CN101255579A - Method for manufacturing hollow out multiple-layer gold ornaments - Google Patents
Method for manufacturing hollow out multiple-layer gold ornaments Download PDFInfo
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- CN101255579A CN101255579A CNA2007100733958A CN200710073395A CN101255579A CN 101255579 A CN101255579 A CN 101255579A CN A2007100733958 A CNA2007100733958 A CN A2007100733958A CN 200710073395 A CN200710073395 A CN 200710073395A CN 101255579 A CN101255579 A CN 101255579A
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Abstract
The invention relates to a preparation method hollowing out multi-layer gold ornamental article, comprising the steps of: manufacturing a mould of each structure; manufacturing a wax vent having innermost structure pattern on an outer surface by an innermost structure mould; coating a conductive layer on the wax vent, eliminating manually the conductive layer of non-gold material portion on the wax vent after electroform; dipping the wax vent into the gold compound solution, processing product electroforming molding taking the conducting layer of the wax vent as plated anode; picking up the semi-product, processing an outer surface of the electroforming gold layer of the semi-product; manufacturing a wax layer having innermost structure pattern on an outer surface by the semi-product with an outer surface processed in adjacent next mould, repeating the steps of manufacturing the conductive layer, electroforming, surface process to obtain a new layer of electroforming layer, repeating the step to obtain number of layer needed by the product; heating the product to eliminate wax. The invention fills technical blank for gold manufacturing technology, accomplishes hollowing out multi-layer gold ornamental article with complex structure and guarantees precision and perfection of product.
Description
Technical field
The present invention relates to a kind of gold ornament manufacture method, be specifically related to a kind of hollow out multiple-layer gold ornaments manufacture method.
Background technology
In the gold ornament manufacturing technology, the hollow out multiple-layer gold ornaments of ecto-entad suit is a technical barrier always, does not find to make the processing method of hollow out multiple-layer gold ornaments so far as yet, makes this class hollow out multiple-layer gold ornaments to make.
Summary of the invention
The technical problem to be solved in the present invention is, a kind of hollow out multiple-layer gold ornaments manufacture method is provided, and fills up the blank of prior art.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of hollow out multiple-layer gold ornaments manufacture method, it is characterized in that, comprise following layout:
S1, each layer of making product structure mold;
S2, make the wax core that outside surface has product innermost layer structure plan with the innermost layer structure mold;
S3, on the wax core coated with conductive layer, the conductive layer of no gold material part after the electroforming on the manual removal wax core;
S4, the wax core being immersed in the gold compound solution, is that electroplating cathode carries out the product electrotyping forming with wax core conductive layer;
S5, taking-up work in-process are handled a half-finished electroforming gold layer outside surface;
Make the wax layer that outside surface has the electroforming pattern in S6, the mould with the work in-process one deck under adjacent after the outside surface processing, repeating step S3, S4, S5 obtain new one deck electroformed layer; Repeating step S6 obtains the product number of plies of needs;
S7, heating products paraffin removal.
In hollow out multiple-layer gold ornaments manufacture method of the present invention, described conductive layer is that gold compound solution, silver compound solution or copper compound solution are coated in the wax core or wax layer outside surface after drying forms.
In hollow out multiple-layer gold ornaments manufacture method of the present invention, described gold compound solution is potassium auric cyanide solution.
In hollow out multiple-layer gold ornaments manufacture method of the present invention, metal compound solution beyond described conductive layer adopts gold is coated in wax core or wax layer outside surface after drying when forming, and also comprises the step of the conductive layer of removing each electroformed layer internal surface after the described step S7.
In hollow out multiple-layer gold ornaments manufacture method of the present invention, the step of the conductive layer of each electroformed layer internal surface of described removal is taken out described product after dissolving fully for the solution of described product being put into this conductive layer metal of dissolving but not dissolving gold again.
In hollow out multiple-layer gold ornaments manufacture method of the present invention, " the half-finished electroforming gold of electroforming layer outside surface being handled " among the described step S5 is inferior optical processing of sandblast or polished finish.
Implement hollow out multiple-layer gold ornaments manufacture method of the present invention, compared with the prior art, its beneficial effect is:
1, filled up the technological gap that hollow out multiple-layer gold ornaments in the gold ornament manufacturing technology is made, hollow out multiple-layer gold ornaments that can the implementation structure complexity is made;
2, guarantee the accuracy of each layer of hollow out multiple-layer gold ornaments structure by mould, every layer of structure once shaped in electroforming finished, and guaranteed the accurate perfection of product.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the schema of a kind of embodiment of hollow out multiple-layer gold ornaments manufacture method of the present invention.
