CN101276670B - Surface adhesion type magnetic element - Google Patents
Surface adhesion type magnetic element Download PDFInfo
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- CN101276670B CN101276670B CN200710089086XA CN200710089086A CN101276670B CN 101276670 B CN101276670 B CN 101276670B CN 200710089086X A CN200710089086X A CN 200710089086XA CN 200710089086 A CN200710089086 A CN 200710089086A CN 101276670 B CN101276670 B CN 101276670B
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Abstract
The invention discloses a surface adhered magnetic member, at least comprising: a magnetic conduction module provided with a first magnetic conduction unit and a second magnetic conduction unit, which are combined to form a receiving space, wherein, the second magnetic conduction unit is provided with a first surface and a second surface, and the second magnetic conduction unit is connected with the first magnetic conduction unit via the first surface; a coil which is partly arranged in the receiving space of the magnetic conduction module, and which includes at least two pins extending on the second surface of the second magnetic conduction unit; and an extending portion which is integrated in at least a part of the second surface of the second magnetic conduction unit. The invention solves the defect that the surface adhered magnetic member can not disposed on a circuit board stably and reposefully, and improves the ability of positioning the surface adhered magnetic member the circuit board.
Description
Technical field
The present invention relates to a kind of magnetic element, relate in particular to a kind of surface adhesion type magnetic element.
Background technology
Magnetic element, for example inductance element or transformer are various electronic installation, for example power supply device or power supply change-over device, indispensable primary element when running.Along with power supply device or power supply change-over device towards miniaturization and high-power trend development, magnetic element also needs the direction of and flat structure little towards volume to improve.In addition, for the ease of magnetic element is assembled on the circuit board, variously can utilizes surface mount technology (Surface Mount Technology is developed so SMT) magnetic element is assembled in the surface adhesion type magnetic element structure of circuit board.See also Fig. 1 (a), it is fixed in the structural representation of a circuit board for showing a conventional surface mount type inductance element.Shown in Fig. 1 (a), a pair of pin 12a that traditional SMD LED surface-mount device LED inductance element 1 comprises a magnetic conduction group 10, a coil 11 and is connected with these coil 11 two ends, 12b.Wherein magnetic conduction group 10 has an accommodation space 13, has a conducting magnetic column (not shown) in this accommodation space 13, makes coil 11 can be arranged in this accommodation space 13 and is set around this conducting magnetic column.Pin 12a, 12b is arranged at the bottom surface of magnetic conduction group 10, because this is to pin 12a, 12b can with the corresponding contact area 21a of circuit board 2,21b utilizes surface mount technology (Surface Mount Technology, SMT) connect, therefore can make SMD LED surface-mount device LED inductance element 1 fixing be positioned on the circuit board 2.
Fig. 1 (b) is that structure shown in the displayed map 1 (a) is in the structural section figure in A cross section.Shown in Fig. 1 (b), SMD LED surface-mount device LED inductance element 1 is fixed by surface mount technology and is positioned on the circuit board 2, also be the pin 12a of SMD LED surface-mount device LED inductance element 1,12b utilizes the corresponding contact area 21a of scolder 22 and circuit board 2,21b connects, make thus SMD LED surface-mount device LED inductance element 1 fixing be positioned on the circuit board 2.Yet, because SMD LED surface-mount device LED inductance element 1 only utilizes pin 12a, the corresponding contact area 21a of 12b and circuit board 2,21b connects, and can be between the bottom surface of SMD LED surface-mount device LED inductance element 1 and the circuit board 2 because of pin 12a, the thickness of 12b and and form quite wide gap 23 between the circuit board 2, so SMD LED surface-mount device LED inductance element 1 no enough contacts area can firmly be fixed and are positioned on the circuit board 2.In addition, the pin 12a of SMD LED surface-mount device LED inductance element 1, the 12b evenness is wayward usually, and the coating weight of scolder 22 is also wayward, therefore when being assembled in SMD LED surface-mount device LED inductance element 1 on the circuit board 2, also may be because of pin 12a, the evenness of 12b is good and SMD LED surface-mount device LED inductance element 1 can't entirely be fixed and be positioned circuit board 2.Moreover, when meeting external impacts or bump, can not cushion the structure division of stress owing to there is other, therefore SMD LED surface-mount device LED inductance element 1 is easily in pin 12a, the engaging zones of 12b and circuit board 2 produces solder crack and makes SMD LED surface-mount device LED inductance element 1 breaking circuit plate 2, and then influences the reliability of product.In addition, SMD LED surface-mount device LED inductance element 1 is in the process that is assembled to circuit board 2, and also easily because of pin 12a, 12b slides and the contact area 21a that is difficult for being positioned circuit board 2 is arranged, and the problem of 21b exists.
