CN101269478B - Accurate milling buffing head mechanical device for attenuated polishing - Google Patents
Accurate milling buffing head mechanical device for attenuated polishing Download PDFInfo
- Publication number
- CN101269478B CN101269478B CN2007100646945A CN200710064694A CN101269478B CN 101269478 B CN101269478 B CN 101269478B CN 2007100646945 A CN2007100646945 A CN 2007100646945A CN 200710064694 A CN200710064694 A CN 200710064694A CN 101269478 B CN101269478 B CN 101269478B
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- overcoat
- ring body
- base
- mechanical device
- polishing
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Abstract
The invention relates to an accurate grinding throwing head mechanical device used for thinning and polishing, and the device is characterized in that an outer sleeve is included; the outer sleeve comprises an upper layer ring body and a lower layer ring body; a plurality of joint levers are fixedly connected between the upper layer ring body and the lower layer ring body; a middle layer which is a round piece body is positioned at the lower part of the upper layer ring body and fixed at the inner sides of the joint levers, the middle position of the middle layer is provided with a retainer; an internal sleeve comprising an upper connection piece which is a round disk shape; a base which is the round disk shape, the center of the base is provided with a hole, and a plurality of joint pins are fixedly connected between the base and the upper connection piece; the internal sleeve is positioned inside the outer sleeve and is linked with the outer sleeve; a micro slide which is one piece body is positioned at the lower part of the base in the internal sleeve and linked with the based in the internal sleeve.
Description
Technical field
The present invention relates to a kind of mechanical device to the accurate control plane attenuate of semi-conducting material and the polishing thickness and the uniformity.Design different sizes and change different counterweights and grinding and polishing material, can be used for metal, semiconductor and other materials of the needs accurate control plane attenuated polishing thickness and the uniformity.
Technical background
Along with the extensive use of semiconductor laser, more urgent to the making demand of high-quality semiconductor laser at Military Application and civil area.High-quality semiconductor laser is particularly strict to the requirement of heat radiation and electric conductivity and stress, except that the design to material itself improves, structural design has also been put on higher step like this.Especially array encapsulating structure device, because " smile effect " that the existence of stress causes is the key factor that the efficient of restriction optical fiber coupling can not get improving, so the control of the precision of attenuate in the noise spectra of semiconductor lasers manufacturing process and polishing is particularly important always.Though now homemade attenuated polishing machine is a lot, main equipment is applicable to that backing material or Si are the making of device, the making of inapplicable and laser instrument.Small-sized attenuated polishing equipment is also more, its basic rotation and revolution function also can compare favourably with external equipment, but because the too summary of grinding and polishing head, and most equipment are to control thickness thinning by experience auxiliary detection estimated time, make the attenuated polishing uniformity and precision not reach the demand of semiconductor laser far away like this.
Summary of the invention
The object of the invention is to provide a kind of mechanical device of the grinding and polishing head to the accurate control plane attenuated polishing thickness of semi-conducting material and the uniformity.This mechanical device is cheap, excellent performance, volume are little, in light weight, simple, convenient and practical.
The accurate milling throwing wheel mechanical device that a kind of attenuated polishing of the present invention is used is characterized in that, comprising:
One overcoat, this overcoat comprises:
One upper strata ring body;
One lower floor's ring body, fixedly connected between this upper strata ring body and the lower floor's ring body by a plurality of connecting rods;
One middle level, this middle level are circular lamellar body, this middle level be positioned at the upper strata ring body the below, be fixed on the inboard of a plurality of connecting rods, this middle level position intermediate is equipped with a stop;
Cover in one, cover comprises in this:
One upper connector, this upper connector are a collar plate shape;
One base, this base are a collar plate shape, and the center of this base has a hole, and be fixedly connected by a plurality of joint pins between this base and the upper connector;
Should interiorly overlap the inside that is positioned at overcoat, and link with overcoat;
One micro slide, this micro slide are a lamellar body, and this micro slide is arranged in the below of base of cover, and with interior cover in the base interlock.
