CN101280110B - Non-dissolvent environment-friendly silicon resin for mica tape - Google Patents

Non-dissolvent environment-friendly silicon resin for mica tape Download PDF

Info

Publication number
CN101280110B
CN101280110B CN2008100975631A CN200810097563A CN101280110B CN 101280110 B CN101280110 B CN 101280110B CN 2008100975631 A CN2008100975631 A CN 2008100975631A CN 200810097563 A CN200810097563 A CN 200810097563A CN 101280110 B CN101280110 B CN 101280110B
Authority
CN
China
Prior art keywords
mica tape
environment
dissolvent
silicon resin
silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008100975631A
Other languages
Chinese (zh)
Other versions
CN101280110A (en
Inventor
卢儒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengda Technology (nantong) Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2008100975631A priority Critical patent/CN101280110B/en
Publication of CN101280110A publication Critical patent/CN101280110A/en
Application granted granted Critical
Publication of CN101280110B publication Critical patent/CN101280110B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a solvent-free environment-friendly silicone special for mica tape, which is made from liquid silicone, silicone rubber, organic solvent and strong base weak acid salt. The solvent-free environment-friendly silicone of the invention has reasonable components, good cohesiveness, good holding power, good pliability, anti-adhesive performance, non-after tack, non-moisture absorption, and non-carbon formation in burning.

Description

Non-dissolvent environment-friendly silicon resin for mica tape
Technical field:
The present invention relates to a kind of silicone resin.
Background technology:
Fire-resistant isinglass belt uses tackiness agent all to be base growth with organic pressure-sensitive gel at present, has electrical insulating property, resistant of high or low temperature etc., mainly comes from import.The shortcoming that exists be dry and comfortable property poor, return sticking, the moisture absorption, solvent etc. arranged.
Summary of the invention:
The object of the present invention is to provide a kind of dry and comfortable, flexibility good, the non-dissolvent environment-friendly silicon resin for mica tape of environmental protection.
Technical solution of the present invention is:
A kind of non-dissolvent environment-friendly silicon resin for mica tape is characterized in that: processed by following component in percentage by weight:
Liquid silicone 10~30%
Zylox 30~50%
Organic solvent 20~45%
Strong base-weak acid salt 0.005~0.02%.
Zylox is liquid or semi-fluid, viscosity 200-5000Pa.s.
Strong base-weak acid salt is sodium-acetate or sodium formiate.
Component of the present invention is reasonable, and cohesiveness is good, hold that viscous force is good, flexibility is good, dry and comfortable, it is sticking, nonhygroscopic not return, and charcoal is not analysed in burning.
Below in conjunction with embodiment the present invention is described further.
Embodiment:
Embodiment 1:
Get the 250ML three-necked flask, add organic solvent toluene (or YLENE) 40 grams, silicone resin 10g, Zylox 50g, load onto stirring, TM and reflux condensing tube, open stirring, add sodium-acetate 0.005g, reflux 6 hours, 112 ℃ of temperature.Add 1 of stopper, stirred 20 minutes, steam toluene under the decompression, get solvent-free liquid resin, cool off subsequent use.Time spent adds BPO 0.48g, stirs, and is coated on the mica tape back 80 ℃ of bakings 3 minutes, solidifies in 3 minutes 150 ℃ of bakings to form.Solidifying agent is organo-peroxide BPO or 2,4-dichlorobenzoperoxide etc.Zylox is liquid or semi-fluid, viscosity 200-5000Pa.s.Strong base-weak acid salt is sodium-acetate or sodium formiate.
Embodiment 2:
Get the 250ML three-necked flask, add toluene 40 grams, liquid silicone 20g, Zylox 40g, load onto stirring, TM and reflux condensing tube, open stirring, add sodium-acetate 0.010g, reflux 6 hours, 112 ℃ of temperature.Add 2 of stoppers, stirred 20 minutes, steam toluene under the decompression, get solvent-free liquid resin, cool off subsequent use.Time spent adds BPO 0.48g, stirs, and is coated on the mica tape back 80 ℃ of bakings 3 minutes, solidifies in 3 minutes 150 ℃ of bakings to form.All the other are with embodiment 1.
Embodiment 3:
Get the 250ML three-necked flask, add toluene 40 grams, liquid silicone 25g, Zylox 35g, load onto stirring, TM and reflux condensing tube, open stirring, add sodium-acetate 0.015g, reflux 6 hours, 112 ℃ of temperature.Add 2 of stoppers, stirred 20 minutes, steam toluene under the decompression, get solvent-free liquid resin, cool off subsequent use.Time spent adds BPO 0.48g, stirs, and is coated on the mica tape back 80 ℃ of bakings 3 minutes, solidifies in 3 minutes 150 ℃ of bakings to form.All the other are with embodiment 3.