Therefore, how to develop a kind of surface adhesion type magnetic element, to improve the problem that conventional art is run into, real is the problem of present required solution.
Summary of the invention
Main purpose of the present invention is to provide a kind of surface adhesion type magnetic element, utilize the formed extension in magnetic conduction group bottom surface of surface adhesion type magnetic element, with interregional the deciding and be connected of the relative contact of the pin of auxiliary surface adhesion type magnetic element with circuit board, preventing surface adhesion type magnetic element breaking circuit plate, to solve surface adhesion type magnetic element and can't entirely, firmly be disposed at shortcomings such as circuit board, and promote the ability that surface adhesion type magnetic element is positioned circuit board.
Another object of the present invention is to provide a kind of surface adhesion type magnetic element, utilize the formed extension in magnetic conduction group bottom surface of surface adhesion type magnetic element, so that functions such as surface adhesion type magnetic element tool compensator or trimmer pressure, damping vibration and impacts.
For achieving the above object, of the present invention one implements state for a kind of surface adhesion type magnetic element is provided than broad sense, at least comprise: a magnetic conduction group, have one first magnetic conductive part and one second magnetic conductive part, and this first magnetic conductive part and this second magnetic conductive part are combined to form an accommodation space, wherein this second magnetic conductive part has a first surface, one a second surface and at least one side that is connected this first surface and this second surface with respect to this first surface, the both sides of this side respectively have the recess of this first surface of perforation and this second surface, and this second magnetic conductive part is connected with this first magnetic conductive part with this first surface; One coil, part is arranged in this accommodation space of this magnetic conduction group, and has at least two pins, and described at least two pins bend along the recess of the both sides of this side of this second magnetic conductive part, and extend on this second surface; And an extension, be integrally formed in the subregion at least of this second surface of this second magnetic conductive part.
For achieving the above object, of the present invention another implemented state for a kind of surface adhesion type magnetic element is provided than broad sense, is arranged on the circuit board, and wherein this circuit board has contact area.This surface adhesion type magnetic element comprises at least: a magnetic conduction group, have one first magnetic conductive part and one second magnetic conductive part, and this first magnetic conductive part and this second magnetic conductive part are combined to form an accommodation space, wherein this second magnetic conductive part has a first surface, one a second surface and at least one side that is connected this first surface and this second surface with respect to this first surface, the both sides of this side respectively have the recess of this first surface of perforation and this second surface, this second magnetic conductive part is connected with this first magnetic conductive part with this first surface, and this magnetic conduction group is relative with this circuit board with this second surface of this second magnetic conductive part; One coil, part is arranged in this accommodation space of this magnetic conduction group, and have at least two pins, wherein said at least two pins are along the recess bending of these both sides, side of this second magnetic conductive part, and extend between this second surface and this circuit board, and this contact area corresponding with this circuit board connects; And an extension, be integrally formed in the subregion at least of this second surface of this second magnetic conductive part.
Description of drawings
Fig. 1 (a): it shows that a conventional surface mount type inductance element is fixed in the structural representation of a circuit board.
Fig. 1 (b): structure is in the structural section figure in A cross section shown in its displayed map 1 (a).
Fig. 2: it is the exploded perspective view of the surface adhesion type magnetic element of preferred embodiment of the present invention.
Fig. 3: it is the combining structure schematic diagram of structure shown in Figure 2.
Fig. 4 (a): it is the end view of structure shown in Figure 3.
Fig. 4 (b): it shows the end view of another kind of structure shown in Figure 3.
Fig. 4 (c): it shows the end view of another kind of structure shown in Figure 3.
Fig. 5 (a): it is the structure side view that structure is arranged at a circuit board shown in Fig. 4 (a).
