CN102573335B - The method of initial layer core veneer - Google Patents

The method of initial layer core veneer Download PDF

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Publication number
CN102573335B
CN102573335B CN201010620353.3A CN201010620353A CN102573335B CN 102573335 B CN102573335 B CN 102573335B CN 201010620353 A CN201010620353 A CN 201010620353A CN 102573335 B CN102573335 B CN 102573335B
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layer
support plate
core veneer
described
initial
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CN201010620353.3A
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Chinese (zh)
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CN102573335A (en
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苏新虹
朱兴华
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北大方正集团有限公司
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Abstract

The present invention provides the manufacture method of a kind of initial layer core veneer, wherein, including: on support plate, prepare at least one of which Seed Layer, at least one of which line layer, copper post layer and prepreg lamination, obtain initial layer core veneer;Described initial layer core veneer is separated with described support plate;Described support plate is made up of rustless steel or aluminium alloy or titanium alloy.The manufacture method of the initial layer core veneer that the present invention provides, by selecting the support plate of the stainless steel of surface finish, the roughness height on the support plate surface avoiding material to be copper affects the quality of line layer, advantageously reduce the thickness of Seed Layer, reduce the manufacturing cost of initial layer core veneer, support plate and initial layer core veneer is separated again, it is to avoid cause the lateral erosion to line layer when separating support plate and initial layer core veneer by etching, thus improve the yield rate of initial layer core veneer by ultrasound wave isolation technics.

Description

The method of initial layer core veneer

Technical field

The present invention relates to manufacture the technical field of printed circuit board (PCB), rise in particular it relates to a kind of The method of beginning layer central layer and for making the support plate of circuit board initial layer core veneer.

Background technology

The fast development of electronic technology makes the integrated level of semiconductor device more and more higher, makes envelope Dress substrate is gradually developed to multi-layer sheet by lamina, such as High density of PCB (printed circuit board (PCB)) Base plate for packaging.In order to improve the integrated level of PCB base plate for packaging, employing interlayer interconnection technique will Multi-layer sheet connects, to obtain more available layout area in limited space.

At present, the method making PCB base plate for packaging includes core Layer increasing method and seedless increasing layer Method.But, utilize have that core Layer increasing method makes to have the thickness of core base plate for packaging thicker, unfavorable In base plate for packaging to highly integrated development.And, when needs processing thickness is below 60 μm When having core base plate for packaging, its yield rate is relatively low.Therefore, in actual applications, extensively adopt Base plate for packaging is made with seedless Layer increasing method.

Seedless Layer increasing method is to make one or more layers line layer on initial layer core veneer surface, thus Form base plate for packaging.The concrete manufacturing process of initial layer core veneer is as follows: initially with galvanizer Skill makes one layer of nickel dam as protective layer on copper support plate surface;Then at the surface of nickel dam electricity Plate one layer of copper film Seed Layer;Recycling image transfer method electroplates initial plant on the seed layer Layer and interlayer copper post layer;Carry out the most successively being laminated, nog plate, Seed Layer sputter coating, Seed Layer plating and the plating of nickel protection layer;Finally by the method etched by copper support plate and guarantor Sheath is got rid of, thus obtains the initial layer core veneer for coreless package substrate.Image shifts Mainly comprising the processes of when manufacture semiconductor chip of method, first covers one layer on substrate and does Film, such as photoresistance etc., is then exposed dry film, developing obtains circuit pattern, then at electricity Electroplate the metals such as a floor copper, aluminum or gold on the pattern of road, then remove dry film, so that it may obtain by The circuit connected according to the shape of circuit pattern.

But, use above-mentioned technique to have the disadvantage in that when making initial layer core veneer

First, due to the nickel dam protection that copper support plate surface roughness is high and electroplating technology makes There is nickel dam and dredge hole problem in layer, causes nickel layer protection layer that line layer cannot be completely covered, After chemical etching copper support plate technique time, easily cause line layer breach, thus cause initiateing Scrapping of layer central layer;

Second, the Seed Layer needing plating is thicker, about in 5-7 μm, and needs etching Number of times is more, easily causes the lateral erosion (Undercut) of line layer, causes the width of line layer not Easy-peel control, is susceptible to the problem that line layer is peeled off;

3rd, the cost of manufacture of initial layer core veneer is higher, and then causes whole base plate for packaging Cost of manufacture is higher.

