CN101262742A - Method for making printed circuit board and etched half-finished circuit board - Google Patents
Method for making printed circuit board and etched half-finished circuit board Download PDFInfo
- Publication number
- CN101262742A CN101262742A CNA2008100275297A CN200810027529A CN101262742A CN 101262742 A CN101262742 A CN 101262742A CN A2008100275297 A CNA2008100275297 A CN A2008100275297A CN 200810027529 A CN200810027529 A CN 200810027529A CN 101262742 A CN101262742 A CN 101262742A
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- wiring board
- board
- etching
- circuit board
- copper
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Abstract
The invention discloses a method for manufacturing a printed wiring board and an etched semi-finished wiring board. The method at least comprises the steps as follows: a. exposing; b. developing: a protective film is caused to form on each unit plate of the wiring board, and the protective film forms a circuit pattern, protective films are also caused to form on at least some parts of connection areas between the unit plates and frame areas of the wiring board; c. etching: an erosion nozzle sprays erosive liquid to the wiring board to erode an exposed base copper on the wiring board, and circuit patterns are etched on the unit plates of the wiring board while at least some part of the base copper in the frame areas of the wiring board and the connection areas between the unit plates is reserved; by adopting the method, the base copper is still reserved on the surfaces of two sides of either the connection areas or the frame areas of the etched semi-finished wiring board so as to form an reinforced copper block. In the etching and follow-up procedures of the wiring board, the strength and rigidity of the wiring board are improved, with low breakdown rate and high product qualification rate.
Description
Technical field
The present invention relates to a kind of manufacture method of printed wiring board and the half-finished circuit board after the etching.
Background technology
At present each electronic product constantly develops to low-power consumption, multi-functional, high reliability direction; and the size of product constantly is being tending towards miniaturization; even it is microminiaturized; in the course of processing of various electronic products; often can use printed wiring board; wiring board plays a part very crucial as the carrier of electronic devices and components.In order to satisfy wiring board high density, the high number of plies and thin thickness requirement, adopt thin core material in the manufacturing process, the thickness that should approach central layer is significantly less than conventional central layer lower limit 0.13mm, be thinned to 0.05-0.10mm, thin central layer in the structure of first being processed as shown in Figure 1, it comprises dielectric layer 5 and top layer base copper 2, and central layer thickness is thin more, and is then soft more; Wiring board needs promptly by the spray chemicals not protected film to be picked up the basic copper corrosion that covers and fall, and form line pattern through internal layer etching work step in the manufacturing process of internal layer chip.
When the thickness of dielectric layers of central layer is lower than 0.13mm, development, etching in the internal layer graphic making process of wiring board and move back the film difficulty that becomes very, in the particularly present processing technology, basic copper with the zone beyond the circuitous pattern all erodes in the circuit board, make central layer become more soft, through etching and thereafter during work step, very easily by the hydraulic shock of the spray of high pressure, be crimped onto in the roller and go, cause product rejection.This shows that in the course of processing of thin central layer, technology adds man-hour routinely, thin central layer very easily is damaged, and its qualification rate is very low.
Summary of the invention
The object of the present invention is to provide the manufacture method of the higher printed wiring board of a kind of qualification rate and the half-finished circuit board after the etching.
The present invention is achieved through the following technical solutions:
A kind of manufacture method of printed wiring board, this method comprises the steps: at least
A. exposure;
B. develop, make on each cell board of wiring board and form diaphragm, this diaphragm forms circuit pattern, and the frame region that makes join domain between each cell board and wiring board also forms diaphragm to small part;
C. etching, the corrosion nozzle corrodes to the basic copper that wiring board ejection corrosive liquid exposes on to wiring board, etches circuit pattern on the cell board of wiring board, and basic copper to the small part of the join domain between the frame region of wiring board, each cell board keeps.
In the etching process of wiring board, corrosive liquid corrodes the part base copper on the cell board and form circuit on cell board, and in the etching process of traditional handicraft, also need the basic copper corrosion in join domain and the frame region is fallen, the intensity of wiring board and rigidity are all significantly reduced; And of manufacture method maximum of the present invention is not both: in etching process, basic copper to small part in wiring board join domain, the frame region keeps, improve the intensity and the rigidity of wiring board, the change of wiring board in the course of processing of avoiding of maximum possible rolled over and distortion, improved the product percent of pass in the wiring board course of processing; Be implemented in the etching process, the basic copper reservation with join domain, frame region then needs exposure, developing process are adjusted accordingly, as in developing process, needs all form diaphragm in join domain, frame region.
