CN101251682A - Back board assembly for backlight module - Google Patents
Back board assembly for backlight module Download PDFInfo
- Publication number
- CN101251682A CN101251682A CN 200810089920 CN200810089920A CN101251682A CN 101251682 A CN101251682 A CN 101251682A CN 200810089920 CN200810089920 CN 200810089920 CN 200810089920 A CN200810089920 A CN 200810089920A CN 101251682 A CN101251682 A CN 101251682A
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- China
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- plate body
- board assembly
- back board
- lateral margin
- backlight module
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a backboard assembly used for a backlight module, comprising a first plate body and a second plate body, wherein, side edges of the second plate body are joined with side edges of the first plate body so as to form a substantially continuous plate body; moreover, the heat conduction coefficient of the second plate body is smaller than that of the first plate body, thereby the second plate body can isolate the heat conduction between a light source device and a lighter which are arranged on two opposite sides of the second plate.
Description
Technical field
The invention relates to a kind of back board assembly that is used for liquid crystal display backlight module; Particularly a kind ofly help heat conducting back board assembly.
Background technology
Because the continuous progress of photoelectric technology and the digitizing of image display technique, kinds of displays is seen everywhere in daily life; Wherein, therefore LCD is widely used in the various electronic products, and replaces the conventional cathode ray tube display gradually because have high image quality, frivolous, low consumpting power, advantage such as radiationless, becomes the main flow in the monitor market.
Existing direct type backlight module is shown in Figure 1A and Figure 1B, and wherein Figure 1B is the diagrammatic cross-section along A-A profile line among Figure 1A.Backlight module 1 comprises a backboard 11, a light supply apparatus 12, an apparatus for lighting up (Inverter) 13 and an insulating mat 15.Light supply apparatus 12 is arranged at the front of backboard 11, and insulating mat 15 parts are arranged on the back side of backboard 11.Apparatus for lighting up 13 is arranged on the back side, insulating mat 15 of backboard 11 with respect to light supply apparatus 12, and electrically connects with light supply apparatus 12.
In order to make LCD present better display effect, LCD on the market is usually towards adopting more the light source of high brightness to reach.Yet if adopt the light supply apparatus 12 of high brightness, it also can increase in the heat that use produced, and apparatus for lighting up 13 is when running, and itself is also because use high electric current and high voltage, and produces certain heat.
For the thermal conductance with backlight module 1 inside goes out, existing backboard 11 adopts metal material usually, and is stamped to form in integrated mode, promotes the integral heat sink effect of backlight module 1 with attempt.But since apparatus for lighting up 13 and the 12 common overlapping settings of part light supply apparatus, the regional area generation high temperature that both sides generate heat simultaneously and will cause backlight module 1.For example, local high heat from light supply apparatus 12 is after backboard 11 heat absorptions, because insulating mat 15 directly contacts with backboard 11, so and then conduct heat to apparatus for lighting up 13.The modulator 13 that puts a spot itself also can generate heat, and this zone will form localized hyperthermia and influence its usefulness, even causes it can't normal operation.And the stacked phenomenon between this kind assembly also can increase the overall weight of materials and product, and be unfavorable for that product is towards lightening trend.
In view of this, providing one to have preferable radiating effect and light-weighted back board assembly, is an industry problem demanding prompt solution for this reason.
Summary of the invention
A purpose of the present invention is to provide a kind of back board assembly that is used for a backlight module, the suitable heat conduction that can completely cut off between light supply apparatus and the apparatus for lighting up, and help the heat energy that light supply apparatus produced, can evenly distribute and disperse towards more favourable direction, avoid heat to concentrate, and then make apparatus for lighting up and light supply apparatus normal operation.
Another object of the present invention is to provide a kind of back board assembly that is used for a backlight module, be that partial back is made with lighter thermal insulation material, with when promoting radiating effect, can save unnecessary materials and weight reduction simultaneously, and then reduce cost, backlight module is developed towards the direction of slimming, promote product competitiveness.
The disclosed back board assembly of the present invention comprises one first plate body and one second plate body, wherein the lateral margin of this second plate body engages with the lateral margin of this first plate body, forming a continuous in fact plate body, and the heat-conduction coefficient of this second plate body is less than the heat-conduction coefficient of this first plate body.
For above-mentioned purpose of the present invention, technical characterictic and advantage can be become apparent, hereinafter cooperate appended graphic being elaborated with preferred embodiment.
Description of drawings
Figure 1A is the floor map of known backlight module;
Figure 1B is the diagrammatic cross-section of existing backlight module along the A-A profile line;
Fig. 2 A is the floor map of backlight module of the present invention; And
Fig. 2 B is the diagrammatic cross-section of backlight module of the present invention along the B-B profile line.