Summary of the invention

For solving the problems referred to above, the present invention provides the manufacture method of a kind of initial layer core veneer, uses The problem that the yield rate of initial layer core veneer is low in prior art, cost is high.

To this end, the present invention provides the manufacture method of a kind of initial layer core veneer, wherein, including: Support plate is prepared at least one of which Seed Layer, at least one of which line layer, copper post layer and half Cured sheets lamination, obtains initial layer core veneer;

Described initial layer core veneer is separated with described support plate;

Described support plate is made up of rustless steel or aluminium alloy or titanium alloy.

Preferably, the thickness of the first sublayer described is 1.8-2.2 μm, preferably 2.0 μm;With/ Or the thickness of described the second sublayer is in 0.8-1.2 μm, preferably 1.0 μm.

Preferably, described separation with described support plate by described initial layer core veneer includes:

Ultrasound wave is utilized to be separated with described support plate by described initial layer core veneer.

Preferably, in described the first sublayer, initial prepared on the support plate of stainless steel Also include before line layer, copper post layer, prepreg lamination and the second sublayer:

Described support plate is processed by shot blasting, and preferably makes the roughness of described support plate exist Between 0.01-0.1mm.

Preferably, after being used for making described initial layer core veneer, described support plate is through over cleaning After reuse.

Preferably, described support plate is used for lamination treatment.

Preferably, prepreg is covered on the surface of described Seed Layer, line layer and copper post layer Lamination, the height of described prepreg lamination is higher than the height of copper post layer, then to semi-solid preparation Sheet lamination is ground obtaining described prepreg lamination and the plane of copper post layer composition.

Preferably, described half is covered on the surface of described Seed Layer, line layer and copper post layer admittedly Include before changing sheet lamination:

The surface of described Seed Layer, line layer and copper post layer is carried out brown process.

Preferably, by flash, heavy copper, splash, electroplate or evaporation mode is at described support plate Upper the first sublayer prepared in described Seed Layer.

Preferably, by flash, heavy copper, splash, electroplate or be deposited with by the way of described half The second seed in described Seed Layer is prepared in the plane of cured sheets lamination and copper post layer composition Layer.

Present invention also offers a kind of support plate for making circuit board initial layer core veneer, wherein, Described support plate is made up of rustless steel or aluminium alloy or titanium alloy.

The present invention has a following beneficial effect:

In the manufacture method of the initial layer core veneer that the present invention provides, by selecting surface finish The support plate of stainless steel, it is to avoid material is that the roughness height on the support plate surface of copper affects line The quality of road floor, advantageously reduces the thickness of Seed Layer, reduces being manufactured into of initial layer core veneer This, then separate support plate and initial layer core veneer by ultrasound wave isolation technics, it is to avoid by erosion Carve and when separating support plate and initial layer core veneer, cause the lateral erosion to line layer, thus improve initial The yield rate of layer central layer.

Accompanying drawing explanation

The flow process of the manufacture method first embodiment of the initial layer core veneer that Fig. 1 provides for the present invention Figure;

The flow process of manufacture method second embodiment of the initial layer core veneer that Fig. 2 provides for the present invention Figure;

In the manufacture method of the initial layer core veneer that Fig. 3 a-3j provides for the present invention, the section of product shows It is intended to.

Detailed description of the invention

The present invention provides the manufacture method of a kind of initial layer core veneer, it is characterised in that including:

Support plate is prepared at least one of which Seed Layer, at least one of which line layer, copper post layer and half Cured sheets lamination, obtains initial layer core veneer;

Described initial layer core veneer is separated with described support plate;

Described support plate is made up of rustless steel or aluminium alloy or titanium alloy.

Preferably, in the various embodiments of the invention,

The thickness of the first sublayer described is 1.8-2.2 μm, preferably 2.0 μm;And/or

The thickness of described the second sublayer in 0.8-1.2 μm, preferably 1.0 μm.

Preferably, in the various embodiments of the invention, described by described initial layer core veneer and institute State support plate separation to include: utilize ultrasound wave to be separated with described support plate by described initial layer core veneer.

Preferably, in the various embodiments of the invention, at the described support plate at stainless steel Upper prepare the first sublayer, Originating Line layer, copper post layer, prepreg lamination and the second Also include before sublayer: described support plate is processed by shot blasting, and preferably make described support plate Roughness between 0.01-0.1mm.