The quantity of a plurality of connecting rods in the wherein said overcoat is 3-5, and this connecting rod is that even distributed weight is identical.
Wherein said overcoat is the one processing and fabricating.
The quantity of a plurality of joint pins in wherein said in the cover is 3-5, and this joint pin is that even distributed weight is identical.
The lower edge of the lower floor's ring body in the wherein said overcoat has the identical gap of a plurality of equally distributed shapes.
The invention has the beneficial effects as follows accurately control plane attenuated polishing thickness, the uniformity and precision, the uniformity and the Millstone of attenuated polishing sample had self-repair function, the present invention is simple in structure, handled easily.
Description of drawings
Below, further specify structure of the present invention, characteristics in conjunction with the drawings to having the detailed description of embodiment, wherein:
Fig. 1, Fig. 2, Fig. 3 are respectively the overcoat of accurate milling throwing wheel, interior cover and micro slide schematic diagram,
Fig. 4 is an assembling stereogram.
The specific embodiment
Below in conjunction with Fig. 1, Fig. 2, Fig. 3, Fig. 4 describe in detail according to the CONSTRUCTED SPECIFICATION of specific embodiment of the invention accurate milling throwing wheel and working condition.
See also shown in Figure 1ly, the accurate milling throwing wheel mechanical device that a kind of attenuated polishing of the present invention is used comprises: an overcoat 10, this overcoat 10 comprise a upper strata ring body 11, lower floor's ring body 12 and a plurality of connecting rod 13.Described overcoat 10 is the one processing and fabricating, or constitutes an integral body with other connected modes such as no seam welding;
Its at the middle and upper levels ring body 11 are concentric annulars of inner wall smooth with lower floor ring body 12, both connect by a plurality of connecting rods 13 of even distribution equivalent weight, play internal cover 20 vertical direction guiding and the spacing effect of horizontal direction; Connecting rod 13 generally selects for use 3-5 to get final product;
Lower edge at lower floor's ring body 12 has the identical gap 15 of a plurality of equally distributed shapes, the grinding and polishing feed liquid can evenly flow into loading by these gap and try to get to the heart of a matter and carry out grinding and polishing in the face of sample, lower floor's ring body 12 lower edge have these gap just can repair dish to the mill of employed grinding and polishing machine synchronously in process of lapping, so just can reduce because the grinding and polishing inhomogeneities that the out-of-flatness of grinding and polishing feed liquid uneven distribution and mill brings; The degree of depth of gap is exceeded with the thickness that is not higher than micro slide 30;
The middle level 14 of overcoat 10 is circular lamellar body, this middle level 14 be positioned at upper strata ring body 11 the below, be fixed on the inboard of a plurality of connecting rods 13, these middle level 14 position intermediate are equipped with a stop 141, the high-precision spiral positioning device that this stop 141 can use market to purchase, this stop 141 act as accurate location to the sample mill polishing thickness;
See also Fig. 1 and consult Fig. 4 simultaneously, for cover 20 in making and overcoat 10 synchronous rotations can be left the circular hole of slightly larger in diameter in joint pin 23 corresponding to the relevant position of 20 more than joint pins 23 of interior cover on the middle level 14 of overcoat 10, during assembling a plurality of joint pins 23 of interior cover 20 being passed these corresponding circular holes is connected with interior cover 20 upper connectors and gets final product, also can be by the word groove that goes into operation at the upper strata of overcoat 10 ring body 11 inwalls, the outer wall of interior cover 20 upper connectors 21 adds other modes such as T type post and plays the interlock effect.
For prevent use and assembling process in phenomenon such as distortion dislocation appears, the overcoat 10 of this accurate milling throwing wheel is except that stop 141, whole overcoat 10 is processed into non-removable integral body by technology such as no seam welding, with the precision of assurance overcoat 10.
