CN101245201A - Thermoplastic powder electrically-conducting paint/printing ink and manufacture method thereof - Google Patents
Thermoplastic powder electrically-conducting paint/printing ink and manufacture method thereof Download PDFInfo
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- CN101245201A CN101245201A CN 200810043183 CN200810043183A CN101245201A CN 101245201 A CN101245201 A CN 101245201A CN 200810043183 CN200810043183 CN 200810043183 CN 200810043183 A CN200810043183 A CN 200810043183A CN 101245201 A CN101245201 A CN 101245201A
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- powder
- printing ink
- electrically conducting
- thermoplastic
- conducting coating
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- 239000000843 powder Substances 0.000 title claims abstract description 54
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 20
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 20
- 238000007639 printing Methods 0.000 title claims description 24
- 238000000034 method Methods 0.000 title description 6
- 238000004519 manufacturing process Methods 0.000 title description 4
- 239000003973 paint Substances 0.000 title 1
- 239000011248 coating agent Substances 0.000 claims abstract description 28
- 238000000576 coating method Methods 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 6
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 6
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 6
- 239000000314 lubricant Substances 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 26
- 238000002360 preparation method Methods 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 21
- 229910044991 metal oxide Inorganic materials 0.000 claims description 19
- -1 indium tin metal oxide compound Chemical class 0.000 claims description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 11
- SDNVJMZXSOXXQN-UHFFFAOYSA-N 3,4-ditert-butyl-2-methylphenol Chemical group CC1=C(O)C=CC(C(C)(C)C)=C1C(C)(C)C SDNVJMZXSOXXQN-UHFFFAOYSA-N 0.000 claims description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 239000012188 paraffin wax Substances 0.000 claims description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 claims description 7
- 239000008116 calcium stearate Substances 0.000 claims description 7
- 235000013539 calcium stearate Nutrition 0.000 claims description 7
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 230000003750 conditioning effect Effects 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 239000012745 toughening agent Substances 0.000 claims description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910000989 Alclad Inorganic materials 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910000611 Zinc aluminium Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 239000011669 selenium Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 3
- 239000012776 electronic material Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 238000005728 strengthening Methods 0.000 abstract 1
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- 239000006185 dispersion Substances 0.000 description 10
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000012855 volatile organic compound Substances 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VVCMGAUPZIKYTH-VGHSCWAPSA-N 2-acetyloxybenzoic acid;[(2s,3r)-4-(dimethylamino)-3-methyl-1,2-diphenylbutan-2-yl] propanoate;1,3,7-trimethylpurine-2,6-dione Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O.CN1C(=O)N(C)C(=O)C2=C1N=CN2C.C([C@](OC(=O)CC)([C@H](C)CN(C)C)C=1C=CC=CC=1)C1=CC=CC=C1 VVCMGAUPZIKYTH-VGHSCWAPSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- HTRSGQGJZWBDSW-UHFFFAOYSA-N [Ge].[Se] Chemical compound [Ge].[Se] HTRSGQGJZWBDSW-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
The invention relates to a chemical industry electronic material, in particular to a thermoplastic powder conductive coating/ink applied in solar field and electronic communication field. The chemical industry electronic material comprises the following components according to weight percentage: (1) conductive powder: 60 to 80 percent; (2) adhesive: 5 to 30 percent; (3) film-forming strengthening agent: 0.3 to 10 percent; (4) lubricant: 0.1 to 3 percent; (5) solidification regulator: 0.1 to 3 percent; (6) adhesion promoter: 0.5 to 10 percent; (7) antioxidant: 0.1 to 3 percent; (8) doping elements:0 to 5 percent.
Description
Technical field:
The present invention relates to a kind of chemical industry electronic material, refer to a kind of Powdered electro-conductive material (coating/printing ink) that is applied to field of solar energy and electronic communication field especially.
Background technology:
In field of solar energy and electronic communication field, generally need a kind of conductor to come transmission current and signal.This conductor is attached on other base materials with coating form, and can carry out sintering processes on demand under the certain temperature condition.Form the conduction favorable conductive body of adherence.It should have characteristics such as excellent electroconductibility, surface smoothness, good sticking power, environmental resistance, good operability and environmental protection.