Preferably, in the various embodiments of the invention, described initial layer core veneer is made being used for Afterwards, described support plate is reused after over cleaning.

Preferably, in the various embodiments of the invention, described support plate is used for lamination treatment.

Preferably, in the various embodiments of the invention, at described Seed Layer, line layer and copper The surface of post layer covers prepreg lamination, and the height of described prepreg lamination is higher than copper post The height of layer, be then ground prepreg lamination obtaining described prepreg lamination and The plane of copper post layer composition.

Preferably, in the various embodiments of the invention, at described Seed Layer, line layer and copper The surface of post layer includes before covering described prepreg lamination: to described Seed Layer, circuit The surface of layer and copper post layer carries out brown process.

Preferably, in the various embodiments of the invention, by flash, heavy copper, splash, electricity Plating or evaporation mode prepare the first sublayer in described Seed Layer on described support plate.

Preferably, in the various embodiments of the invention, by flash, heavy copper, splash, electricity The mode of plating or evaporation is prepared in the plane that described prepreg lamination and copper post layer form The second sublayer in described Seed Layer.

Implement the present invention time, except ground floor line layer (and the first sublayer), second Beyond line layer (and the second sublayer), also can set gradually more line layer further (and Seed Layer).

The present invention provides a kind of support plate for making circuit board initial layer core veneer, and its feature exists In, described support plate is made up of rustless steel or aluminium alloy or titanium alloy.

For making those skilled in the art be more fully understood that technical scheme, knot below Close accompanying drawing the manufacture method of the initial layer core veneer that the present invention provides is described in detail.

The flow process of the manufacture method first embodiment of the initial layer core veneer that Fig. 1 provides for the present invention Figure.As it is shown in figure 1, the method for the present embodiment initial layer core veneer comprises the steps:

Step 101, on support plate prepare at least one of which Seed Layer, at least one of which line layer, copper Post layer and prepreg lamination, obtain initial layer core veneer.

In the present embodiment, the support plate 101 of stainless steel processes through mirror finish, is carrying By flash, heavy copper, splash on the upper surface of plate, electroplate or the mode such as evaporation prepares seed The first sublayer in Ceng, the material of the first sublayer can select copper, it is preferable that first The thickness of Seed Layer is about 2 μm.It is stainless support plate by selecting material, and to support plate Surface is processed by shot blasting, makes support plate ground roughness between 0.01-0.1mm, reduces because carrying The rough surface of plate and the phenomenon such as the generation breach of first line layer that causes or fracture, meanwhile, The support plate of surface finish is also beneficial to initial layer core veneer and separates from support plate.

In the present embodiment, by image transfer method prepare Originating Line layer in line layer and The copper post layer connected for interlayer, then to the first sublayer, Originating Line layer and copper post layer Surface carry out brown process, the surface overlying of each line layer processed through brown the most again Cover one layer of prepreg lamination, then through lamination treatment, then grind prepreg lamination, Lamination treatment is for improving the compactness between each metal level, it is to avoid metal liftoff, grinds Process the plane making copper post layer expose and guaranteeing prepreg lamination and copper post layer upper surface composition Smooth, enable follow-up line layer to prepare on flat surface, improve follow-up line layer Yield rate;Again by flash, level sink copper, metal expulsion, electroplate or be deposited with by the way of The second sublayer in plating sublayer on prepreg lamination with the plane of copper post layer composition, The thickness of the second sublayer is about 0.8-1.2 μm, preferably 1.0 μm;The most again by figure In the first sublayer, prepare the secondary wire layer in line layer as transfer method, thus had There is the initial layer core veneer of two-layer line layer.

Repeat above-mentioned step, the initial layer core veneer of available more line layers.

Step 102, initial layer core veneer is separated with support plate.

Separate initial layer core veneer with support plate to obtain independent initial layer core veneer.The present embodiment In, can by the method for the non-etched such as ultrasound wave isolation technics separate initial layer core veneer with Support plate, ultrasound wave separation initial layer core veneer and support plate advantageously reduce the manufacture of initial layer core veneer During etching number of times, it is to avoid occur repeatedly etch the serious lateral erosion that line layer is caused (Undercut), such that it is able to improve quality and the stability of each line layer.Divide with initial sandwich layer Support plate after from can be reused after the washing, and support plate can be also used at lamination Reason, thus also save cost.