See also the interior cover 20 of Fig. 2 and comprise a upper connector 21, a base 22 and upper connector 21, interior cover 20;
Wherein upper connector 21 is a collar plate shape, and its external diameter is slightly less than the internal diameter of layer ring body 11 on the overcoat 10, and the flatness of the height of this difference and interior cover 20 and base 22 bottom surfaces plays a decisive role to the uniformity of the grinding and polishing of sample;
See also Fig. 2 and consult Fig. 4 simultaneously, during 10 assemblings of interior cover 20 and overcoat in the base 22 of cover 20 pass by a plurality of joint pins 23 that the corresponding aperture on the layer 14 is connected with the upper connector 21 of interior cover 20 among the overcoat 10; Joint pin 23 adopts 3-5 usually, and being evenly distributed on above the base 22 of weight such as must be; Be vertically welded on the base 22 for guaranteeing that this joint pin 23 of precision can adopt, also can weld together after assembling with overcoat 10, also can adopt the fastening alternate manner that waits of screw to fix with upper connector 21;
After interior cover 20 inside that are positioned at overcoat 10 assemble, interior cover 20 must link with overcoat 10, again the base 22 of interior cover 20 and lower floor's ring body 12 of overcoat 10 are carried out fine gtinding together after assembling, so that the bottom surface of the bottom surface of base 22 and lower floor's ring body 12 is in same plane, to improve the uniformity of print attenuated polishing.
Whole accessories of overcoat 10 and interior cover 20 should be non-corrosive, anti-slight acid and alkali corrosion, organic solvent-resistant, wear-resisting, hard not yielding, easy fracture, material that finished surface is smooth are not made.
If the upper connector 21 of mill head overcoat 10 upper strata ring bodies 11 and interior cover 20 is designed to oval then can reduces the restriction that is subjected to machining accuracy, further improve the uniformity, and need not to increase other interlock design.
Seeing also Fig. 3 micro slide 30 is a lamellar body, the size of this micro slide 30 should be less than the interior ring of overcoat 10 lower floor's ring bodies 12, this micro slide 30 is must thickness even, and the material that its material is non-corrosive, anti-slight acid and alkali corrosion, organic solvent-resistant, wear-resisting, hard not yielding, anti-100 degree high temperature, finished surface is smooth is made; This micro slide 30 is arranged in the below of cover 20 base 22 during use, and with interior cover 20 in base 22 interlocks, seeing also Fig. 2 linkage manner can be at interior cover 20 lower floor's ring bodies 12 bottom surface mounting screw, correspondingly opens shallow slot etc. on micro slide 30.
The course of work of the present invention is:
1, sample size should be less than micro slide 30;
2, sample is fixed on the center on the plane of micro slide 30,, after cooling the paraffin at sample surfaces and edge is wiped totally for the mode that semi-conducting material can adopt fusion paraffin to paste;
3, drip several dripping at the back side of micro slide 30, aim at the interlock position, utilize the surface tension effects of water micro slide 30 to be sticked on base 22 bottom surfaces of interior cover 20;
4, accurate milling throwing wheel is placed on the abrasive disk of grinder, stop 141 is set the attenuate parameter, start grinder and begin attenuate;
5, treat in cover upper connector 21 belows and after stop 141 contacts, can stop the rotation of grinder grinding and polishing dish;
6, take off accurate milling throwing wheel, will grind feed liquid with big water gaging and rinse well;
7, accurate milling throwing wheel is placed on the polishing disk of polishing machine, stop 141 is set burnishing parameters, start polishing machine and begin polishing;
8, treat in cover upper connector 21 belows and after stop 141 contacts, can stop the rotation of polishing machine polishing disk;
9, take off accurate milling throwing wheel, polishing fluid is rinsed well with big water gaging;
10, inwardly overlap in the centre bore 221 on 20 bases 22 and be blown into gas, micro slide 30 is separated with interior cover 20 bases 22;
11, take off print from micro slide 30, finish the whole courses of work of attenuated polishing.
