CN101254678A - Copper-plastic composite board process technique and copper-plastic composite board - Google Patents
Copper-plastic composite board process technique and copper-plastic composite board Download PDFInfo
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- CN101254678A CN101254678A CNA200810032786XA CN200810032786A CN101254678A CN 101254678 A CN101254678 A CN 101254678A CN A200810032786X A CNA200810032786X A CN A200810032786XA CN 200810032786 A CN200810032786 A CN 200810032786A CN 101254678 A CN101254678 A CN 101254678A
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Abstract
The invention provides a copper-plastic composite plate processing process, which comprises the following steps: (1) pre-treating a copper plate by using weak basic degreasing agent to remove oil stains on the surface of the copper plate; (2) arranging a high-pressure low-density polyethylene intermediate layer between the copper layer serving as the surface layer and an aluminum plate serving as the bottom layer; bonding the layers by a Bynel4157 polymer adhesive material, and combining at a temperature of 180 to 250 DEG C and under a composite roller pressure of 0.2 to 0.8 MPa; and (3) fast on-line cooling, bonding a protection film on the surface, trimming, and cutting to form the copper-plastic composite plate once. The invention also provides a copper-plastic composite plate manufactured by the process. The process can greatly improve the operability and the technology stability of the combining process by respectively controlling the temperature and the pressure of different material layers, thus effectively solving the problem of bonding strength of the copper material and the plastic plate core and the flatness of the copper-plastic composite plate.
Description
Technical field
The present invention relates to material and make the field, relate in particular to a kind of processing technology of manufactured copper plastic clad plate.The invention still further relates to a kind of copper-plastic composite board that adopts above-mentioned processing technology to obtain.
Background technology
In the prior art, the production method of the compound manufactured copper aluminum composite plate of copper coin and aluminium sheet generally is to adopt directly compound processing method of two kinds of metals of copper-aluminium.This directly compound processing method, mainly contain two kinds: a kind of is to be composited with milling method when metallurgy; Another kind is that the method with explosive forming is composited.But the manufacturing process of these two kinds of production methods is more complicated all, generally only is applicable to small lot batch manufacture, is difficult to realize large batch of streamline production.
The production method of the compound manufactured copper aluminum composite plate of copper coin and aluminium sheet can also adopt the way of setting up plastic interlayer to make.Specifically be in the middle of two kinds of metal levels of copper coin-aluminium sheet, to add plastic plate core, the compound copper-plastic-aluminium composite plate of making of three.
The production method of copper-plastic-aluminium composite plate generally has cold compound and hot compound two kinds of processing technologys.The invention of wherein cold complex machining process early, promptly at copper coin, aluminium sheet or at the liquid binding agent of the two sides of quilted plastic panel coating, then copper-mould-aluminium is overlaped heating or pressurization form.
And the new complex method that hot complex machining process is a developed recently to get up.Hot composition process normally is injection molded into the sheet material that needs thickness with injection machine after with plate core PE plastic hot melt, and under suitable temperature, pressurization is composited with core and copper, aluminium sheet adding additives (general adopt be film-like adhesive) then.The method has tangible technical advantage than cold complex machining process.
But existing hot complex machining process is also immature, has following obvious defects in actual production:
1, yield rate is low; Because compound condition such as unresolved binding material and bonding standard for a long time, hot complex machining process technical stability of the prior art is relatively poor, and substandard product is more, is difficult to effectively reduce production costs;
2, the copper-plastic composite board adhesion strength that adopts existing hot composition process to obtain is relatively poor, and flatness is bad, and the product life cycle that makes is short, just cracking and can't using in long-time after the use.
Therefore, those skilled in the art is devoted to research and develop the good copper-plastic composite board processing technology of composite plate adhesive strength height, flatness that a kind of technical stability is good, make always.
Summary of the invention
Because the above-mentioned defective of prior art, technical problem to be solved by this invention provides the processing technology of a kind of production adhesion strength height, copper-plastic composite board that flatness is good.
