that orientation liquid 120 dry solidifications on the glass substrate 110 become alignment film.When glass substrate 110, the user can change the position (some P) of thimble 130 support glass substrates 110 in good time, to avoid the orientation liquid 120 on the P dry too fast, causes dried alignment film uneven thickness.

Particularly, the user can utilize lifting mechanism 140 that glass substrate 110 is lifted away from thimble 130 (illustrating as Figure 1B) earlier in glass substrate 110.Then, change the relative position (illustrating) of glass substrate 110 and thimble 130, and then glass substrate 110 put back on the thimble 130 (illustrate) as Fig. 1 D as Fig. 1 C.By Fig. 1 D as can be seen, this moment, the position of thimble 130 support glass substrates 110 changed, and no longer was some P originally.

Though in Figure 1B and Fig. 1 C, the user is the position of thimble 130 fixedly, and move glass substrate 110 according to the direction of arrow A simultaneously, but this does not limit the present invention, the user also can select the position of fixing glass substrate, and mobile simultaneously thimble, changes as long as relative position between the two produces.

Embodiment 2

Fig. 2 A-2C illustrates the synoptic diagram according to the soft roasting method of another embodiment of the present invention.Similarly, the user can coat orientation liquid 120 on the glass substrate 110 earlier, and then this glass substrate 110 is placed on the thimble 130 of heating plate, and utilize heating plate glass substrate 110 (illustrating) as Fig. 2 A, make that orientation liquid 120 dry solidifications on the glass substrate 110 become alignment film.The difference of present embodiment and embodiment 1 is: (that is to say because the section shape of the thimble 130 of present embodiment presents the structure of similar zigzag, the root of thimble 130 is to be positioned on the different Z-axises with the top), therefore the user can change the position of thimble 130 support glass substrates 110 by the mode of rotating thimble 130.

Particularly, the user can utilize lifting mechanism 140 that glass substrate 110 is lifted away from thimble 130 (illustrating as Fig. 2 B) earlier in glass substrate 110.Then, the position of fixing glass substrate 110, and rotate thimble 130 simultaneously, make relative position between the two produce change (illustrating) as Fig. 2 C.Then, glass substrate 110 is put back on the thimble 130.By Fig. 2 C as can be seen, because the relative position of thimble 130 and glass substrate 110 changes, so the position of thimble 130 support glass substrates 110 will change to some extent, and can not be some P originally again.

Embodiment 3

Fig. 3 A-3D illustrates the synoptic diagram according to the soft roasting method of yet another embodiment of the invention.The difference of a present embodiment and a last embodiment is: thimble 130 quantity on the heating plate of present embodiment are a plurality of, these thimbles 130 will take turns support glass substrate 110 (illustrating as Fig. 3 A-3D), to avoid thimble 130 Long contact time glass substrates 110, cause the local temperature on the glass substrate 110 too high.

Particularly, the thimble 130 of Fig. 3 A-3D is in quaternate mode, does simple harmonic motion along the direction of vertical glass substrate 110, and wherein thimble 130 on the same group has 90 ° phase differential to each other, that is to say that those thimbles 130 are to contact with glass substrate 110 in regular turn.Should be appreciated that, more than the embodiment lifted only be illustration, be not in order to restriction the present invention, those who are familiar with this art should look the mode of motion that elasticity of demand is at that time selected thimble 130.For instance, when thimble changes when doing simple harmonic motion in the mode of N a group, phase differential each other then can be 360 °/N.

Comprehensive above three embodiment, because the position of thimble 130 support glass substrates 110 can change when heating to some extent, and same position that can Long contact time glass substrate 110, therefore can effectively avoid on the glass substrate 110 because of the too high problem that causes of local temperature, for example: dried thickness inequality.

In addition, in an embodiment of the present invention, it for example is in 20 seconds that the time of thimble 130 lasting contact glass substrates 110 can be controlled at.In other words, surpass 20 seconds in case thimble 130 continues the time of contact glass substrate 110, the user will change the position of thimble 130 support glass substrates 110, produces the too high phenomenon of temperature with the zone of avoiding glass substrate 110 to contact with thimble 130.Should be appreciated that, more than the time parameter lifted all only be illustration, be not in order to restriction the present invention, those who are familiar with this art should look at that time elasticity of demand and select its embodiment.

Though the present invention discloses with specific embodiment; but it is not in order to limit the present invention; any those skilled in the art; the displacement of the equivalent assemblies of under the prerequisite that does not break away from design of the present invention and scope, having done; or, all should still belong to the category that this patent is contained according to equivalent variations and modification that scope of patent protection of the present invention is done.

Claims

1. soft roasting method, this method comprises the following step:

Heat a substrate with a heating plate, wherein this heating plate has at least one thimble and supports this substrate;

In this substrate of heating, change the position that this thimble supports this substrate.

2. soft roasting method as claimed in claim 1 is characterized in that: change the step that this thimble supports the position of this substrate and comprise:

This substrate is lifted away from this thimble;

After this substrate is lifted away from this thimble, change the relative position of this substrate and this thimble;

Behind the relative position that changes this substrate and this thimble, this substrate is put back on this thimble.

3. soft roasting method as claimed in claim 2 is characterized in that: the step that changes the relative position of this substrate and this thimble comprises:

Fix the position of this thimble, and move this substrate simultaneously.

4. soft roasting method as claimed in claim 2 is characterized in that: the step that changes the relative position of this substrate and this thimble comprises:

Fix the position of this substrate, and move or rotate this thimble simultaneously.

5. soft roasting method as claimed in claim 4 is characterized in that: the root of this thimble is to be positioned on the different Z-axises with the top.

6. soft roasting method as claimed in claim 1 is characterized in that: the quantity of this thimble is a plurality of.

7. soft roasting method as claimed in claim 6 is characterized in that: change the step that this thimble supports the position of this substrate and comprise:

Support this substrate with those thimbles in turn.

8. soft roasting method as claimed in claim 7 is characterized in that: each those thimble is all done simple harmonic motion along the direction of vertical this substrate.