Fig. 5 (b): it is the structure side view that structure is arranged at a circuit board shown in Fig. 4 (b).
Fig. 5 (c): it is the structure side view that structure is arranged at a circuit board shown in Fig. 4 (c).
Fig. 5 (d): it is arranged at the structure side view of a circuit board for structure shown in another kind of Fig. 4 (c).
Fig. 6: it is the structural representation of the surface adhesion type magnetic element of another preferred embodiment of the present invention.
Fig. 7: it is the structural representation of the surface adhesion type magnetic element of the another preferred embodiment of the present invention.
Fig. 8: it is the present invention's structural representation of the surface adhesion type magnetic element of a preferred embodiment again.
Fig. 9: it is the structural representation of the surface adhesion type magnetic element of another preferred embodiment of the present invention.
Wherein, description of reference numerals is as follows:
SMD LED surface-mount device LED inductance element: 1
Magnetic conduction group: 10,30
Coil: 11
Pin: 12a, 12b
Accommodation space: 13,36
Circuit board: 2,4
Contact area: 21a, 21b, 41a, 41b
Scolder: 22,34
Gap: 23,31c
Surface adhesion type magnetic element: 3
Coil: 31
First magnetic conductive part: 301
Second magnetic conductive part: 302
Conducting magnetic column: 303
The first side wall: 304
Second sidewall: 305
First surface: 306
Second surface: 307
Extension: 308
First pin: 32a
Second pin: 32b
Section part part: 31a among the coil
Passage: 31b
Recess: 309,42
Side: 309a
First opening: 33
Viscose: 35
First recess: 308a
Second recess: 308b
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back.Be understood that the present invention can have various variations on different enforcement states, its neither departing from the scope of the present invention, and explanation wherein and accompanying drawing be when the usefulness that explain in itself, but not in order to restriction the present invention.
See also Fig. 2 and Fig. 3, it is respectively the exploded perspective view and the combination schematic diagram of the surface adhesion type magnetic element of preferred embodiment of the present invention.As Fig. 2 and shown in Figure 3, surface adhesion type magnetic element 3 of the present invention can be for example SMD LED surface-mount device LED inductance element, and not as limit.Surface adhesion type magnetic element 3 of the present invention mainly comprises a magnetic conduction group 30, a coil 31 and at least two pins that extended by this coil 31, for example first pin 32a and the second pin 32b.Wherein, magnetic conduction group 30 is made up by one first magnetic conductive part 301 and one second magnetic conductive part 302, and this first magnetic conductive part 301 forms an accommodation space 36 with these second magnetic conductive part, 302 combination backs.In certain embodiments, this first magnetic conductive part 301 is respectively E type and the combination of I type magnetic conductive part or E type and the combination of E type magnetic conductive part with this second magnetic conductive part 302.In further embodiments, first magnetic conductive part 301 has a conducting magnetic column 303 and two side at least, for example the first side wall 304 and with respect to second sidewall 305 of this first side wall 304.Conducting magnetic column 303 is arranged between the first side wall 304 and second sidewall 305, and conducting magnetic column 303 can be circular, oval, square or other Any shape haply cylinder and constitutes.In addition, second magnetic conductive part 302 is the magnetic conductive part of template basically, and have a first surface 306 and a second surface 307 and be connected in first surface 306 and the side 309a of second surface 307, wherein this first surface 306 is with respect to this second surface 307, and this first surface 306 is flat surface haply.In addition, the subregion at least of this second surface 307 forms an extension 308, and wherein this extension 308 is integrally formed in this second magnetic conductive part 302, and this extension 308 can be for example cuboid.
In certain embodiments, coil 31 is square haply bar shape coil for the cross section, and the two end portions of coil 31 forms described at least two pins, for example the first pin 32a and the second pin 32b.In addition, coil sections 31 is arranged in the accommodation space 36 of this magnetic conduction group 30.In certain embodiments, for example oval, circular, square haply or other Any shape of the stage casing part 31a of coil 31 folding coiled, and make this at least two pin 32a, 32b extends in same plane.Coil 31 stage casing part 31a foldings around the zone form a channel 31b, this channel 31b can be sheathed on the conducting magnetic column 303 of first magnetic conductive part 301, and coil 31 is placed between the first side wall 304 and second sidewall 305 of first magnetic conductive part 301.Second magnetic conductive part 302 both sides of a side 309a therein has recess 309 or does not have recess, and this recess 309 connects first surface 306 and second surface 307, this second magnetic conductive part 302 can be after coil 31 be disposed at first magnetic conductive part 301, at least two pin 32a by this coil 31, the formed gap 31c of stage casing part 31a of 32b and coil 31 inserts, and the first side wall 304 of first magnetic conductive part 301 is connected with the first surface 306 of second magnetic conductive part 302 with second sidewall, 305 end faces, is surface adhesion type magnetic element 3 thus with the framework.