For achieving the above object, the invention provides a kind of copper-plastic composite board processing technology, may further comprise the steps:
Step 1: adopt the alkalescent degreasing agent to the copper coin preliminary treatment, remove the greasy dirt on described copper coin surface;
Step 2: the described copper coin that adopts step 1 to obtain is a superficial layer, and the employing aluminium sheet is a bottom surface layer, arranges the intermediate layer of a hp-ldpe material between described superficial layer and the described bottom surface layer; Use Bynel4157 macromolecule binding material between each layer, compound under temperature 180-250 ℃, the process conditions of composite roll pressure 0.2-0.8MPa;
Step 3: adhesive surface diaphragm after the online quick cooling, implement deburring, cutting one-shot forming.
Preferably, in step 2, at first distinguish the described copper coin of preheating, described aluminium sheet; Described copper coin preheat temperature is controlled at 180 ℃-220 ℃, and tension force is controlled at 100kg-200kg; Described aluminium sheet preheat temperature is controlled at 120 ℃-150 ℃, and tension force is controlled at 50kg-90kg.
Process of the present invention has been utilized the composite principle of metal material and plastics, controlled the scope of technical parameters such as temperature in the combination process process, pressure effectively, particularly, by controlling the temperature and pressure of unlike material layer respectively, improve the operability and the technical stability of combination process greatly, efficiently solved the adhesion strength of copper material and plate core plastics and the flatness problem of copper-plastic composite board.
The present invention also provides a kind of copper-plastic composite board that adopts above-mentioned processing technology to make.
Owing to adopted above-mentioned complex machining process, copper-plastic composite board of the present invention to have good antistripping ability, flatness is good, does not need to carry out application, has fundamentally solved the problem of environmental pollution that 3 benzene waste gas discharges in the coating in the production process.
Because technology of the present invention is stable, the yield rate height can be realized high-efficiency and continuous production, has greatly reduced production cost, has improved production efficiency.
Be described further below with reference to the technique effect of accompanying drawing, to understand purpose of the present invention, feature and effect fully design of the present invention, concrete structure and generation.
Description of drawings
Fig. 1 is a copper-plastic-aluminium composite plate structure schematic diagram of the present invention.
The specific embodiment
In conjunction with shown in Figure 1, copper of the present invention is moulded combination process and be may further comprise the steps:
Step 1: adopt copper coin 1 preliminary treatment of the novel alkalescent degreasing agent Ridoline336 of Henkel Corp., remove the greasy dirt on copper coin 1 surface, improve the surface state of copper coin 1 to the coiled material shape.
Step 2: the copper coin 1 that adopts step 1 to obtain is a superficial layer, and adopting the aluminium sheet 5 of coiled material shape is bottom surface layer, arranges the intermediate layer 3 of a hp-ldpe material between copper coin 1 and the aluminium sheet 5; Use the Bynel4157 of E.I.Du Pont Company macromolecule binding material to form high strength bonding rete 2,4 between each layer, compound under temperature 180-250 ℃, the process conditions of composite roll pressure 0.2-0.8MPa, guarantee good bond effect and higher peel strength.
Bynel857 macromolecule binding material is to be the ter-polymers of main body by anhydride modified low density polyethylene (LDPE), and must have greater than 60% content and enough thickness.
Particularly, in order to solve the bow warping problem that causes owing to copper, aluminium unlike material, in step 2, the temperature and the tension force of upper and lower metallic plate are controlled respectively; Be specially copper coin 1 preheat temperature is controlled at 180-220 ℃, tension force is controlled at 100-200kg; Aluminium sheet 5 preheat temperatures are controlled at 120-150 ℃, and tension force is controlled at 50-90kg.
Step 3: adhesive surface diaphragm after the online quick cooling, according to actual needs, implement deburring, cutting one-shot forming.
Use the aluminium sheet of the copper coin of coiled material shape and coiled material shape can realize that streamline produces continuously, cut into the composite plate of various different size specifications more as required, reduce production costs.
Process of the present invention has been utilized the composite principle of metal material and polyethylene kind plastics, by controlling the temperature and pressure of unlike material layer respectively, improve the operability and the technical stability of combination process greatly, efficiently solved the adhesion strength of copper material and plate core plastics and the flatness problem of copper-plastic composite board.
Process of the present invention can also be applicable to the manufacturing of various composite plates such as copper plastic-steel, copper-plastic-copper.
