CN101280169A - High temperature-resistant organosilicon contact adhesive - Google Patents
High temperature-resistant organosilicon contact adhesive Download PDFInfo
- Publication number
- CN101280169A CN101280169A CNA2008100975627A CN200810097562A CN101280169A CN 101280169 A CN101280169 A CN 101280169A CN A2008100975627 A CNA2008100975627 A CN A2008100975627A CN 200810097562 A CN200810097562 A CN 200810097562A CN 101280169 A CN101280169 A CN 101280169A
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- China
- Prior art keywords
- high temperature
- contact adhesive
- resistant organosilicon
- organosilicon contact
- silicon rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses silicone high temperature resistant pressure-sensitive adhesive which is prepared by the compositions of TMQ resin, silicon rubber, organic solvent, strong base-weak acid salt, fumed silica and polymerization inhibitor. The silicone high temperature resistant pressure-sensitive adhesive has the advantages of good high temperature resistance and enduring the high temperature of 280 DEG C to 300 DEG C.
Description
Technical field:
The present invention relates to a kind of pressure sensitive adhesive.
Background technology:
Organic pressure-sensitive gel is mainly used in Kapton, U.S. line paper, makes Pressuresensitive Tape.Adhesive tape has fabulous high thermal resistance, electrical insulating property, anti-chemical, and nontoxic, free from extraneous odour, to human body and environmentally friendly.The organic silicon polyimide film adhesive tape that temperature resistant grade is the highest in the market is 200 ℃ (long term operation temperature), and the short-term ultimate temperature is 260 ℃.
In the field that PCB mobile phone and various electronic apparatus and C level electric insulation are used, use temperature reaches 300 ℃, and common organic pressure-sensitive gel band has not satisfied requirement.
Summary of the invention:
The object of the present invention is to provide a kind of can resistant to elevated temperatures high temperature-resistant organosilicon contact adhesive.
Technical solution of the present invention is:
A kind of high temperature-resistant organosilicon contact adhesive is characterized in that: made by following component in percentage by weight:
TMQ resin 15～30%
Silicon rubber 25～40%
Organic solvent 25～45%
Strong base-weak acid salt 0.002～0.005%
Gas-phase silica 5～10%
Stopper 0.01～0.3%.
Silicon rubber is that molecular weight is the phenyl siloxane rubber of 20-80 ten thousand, and phenyl content is 5-15%.Organic solvent is toluene or dimethylbenzene.Strong base-weak acid salt is sodium-acetate or sodium formiate.
The TMQ resin is that cage modle contains phenyl polysiloxane.
Resistance to elevated temperatures of the present invention is good, can anti-280-300 ℃ high temperature.
The invention will be further described below in conjunction with embodiment.
Embodiment:
Embodiment 1:
Get the 250mL three-necked flask, add toluene 40g, TMQ15g, silicon rubber 45g loads onto stirring, thermometer and reflux condensing tube, opens stirring, add sodium-acetate 0.005g, reflux 8 hours, 115 ℃ of temperature, add 1 of stopper (0.05g), stirred 20 minutes, and added gas-phase silica 10g, solid content to 50% is regulated in the back that stirs, cool off high temperature-resistant organosilicon contact adhesive, standby.Time spent adds solidifying agent dibenzoyl peroxide 0.40g, stirs, and is coated on the Kapton with coating machine, 80 ℃ of bakings 3 minutes, forms in 150 ℃ of bakings curing in 2 minutes.
Wherein silicon rubber is that molecular weight is the phenyl siloxane rubber of 20-80 ten thousand, and phenyl content is 5-15%.
Embodiment 2:
Get the 250mL three-necked flask, add toluene 40g, TMQ20g, silicon rubber 40g loads onto stirring, thermometer and reflux condensing tube, opens stirring, add sodium-acetate 0.010g, reflux 8 hours, 115 ℃ of temperature add 2 of stoppers (0.1g), stirred 20 minutes, add gas-phase silica 5g, solid content to 50% is regulated in the back that stirs, and cools off standby.Time spent adds dibenzoyl peroxide 0.40g, stirs, and is coated on the Kapton with coating machine, 80 ℃ of bakings 3 minutes, forms in 150 ℃ of bakings curing in 2 minutes.