As shown in Figure 3, in certain embodiments, at least two pin 32a of coil 31,32b is extended outward by first magnetic conductive part 301 and second magnetic conductive part 302 combination formed first openings 33 in back or second one of them opening of opening (not shown) relative with first opening 33.By at least two pin 32a that first opening 33 or the second opening (not shown) extend outward, 32b further extends with the direction that is parallel to second surface 307 haply in the recess 309 bending backs of second magnetic conductive part 302.In certain embodiments, extension 308 be formed on the second surface 307 and be arranged at the first pin 32a and the second pin 32b between.
Fig. 4 (a) is the end view of structure shown in Figure 3.In certain embodiments, relatively less than described at least two pin 32a, 32b is with respect to the height of second surface 307 d1 approximately haply in the second surface 307 outward extending height of second magnetic conductive part 302 for extension 308.In addition, in other embodiments, shown in Fig. 4 (b), extension 308 equals described at least two pin 32a haply in the second surface 307 outward extending height of second magnetic conductive part 302, and 32b is with respect to the height of second surface 307.At other embodiment, shown in Fig. 4 (c), extension 308 is higher than this at least two pin 32a haply in the second surface 307 outward extending height of second magnetic conductive part 302, and 32b is with respect to the about d2 haply of the height of second surface 307.
See also Fig. 5 (a), it is the structure side view that structure is arranged at a circuit board shown in Fig. 4 (a).Shown in Fig. 5 (a), extension 308 in the second surface 307 outward extending height of second magnetic conductive part 302 relatively less than described at least two pin 32a, 32b is with respect to the about d1 haply of the height of second surface 307, therefore the extension 308 of surface adhesion type magnetic element 3 can with circuit board 4 between utilize viscose 35 to be connected, at least two pin 32a of surface adhesion type magnetic element 3,32b can by surface mount technology utilize scolder 34 and with the corresponding contact area 41a of circuit board 4,41b connects, and just surface adhesion type magnetic element 3 can be fixed and be positioned on the circuit board 4 thus.Because 4 formed gaps of the extension 308 of second magnetic conductive part 302 on second surface 307 and circuit board of surface adhesion type magnetic element 3 are relative less, therefore can utilize viscose 35 to be connected with circuit board 4, but the pin 32a of auxiliary surface adhesion type magnetic element 3 thus, 32b and circuit board 4 contraposition mutually are to prevent surface adhesion type magnetic element 3 breaking circuit plates 4, to solve surface adhesion type magnetic element 3 and can't entirely, firmly be disposed at shortcoming such as circuit board 4 and promote the ability that surface adhesion type magnetic element 3 is positioned circuit board 4.On the other hand, also can make surface adhesion type magnetic element 3 utilize extension 308 and viscose 35 and have functions such as compensator or trimmer pressure, damping vibration and impact.
See also Fig. 5 (b), it is the structure side view that structure is arranged at a circuit board shown in Fig. 4 (b).Shown in Fig. 5 (b), extension 308 equals this at least two pin 32a haply in the second surface 307 outward extending height of second magnetic conductive part 302,32b is with respect to the height of second surface 307, therefore in the same manner the extension 308 of surface adhesion type magnetic element 3 can with circuit board 4 between utilize viscose 35 to be connected, at least two pin 32a of surface adhesion type magnetic element 3,32b can by surface mount technology utilize scolder 34 and with the corresponding contact area 41a of circuit board 4,41b connects, and just surface adhesion type magnetic element 3 can be fixed and be positioned on the circuit board 4 thus.Because 4 formed gaps of the extension 308 of second magnetic conductive part 302 on second surface 307 and circuit board of surface adhesion type magnetic element 3 are relative less, therefore can utilize viscose 35 to be connected with circuit board 4, but the pin 32a of auxiliary surface adhesion type magnetic element 3 thus, 32b and circuit board 4 contraposition mutually, preventing surface adhesion type magnetic element 3 breaking circuit plates 4, to solve surface adhesion type magnetic element 3 and can't entirely, firmly be disposed at shortcomings such as circuit board 4, and promote the ability that surface adhesion type magnetic element 3 is positioned circuit board 4.On the other hand, also can make surface adhesion type magnetic element 3 utilize extension 308 and viscose 35 and have functions such as compensator or trimmer pressure, damping vibration and impact.