Existing analogous products such as electrically conducting coating or electric slurry all exist with liquid form, and this form products solidifying form all is a heat curing-type, and contains more volatile organic compounds (VOC), and is unfavorable to ecotope.Need need levelling through spraying or printing during use, the baking burning time is longer.The thinner thickness of film (general dry film thickness is at 20-25 μ m, and the sintering thickness is at 10-18 μ m).As require to form the coating of narrow and thick (as 100 μ m thickness), as the silver-colored gate electrode in sun power surface, just be difficult to reach requirement.
Summary of the invention:
Technical problem to be solved by this invention just is to overcome the deficiency of liquid electrically conducting coating of existing thermoset and electric slurry, and a kind of electrically conducting coating/printing ink of thermoplastic solid state powder shape is provided.
A kind of thermoplastic powder electrically conducting coating/printing ink comprises following component (weight percent)
1, conducting powder 60-80%
2, caking agent 5-30%
3, film forming toughener 0.3-10%
4, lubricant 0.1-3%
5, solidify conditioning agent 0.1-3%
6, adhesion promoter 0.5-10%
7, antioxidant 0.1-3%
8, doped element 0-5%
In said components total amount 100% weight part, in preparation process, add the weight part 30-100% of solubility promoter.
Above-mentioned conducting powder can be selected one of metal powders such as silver powder, aluminium powder, copper powder, nickel powder, silver-coated copper powder, silver-colored alclad powder, silver-colored nickel coat powder or its mixture with environment resistant for use with the different of cost requirement according to electroconductibility, or one of metal oxide such as indium tin metal oxide compound, tin antimony metal oxide compound, zinc gallium metal oxide compound, zinc-aluminium metal oxide or mixture.
Above-mentioned conducting powder is flaky or globular, or sheet and spherical blended.
Above-mentioned conducting powder particle diameter micron order or submicron order or nano level, generally between 0.01-50 μ m, the metal powder particle diameter is that the best, metal oxide particle diameter are the best at 1-30nm at 5.0-15 μ.
Above-mentioned binding agent can adopt thermoplastic polyurethane (TPU) or ethylene-vinyl acetate copolymer (EVA).Its cementability to metal conductive powder is good, multiple base material is had good sticking power and surface smoothness, and have good chemical stability and wear resistance, and is harmless, and environmental sound is environmentfriendly products.
The melt temperature of above-mentioned caking agent is 60 ℃-180 ℃, and 60 ℃-90 ℃ is best.
Above-mentioned adhesion promoter is a glass, when its during at film forming and sintering, it can promote the sticking power of coating to ground, and can form the low resistance rete.
Above-mentioned film forming toughener adopts rosin, and it can improve the flow leveling and the anti-sag performance of rete, increases tackiness agent viscosity, and rete can not form bead when sintering, and it also can provide rete outstanding weldability.
Above-mentioned lubricant is to adopt Zinic stearas or calcium stearate, and it can make product be easy to pass through mesh screen when wire mark.
What solidify that conditioning agent adopts is paraffin, and it can regulate film forming set time.
Doped element is selected P type or N-type semiconductor material such as phosphorus, gallium, boron, indium, silicon, selenium germanium etc. as required for use, to reduce the resistivity of material, improves electroconductibility, improves effciency of energy transfer.Non-ly can not mix when being applied to field of solar energy.
Need select suitable solubility promoter in addition for use during preparation, ratio is not limit, and decides according to the solvability of caking agent and auxiliary agent.These solubility promoters are vapored away by oven dry in preparation process, do not have these solubility promoters in finished product.Generally select N-Methyl pyrrolidone (NMP), ditan (DPM) for use, esters solvents such as propylene glycol monomethyl ether, vinyl acetic monomer/N-BUTYL ACETATE, methyl ethyl ketone/butanone ketones solvent or their mixtures such as (MEK/MIBK).For protecting environment and saving production cost, distillation recovery device is installed in the baking oven suggestion during oven dry, and the solubility promoter of collection is recycling.
Antioxidant is selected di-tert-butyl methyl phenol for use, to slow down the aging speed of hot melt adhesive, as sintering process, then need not to add.
The preparation method:
Each analog assistant of caking agent and other mixes in the 1st step, elder generation, adds a certain amount of solubility promoter, dissolves dispersion with stirrer.