Embodiment 3:
Get the 250mL three-necked flask, add dimethylbenzene 40g, TMQ25g, silicon rubber 35g loads onto stirring, thermometer and reflux condensing tube, opens stirring, add sodium formiate 0.015g, reflux 8 hours, 115 ℃ of temperature add 1 of stopper, stirred 20 minutes, add gas-phase silica 5g, solid content to 50% is regulated in the back that stirs, and cools off standby.Time spent adds solidifying agent 2, and 4-dichlorobenzoperoxide 0.40g stirs, and is coated on the Kapton with coating machine, 80 ℃ of bakings 3 minutes, forms in 150 ℃ of bakings curing in 2 minutes.
Claims (4)
1, a kind of high temperature-resistant organosilicon contact adhesive is characterized in that: made by following component in percentage by weight:
TMQ resin 15～30%
Silicon rubber 25～40%
Organic solvent 25～45%
Strong base-weak acid salt 0.002～0.005%
Gas-phase silica 5～10%
Stopper 0.01～0.3%.
2, high temperature-resistant organosilicon contact adhesive according to claim 1 is characterized in that: silicon rubber is that molecular weight is the phenyl siloxane rubber of 20-80 ten thousand, and phenyl content is 5-15%.
3, high temperature-resistant organosilicon contact adhesive according to claim 1 and 2 is characterized in that: organic solvent is toluene or dimethylbenzene.
4, high temperature-resistant organosilicon contact adhesive according to claim 1 and 2 is characterized in that: strong base-weak acid salt is sodium-acetate or sodium formiate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100975627A CN101280169A (en) | 2008-05-16 | 2008-05-16 | High temperature-resistant organosilicon contact adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100975627A CN101280169A (en) | 2008-05-16 | 2008-05-16 | High temperature-resistant organosilicon contact adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101280169A true CN101280169A (en) | 2008-10-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100975627A Pending CN101280169A (en) | 2008-05-16 | 2008-05-16 | High temperature-resistant organosilicon contact adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101280169A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103009734A (en) * | 2012-12-11 | 2013-04-03 | 宁波大榭开发区综研化学有限公司 | High-temperature resistant protecting film of electronic circuit board |
| CN107629706A (en) * | 2016-07-14 | 2018-01-26 | 昆山汉品电子有限公司 | Silica gel glued membrane, silica gel film structure and silica gel glue film manufacturing process |
| CN107629717A (en) * | 2016-07-14 | 2018-01-26 | 昆山汉品电子有限公司 | Electric silica gel glued membrane, electric silica gel film structure and preparation method |
| CN108276928A (en) * | 2018-02-09 | 2018-07-13 | 佛山凯仁精密材料有限公司 | A kind of silicone protective film of noresidue and preparation method thereof |
| CN115678453A (en) * | 2022-10-31 | 2023-02-03 | 福建友谊胶粘带集团有限公司 | Preparation process of masking tape for painting |
-
2008
- 2008-05-16 CN CNA2008100975627A patent/CN101280169A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103009734A (en) * | 2012-12-11 | 2013-04-03 | 宁波大榭开发区综研化学有限公司 | High-temperature resistant protecting film of electronic circuit board |
| CN107629706A (en) * | 2016-07-14 | 2018-01-26 | 昆山汉品电子有限公司 | Silica gel glued membrane, silica gel film structure and silica gel glue film manufacturing process |
| CN107629717A (en) * | 2016-07-14 | 2018-01-26 | 昆山汉品电子有限公司 | Electric silica gel glued membrane, electric silica gel film structure and preparation method |
| CN108276928A (en) * | 2018-02-09 | 2018-07-13 | 佛山凯仁精密材料有限公司 | A kind of silicone protective film of noresidue and preparation method thereof |
| CN108276928B (en) * | 2018-02-09 | 2021-09-17 | 佛山凯仁精密材料有限公司 | Residue-free silica gel protective film and preparation method thereof |
| CN115678453A (en) * | 2022-10-31 | 2023-02-03 | 福建友谊胶粘带集团有限公司 | Preparation process of masking tape for painting |
| CN115678453B (en) * | 2022-10-31 | 2024-02-27 | 福建友谊胶粘带集团有限公司 | Preparation process of masking tape for spray painting shielding |
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Open date: 20081008 |