See also Fig. 5 (c), it is the structure side view that structure is arranged at a circuit board shown in Fig. 4 (c).Shown in Fig. 5 (c), extension 308 is higher than described at least two pin 32a haply in the second surface 307 outward extending height of second magnetic conductive part 302,32b is with respect to the about d2 haply of the height of second surface 307, so at least two pin 32a of surface adhesion type magnetic element 3,32b can by surface mount technology utilize scolder 34 and with the corresponding contact area 41a of circuit board 4,41b connects, and the extension 308 of surface adhesion type magnetic element 3 can contact haply with circuit board 4, just surface adhesion type magnetic element 3 can be fixed and be positioned on the circuit board 4 with this.Because the extension 308 of second magnetic conductive part 302 on second surface 307 of surface adhesion type magnetic element 3 contacts haply with circuit board 4, therefore pin 32a that can auxiliary surface adhesion type magnetic element 3,32b and circuit board 4 contraposition mutually, can't entirely, firmly be disposed at shortcomings such as circuit board 4 to solve surface adhesion type magnetic element 3, and promote the ability that surface adhesion type magnetic element 3 is positioned circuit board 4.On the other hand, also can make surface adhesion type magnetic element 3 utilize extension 308 and have functions such as compensator or trimmer pressure, damping vibration and impact.
In certain embodiments, shown in Fig. 5 (d), if extension 308 is higher than described at least two pin 32a haply in the second surface 307 outward extending height of second magnetic conductive part 302,32b is with respect to the about d3 haply of the height of second surface 307, and the height d3 of structure shown in Fig. 5 (d) is greater than the height d2 of structure shown in Fig. 5 (c), at least two pin 32a of surface adhesion type magnetic element 3 then, 32b can by surface mount technology utilize scolder 34 and with the corresponding contact area 41a of circuit board 4,41b connects, and the extension 308 of surface adhesion type magnetic element 3 can contact with corresponding recess 42 internal faces of circuit board 4 or utilize viscose 35 to be connected, and just surface adhesion type magnetic element 3 can be fixed and be positioned on the circuit board 4 thus.Because second magnetic conductive part 302 crack between 4 of extension on the second surface 307 308 and circuit boards form of surface adhesion type magnetic element 3 is relative less, therefore can utilize viscose 35 to be connected with circuit board 4, but the pin 32a of auxiliary surface adhesion type magnetic element 3 thus, 32b and circuit board 4 contraposition mutually, preventing surface adhesion type magnetic element 3 breaking circuit plates 4, to solve surface adhesion type magnetic element 3 and can't entirely, firmly be disposed at shortcomings such as circuit board 4, and promote the ability that surface adhesion type magnetic element 3 is positioned circuit board 4.On the other hand, also can make surface adhesion type magnetic element 3 utilize extension 308 and viscose 35 and have functions such as compensator or trimmer pressure, damping vibration and impact.