The 2nd goes on foot, conducting powder is slowly added in the above-mentioned mixing solutions, carries out dispersed with stirring with high-speed shearing machine, and churning time is decided on dispersion effect.
The 3rd step, place the baking oven of 50 ℃-180 ℃ (look the boiling point of solubility promoter and be lower than the melt temperature of caking agent) to toast said mixture, till oven dry.
The 4th step, the mixture of above-mentioned oven dry is pulverized with pulverizer, crushed material is put into shredder and is ground to powdery, with till being ground to virgin metal powder footpath size, is finished product.Grinding container should have refrigerating unit, grinds and will cool off simultaneously.
This thermoplastic powder electrically conducting coating/printing ink is exactly in order to remedy above-mentioned deficiency, satisfies market demand and invents.This product is a kind of composite powder, as conducting medium, skin deposits/coats a certain proportion of thermoplastic adhesive with metal powder (metal powder or its mixtures such as silver powder, aluminium powder, copper powder, nickel powder, silver-coated copper powder, silver-colored alclad powder) or metal oxide (one of indium tin metal oxide compound, tin antimony metal oxide compound, zinc gallium metal oxide compound, zinc-aluminium metal oxide or mixture).He at room temperature is a solid, and when it is applied on the heat-stable base material and heating when reaching 60-180 ℃, it has just become liquid.After it is transferred to the base material of room temperature, just solidify immediately, therefore also just do not needed drying program.The minimizing of drying program can be enhanced productivity and output, satisfies the requirement of high-speed automated production.This thermoplastic techniques can make thickness reach required thickness, and this rete can carry out sintering processes as required under specified temp.
Effect of the present invention:
1, the invention provides a kind of thermoplastic powder electro-conductive material, is a kind of solid-state electrically conducting coating/printing ink, and it does not contain any solvent, and resin is harmless, is a kind of Green Product of VOC free, meets the ISO4001 environment and proves standard-required.
2, product of the present invention can form conventional heat curing-type electrically conducting coating/printing ink/electric slurry thick film layers that is beyond one's reach, this thickness layer is most important in solar cell is made, surperficial silver-colored grid on the solar silicon cell, require that it tries one's best narrow so that more large-area luminous energy shine on the silicon chip, to improve electricity conversion, same like this volume resistance will reach alap resistance just needs thicker rete to support that the present invention just can satisfy such requirement.
3, product fusion liquefaction construction of the present invention is solidified under the room temperature immediately, and it does not need the dry solidification process, and the minimizing of drying program can be enhanced productivity and output, satisfies the requirement of high-speed automated production.Also saved simultaneously the required energy of a large amount of bakings.
4, the preferred and reasonable proportioning of raw material among the present invention makes its product when film forming and sintering, can produce very little volumetric quantity (density height) and resistance contact rate, forms low resistance, the conductivity excellence.
5, during product film forming of the present invention and numerous base material have good sticking power, rete had outstanding welding property when sintering was used.
Embodiment:
Embodiment 1: preparation TPU-silver thermoplastic powder electrically conducting coating/printing ink
The material name ratio
(1) silver powder 70%
(2)TPU 20％
(3) rosin 6%
(4)SiO
2 2％
(5) paraffin 0.5%
(6) Zinic stearas 1%
(7) di-tert-butyl methyl phenol 0.4%
(8) phosphorus 0.1%
Total amount 100%
(9) ethyl acetate (preparation solubility promoter) 50%
Earlier (2) (3) (4) (5) (6) (7) (8) are poured into respectively in (9), stir, adding (1) then while stirring uses high-shear dispersion machine violent stirring to homodisperse, insert then in 50 ℃ the baking oven and dry, with pulverizer the block mixture of oven dry is pulverized, crushed material is put into shredder and is ground to powdery and is finished product again.
Embodiment 2: preparation EVA-silver thermoplastic powder electrically conducting coating/printing ink
The material name ratio
(1) silver powder 75%
(2)EVA 15％
(3) rosin 5%
(4)SiO
2 2.5％
(5) paraffin 1.3%
(6) calcium stearate 0.8%
(7) di-tert-butyl methyl phenol 0.3%
(8) boron 0.1%
Total amount 100%
(9) ethyl acetate (preparation solubility promoter) 40%
Earlier (2) (3) (4) (5) (6) (7) (8) are poured into respectively in (9), stir, homodisperse, add while stirring then (1), with high-shear dispersion machine violent stirring to homodisperse, insert then in 50 ℃ the baking oven and dry, with pulverizer the block mixture of oven dry is pulverized, crushed material is put into shredder and is ground to powdery and is finished product.