In actual applications, support plate can use the metal material that compactness is high to prepare, example As used the materials such as rustless steel, titanium alloy or aluminium alloy to prepare, the material that above-mentioned compactness is high The thin hole problem of copper support plate can be prevented effectively from.

The present embodiment is by selecting the support plate of the stainless steel of surface finish, it is to avoid material is The roughness on the support plate surface of copper is high and affects the quality of line layer, advantageously reduces Seed Layer Thickness, reduce the cost of manufacture of initial layer core veneer, then divided by ultrasound wave isolation technics From support plate and initial layer core veneer, it is to avoid make when separating support plate and initial layer core veneer by etching The lateral erosion of paired transmission line layer, thus improve the yield rate of initial layer core veneer.

The flow process of manufacture method second embodiment of the initial layer core veneer that Fig. 2 provides for the present invention Figure.As Fig. 2 shows, the method for the present embodiment initial layer core veneer comprises the steps:

Step 201, on support plate, prepare the first sublayer.

In the manufacture method of the initial layer core veneer that Fig. 3 a-3j provides for the present invention, the section of product shows It is intended to.Refering to Fig. 3 a, in the present embodiment, the support plate 101 of stainless steel is through minute surface Polishing, smooth surface;Refering to Fig. 3 b, flash, heavy on the upper surface of support plate 101 The first sublayer in Seed Layer is prepared in copper, splash, the preventing and treating electroplating or be deposited with on support plate 201, the first sublayer 201 material for copper, the thickness of the first sublayer 201 is in 1.8-2.2 μm Between, preferably 2 μm, meanwhile, the lower surface at support plate 101 covers one layer of dry film 202 As anti-plate protective layer, dry film 202 can be photoresist, subsequently into step 102.

Step 202, in the first sublayer, prepare Originating Line layer;

Refering to Fig. 3 c, cover one layer of dry film by image transfer method in the first sublayer 201, The dry film 302 with Originating Line layer pattern is obtained after overexposure, development, the most again first Originating Line layer 301 in electroplating line layer in Seed Layer 201, subsequently into step 203.

Step 203, prepares copper post layer on Originating Line layer.

Refering to Fig. 3 d and Fig. 3 e, at initial electric line layer 301 and the table of the first sublayer 201 One layer of dry film is covered, then by obtaining that there is copper post layer pattern after exposure, development on face Dry film 402, then on copper post layer pattern, electro-coppering obtains copper post layer 401, then by dry film 302 Remove with dry film 402 etching, enter step 204.

Step 204, each sandwich circuit layer on support plate is laminated, milled processed.

In this step, refering to Fig. 3 f and Fig. 3 g, first to the first sublayer 201 on support plate, Originating Line layer 301 and copper post layer 401 carry out brown and process to improve its surface roughness, When brown processes, it will etch into the first sublayer 201, Originating Line layer 301 and copper post layer The copper on 401 surfaces, the thickness of etch copper should control in 0.7-1.0 μm;Then at First Line Cover a floor prepreg lamination 601 on the floor of road and carry out lamination treatment, then grinding half solid Changing sheet lamination, milled processed makes copper post layer expose and guarantees prepreg lamination 601 and copper post The coplanar flat of layer 401 upper surface composition, wherein, prepreg lamination 601 both ensures to plant Sublayer 201, isolation between Originating Line layer 301 and follow-up line layer, can make again follow-up Line layer can prepare on flat surface and be fully contacted, after raising with copper post layer 401 The yield rate of continuous line layer.

Step 205, preparation second on prepreg lamination with the flat surface of copper post layer composition Seed Layer.

Refering to Fig. 3 h, at the flat surface of prepreg lamination 601 with copper post layer 401 composition On by flash, heavy copper (Plating Through Hole, PTH) or splash (Sputer), plating Or evaporation mode prepare the second sublayer 801, the thickness of the second sublayer 801 exists Between 0.8-1.2 μm, preferably 1.0 μm.

Step 206, in the second sublayer prepare secondary wire layer.

Refering to Fig. 3 i, prepare secondary wire layer by image transfer method in the second sublayer 801 901, thus on support plate 101, prepare initial layer core veneer 111.

