CN101216582B - Miniaturized single fiber bidirectional device based on plane light wave-guide branch structure - Google Patents
Miniaturized single fiber bidirectional device based on plane light wave-guide branch structure Download PDFInfo
- Publication number
- CN101216582B CN101216582B CN2008100257509A CN200810025750A CN101216582B CN 101216582 B CN101216582 B CN 101216582B CN 2008100257509 A CN2008100257509 A CN 2008100257509A CN 200810025750 A CN200810025750 A CN 200810025750A CN 101216582 B CN101216582 B CN 101216582B
- Authority
- CN
- China
- Prior art keywords
- optical
- chip
- plc
- branch
- single fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a miniaturized single fiber bi-directional device based on the branch structure of a planar light-wave circuit (PLC), which comprises a PLC optical chip, a wavelength-division-multiplexing (WDM) optical filter, a laser chip, a detector chip, an optical fiber or fiber core insert, and a photodetector chip (MPD), wherein the above components are fixed on corresponding positions by on-chip or off-chip integration and packaged in a housing; the optical chip is a branch light waveguide structure based on PLC; and the WDM optical fiber is an embedded filter, a bonded filter or an optical filtering film directly plated on the end face of the optical chip. The entire single fiber bi-directional device has very small size which accords with the miniaturization development tendency, and the laser chip and the optical signal detector chip are coupled with the PLC optical chip to achieve good integrity among the elements.
Description
Technical field
The present invention relates to a kind of single fiber bi-directional device, relate in particular to a kind of miniaturized single fiber bidirectional device that is used for optical fiber communication based on planar optical waveguide (PLC) branched structure.
Technical background
The single fiber bi-directional device is one of core light device that is used for optical transfer network and optical access network, is laser instrument and detector are packaged together, and realizes the transmitted in both directions of signal jointly by an optical fiber.At present it realizes that technical approach is to adopt the discrete component technology, the laser instrument of transistor outline can (TO-CAN) packing forms and detector and wavelength-division multiplex (WDM) Thin Film Filter is encapsulated in the betal can, by an optical fiber coupling output.This technical approach is very ripe at present, but encapsulation volume is bigger, owing to adopt manual mode to carry out encapsulation operation, the reliability of encapsulation is relatively poor simultaneously, and efficient is lower, and because manual operations when large-scale production, does not have cost advantage.Along with the single fiber bi-directional optical device enters civil area, the pressure of cost is increasing, and the drawback of this traditional technical approach is just more and more obvious.In recent years, emerging PLC technology is compared with conventional art has bigger advantage and potentiality, and obtains important application in fields such as optical branching device, DWDM multiplexing demultiplexing device, ROADM, same, in single fiber bi-directional transceiving device field, the PLC technology is also placed high hopes.
Summary of the invention
The object of the invention is to provide a kind of miniaturized single fiber bidirectional device based on planar optical waveguide (PLC) branched structure, and it is simple in structure, and size is little, and low to the chip manufacture technological requirement, especially is fit to low cost optical transmission and light and inserts application.
Purpose of the present invention can realize by following technical scheme, and a kind of miniaturized single fiber bidirectional device based on plane light wave-guide branch structure comprises a planar optical waveguide (PLC) optical chip, is mainly used to the light conducting signal; A wavelength-division multiplex (WDM) optical lightscreening spare is used to separate the light of two wavelength of uplink and downlink; A chip of laser that is used for producing light signal; A detector chip that is used for receiving optical signals; Optical fiber or fiber stub are used for being connected with optical waveguide port on the optical chip, realize inputing or outputing light signal; A photo detector chip (MPD) that is used for monitoring laser power; Above-mentioned each ingredient with on the sheet or the outer integration mode of sheet be fixed on the relevant position and be packaged in the shell body; It is characterized in that: described optical chip is the branch waveguide structure based on planar optical waveguide (PLC) technology, described wavelength-division multiplex (WDM) optical filtering part is for embedding optical filter, amplexiform optical filter or directly being plated in one deck optical lightscreening film of optical chip end face, leaded light and beam split function that the PLC optical chip of branch waveguide structure and WDM optical filtering part combine and realized the single fiber bi-directional device inside.