Embodiment 3: preparation TPU-silver-aluminothermy plastic powder electrically conducting coating/printing ink
The material name ratio
(1) aluminium powder 30%
(2) silver powder 40%
(3)TPU 25％
(4) rosin 2%
(5)SiO
2 1％
(6) paraffin 0.7%
(7) Zinic stearas 1.0%
(8) di-tert-butyl methyl phenol 0.25%
(9) gallium 0.05%
Total amount 100%
(10) ethyl acetate (preparation solubility promoter) 60%
Earlier (2) (3) (4) (5) (6) (7) (8) (9) are poured into respectively in (10), stir, homodisperse, add while stirring then (1), with high-shear dispersion machine violent stirring to homodisperse, insert then in 50 ℃ the baking oven and dry, with pulverizer the block mixture of oven dry is pulverized, crushed material is put into shredder and is ground to powdery and is finished product.
Embodiment 4: preparation EVA-silver copper-clad thermoplastic powder electrically conducting coating/printing ink
The material name ratio
(1) silver-coated copper powder 65%
(2)EVA 25％
(3) rosin 4.5%
(4)SiO
2 2％
(5) paraffin 1.5%
(6) calcium stearate 1.8%
(7) di-tert-butyl methyl phenol 0.2%
(8) doped element 0%
Total amount 100%
(9) MEK (preparation solubility promoter) 55%
Earlier (2) (3) (4) (5) (6) (7) (8) are poured into respectively in (9), stir, homodisperse, add while stirring then (1), with high-shear dispersion machine violent stirring to homodisperse, insert then in 50 ℃ the baking oven and dry, with pulverizer the block mixture of oven dry is pulverized, crushed material is put into shredder and is ground to powdery and is finished product.
Embodiment 5: preparation TPU-aluminothermy plastic powder electrically conducting coating/printing ink
The material name ratio
(1) aluminium powder 60%
(2)TPU 30％
(3) rosin 5%
(4)SiO
2 1.5％
(5) paraffin 0.5%
(6) Zinic stearas 2%
(7) di-tert-butyl methyl phenol 0.2%
(8) gallium 0.8%
Total amount 100%
(9) MIBK (preparation solubility promoter) 80%
Earlier (2) (3) (4) (5) (6) (7) (8) are poured into respectively in (9), stir, homodisperse, add while stirring then (I), with high-shear dispersion machine violent stirring to homodisperse, insert then in 50 ℃ the baking oven and dry, with pulverizer the block mixture of oven dry is pulverized, crushed material is put into shredder and is ground to powdery and is finished product.
Embodiment 6: preparation EVA-aluminothermy plastic powder electrically conducting coating/printing ink
The material name ratio
(1) aluminium powder 69%
(2)EVA 10％
(3) rosin 5%
(4)SiO
2 6％
(5) paraffin 4%
(6) calcium stearate 5%
(7) di-tert-butyl methyl phenol 0.97%
(8) indium 0.03%
Total amount 100%
(9) ethyl acetate (preparation solubility promoter) 60%
Earlier (2) (3) (4) (5) (6) (7) (8) are poured into respectively in (9), stir, homodisperse, add while stirring then (1), with high-shear dispersion machine violent stirring to homodisperse, insert then in 50 ℃ the baking oven and dry, with pulverizer the block mixture of oven dry is pulverized, crushed material is put into shredder and is ground to powdery and is finished product.
Embodiment 7: preparation EVA-indium tin oxide thermoplastic powder electrically conducting coating/printing ink
The material name ratio
(1) indium tin oxide 50%
(2)EVA 30％
(3) rosin 5%
(4)SiO
2 6％
(5) paraffin 3%
(6) calcium stearate 5%
(7) di-tert-butyl methyl phenol 0.97%
(8) selenium 0.03%
Total amount 100%
(9) ethyl acetate (preparation solubility promoter) 60%
Earlier (2) (3) (4) (5) (6) (7) (8) are poured into respectively in (9), stir, homodisperse, add while stirring then (1), with high-shear dispersion machine violent stirring to homodisperse, insert then in 50 ℃ the baking oven and dry, with pulverizer the block mixture of oven dry is pulverized, crushed material is put into shredder and is ground to powdery and is finished product.