The present invention also provides a kind of copper-plastic composite board that adopts above-mentioned processing technology to make, and has good antistripping ability, and flatness is good.
Because technology of the present invention is stable, the yield rate height can be realized high-efficiency and continuous production, has greatly reduced production cost, has improved production efficiency.
Should be appreciated that, in claims of the present invention, specification, all " comprising ... " all are interpreted as open implication, and just its implication is equal to " containing at least ... ", and should not be construed as enclosed implication, promptly its implication should not be construed " only comprising ... ".
In sum, described in this specification is several preferred embodiment of the present invention, and above embodiment is only unrestricted in order to technical scheme of the present invention to be described.All technical staff in the art all should be within claim protection domain of the present invention under this invention's idea on the basis of existing technology by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (3)
1, a kind of copper-plastic composite board processing technology may further comprise the steps:
Step 1: adopt the alkalescent degreasing agent to the copper coin preliminary treatment, remove the greasy dirt on described copper coin surface;
Step 2: the described copper coin that adopts step 1 to obtain is a superficial layer, and the employing aluminium sheet is a bottom surface layer, arranges the intermediate layer of a hp-ldpe material between described superficial layer and the described bottom surface layer; Use Bynel4157 macromolecule binding material between each layer, compound under temperature 180-250 ℃, the process conditions of composite roll pressure 0.2-0.8MPa;
Step 3: adhesive surface diaphragm after the online quick cooling, implement deburring, cutting one-shot forming.
2, copper-plastic composite board processing technology as claimed in claim 1 is characterized in that: in step 2, at first distinguish the described copper coin of preheating, described aluminium sheet; Described copper coin preheat temperature is controlled at 180 ℃-220 ℃, and tension force is controlled at 100kg-200kg; Described aluminium sheet preheat temperature is controlled at 120 ℃-150 ℃, and tension force is controlled at 50kg-90kg.
3, a kind of copper-plastic composite board that adopts above-mentioned processing technology to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200810032786XA CN101254678A (en) | 2008-01-17 | 2008-01-17 | Copper-plastic composite board process technique and copper-plastic composite board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200810032786XA CN101254678A (en) | 2008-01-17 | 2008-01-17 | Copper-plastic composite board process technique and copper-plastic composite board |
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| CN101254678A true CN101254678A (en) | 2008-09-03 |
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| CNA200810032786XA Pending CN101254678A (en) | 2008-01-17 | 2008-01-17 | Copper-plastic composite board process technique and copper-plastic composite board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101693421B (en) * | 2009-10-20 | 2012-03-07 | 广东生益科技股份有限公司 | Method and device for controlling temperature of specular steel plate |
| CN102712138A (en) * | 2010-01-21 | 2012-10-03 | Jx日矿日石金属株式会社 | Method for producing copper clad laminate, copper foil used therein, and laminating apparatus for copper clad laminate |
| CN102873936A (en) * | 2012-09-27 | 2013-01-16 | 广东晟力新材料股份有限公司 | Bimetallic composite plate material and manufacturing process thereof |
| CN114161742A (en) * | 2021-12-17 | 2022-03-11 | 上海华源复合新材料有限公司 | Production method of aluminum-plastic composite board for embedded light bar |
-
2008
- 2008-01-17 CN CNA200810032786XA patent/CN101254678A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101693421B (en) * | 2009-10-20 | 2012-03-07 | 广东生益科技股份有限公司 | Method and device for controlling temperature of specular steel plate |
| CN102712138A (en) * | 2010-01-21 | 2012-10-03 | Jx日矿日石金属株式会社 | Method for producing copper clad laminate, copper foil used therein, and laminating apparatus for copper clad laminate |
| CN102873936A (en) * | 2012-09-27 | 2013-01-16 | 广东晟力新材料股份有限公司 | Bimetallic composite plate material and manufacturing process thereof |
| CN102873936B (en) * | 2012-09-27 | 2016-06-15 | 广东晟力新材料股份有限公司 | Bi-metal composite panel and manufacturing process thereof |
| CN114161742A (en) * | 2021-12-17 | 2022-03-11 | 上海华源复合新材料有限公司 | Production method of aluminum-plastic composite board for embedded light bar |
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Open date: 20080903 |