The branch waveguide structure of PLC optical chip of the present invention is to adopt the V branch or the y branch optical waveguide structure of semiconducter process fabrication techniques, and itself does not play the branch light action.One of its effect is the light from optical fiber and chip of laser to be limited in the optical waveguide conduct, and plays the leaded light effect; Two of effect is to be WDM optical filtering part cremasteric reflex and transmitted light path; Three of effect is that the PLC optical chip itself can be used as platform, i.e. grooving in its surface earlier or dig pit is placed parts such as chip of laser, detector chip, WDM optical filtering part and optical fiber in its surface then.
The process of embedding optical filter of the present invention is that an elongated groove is dug in the position of placing the WDM optical filter at PLC optical chip branch node place, then with in the thin WDM optical filter embedded groove.
Process of amplexiforming optical filter of the present invention is after the end surface grinding of the branch node side of the PLC optical chip polishing, sticks thin WDM optical filter at the end face of branch node side.
Direct process of plating of the present invention is fixing and put into coating machine reposefully with anchor clamps the end surface grinding of the branch node side of PLC optical chip polishing back, directly the end face of the branch node side of PLC optical chip is carried out plated film (be deposit/be coated with optical thin film) then.Because the too thick meeting of optical filter thickness brings big insertion loss, this just makes to embed optical filter and amplexiform the optical filter mode all needs to use very thin Thin Film Filter, yet because the stress ability to bear of thin optical filter substrate is limited, its preparation difficulty is bigger; And adopt direct plated film mode, PLC optical chip to be equivalent to the substrate of WDM optical filter, and so just avoided the stress ability to bear restricted problem of thin substrate in the film preparation, reduced the difficulty of WDM optical filtering part preparation.
In addition, detector chip of the present invention can be medium-sized, also can be waveguide type; Optical power detector chip of the present invention can directly place chip of laser to carry out the back behind to detection, also can place the chip of laser front and link to each other by optical waveguide to carry out forward detection.
Of the present invention is gone up integrated (ON-CHIP) mode is grooving or dig pit and make some registration marks on the PLC optical chip earlier, each building block directly is placed on the PLC optical chip by means of registration mark with the aligning machine then; Of the present invention outer integrated (OFF-CHIP) mode is the relevant position of optical fiber, laser instrument, detector and WDM Thin Film Filter etc. being fixed in the PLC chip side.Sheet upper type integrated level is higher, and the outer mode initial stage input cost of sheet is lower, in actual applications, can be as the case may be, select on the outer and sheet of sheet a kind of in the integration mode, or select the combination of dual mode flexibly.
The present invention compares with existing other technologies scheme, has following beneficial effect:
One, PLC optical chip of the present invention itself does not play the branch light action, its size can be littler, it is easier to make, simpler, other critical pieces also all adopt chip form, make that the volume of whole single fiber bi-directional device is very little, meet the miniaturization development trend, and chip of laser and optical signal detector chip all and between the PLC optical chip are coupled, conformability between the components and parts is good, like this, as long as with the PLC optical chip, WDM optical filtering part, optical fiber or fiber stub, chip of laser, after optical signal detector chip coupling encapsulation is finished, they are fixed in the package casing that has optical fiber outlet and an electric pin together, carry out level Hermetic Package then, the input and output of light signal just can realize by optical fiber or fiber stub;
Two, the present invention proposes at PLC optical chip end face coating first as the WDM part that filters, compare with other WDM optical filtering parts (as grating, coupling mechanism, Mach-Zehnder interferometer) based on the fabrication techniques of PLC, it can adopt the plated film standard technology of current maturation to realize, it makes simple, performance index such as isolation and loss also can be done finely, can easily satisfy various optical fiber transmitting-receiving application requirements.