Claims (5)
1. the accurate milling throwing wheel mechanical device that attenuated polishing is used is characterized in that, comprising:
One overcoat, this overcoat comprises:
One upper strata ring body;
One lower floor's ring body, fixedly connected between this upper strata ring body and the lower floor's ring body by a plurality of connecting rods;
One middle level, this middle level are circular lamellar body, this middle level be positioned at the upper strata ring body the below, be fixed on the inboard of a plurality of connecting rods, this middle level position intermediate is equipped with a stop;
Cover in one, cover comprises in this:
One upper connector, this upper connector are a collar plate shape;
One base, this base are a collar plate shape, and the center of this base has a hole, and be fixedly connected by a plurality of joint pins between this base and the upper connector;
Should interiorly overlap the inside that is positioned at overcoat, and link with overcoat;
One micro slide, this micro slide are a lamellar body, and this micro slide is arranged in the below of base of cover, and with interior cover in the base interlock.
2. the accurate milling throwing wheel mechanical device that attenuated polishing according to claim 1 is used is characterized in that the quantity of a plurality of connecting rods in the wherein said overcoat is 3-5, and this connecting rod is that even distributed weight is identical.
3. the accurate milling throwing wheel mechanical device that attenuated polishing according to claim 1 is used is characterized in that, wherein said overcoat is the one processing and fabricating.
4. the accurate milling throwing wheel mechanical device that attenuated polishing according to claim 1 is used is characterized in that, the quantity of a plurality of joint pins in the wherein said interior cover is 3-5, and this joint pin is that even distributed weight is identical.
5. the accurate milling throwing wheel mechanical device that attenuated polishing according to claim 1 is used is characterized in that, the lower edge of the lower floor's ring body in the wherein said overcoat has the identical gap of a plurality of equally distributed shapes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100646945A CN101269478B (en) | 2007-03-23 | 2007-03-23 | Accurate milling buffing head mechanical device for attenuated polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100646945A CN101269478B (en) | 2007-03-23 | 2007-03-23 | Accurate milling buffing head mechanical device for attenuated polishing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101269478A CN101269478A (en) | 2008-09-24 |
| CN101269478B true CN101269478B (en) | 2010-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100646945A Expired - Fee Related CN101269478B (en) | 2007-03-23 | 2007-03-23 | Accurate milling buffing head mechanical device for attenuated polishing |
Country Status (1)
| Country | Link |
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| CN (1) | CN101269478B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0534108A1 (en) * | 1991-09-24 | 1993-03-31 | Peter Wolters Ag | Method for one-sided surface making of workpieces |
| US6176767B1 (en) * | 1997-07-04 | 2001-01-23 | Lidkoping Machine Tools Ab | Double face abrading machine |
| CN2424875Y (en) * | 2000-04-21 | 2001-03-28 | 黄威丰 | Lapping mechanism of lapping machine |
| US7022001B2 (en) * | 2004-01-15 | 2006-04-04 | Fujikoshi Machinery Corp. | Polishing apparatus |
| CN201009162Y (en) * | 2007-03-23 | 2008-01-23 | 中国科学院半导体研究所 | Accurate milling throwing wheel mechanical device for attenuated polishing |
-
2007
- 2007-03-23 CN CN2007100646945A patent/CN101269478B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0534108A1 (en) * | 1991-09-24 | 1993-03-31 | Peter Wolters Ag | Method for one-sided surface making of workpieces |
| US6176767B1 (en) * | 1997-07-04 | 2001-01-23 | Lidkoping Machine Tools Ab | Double face abrading machine |
| CN2424875Y (en) * | 2000-04-21 | 2001-03-28 | 黄威丰 | Lapping mechanism of lapping machine |
| US7022001B2 (en) * | 2004-01-15 | 2006-04-04 | Fujikoshi Machinery Corp. | Polishing apparatus |
| CN201009162Y (en) * | 2007-03-23 | 2008-01-23 | 中国科学院半导体研究所 | Accurate milling throwing wheel mechanical device for attenuated polishing |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2001-293656A 2001.10.23 |
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| Publication number | Publication date |
|---|---|
| CN101269478A (en) | 2008-09-24 |
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Granted publication date: 20100623 Termination date: 20120323 |