Embodiment
As shown in Figure 1, hollow out multiple-layer gold ornaments manufacture method of the present invention comprises the steps:
At first, making each layer of product scantlings of the structure sample accurately in advance, is each layer of Modelling product structure mold with each layer of product structure sample.
Then, make the wax core that outside surface has product innermost layer structure plan with the structure mold of innermost layer.
Then, coated with conductive layer on the wax core, the conductive layer of no gold material part after the electroforming on the manual removal wax core.Normally be coated in the wax core outer surface, treat to obtain conductive layer after the solution drying with metal compound solution.Metal compound solution commonly used has gold compound solution (potassium auric cyanide solution), silver compound solution or copper compound solution etc.
Then, the wax core being immersed in the gold compound solution, is that electroplating cathode carries out the product electrotyping forming with wax core conductive layer.
After electrotyping forming is finished, take out work in-process, half-finished electroforming gold layer outside surface handled, make it reach the specification of quality of finished product outside surface.According to the different mass requirement of product external surfaces, product external surfaces is handled and is generally the inferior optical processing of sandblast, polished finish etc.
Then, the work in-process after the outside surface processing are made the wax layer that outside surface has the electroforming pattern in the mould of adjacent one deck down, repeat above-mentioned " system conductive layer ", " electroforming ", " surface treatment " step, obtain new one deck electroformed layer; Repeat the product number of plies that this step obtains needs.
Then, product is heated, remove dewax core and wax layer.Heating temperature should surpass the fusing point of wax, to reach the purpose of paraffin removal.As product is carried out heating bath in 80 ℃ to 100 ℃ hot water.
At last, remove the conductive layer of each electroformed layer internal surface of product.Normally work in-process are put into the solution that dissolves the conductive layer metal but do not dissolve gold, the conductive layer metal is dissolved in the solution fully, then product is taken out.
When the conductive layer metal is when adopting gold compound solution to make, the processing that need not remove conductive layer.
Claims (6)
1. a hollow out multiple-layer gold ornaments manufacture method is characterized in that, comprises following layout:
S1, each layer of making product structure mold;
S2, make the wax core that outside surface has product innermost layer structure plan with the innermost layer structure mold;
S3, on the wax core coated with conductive layer, the conductive layer of no gold material part after the electroforming on the manual removal wax core;
S4, the wax core being immersed in the gold compound solution, is that electroplating cathode carries out the product electrotyping forming with wax core conductive layer;
S5, taking-up work in-process are handled a half-finished electroforming gold layer outside surface;
Make the wax layer that outside surface has the electroforming pattern in S6, the mould with the work in-process one deck under adjacent after the outside surface processing, repeating step S3, S4, S5 obtain new one deck electroformed layer; Repeating step S6 obtains the product number of plies of needs;
S7, heating products paraffin removal.
2. hollow out multiple-layer gold ornaments manufacture method as claimed in claim 1 is characterized in that: described conductive layer is that gold compound solution, silver compound solution or copper compound solution are coated in the wax core or wax layer outside surface after drying forms.
3. hollow out multiple-layer gold ornaments manufacture method as claimed in claim 1 is characterized in that: described gold compound solution is potassium auric cyanide solution.
4. as the described hollow out multiple-layer gold ornaments of one of claim 1 to 3 manufacture method, it is characterized in that: the metal compound solution beyond described conductive layer adopts gold is coated in wax core or wax layer outside surface after drying when forming, and also comprises the step of the conductive layer of removing each electroformed layer internal surface after the described step S7.
5. hollow out multiple-layer gold ornaments manufacture method as claimed in claim 4 is characterized in that: the step of the conductive layer of each electroformed layer internal surface of described removal is taken out described product after dissolving fully for the solution of described product being put into this conductive layer metal of dissolving but not dissolving gold again.