Description of drawings
Fig. 1 is that the embodiment of the invention 1 adopts the PLC optical chip synoptic diagram that embeds the single fiber bi-directional device of integration mode on optical filter, the sheet;
Fig. 2 is that the embodiment of the invention 1 adopts the one-piece construction synoptic diagram that embeds the single fiber bi-directional device of integration mode on optical filter, the sheet.
Fig. 3 is the PLC optical chip synoptic diagram that the embodiment of the invention 2 adopts the single fiber bi-directional device of direct plated film, the outer integration mode of sheet;
Fig. 4 is the one-piece construction synoptic diagram that the embodiment of the invention 2 adopts the single fiber bi-directional device of direct plated film, the outer integration mode of sheet.
Embodiment
Embodiment one:
As shown in Figure 1, 2, the embodiment of the invention adopt to embed the optical filter mode, and all building blocks adopt all that integration mode is fixed on the PLC optical chip 11 on the sheet.PLC optical chip 11 is the Y branched structures that adopt the semiconducter process fabrication techniques; An elongated groove 14 has been dug in the position of placing WDM optical filter 12 on the Y of PLC optical chip 11 branch node, and WDM optical filter 12 is embedded; The port position of coupled fiber has been dug a V-type groove 22 on PLC optical chip 11, and the machining precision of this groove is very high, therefore, only need optical fiber 21 be put into reposefully and be fixed in wherein, just can realize that optical fiber 21 aims at the fiber port of PLC optical chip 11; On PLC optical chip 11, place chip of laser 31, one hole 32 has respectively been dug in the position of optical signal detector chip 41 and optical power monitoring detector (MPD) chip 51,42 and 52, made the sign 33 of some alignings simultaneously in the inside, hole, 43 and 53, chip of laser 31 and optical signal detector chip 41 are by corresponding registration mark 32,42 make the luminous position of chip of laser 31, the photosensitive position of optical signal detector chip 41 and PLC optical chip 11 corresponding optical waveguide ports are aimed at, and chip of laser 31 grades can adopt the mode of flip chip bonding to be fixed in the hole.In addition, optical power monitoring detector 51 is to be fixed on chip of laser 41 fronts after linking to each other by optical waveguide.
Present embodiment adopts integration mode on the sheet, and its advantage is the integrated level height, and the efficient of encapsulation and reliability can embody greater advantage also than higher in large-scale production.Its difficult point is that the optical filter thickness requirement that embeds is very thin, should be less than two, 30 micron, and the preparation difficulty of this ultra-thin optical filter is bigger.
Embodiment two:
Shown in Fig. 3,4, the embodiment of the invention adopts direct plated film mode, and all parts all adopt the outer integration mode of sheet to be fixed on PLC optical chip 11 sides on the substrate 1.PLC optical chip 11 is the V branched structures that adopt the semiconducter process fabrication techniques; After the polishing of the end surface grinding of the branch node side of PLC optical chip 11, with the fixing coating machine of also putting into reposefully of anchor clamps, then directly to the end face deposit of the branch node side of PLC optical chip 11 one deck WDM light filter film 12, be used for branch and separate upper and lower road light signal.Optical fiber 21 is used to transmit upper and lower road light signal, and optical fiber 21 is fixed in the fiber port position of PLC optical chip 11 sides by holder 22; Chip of laser 31 is used to send uplink optical signal, optical signal detector chip 41 is used to receive downlink optical signal, they also are to be fixed in the corresponding Waveguide interface in PLC optical chip 11 sides respectively by holder 32 and 42, in addition, optical power detector chip 51 (MPD) is placed on chip of laser 31 behind.