[primary clustering symbol description]
1 backlight module, 11 backboards
12 light supply apparatuses, 13 apparatus for lighting up
15 insulating mats, 2 backlight modules
21 back board assemblies, 211 first plate bodys
212 second plate bodys, 213 engagement devices
22 light supply apparatuses, 23 apparatus for lighting up
Embodiment
Please refer to Fig. 2 A and Fig. 2 B, wherein Fig. 2 B is the diagrammatic cross-section along B-B profile line among Fig. 2 A.Backlight module 2 of the present invention comprises a back board assembly 21, a light supply apparatus 22 and an apparatus for lighting up (inverter) 23 at least, and wherein light supply apparatus 22 and apparatus for lighting up 23 are isolated by back board assembly 21 in fact.Clearer and more definite, for improve existing backlight module via backboard with high heat conduction that light supply apparatus produced to apparatus for lighting up and then produce localized hyperthermia and influence shortcoming such as apparatus for lighting up running, back board assembly 21 of the present invention is by the material that has different heat-conduction coefficient in zones of different, the high hot non-conducting that is produced with isolated light supply apparatus 22 is to apparatus for lighting up 23, and still can keep light supply apparatus 22 heat radiations.Wherein, light supply apparatus 22 of the present invention can be cold cathode fluorescent lamp (Cold Cathode Fluorescent Lamp, CCFL) or light emitting diode (Light Emitting Diode, LED) constitute, perhaps, the person with usual knowledge in their respective areas also can use other light source as an alternative, all can use back board assembly 21 of the present invention, reach the purpose of effectively isolated and heat radiation, being chosen in this and not limiting of light supply apparatus 22.
Because first plate body 211 adopts the material with high coefficient of thermal conductivity, therefore can be made by metal material.Preferably, the material of first plate body 211 can be selected from galvanized steel, aluminium, aluminium alloy and group that combination became thereof.And second plate body 212 adopts the material that has than low heat conduction coefficient, therefore can be made by nonmetallic materials.In the present embodiment, second plate body 212 can be made by a plastic material, and preferably be selected from polycarbonate (Polycarbonate, PC), acrylonitrile-butadiene-styrene copolymer (AcrylonitrileButadiene Styrene copolymer, ABS) and the group that become of combination.In in the case, because of the material of second plate body 212 also belongs to non electrically conductive material simultaneously, therefore more can save the setting of existing insulating mat simultaneously, and still can with apparatus for lighting up 23 insulation, do not have the anxiety of electric leakage.
Can be fixed to one another for first plate body 211 and second plate body 212 guaranteeing to be bonded with each other by lateral margin, back board assembly 21 of the present invention also comprises an engagement device 213.In the present embodiment, the lateral margin of the lateral margin of first plate body 211 and second plate body 212 is local at least overlapping, and engagement device 213 can have a positive device and cooperate a negative device of fixing with positive device, by this positive device and negative device, first plate body 211 and second plate body are interfixed.Clearer and more definite, above-mentioned negative device can be through a plurality of through holes of first plate body 211 and the overlapped part of second plate body, 212 lateral margins, positive device then can be screw, rivet or its combination, is arranged in above-mentioned through hole, to engage first plate body 211 and second plate body 212.Implement in the sample attitude in other, engagement device 213 be not limited in above-mentioned with screw togather, mode such as riveted fixes first plate body 211 and second plate body 212, first plate body 211 and second plate body 212 also positive device and negative device can be formed at the lateral margin of first plate body 211 and second plate body 212 respectively, so that can directly engage mutually; Perhaps, utilize for example bonding first plate body 211 of material such as viscose or hot melt adhesive and second plate body 212.Aforesaid way all can reach the purpose of fixing first plate body 211 and second plate body 212; therefore aforesaid juncture is only in order to exemplify; non-in order to limit claim protection domain of the present invention, those having an ordinary knowledge in this technical field are when the fixed form that can think easily and other is equivalent.
By above-mentioned exposure, back board assembly of the present invention can completely cut off the heat conduction between light supply apparatus and the apparatus for lighting up, and heat energy is spread equably, saves unnecessary materials simultaneously, and then reduces cost, and make backlight module slimming and lightweight.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (14)
1. a back board assembly that is used for a backlight module is characterized in that, comprises:
One first plate body has a lateral margin; And
One second plate body has a lateral margin;
This lateral margin of this second plate body engages with this lateral margin of this first plate body, and to form a continuous plate body, wherein the heat-conduction coefficient of this second plate body is less than the heat-conduction coefficient of this first plate body.