6. hollow out multiple-layer gold ornaments manufacture method as claimed in claim 4 is characterized in that: " the half-finished electroforming gold of electroforming layer outside surface being handled " among the described step S5 is inferior optical processing of sandblast or polished finish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100733958A CN101255579B (en) | 2007-02-26 | 2007-02-26 | Method for manufacturing hollow out multiple-layer gold ornaments |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100733958A CN101255579B (en) | 2007-02-26 | 2007-02-26 | Method for manufacturing hollow out multiple-layer gold ornaments |
Publications (2)
| Publication Number | Publication Date |
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| CN101255579A true CN101255579A (en) | 2008-09-03 |
| CN101255579B CN101255579B (en) | 2010-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007100733958A Active CN101255579B (en) | 2007-02-26 | 2007-02-26 | Method for manufacturing hollow out multiple-layer gold ornaments |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010102516A1 (en) * | 2009-03-11 | 2010-09-16 | Pino Aliprandini (Hk) Limited | Method of manufacturing hard gold jewellery |
| CN102107259A (en) * | 2010-12-08 | 2011-06-29 | 山东梦金园珠宝首饰有限公司 | Method for pouring bowl-shaped ornament |
| CN102274928A (en) * | 2011-07-29 | 2011-12-14 | 林玉成 | Method for manufacturing metal accessory through die-parting formation |
| CN104097445A (en) * | 2013-04-08 | 2014-10-15 | 深圳市福昌科技开发有限公司 | Furnishing piece |
| CN106862870A (en) * | 2017-02-17 | 2017-06-20 | 深圳粤通国际珠宝股份有限公司 | A kind of method for processing noble metal |
| CN108958005A (en) * | 2018-07-14 | 2018-12-07 | 福州珂麦表业有限公司 | A kind of gold wrist-watch batch wreath manufacture craft |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4343684A (en) * | 1980-12-19 | 1982-08-10 | Stanley Lechtzin | Method of electroforming and product |
| US5393405A (en) * | 1993-12-01 | 1995-02-28 | Ultralite Technology Incorporated | Method of electroforming a gold jewelry article |
| EP0727511B1 (en) * | 1995-02-14 | 1998-06-24 | M. YASUI & CO., LTD. | Method of producing hollow electroformed product of precious metal |
| CN1532306A (en) * | 2003-03-20 | 2004-09-29 | 蒋荣昌 | Metal electroforming method of forming external mold and internal and exterual combined mold |
-
2007
- 2007-02-26 CN CN2007100733958A patent/CN101255579B/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010102516A1 (en) * | 2009-03-11 | 2010-09-16 | Pino Aliprandini (Hk) Limited | Method of manufacturing hard gold jewellery |
| CN102107259A (en) * | 2010-12-08 | 2011-06-29 | 山东梦金园珠宝首饰有限公司 | Method for pouring bowl-shaped ornament |
| CN102274928A (en) * | 2011-07-29 | 2011-12-14 | 林玉成 | Method for manufacturing metal accessory through die-parting formation |
| CN104097445A (en) * | 2013-04-08 | 2014-10-15 | 深圳市福昌科技开发有限公司 | Furnishing piece |
| WO2014167486A3 (en) * | 2013-04-08 | 2015-05-07 | 周大福珠宝金行有限公司 | Decorative item |
| CN106862870A (en) * | 2017-02-17 | 2017-06-20 | 深圳粤通国际珠宝股份有限公司 | A kind of method for processing noble metal |
| CN108958005A (en) * | 2018-07-14 | 2018-12-07 | 福州珂麦表业有限公司 | A kind of gold wrist-watch batch wreath manufacture craft |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101255579B (en) | 2010-06-30 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Qianyu Jewelry Co., Ltd. Assignor: Shenzhen Baitai Jewellery Co., Ltd. Contract fulfillment period: 2008.7.27 to 2027.2.26 Contract record no.: 2008440000223 Denomination of invention: Method for manufacturing hollow out multiple-layer gold ornaments License type: General permission Record date: 2008.8.28 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: COMMON LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.7.27 TO 2027.2.26 Name of requester: SHENZHEN BIWIN JEWELRY CO., LTD. Effective date: 20080828 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN BAITAI INVESTMENT HOLDINGS GROUP CO., LTD Free format text: FORMER NAME: SHENZHEN BAITAI JEWELLERY CO., LTD. |
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| CP03 | Change of name, title or address |
Address after: Yantian District of Shenzhen city in Guangdong province 518000 comprehensive building Beishan Industrial Zone 3F1-F8 and the exhibition hall (only office) Patentee after: SHENZHEN BATAR INVESTMENT HOLDING GROUP CO., LTD. Address before: 3, seventh floor, No. 518000 workshop, Pacific Industrial Zone, Sha Salt Road, Yantian District, Guangdong, Shenzhen Patentee before: Shenzhen Baitai Jewellery Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180808 Address after: 100000 Beijing Dongcheng District Liu Yin Park South Street No. 901 Patentee after: China Gold Group Gold jewelry (Beijing) Limited Address before: 518000 3F1-F8 and exhibition hall of Beishan industrial complex, Yantian District, Shenzhen, Guangdong. Patentee before: SHENZHEN BATAR INVESTMENT HOLDING GROUP CO., LTD. |