Present embodiment adopts direct plated film mode, can avoid the stress ability to bear restricted problem of thin substrate in the film preparation, makes the yield rate of film optical filtering part preparation improve, and the difficulty and the cost of the preparation of film optical filtering part can be reduced.But because it adopts the outer integration mode of sheet, integrated level is relatively low.
Detector in the optics combined chip that assembles with the foregoing description is added trans-impedance amplifier (TIA), put into the sealing of an airtight metal shell and routing again and just finished encapsulation.In addition, the groove of opening on the surface of PLC optical chip 11 14 or the structure of digging pit can also be U type groove, bar-shaped trough or cross etc.; End face at the optical waveguide port of PLC optical chip 11 also can be opened various groove structures as registration mark, the aligning location when being used for realizing PLC optical chip 11 and optical fiber 21, chip of laser 31,41 couplings of optical signal detector chip.
More than among each embodiment the principle of work and the course of work of single fiber bi-directional device as follows:
The wavelength of the uplink optical signal of single fiber bi-directional device is λ
1With the wavelength of downlink optical signal be λ
2, λ
1And λ
2Centre wavelength can be among 1310nm, 1490nm, the 1550nm any two.Descending wavelength is λ
2Light signal be input in the PLC optical chip 11 by optical fiber 21, branch light action by WDM optical filter or WDM light filter film 12 is output to optical signal detector chip 41 ports, optical signal detector chip 41 converts downlink optical signal the current signal of corresponding size to, and to send wavelength be λ to chip of laser 31 simultaneously
1The laser instrument port of uplink optical signal by PLC optical chip 11 be input in the PLC optical chip 11, it is output to the branch light action by WDM optical filter or WDM light filter film 12 in the optical fiber 21 and transmits.So just realized in an optical fiber, transmitting simultaneously the signal of the different wave length of uplink and downlink.
Embodiments of the present invention are not limited thereto, according to foregoing of the present invention, according to the ordinary skill knowledge and the customary means of this area,, can also make modification, replacement or the change of other various ways not breaking away under the above-mentioned basic fundamental thought of the present invention prerequisite.
Claims (4)
1. miniaturized single fiber bidirectional device based on plane light wave-guide branch structure comprises:
A planar optical waveguide optical chip is used for the light conducting signal;
A WDM optical optical filtering part is used to separate the light of two wavelength of uplink and downlink;
A chip of laser that is used for producing light signal;
A detector chip that is used for receiving optical signals;
Optical fiber or fiber stub are used for being connected with optical waveguide port on the optical chip, realize inputing or outputing light signal;
A photo detector chip that is used for monitoring laser power;
Above-mentioned each ingredient is fixed on corresponding position with the outer integration mode of sheet and is packaged in the housing;
It is characterized in that: described optical chip is the branch waveguide structure based on planar optical waveguide, and described WDM optical optical filtering part is for directly being plated in one deck optical lightscreening film of optical chip end face;
The end face of the branch node side in the described planar optical waveguide optical chip branch waveguide structure is the grinding and polishing end face, and described optical lightscreening thin-film-coating is on described polished end faces.
2. the miniaturized single fiber bidirectional device based on plane light wave-guide branch structure according to claim 1 is characterized in that: described branch waveguide structure is to adopt the V branch waveguide structure of semiconducter process fabrication techniques.
3. the miniaturized single fiber bidirectional device based on plane light wave-guide branch structure according to claim 1 is characterized in that: described optical power detector chip is plain edition or waveguide type; Described optical power detector chip directly places chip of laser behind.