2. back board assembly as claimed in claim 1 is characterized in that, this first plate body is made by a metal material.
3. back board assembly as claimed in claim 1 is characterized in that, this metal material is selected from following group: galvanized steel, aluminium, aluminium alloy and combination thereof.
4. back board assembly as claimed in claim 3 is characterized in that, this second plate body is made by nonmetallic materials.
5. back board assembly as claimed in claim 4 is characterized in that, this second plate body is made by a plastic material.
6. back board assembly as claimed in claim 5, it is characterized in that, this plastic material is selected from following group: polycarbonate (Polycarbonate, PC), acrylonitrile-butadiene-styrene copolymer (AcrylonitrileButadiene Styrene copolymer, ABS) and the combination.
7. back board assembly as claimed in claim 1 is characterized in that, also comprises an engagement device, in order to this lateral margin of fixing this first plate body and this lateral margin of this second plate body.
8. back board assembly as claimed in claim 7 is characterized in that, this lateral margin of this first plate body and this lateral margin of this second plate body are local at least overlapping.
9. back board assembly as claimed in claim 7 is characterized in that, this engagement device has a positive device and cooperates a negative device of fixing with this positive device.
10. back board assembly as claimed in claim 9 is characterized in that, this feminine gender device is formed at these lateral margins of this first plate body and this second plate body, and this positive device is to pass this feminine gender device and engage.
11. back board assembly as claimed in claim 10 is characterized in that, this positive device is selected from following group: screw, rivet and combination thereof.
12. back board assembly as claimed in claim 9, it is characterized in that, this positive device and this feminine gender device are formed at respectively on this lateral margin of this lateral margin of this first plate body and this second plate body, make that this first plate body and this second plate body are suitable can to engage with this feminine gender device mutually by this positive device.
13. back board assembly as claimed in claim 1 is characterized in that, this lateral margin of this second plate body and this lateral margin of this first plate body are to engage with one of them of viscose and hot melt adhesive.
14. back board assembly as claimed in claim 1 is characterized in that, this backlight module comprises a light supply apparatus and an apparatus for lighting up in addition; This light supply apparatus and this apparatus for lighting up are isolated by this back board assembly in fact, and oppose mutually about this second plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810089920 CN101251682A (en) | 2008-04-09 | 2008-04-09 | Back board assembly for backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810089920 CN101251682A (en) | 2008-04-09 | 2008-04-09 | Back board assembly for backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101251682A true CN101251682A (en) | 2008-08-27 |
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ID=39955138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810089920 Pending CN101251682A (en) | 2008-04-09 | 2008-04-09 | Back board assembly for backlight module |
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| Country | Link |
|---|---|
| CN (1) | CN101251682A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012159331A1 (en) * | 2011-05-26 | 2012-11-29 | 深圳市华星光电技术有限公司 | Display device and backlight module |
| WO2012171232A1 (en) * | 2011-06-16 | 2012-12-20 | 深圳市华星光电技术有限公司 | Liquid crystal backboard and manufacturing method thereof |
| WO2013037158A1 (en) * | 2011-09-15 | 2013-03-21 | 深圳市华星光电技术有限公司 | Composite backlight plate, backlight module and liquid crystal display |
| CN104964179A (en) * | 2015-02-13 | 2015-10-07 | 立达信绿色照明股份有限公司 | Fluorescent lamp |
| CN107436507A (en) * | 2016-05-25 | 2017-12-05 | 鸿富锦精密工业（深圳）有限公司 | Backlight module and apply its display device |
-
2008
- 2008-04-09 CN CN 200810089920 patent/CN101251682A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012159331A1 (en) * | 2011-05-26 | 2012-11-29 | 深圳市华星光电技术有限公司 | Display device and backlight module |
| WO2012171232A1 (en) * | 2011-06-16 | 2012-12-20 | 深圳市华星光电技术有限公司 | Liquid crystal backboard and manufacturing method thereof |
| WO2013037158A1 (en) * | 2011-09-15 | 2013-03-21 | 深圳市华星光电技术有限公司 | Composite backlight plate, backlight module and liquid crystal display |
| CN104964179A (en) * | 2015-02-13 | 2015-10-07 | 立达信绿色照明股份有限公司 | Fluorescent lamp |
| CN104964179B (en) * | 2015-02-13 | 2019-05-10 | 漳州立达信灯具有限公司 | Fluorescent lamp |
| CN107436507A (en) * | 2016-05-25 | 2017-12-05 | 鸿富锦精密工业（深圳）有限公司 | Backlight module and apply its display device |
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Open date: 20080827 |