Claims (2)

1. non-dissolvent environment-friendly silicon resin for mica tape is characterized in that: processed by following component in percentage by weight:
Liquid silicone 10~30%
Zylox 30~50%
Organic solvent 20~45%
Sodium formiate 0.005~0.02%.
2. non-dissolvent environment-friendly silicon resin for mica tape according to claim 1 is characterized in that: Zylox is liquid or semi-fluid, viscosity 200-5000Pa.s.
CN2008100975631A 2008-05-16 2008-05-16 Non-dissolvent environment-friendly silicon resin for mica tape Expired - Fee Related CN101280110B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008100975631A CN101280110B (en) 2008-05-16 2008-05-16 Non-dissolvent environment-friendly silicon resin for mica tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008100975631A CN101280110B (en) 2008-05-16 2008-05-16 Non-dissolvent environment-friendly silicon resin for mica tape

Publications (2)

Publication Number Publication Date
CN101280110A CN101280110A (en) 2008-10-08
CN101280110B true CN101280110B (en) 2012-04-25

Family

ID=40012789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100975631A Expired - Fee Related CN101280110B (en) 2008-05-16 2008-05-16 Non-dissolvent environment-friendly silicon resin for mica tape

Country Status (1)

Country Link
CN (1) CN101280110B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103627337B (en) * 2013-05-14 2016-08-17 苏州邦立达新材料有限公司 A kind of thermohardening type is without impression silicone pressure sensitive adhesive tape and preparation method thereof
CN103440903B (en) * 2013-08-16 2015-12-02 卢儒 A kind of nuclear power machine mica tape silicon resin composition and uses thereof
CN103484055B (en) * 2013-08-16 2014-12-10 卢儒 Silicone resin composition for nuclear generator mica tapes, and preparation method and application thereof
CN106710700A (en) * 2016-12-18 2017-05-24 湖北平安电工材料有限公司 After-tack prevention high voltage withstanding mica tape

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101157844A (en) * 2007-09-20 2008-04-09 卢儒 Special organosilicon adhesive for fire-resistant isinglass belt and production method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101157844A (en) * 2007-09-20 2008-04-09 卢儒 Special organosilicon adhesive for fire-resistant isinglass belt and production method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
陆宪良等.有机硅胶粘剂在耐火云母带中的应用.《华东理工大学学报》.1997,第23卷(第04期),472-476. *
高群等.有机硅粘合剂在耐火云母带上的应用.《中国胶粘剂》.2003,第12卷(第05期),56-60. *

Also Published As

Publication number Publication date
CN101280110A (en) 2008-10-08

Similar Documents

Publication Publication Date Title
CN108410397B (en) Organic silicon modified high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof
CN101280110B (en) Non-dissolvent environment-friendly silicon resin for mica tape
CN103497725B (en) Preparation method of wet curing reaction-type polyurethane hot melt adhesive for textile
CN103030976A (en) Single-component heat-curing liquid silicone rubber and preparation method thereof
CN105199623A (en) Double-component addition type anti-sedimentation conductive silicone rubber and preparation method thereof
CN108865053A (en) A kind of high-low temperature resistant conduction organic pressure-sensitive gel and the preparation method and application thereof
CN102321444B (en) Heat-conducting acrylic pressure-sensitive adhesive composition and acrylic heat-conducting patch
CN101319042A (en) Low-viscosity cardanol solidifying agent of epoxy resin and preparation method thereof
CN103525332B (en) A kind of orange cold foil tackiness agent and application thereof
CN102775942A (en) Fluoroacrylate pressure sensitive adhesive, and preparation method thereof
CN104559819A (en) High-performance nano carbon cooling composite material
CN103146341A (en) Two-component high-adhesion room temperature organic silicon rubber
CN103305179A (en) Preparation method of hydrosilylation/free radical dual-crosslinking organic silicon pressure-sensitive adhesive
CN101157844B (en) Special organosilicon adhesive for fire-resistant isinglass belt and production method
US20020013386A1 (en) Silicone-based pressure-sensitive adhesive composition
CN103396746B (en) A kind of high-performance water-based pressure sensitive adhesive and preparation method thereof
CN105131859A (en) Silicone composite sheet with surface tackiness
CN105315903A (en) High-temperature-resistant acrylate pressure-sensitive adhesive and preparing method thereof
CN103484055B (en) Silicone resin composition for nuclear generator mica tapes, and preparation method and application thereof
CN101280169A (en) High temperature-resistant organosilicon contact adhesive
CN103351805B (en) A kind of heat radiation coating for LED and preparation method thereof
CN105017986A (en) Scratch-resistant ultrathin printable single-sided adhesive, and preparation method and application thereof
US11359111B2 (en) Thermally conductive thin-film cured product, method for producing same, and thermally conductive member
CN103980857B (en) Adhesion type silicone grease composition and preparation method thereof
CN100513500C (en) Self-curing polyurethane insulating varnish and its production

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20081008

Assignee: Jiangsu Shengda Yuantong new Mstar Technology Ltd

Assignor: Lu Ru

Contract record no.: 2013990000126

Denomination of invention: Non-dissolvent environment-friendly silicon resin for mica tape

Granted publication date: 20120425

License type: Exclusive License

Record date: 20130328

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160616

Address after: 226017 Jiangsu city of Nantong Province Economic and Technological Development Zone Road, No. 31.

Patentee after: Shengda Technology (Nantong) Co., Ltd.

Address before: 214000 Wuxi Sheng Da Science and Technology Co., Ltd., No. 15, Feng Feng Road, Mei Cun Industrial Park, Wuxi New District, Jiangsu, China

Patentee before: Lu Ru

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120425

Termination date: 20210516

CF01 Termination of patent right due to non-payment of annual fee