In addition, the shape of extension 308 and at least two pin 32a, the relative position of 32b also can have various variation examples.In certain embodiments, as shown in Figure 6, extension 308 can be formed at a lateral parts of the second surface 307 of second magnetic conductive part 302, and with this at least two pin 32a, 32b is vertical haply.In this embodiment, extension 308 also can be lower than, be equal to or higher than this at least two pin 32a with respect to the height of second surface 307, and 32b is with respect to the height of second surface 307.In addition, utilize this kind surface adhesion type magnetic element 3 to be arranged at the mode of circuit board 4 and various enforcement state thereof as previously mentioned, repeat no more in this.Moreover in another embodiment, as shown in Figure 7, extension 308 also can be cylinder haply, and extension 308 can be formed between the first pin 32a and the second pin 32b.In this embodiment, extension 308 also can be lower than, be equal to or higher than this at least two pin 32a, the height of 32b with respect to the height of second surface 307.In addition, utilize this kind surface adhesion type magnetic element 3 to be arranged at the mode of circuit board 4 and various enforcement state thereof as previously mentioned, do not repeat them here.Moreover in another embodiment, as shown in Figure 8, extension 308 also can be E type cylinder haply, and extension 308 has one first recess 308a and one second recess 308b, in order to ccontaining this at least two pin 32a, 32b to small part.In this embodiment, extension 308 also can be lower than, be equal to or higher than this at least two pin 32a, the height of 32b with respect to the height of second surface 307.In addition, utilize this kind surface adhesion type magnetic element 3 to be arranged at the mode of circuit board 4 and various enforcement state thereof as previously mentioned, do not repeat them here.
See also Fig. 9, it shows the structural representation of the surface adhesion type magnetic element of another preferred embodiment of the present invention.As shown in the figure, in certain embodiments, first opening 33 and the second opening (not shown) of the magnetic conduction group 30 that this first pin 32a and this second pin 32b can be respectively made up by first magnetic conductive part 301 and second magnetic conductive part 302 extend, wherein this first opening 33 is with respect to this second opening (not shown), and therefore the first pin 32a and the second pin 32b can be extended in the mode that is parallel to second surface 307 by the bending back, opposite flank of second magnetic conductive part 302.Because structural principle, function and the application of this embodiment are similar to previous embodiment, do not repeat them here.
In sum, surface adhesion type magnetic element of the present invention utilizes the formed extension in magnetic conduction group bottom surface of surface adhesion type magnetic element, with interregional the deciding and be connected of the relative contact of the pin of auxiliary surface adhesion type magnetic element with circuit board, preventing surface adhesion type magnetic element breaking circuit plate, to solve surface adhesion type magnetic element and can't entirely, firmly be disposed at shortcomings such as circuit board, and promote the ability that surface adhesion type magnetic element is positioned circuit board.On the other hand, surface adhesion type magnetic element of the present invention also can utilize extension and viscose to reduce the gap of surface adhesion type magnetic element and circuit board, makes it have functions such as compensator or trimmer pressure, damping vibration and impact.
Above-described only is preferable possible embodiments of the present invention; described embodiment is not in order to limit scope of patent protection of the present invention; therefore the equivalent structure done of every utilization specification of the present invention and accompanying drawing content changes, and in like manner all should be included in protection scope of the present invention.
Claims (14)
1. a surface adhesion type magnetic element is characterized in that, comprises at least:
One magnetic conduction group, have one first magnetic conductive part and one second magnetic conductive part, and this first magnetic conductive part and this second magnetic conductive part are combined to form an accommodation space, wherein this second magnetic conductive part has a first surface, a second surface and at least one side that is connected this first surface and this second surface with respect to this first surface, the both sides of this side respectively have the recess of this first surface of perforation and this second surface, and this second magnetic conductive part is connected with this first magnetic conductive part with this first surface;
One coil, part is arranged in this accommodation space of this magnetic conduction group, and has at least two pins, and described at least two pins bend along the recess of the both sides of this side of this second magnetic conductive part, and extend on this second surface; And
One extension is integrally formed in the subregion at least of this second surface of this second magnetic conductive part.
2. surface adhesion type magnetic element as claimed in claim 1 is characterized in that, this surface adhesion type magnetic element is the SMD LED surface-mount device LED inductance element.
3. surface adhesion type magnetic element as claimed in claim 1 is characterized in that, this first magnetic conductive part also comprises a conducting magnetic column and two side at least, and this conducting magnetic column is arranged between this two side, and this conducting magnetic column is circular, ellipse or square cylinder.
4. surface adhesion type magnetic element as claimed in claim 3, it is characterized in that, this coil also comprises a stage casing part, this stage casing part folding coiled is oval or circular haply, and described at least two pins are extended in same plane, and wherein this center section part branch folding around the zone form a channel, this channel is used to be sheathed on this conducting magnetic column of this first magnetic conductive part, makes this coil of part be placed in this accommodation space.