Embodiment 8: preparation TPU-tin antimony metal oxide compound plastic powder electrically conducting coating/printing ink
The material name ratio
(1) tin antimony metal oxide compound 65%
(2)TPU 18％
(3) rosin 5%
(4)SiO
2 5％
(5) paraffin 3%
(6) calcium stearate 2%
(7) di-tert-butyl methyl phenol 2%
Total amount 100%
(8) ethyl acetate (preparation solubility promoter) 60%
Earlier (2) (3) (4) (5) (6) (7) are poured into respectively in (8), stir, homodisperse, add while stirring then (1), with high-shear dispersion machine violent stirring to homodisperse, insert then in 50 ℃ the baking oven and dry, with pulverizer the block mixture of oven dry is pulverized, crushed material is put into shredder and is ground to powdery and is finished product.
Claims (7)
1, a kind of thermoplastic powder electrically conducting coating/printing ink by weight percentage, comprises component:
(1), conducting powder 60-80%; (2), caking agent 5-30%; (3), film forming toughener 0.3-10%; (4), lubricant 0.1-3%; (5), solidify conditioning agent 0.1-3%; (6), adhesion promoter 0.5-10%; (7), antioxidant 0.1-3%; (8), doped element 0-5%;
Described conducting powder is selected one of metal oxides such as one of metal powders such as silver powder, aluminium powder, copper powder, nickel powder, silver-coated copper powder, silver-colored alclad powder, silver-colored nickel coat powder or its mixture or indium tin metal oxide compound, tin antimony metal oxide compound, zinc gallium metal oxide compound, zinc-aluminium metal oxide or its mixture for use according to electroconductibility and environment resistant and cost requirement different
Described binding agent adopts thermoplastic polyurethane (TPU) or ethylene-vinyl acetate copolymer (EVA);
Described film forming toughener is a rosin;
Described lubricant is Zinic stearas or calcium stearate;
Described curing conditioning agent is a paraffin;
Described adhesion promoter is a glass;
Described antioxidant is a di-tert-butyl methyl phenol;
Described doped element is selected P type or N-type semiconductor material such as phosphorus, gallium, boron, indium, silicon, selenium, germanium etc. for use.
2, thermoplastic powder electrically conducting coating/printing ink according to claim 1 is characterized in that: described metal powder is a sheet or spherical, or sheet is mixed with spherical.
3, thermoplastic powder electrically conducting coating/printing ink according to claim 1 is characterized in that: described conducting powder particle diameter micron order or submicron order or nano level, and between 0.01-50 μ m.
4, thermoplastic powder electrically conducting coating/printing ink according to claim 3 is characterized in that: described metal powder particle diameter is between 5.0-15 μ m, and the metal oxide particle diameter is between 1-30nm.
5, thermoplastic powder electrically conducting coating/printing ink according to claim 1 is characterized in that: the melt temperature of described caking agent is 60 ℃-180 ℃.
6, thermoplastic powder electrically conducting coating/printing ink according to claim 5 is characterized in that: the melt temperature of described caking agent is 60 ℃-90 ℃.
7, a kind of thermoplastic powder electrically conducting coating/printing ink preparation method, step is:
The 1st the step, in described component total amount 100% weight part of claim 1, caking agent, film forming toughener, lubricant, curing conditioning agent, adhesion promoter, antioxidant, doped element are mixed, the solubility promoter that adds weight part 30-100%, dispersed with stirring;
The 2nd step, conducting powder is slowly added in the above-mentioned mixing solutions dispersed with stirring;
The 3rd the step, according to the boiling point of solubility promoter and being lower than under the melt temperature condition of caking agent, place baking oven to toast said mixture, until oven dry;
The 4th step, the mixture of above-mentioned oven dry is pulverized with pulverizer, crushed material is put into shredder be ground to powdery, cool off during grinding,, be finished product with till being ground to this conducting powder size,
Above-mentioned solubility promoter is N-Methyl pyrrolidone, ditan, a kind of or its mixture of propylene glycol monomethyl ether, vinyl acetic monomer/N-BUTYL ACETATE, methyl ethyl ketone/butanone.
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