The further improvement of manufacture method of the present invention is:
In above-mentioned c step, described wiring board places on the roller and motion rearward, and its longitudinal axis becomes angle of inclination (optional 25 degree in its angle of inclination are to 65 degree) with respect to the direction of motion.In etching process, corrosive liquid increases gradually to the impulsive force of wiring board, avoids the moment impact to wiring board, with the qualification rate of further raising product.
Half-finished circuit board after a kind of etching, this wiring board is provided with at least two cell boards, and the basic copper that keeps in the cell board both side surface forms circuit pattern; Zone on this wiring board, between each cell board is a join domain, and the periphery of this wiring board is a frame region, and the join domain of this half-finished circuit board, frame region one of them both side surface at least still remain with basic copper and form the reinforcement copper billet.
The further structure of this half-finished circuit board is:
The both side surface of described join domain and frame region all keeps basic copper and forms the reinforcement copper billet respectively.Be that the join domain of wiring board and the equal intensity of frame region, rigidity all are improved.
Each strengthens copper billet is a plurality of, and the clearance space between a plurality of reinforcement copper billets is a separate slot.After separate slot is set, to make things convenient for the processing of the follow-up work step of wiring board, as in follow-up pressing work step, each wiring board bonds by the semi-solid preparation resin, when bonding, avoids frame region and join domain bonding too tight, be unfavorable for subsequent treatment, separate slot also helps the semi-solid preparation resin flow.
The described copper billet of respectively strengthening is circular slab or rectangular slab.
Described reinforcement copper billet is measure-alike, and the uniform arrangement of each described reinforcement copper billet.
In the both side surface of described wiring board, wherein the edge of the described reinforcement copper billet on the side surface is positioned at the center of the above reinforcement copper billet of opposite side surface.Be the setting of staggering mutually of the reinforcement copper billet of two side surfaces of wiring board, avoid having influence on the intensity and the rigidity of wiring board join domain, frame region owing to the setting of separate slot.
Description of drawings
Fig. 1 is the sectional drawing of thin central layer in first being processed;
Fig. 2 is the flow chart of manufacture method of the present invention;
Fig. 3 is the placement location schematic diagram of wiring board in etching process;
Fig. 4 is the composition that hardens of the described circuit after the etching;
Fig. 5 is the enlarged drawing at A place among Fig. 4;
Fig. 6 is the enlarged drawing of the back surface at A place among Fig. 4;
Fig. 7 is the perspective enlarged drawing at A place among Fig. 4;
Description of reference numerals:
1, cell board, 2, basic copper, 3, frame region, 4, join domain, 5, dielectric layer, 6, strengthen copper billet, 7, dividing plate.
Embodiment
As Fig. 2, shown in Figure 3, a kind of manufacture method of printed wiring board comprises the steps: at least
A. exposure;
B. develop, make on each cell board 1 of wiring board and form diaphragm, this diaphragm forms circuit pattern, and the frame region 3 that makes join domain 4 between each cell board 1 and wiring board also forms diaphragm to small part;
C. etching, the corrosion nozzle corrodes to the basic copper that wiring board ejection corrosive liquid exposes on to wiring board, on the cell board 1 of wiring board, etch the circuit pattern (not shown), and the basic copper of the join domain 4 between the frame region 3 of wiring board, each cell board 1 partly keeps, in etching process, wiring board places on the roller and motion rearward, and its longitudinal axis becomes the angle of inclination of 30 degree with respect to the direction of motion.
Extremely shown in Figure 7 by the circuit board structure after the said method etching such as Fig. 4:
Half-finished circuit board after a kind of etching, this wiring board are provided with a plurality of cell boards 1, and the basic copper that keeps in cell board 1 both side surface forms circuit pattern; Zone on this wiring board, between each cell board 1 is a join domain 4, and the periphery of this wiring board is a frame region 3, and the join domain 4 of this half-finished circuit board and the both side surface of frame region 3 still remain with basic copper and form reinforcement copper billet 6.
Wherein, each strengthens copper billet 6 for a plurality of and measure-alike, rectangular, each strengthens copper billet 6 uniform arrangements, clearance space therebetween is a separate slot 7, and in the both side surface of wiring board, wherein the edge of the reinforcement copper billet 6 on the side surface is positioned at the center of strengthening copper billet 6 on the opposite side surface.