Repeat the above steps, can prepare the initial layer core veneer of more line layer.

Step 207, support plate is separated with initial layer core veneer.

In the present embodiment, refering to Fig. 3 j, can be by non-etched such as ultrasound wave isolation technics Initial layer core veneer 111 and support plate 101 are separated by mode, thus reduce and preparing initial layers core Etching number of times during plate 111.

The present embodiment, by selecting the support plate of for example, stainless steel of surface finish, prevents Thin hole phenomenon, it is to avoid material is that the roughness height on the support plate surface of copper affects line layer Quality, decreases the thickness of Seed Layer simultaneously, reduces cost, then is separated by ultrasound wave Technology separates support plate and initial layer core veneer, it is to avoid separate support plate and initial layers by etching Cause the serious lateral erosion to line layer during central layer, thus improve the quality of initial layer core veneer.

Present invention also offers a kind of support plate for making circuit board initial layer core veneer, support plate Consistency high, the thin hole problem of support plate can be prevented effectively from, support plate can be aluminium alloy load Plate, titanium alloy support plate and rustless steel support plate etc..Preferably, the roughness of support plate exists Between 0.01-0.1mm, it is easy to make support plate with initial by non-etched technology such as ultrasonic technologies Layer central layer separates.

It is understood that the principle that is intended to be merely illustrative of the present of embodiment of above and The illustrative embodiments used, but the invention is not limited in this.For in this area Those of ordinary skill for, without departing from the spirit and substance in the present invention, can To make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.

Claims (10)

1. the manufacture method of an initial layer core veneer, it is characterised in that including:
Support plate is prepared at least one of which Seed Layer, at least one of which line layer, copper post layer and half Cured sheets lamination, obtains initial layer core veneer;Described Seed Layer includes the first sublayer and second Seed Layer, the thickness of the first sublayer described is 1.8-2.2 μm;
Ultrasound wave is utilized to be separated with described support plate by described initial layer core veneer;
Described support plate is made up of aluminium alloy or titanium alloy.
The manufacture method of initial layer core veneer the most according to claim 1, it is characterised in that
The thickness of the first sublayer described is 2.0 μm;
The thickness of described the second sublayer is in 0.8-1.2 μm.
The manufacture method of initial layer core veneer the most according to claim 1, it is characterised in that Prepared by the support plate of described aluminium alloy or titanium alloy material the first sublayer, Originating Line layer, Also include before copper post layer, prepreg lamination and the second sublayer:
Described support plate is processed by shot blasting, and makes the roughness of described support plate exist Between 0.01-0.1mm.
The manufacture method of initial layer core veneer the most according to claim 1, it is characterised in that After being used for making described initial layer core veneer, described support plate is reused after over cleaning.
The manufacture method of initial layer core veneer the most according to claim 1, it is characterised in that
Described support plate is used for lamination treatment.
The manufacture method of initial layer core veneer the most according to claim 1, it is characterised in that
Prepreg lamination, institute is covered on the surface of described Seed Layer, line layer and copper post layer State the height height higher than copper post layer of prepreg lamination, then prepreg lamination is entered Row grinds and obtains described prepreg lamination and the plane of copper post layer composition.
The manufacture method of initial layer core veneer the most according to claim 1, it is characterised in that Before the surface of described Seed Layer, line layer and copper post layer covers described prepreg lamination Including:
The surface of described Seed Layer, line layer and copper post layer is carried out brown process.
The manufacture method of initial layer core veneer the most according to claim 1, it is characterised in that:
Prepared on described support plate by flash, heavy copper, splash, plating or evaporation mode The first sublayer in described Seed Layer.
The manufacture method of initial layer core veneer the most according to claim 1, it is characterised in that
At described prepreg by the way of flash, heavy copper, splash, plating or evaporation The second sublayer in described Seed Layer is prepared in the plane of lamination and copper post layer composition.
10. the initial layers that the manufacture method that a kind uses described in any one of claim 1-9 makes Central layer.
CN201010620353.3A 2010-12-23 2010-12-23 The method of initial layer core veneer CN102573335B (en)

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CN106961808B (en) * 2017-02-20 2019-09-10 宁波华远电子科技有限公司 The production method of sunk type high density interconnecting board
CN109788664A (en) * 2017-11-14 2019-05-21 何崇文 A kind of circuit base plate and preparation method thereof

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