5. surface adhesion type magnetic element as claimed in claim 4 is characterized in that, this second magnetic conductive part is arranged in the gap that this center section part branch of two pins of this coil and this coil forms at least.
6. surface adhesion type magnetic element as claimed in claim 1 is characterized in that, this coil is that the cross section is square haply bar shape coil, and wherein this second magnetic conductive part is the magnetic conductive part of template haply.
7. surface adhesion type magnetic element as claimed in claim 1 is characterized in that, this extension is cuboid or cylinder haply, and this extension is parallel haply or perpendicular to described at least two pins or be arranged between this at least two pin.
8. as claim 1 a described surface adhesion type magnetic element, it is characterized in that this extension has one first recess and one second recess, be used for ccontaining described at least two pins to small part.
9. as claim 1 a described surface adhesion type magnetic element, it is characterized in that, this extension with respect to the height of this second surface haply less than, be equal to or greater than the height of described at least two pins with respect to this second surface.
10. as claim 1 a described surface adhesion type magnetic element, it is characterized in that, described at least two pins comprise one first pin and one second pin, and this first pin and this second pin are extended to this second surface of this second magnetic conductive part by the same side or the opposite flank bending of this second magnetic conductive part.
11. a surface adhesion type magnetic element is arranged on the circuit board, this circuit board has contact area, it is characterized in that, this surface adhesion type magnetic element comprises at least:
One magnetic conduction group, have one first magnetic conductive part and one second magnetic conductive part, and this first magnetic conductive part and this second magnetic conductive part are combined to form an accommodation space, wherein this second magnetic conductive part has a first surface, one a second surface and at least one side that is connected this first surface and this second surface with respect to this first surface, the both sides of this side respectively have the recess of this first surface of perforation and this second surface, this second magnetic conductive part is connected with this first magnetic conductive part with this first surface, and this magnetic conduction group is relative with this circuit board with this second surface of this second magnetic conductive part;
One coil, part is arranged in this accommodation space of this magnetic conduction group, and have at least two pins, wherein said at least two pins are along the recess bending of these both sides, side of this second magnetic conductive part, and extend between this second surface and this circuit board, and this contact area corresponding with this circuit board connects; And
One extension is integrally formed in the subregion at least of this second surface of this second magnetic conductive part.
12. surface adhesion type magnetic element as claimed in claim 11 is characterized in that, also comprises viscose between this extension of this second magnetic conductive part and this circuit board.
13. surface adhesion type magnetic element as claimed in claim 11 is characterized in that, this contact area that described at least two pins are corresponding with this circuit board connects with scolder.
14. surface adhesion type magnetic element as claimed in claim 11 is characterized in that, this circuit board also comprises a recess, extends in this recess for this extension, wherein also comprises viscose between wall within this recess of this extension and this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710089086XA CN101276670B (en) | 2007-03-29 | 2007-03-29 | Surface adhesion type magnetic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710089086XA CN101276670B (en) | 2007-03-29 | 2007-03-29 | Surface adhesion type magnetic element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101276670A CN101276670A (en) | 2008-10-01 |
| CN101276670B true CN101276670B (en) | 2010-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710089086XA Active CN101276670B (en) | 2007-03-29 | 2007-03-29 | Surface adhesion type magnetic element |
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| Country | Link |
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| CN (1) | CN101276670B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2156576Y (en) * | 1993-04-29 | 1994-02-16 | 徐明恩 | Surface adhesive type crystal chip filtering element |
| US20020158738A1 (en) * | 2001-04-30 | 2002-10-31 | Han-Cheng Hsu | Filtering induction device |
| CN1455421A (en) * | 2002-04-30 | 2003-11-12 | 东京零件工业股份有限公司 | Common mode choke |
-
2007
- 2007-03-29 CN CN200710089086XA patent/CN101276670B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2156576Y (en) * | 1993-04-29 | 1994-02-16 | 徐明恩 | Surface adhesive type crystal chip filtering element |
| US20020158738A1 (en) * | 2001-04-30 | 2002-10-31 | Han-Cheng Hsu | Filtering induction device |
| CN1455421A (en) * | 2002-04-30 | 2003-11-12 | 东京零件工业股份有限公司 | Common mode choke |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101276670A (en) | 2008-10-01 |
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