Among the present invention, in the etching process of wiring board, join domain 4 and frame region 3 are etched separate slot 7, and reserve part base copper and form and strengthen copper billet 6, the bulk strength and the rigidity of the wiring board in the course of processing are improved, be difficult for bending, distortion, the probability of damaging in the product processing is little, the qualification rate height also avoids wiring board to produce the bending distortion in follow-up work step (as the blown film work step); Simultaneously in etching process, place wiring board on the roller and the longitudinal axis that makes wiring board becomes the angles of inclination of 30 degree with respect to its moving direction, reduced the moment impact of wiring board when etching.
Claims (9)
1, a kind of manufacture method of printed wiring board is characterized in that, this method comprises the steps: at least
A. exposure;
B. develop, make on each cell board of wiring board and form diaphragm, this diaphragm forms circuit pattern, and the frame region that makes join domain between each cell board and wiring board also forms diaphragm to small part;
C. etching, the corrosion nozzle corrodes to the basic copper that wiring board ejection corrosive liquid exposes on to wiring board, etches circuit pattern on the cell board of wiring board, and basic copper to the small part of the join domain between the frame region of wiring board, each cell board keeps.
2, the manufacture method of printed wiring board according to claim 1 is characterized in that, in above-mentioned c step, described wiring board places on the roller and motion rearward, and its longitudinal axis becomes the angle of inclination with respect to the direction of motion.
As the manufacture method of printed wiring board as described in the claim 3, it is characterized in that 3, described angle of inclination is that 25 degree are to 65 degree.
4, the half-finished circuit board after a kind of etching, this wiring board is provided with at least two cell boards, and the basic copper that keeps in the cell board both side surface forms circuit pattern; Zone on this wiring board, between each cell board is a join domain, the periphery of this wiring board is a frame region, it is characterized in that the join domain of this half-finished circuit board, frame region one of them both side surface at least still remain with basic copper and form the reinforcement copper billet.
5, as the half-finished circuit board after the etching as described in the claim 4, it is characterized in that the both side surface of described join domain and frame region all keeps basic copper and forms the reinforcement copper billet respectively.
6, as the half-finished circuit board after the etching as described in claim 4 or 5, it is characterized in that each strengthens copper billet is a plurality of, the clearance space between a plurality of reinforcement copper billets is a separate slot.
7, as the half-finished circuit board after the etching as described in the claim 6, it is characterized in that the described copper billet of respectively strengthening is circular slab or rectangular slab.
8, as the half-finished circuit board after the etching as described in the claim 6, it is characterized in that described reinforcement copper billet is measure-alike, and the uniform arrangement of each described reinforcement copper billet.
As the half-finished circuit board after the etching as described in the claim 8, it is characterized in that 9, in the both side surface of described wiring board, wherein the edge of the described reinforcement copper billet on the side surface is positioned at the opposite side surface the above strengthens the center of copper billet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100275297A CN101262742A (en) | 2008-04-18 | 2008-04-18 | Method for making printed circuit board and etched half-finished circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100275297A CN101262742A (en) | 2008-04-18 | 2008-04-18 | Method for making printed circuit board and etched half-finished circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101262742A true CN101262742A (en) | 2008-09-10 |
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ID=39962874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100275297A Pending CN101262742A (en) | 2008-04-18 | 2008-04-18 | Method for making printed circuit board and etched half-finished circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101262742A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101959371A (en) * | 2010-05-27 | 2011-01-26 | 世达普(苏州)通信设备有限公司 | Manufacture method for ensuing integrated manufacture structure and dimension of printed circuit board |
| CN105722330A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Manufacturing method for metal line layer, and circuit board |
| CN106163118A (en) * | 2016-07-18 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | Thin plate production and processing method |
| CN111242587A (en) * | 2020-01-21 | 2020-06-05 | 广州兴森快捷电路科技有限公司 | Method, device, equipment and storage medium for compiling product process flow |
-
2008
- 2008-04-18 CN CNA2008100275297A patent/CN101262742A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101959371A (en) * | 2010-05-27 | 2011-01-26 | 世达普(苏州)通信设备有限公司 | Manufacture method for ensuing integrated manufacture structure and dimension of printed circuit board |
| CN105722330A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Manufacturing method for metal line layer, and circuit board |
| CN106163118A (en) * | 2016-07-18 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | Thin plate production and processing method |
| CN111242587A (en) * | 2020-01-21 | 2020-06-05 | 广州兴森快捷电路科技有限公司 | Method, device, equipment and storage medium for compiling product process flow |
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Open date: 20080910 |