4. the miniaturized single fiber bidirectional device based on plane light wave-guide branch structure according to claim 1 is characterized in that: described outer integration mode is the relevant position of each building block being fixed in planar optical waveguide optical chip upside end face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100257509A CN101216582B (en) | 2008-01-11 | 2008-01-11 | Miniaturized single fiber bidirectional device based on plane light wave-guide branch structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100257509A CN101216582B (en) | 2008-01-11 | 2008-01-11 | Miniaturized single fiber bidirectional device based on plane light wave-guide branch structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101216582A CN101216582A (en) | 2008-07-09 |
| CN101216582B true CN101216582B (en) | 2011-05-04 |
Family
ID=39623051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100257509A Active CN101216582B (en) | 2008-01-11 | 2008-01-11 | Miniaturized single fiber bidirectional device based on plane light wave-guide branch structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101216582B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102135649B (en) * | 2010-08-04 | 2012-04-18 | 华为技术有限公司 | Manufacturing method of optical module and optical module |
| CN102322945A (en) * | 2011-06-22 | 2012-01-18 | 中国科学院上海光学精密机械研究所 | Power on-line monitoring device for high-power optical fiber laser |
| CN102983915A (en) * | 2012-12-13 | 2013-03-20 | 深圳新飞通光电子技术有限公司 | Planar optical waveguide type single-fiber bidirectional four-port optical component and optical transmitting-receiving integrated module |
| CN103278887A (en) * | 2013-04-24 | 2013-09-04 | 深圳市中兴新地通信器材有限公司 | Filtering structures based on optical waveguide and filtering film |
| CN103487890A (en) * | 2013-09-10 | 2014-01-01 | 浙江同星光电科技有限公司 | Miniature WDM |
| CN106375741A (en) * | 2016-10-11 | 2017-02-01 | 中国人民解放军陆军军官学院 | Night vision true color image acquisition method based on filtering of image intensifier |
| CN113267851A (en) | 2019-12-23 | 2021-08-17 | 讯芸电子科技(中山)有限公司 | Optical communication module |
-
2008
- 2008-01-11 CN CN2008100257509A patent/CN101216582B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101216582A (en) | 2008-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101216582B (en) | Miniaturized single fiber bidirectional device based on plane light wave-guide branch structure | |
| CN112925069B (en) | Integrated optical transceiver, compact optical engine and multichannel optical engine | |
| US10215919B2 (en) | Optical coupling arrangement | |
| CN105278056B (en) | Wavelength division multiplexing and de-multiplexing optical assembly | |
| Boeuf et al. | A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications | |
| KR101866495B1 (en) | Two-stage Adiabatically Coupled Photonic Systems | |
| CN105759371B (en) | A kind of parallel emission and reception module and production method for dual link transmission | |
| CN101191875B (en) | Single fiber bidirectional device based on PLC technology and its manufacture method | |
| EP1723456B1 (en) | System and method for the fabrication of an electro-optical module | |
| WO2021115129A1 (en) | Optical module | |
| US20010046352A1 (en) | Fiber-type optical coupler, manufacturing method thereof and optical parts and apparatuses using the same | |
| CN104914519B (en) | A kind of 40G optical transceiver modules | |
| US20020154879A1 (en) | Optical device, and optical transceiver and other optical apparatuses using the optical device | |
| CN104516070A (en) | High-reliability non-airtight packaged parallel transceiving component | |
| JP3344446B2 (en) | Optical transceiver module | |
| US7027677B2 (en) | Integrating optical components on a planar light circuit | |
| CN1507065B (en) | Optical transmitter receiver | |
| KR20050000706A (en) | Structure of coupling up optical device to optical waveguide and method for coupling arrangement using the same | |
| CN104049323A (en) | Optical module | |
| CN212647059U (en) | Optical module and optical communication module thereof | |
| CN114402243A (en) | Microminiature optical transmission module and method for manufacturing the same using semiconductor package | |
| CN1878035B (en) | Hybrid integrated silicon-based photosignal processing chip | |
| US20040223682A1 (en) | Hybrid optical circuits with thin film filters | |
| Han et al. | A PLC‐Based Optical Sub‐assembly of Triplexer Using TFF‐Attached WDM and PD Carriers | |
| US20230314740A1 (en) | Optical semiconductor module and manufacturing method of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |