CN101216301A - Less qualified solder pad space length detection device and method - Google Patents
Less qualified solder pad space length detection device and method Download PDFInfo
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- CN101216301A CN101216301A CNA2008100011513A CN200810001151A CN101216301A CN 101216301 A CN101216301 A CN 101216301A CN A2008100011513 A CNA2008100011513 A CN A2008100011513A CN 200810001151 A CN200810001151 A CN 200810001151A CN 101216301 A CN101216301 A CN 101216301A
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- space length
- solder pad
- pad space
- spacing
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Abstract
The invention discloses a detection device for detecting spaces between unqualified bonding pads and a method thereof to realize the space detection of the unqualified bonding pads. The device comprises a space measurement unit for measuring space of the bonding pads; a space comparing unit for comparing the space of the bonding pads measured by the space measurement unit with the allowable range of production process; and an unqualified bonding pad determining unit for determining the space measured by the space measurement unit unqualified when the measured space of the bonding pads is out of the allowable range of production process after comparison by the space comparing unit. The method comprises the following steps of: measuring the space of the bonding pads by the space measurement unit; comparing the bonding pad space measured by the space measurement unit with the allowable range of production process; and determining the space measured by the space measurement unit unqualified when the measured bonding pad space is out of the allowable range of production process after comparison by the space comparing unit.
Description
Technical field
The present invention relates to electronic circuit field, relate in particular to less qualified solder pad space length detection device and method.
Background technology
Device count on the printed circuit board (PCB) (PCB, Print Circuit Board) constantly increases at present, and plate density is increasing, when therefore putting device on circuit board, makes that probably the solder pad space length between different elements is too small, does not meet the requirement of production technology.
Fig. 1 a is first kind of solder pad space length synoptic diagram of different elements on the pcb board, Fig. 1 b is second kind of solder pad space length synoptic diagram of different elements on the pcb board, if solder pad space length in the spacing range that production technology allows, then may not cause pcb board to produce, reduce the problem of pcb board production efficiency.
Therefore need a kind of scheme that can realize that less qualified solder pad space length detects badly, avoid the problems referred to above to detect less qualified solder pad space length.
Summary of the invention
The embodiment of the invention provides a kind of less qualified solder pad space length detection device and method, to realize the detection of less qualified solder pad space length.
The embodiment of the invention provides a kind of less qualified solder pad space length detection device, comprising: the distance measurement unit is used to measure solder pad space length; The spacing comparing unit is used for the scope that the solder pad space length measured comparison distance measurement unit and production technology allow; Defective spacing determining unit is used for when the spacing comparing unit relatively obtains the described solder pad space length of measuring and do not belong to the scope that production technology allows, and determines that this spacing that the distance measurement unit measures is defective.
The embodiment of the invention provides a kind of less qualified solder pad space length detection method, comprising: less qualified solder pad space length detection device is measured solder pad space length; Compare and measure the scope that the solder pad space length that and production technology allow; And when the described solder pad space length of measuring does not belong to the scope of production technology permission, determine that this spacing is defective.
The embodiment of the invention is measured solder pad space length automatically based on the less qualified solder pad space length measurement mechanism, and compare and measure the solder pad space length that and the spacing range of manufacturing technique requirent, and when the solder pad space length of measuring does not belong to the scope of production technology permission, determine that this spacing is defective, realized the detection of less qualified solder pad space length, thereby follow-uply detected less qualified solder pad space length can be adjusted into qualified solder pad space length, avoid for example reducing the problems such as production efficiency of pcb board owing to the defective all kinds of problems that cause of solder pad space length.
Description of drawings
Fig. 1 a is first kind of solder pad space length synoptic diagram of different elements on the pcb board;
Fig. 1 b is second kind of solder pad space length synoptic diagram of different elements on the pcb board;
Fig. 2 is the structural representation of the less qualified solder pad space length detection device of embodiment of the invention proposition;
Fig. 3 is the method flow diagram of the detection less qualified solder pad space length of embodiment of the invention proposition;
Fig. 4 is the implementation process figure of first embodiment of the invention;
Fig. 5 is the concrete structure synoptic diagram of a kind of distance measurement unit of embodiment of the invention proposition;
Fig. 6 is the implementation process figure of second embodiment of the invention.
Embodiment
The problem of mentioning at background technology, the embodiment of the invention proposes to carry out following process by programming: measure solder pad space length, and the solder pad space length measured and the spacing range of manufacturing technique requirent compared, and when the described solder pad space length of measuring does not belong to the scope of production technology permission, determine that this spacing is defective, thereby realized the detection of less qualified solder pad space length.
Based on above-mentioned thinking, the embodiment of the invention proposes a kind of less qualified solder pad space length detection device, to realize the detection of less qualified solder pad space length.
Fig. 2 is the structural representation of the less qualified solder pad space length detection device of embodiment of the invention proposition, and in conjunction with this figure as can be known, this pick-up unit 10 comprises:
Defective spacing determining unit 13 is used for when spacing comparing unit 12 relatively obtains the described solder pad space length of measuring and do not belong to the scope that production technology allows, and determines that this spacing that distance measurement unit 11 measures is defective.
Elaborate this device 10 below in conjunction with this pick-up unit 10 and each unit thereof and how to detect less qualified solder pad space length automatically.
Fig. 3 is the method flow diagram of the detection less qualified solder pad space length of embodiment of the invention proposition, and in conjunction with this figure as can be known, the testing process that the embodiment of the invention proposes comprises:
Step 1, solder pad space length is measured in distance measurement unit 11;
Wherein said solder pad space length may be formed by the pad of identity element, also may form by the pad of different elements, if solder pad space length is formed by the pad of identity element, then the size of this solder pad space length is fixed, and the problem that can cause background technology to be mentioned is not actually qualified solder pad space length.Therefore in the distance measurement unit 11 when detecting less qualified solder pad space lengths, can only detect the solder pad space length that the pad of different elements forms.
But whether form the required resource that expends for the identification solder pad space length by the pad of identity element for avoiding expending less qualified solder pad pick-up unit 10, also whether the solder pad space length of discriminating measurement is not formed by the pad of identity element, if the solder pad space length that has the pad by identity element to form is detected to defective by this pick-up unit 10, so can be after this pick-up unit 10 detects less qualified solder pad space length, in detected less qualified solder pad space length, the solder pad space length that will be formed by the pad of identity element is rejected and is got final product by the testing staff.
Step 2, spacing comparing unit 12 compare and measure the scope that the solder pad space length that and production technology allow;
Usually the spacing of the pad of manufacturing technique requirent different elements must not be less than certain numerical value, and therefore described spacing range is generally more than or equal to described numerical value.
When step 3, defective spacing determining unit 13 do not belong to the scope of production technology permission at the described solder pad space length of measuring, determine that this spacing is defective.
Defective spacing determining unit 13 determine this spacing defective after, this pick-up unit 10 can be prompted to the testing staff with this solder pad space length corresponding bonding pad, reminding method can comprise multiple mode, for example highlights etc.
Less qualified solder pad space length detection device 10 is carried out above-mentioned steps 1 to 3 by circulation, can realize the automatic detection of less qualified solder pad space length.
Based on above-mentioned thinking, provide following several embodiment below:
Embodiment one, less qualified solder pad space length detection device 10 do not meet the scope that production technology allows with spacing, and the solder pad space length that is formed by the pad of different elements, and detecting automatically is less qualified solder pad space length.
For whether the solder pad space length that identifies measurement is formed by the pad of different elements, in testing process, can introduce deterministic process, judge that by less qualified solder pad space length detection device 10 whether the solder pad space length of measurement is formed by the pad of different elements.
This deterministic process can be in the distance measurement unit 11 be carried out when measuring solder pad space lengths, be to carry out in the above-mentioned steps 1, do not carry out after can not belonging to the scope that production technology allows at the solder pad space length that defective spacing determining unit 13 is determined measurement yet, promptly in step 3, carry out, provide the embodiment of both of these case below respectively.
Embodiment one, distance measurement unit 11 judge that whether solder pad space length is formed by the pad of different elements, if belong to, then measures its spacing.
Fig. 4 is the implementation process figure of first embodiment of the invention, and in conjunction with this figure as can be known, the implementation process of first embodiment of the invention is as follows:
Step a1, distance measurement unit 11 reads the attribute information of a pad; Described attribute information comprises the element identifier information of the affiliated element of pad;
Step a2, distance measurement unit 11 reads the attribute information of another pad;
Wherein the pad attribute information can call the function that software carries by distance measurement unit 11 and reads, for example based on PCB designing wiring instrument ALLEGRO software, distance measurement unit 11 can be based on finish reading of pcb board top layer pad attribute information as minor function:
axlVisibleDesign(nil)；
axlVisibleLayer(″pin/top″t)；
axlSetFindFilter(？enabled?list(″noall″″pins″)？onButtons?list(″noall″″pins″))；
axlClearSelSet()；
axlAddSelectAll()；
pin_dbids＝axlGetSelSet()；
Wherein pin_dbids is the top layer pad attribute information that reads.
Can also read the pad attribute information of other layers of pcb board based on above-mentioned function, for example the parameter " top " in the above-mentioned axlVisibleLayer function can be revised as " bottom ", realize reading of bottom pad attribute information.
Step a3, distance measurement unit 11 judges according to described attribute information whether two pads belong to different elements, if forward step a4 to, otherwise forward step a2 to;
Its determination methods is: judge whether the element identifier information that comprises in the attribute information of these two pads is identical, if it is different, then determine these two pads and belong to different elements, this solder pad space length is formed by the pad of different elements, otherwise the pad of determining by identity element forms.
Wherein can extract element identifier information in the pad attribute information by calling the function that software carries, be example with ALLEGRO software still:
pinparent＝pin～＞component?pinparentname＝pinparent～＞name
pinsparent＝pins～＞component?pinsparentname＝pinsparent～＞name
Step a4, the spacing of described two pads is measured according to described attribute information in distance measurement unit 11;
Usually the positional information that also comprises pad in the attribute information of this pad can go out the spacing of two pads according to described positional information calculation.
Wherein distance measurement unit 11 can calculate the spacing of described two pads based on the axlAirGap function of ALLEGRO software.
Step a5, spacing comparing unit 12 judge the spacing measured distance measurement unit 11 whether in the scope that production technology allows, if not, forward step a6 to, otherwise forward step a2 to;
Step a6, it is defective that defective spacing determining unit 13 is determined this spacing.
Carry out above-mentioned steps by circulation, defective pitch measuring 10 can detect underproof solder pad space length on the pcb board automatically.
In step a3, when described two pads belong to similar elements, will forward step a2 to, measure other solder pad space lengths, in fact, also can not forward step a2 to, and measure other solder pad space lengths by forwarding step a1 to.Similarly, in step a5, if the spacing that calculates then also can forward step a1 to, and not forward step a2 in the scope that production technology allows.
ALLEGRO software is carried out secondary development is example: the procedure stores that might as well will write out based on above-mentioned steps is the check.il document, and the document imported ALLEGRO software, be equivalent to set up a new order check, move this order and can detect less qualified solder pad space length automatically, and be prompted to the testing staff.
Wherein check.il is imported ALLEGRO process can for:
1) after finding the pcbenv file under the path of Home environment variable settings, in pcbenv, increase the Allegro.ilinit document newly, reach as the path of setting check.il and be written into check.il automatically;
2) editor Allegro.ilinit document, grammer is as follows:
setSkillPath(buildString(appendl(getSkillPath()“D:/skill″)))；
Load(“check.il”)；
Wherein D:/skill is the path of putting the check.il document, can build the catalogue that a catalogue is called skill under the D dish, and check.il is stored in this catalogue; Load is used for check.il is imported ALLEGRO.
3) Allegro.ilinit has been edited after, as long as open ALLEGRO software, operation check order can detect underproof solder pad space length automatically.
Spacing measuring unit 11 is only measured the solder pad space length that the pad by different elements forms among this embodiment, provides a kind of concrete structure of distance measurement unit 11 below.
With reference to Fig. 5, the concrete structure synoptic diagram of a kind of distance measurement unit that proposes for the embodiment of the invention, in conjunction with this figure as can be known, this distance measurement unit 11 specifically comprises:
Information reads subelement 14, is used to read the attribute information of solder pad space length corresponding bonding pad, comprises the element identifier information of the affiliated element of pad in the described attribute information;
Information judgment sub-unit 15 is used to judge whether described element identifier information is consistent; And
Embodiment two, detecting solder pad space length not after the scope that technology allows, and under the situation that solder pad space length is formed by the pad of different elements, determine that this spacing is defective.
Fig. 6 is the implementation process figure of second embodiment of the invention, and in conjunction with this figure as can be known, the implementation process of second embodiment of the invention comprises:
Step b1, distance measurement unit 11 reads the attribute information of a pad;
Step b2, distance measurement unit 11 reads the attribute information of another pad;
Step b3, the spacing of these two pads is measured according to described attribute information in distance measurement unit 11;
The spacing that step b4, spacing comparing unit 12 judge these two pads whether in the scope that production technology allows, if not, forward step b5 to, otherwise forward step b2 to;
Step b5, defective spacing determining unit 13 judges whether these two pads belong to different elements, if forward step b6 to, otherwise forward step b2 to according to described attribute information;
Step b6, defective spacing determining unit 13 determines that the spacing of these two pads is defective.
Carry out above-mentioned steps by circulation, defective gap measuring device 10 can detect underproof solder pad space length automatically, is prompted to the testing staff.
Similar with first embodiment, among the step b4, in the time of in described spacing belongs to the scope that production technology allows, can be by forwarding step b1 to, and do not forward step b2 to, measure other solder pad space lengths; In step b5, when described spacing is formed by the pad of identity element, can be by forwarding step b1 to, and do not forward step b2 to, measure other solder pad space lengths.
Embodiment two, defective gap measuring device 10 does not meet spacing the solder pad space length of the scope of production technology permission, automatically detect and be underproof solder pad space length, again by the testing staff from automatic detected less qualified solder pad space length, select the solder pad space length that the pad by different elements forms, be defined as actual less qualified solder pad space length.
In the embodiment one, in the solder pad space length that defective gap measuring device 10 only will be formed by the pad of different elements, underproof solder pad space length is prompted to the testing staff, in fact, because the underproof pad number of spacing is lower, even therefore defective gap measuring device 10 will be formed by the pad of identity element, underproof solder pad space length is prompted to the testing staff, again by the testing staff in these underproof solder pad space lengths, filter out the solder pad space length that the pad by different elements forms, and determine that the solder pad space length that filters out is defective, then also can realize the detection of less qualified solder pad space length.
The implementation process of the implementation process of this scheme two and scheme one is similar, and the embodiment of the invention repeats no more.
The embodiment of the invention is by measuring solder pad space length automatically, and compare and measure the solder pad space length that and the spacing range of manufacturing technique requirent, and when the solder pad space length of measuring does not belong to the scope of production technology permission, determine that this spacing is defective, thereby realized the detection of less qualified solder pad space length.
The embodiment of the invention can not meet spacing the scope that production technology allows, and the solder pad space length that forms by the pad of different elements, automatically detect and be less qualified solder pad space length, thereby make the testing process of less qualified solder pad space length carry out automatically, need not artificial participation, thereby not only realize on the basis of less qualified solder pad space length detection, and detection efficiency is high.
The embodiment of the invention can not meet solder pad space length the solder pad space length of the scope of production technology permission, automatically detect and be underproof solder pad space length, again by the testing staff from automatic detected less qualified solder pad space length, the pad of selecting by different elements forms solder pad space length, be defined as actual less qualified solder pad space length, thereby not only realize the detection of less qualified solder pad space length and higher detection efficient is arranged, and can save the detection resource.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (8)
1. a less qualified solder pad space length detection device is characterized in that, comprising:
The distance measurement unit is used to measure solder pad space length;
The spacing comparing unit is used for the scope that the solder pad space length measured comparison distance measurement unit and production technology allow;
Defective spacing determining unit is used for when the spacing comparing unit relatively obtains the described solder pad space length of measuring and do not belong to the scope that production technology allows, and determines that this spacing that the distance measurement unit measures is defective.
2. device as claimed in claim 1 is characterized in that, the less qualified solder pad space length that described defective spacing determining unit is determined is formed by the pad of different elements.
3. device as claimed in claim 2 is characterized in that, the solder pad space length that described distance measurement unit is measured is formed by the pad of different elements.
4. device as claimed in claim 3 is characterized in that, described distance measurement unit specifically comprises:
Information reads subelement, is used to read the attribute information of solder pad space length corresponding bonding pad, comprises the element identifier information of the affiliated element of described pad in the described attribute information;
The information judgment sub-unit is used to judge whether described element identifier information is consistent; And
The distance measurement subelement is used for when described element identifier information inconsistency, determines described solder pad space length and is the solder pad space length that the pad of different elements forms, and measure described solder pad space length.
5. a less qualified solder pad space length detection method is characterized in that, comprising:
Less qualified solder pad space length detection device is measured solder pad space length;
Compare and measure the scope that the solder pad space length that and production technology allow; And
When the described solder pad space length of measuring does not belong to the scope of production technology permission, determine that this spacing is defective.
6. method as claimed in claim 5 is characterized in that, the described defective spacing of determining is formed by the pad of different elements.
7. method as claimed in claim 6 is characterized in that the solder pad space length of described measurement is formed by the pad of different elements.
8. method as claimed in claim 7 is characterized in that, the less qualified solder pad space length measurement mechanism is measured described solder pad space length, specifically comprises:
Read the attribute information of described solder pad space length corresponding bonding pad, comprise the element identifier information of the affiliated element of described pad in the described attribute information;
Judge whether described element identifier information is consistent; And
When inconsistent, determine that described solder pad space length is the solder pad space length between different elements, and
Measure described solder pad space length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100011513A CN101216301B (en) | 2008-01-17 | 2008-01-17 | Less qualified solder pad space length detection device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100011513A CN101216301B (en) | 2008-01-17 | 2008-01-17 | Less qualified solder pad space length detection device and method |
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| CN101216301A true CN101216301A (en) | 2008-07-09 |
| CN101216301B CN101216301B (en) | 2012-07-25 |
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| CN2008100011513A Expired - Fee Related CN101216301B (en) | 2008-01-17 | 2008-01-17 | Less qualified solder pad space length detection device and method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101644734B (en) * | 2008-08-07 | 2012-10-10 | 和硕联合科技股份有限公司 | Method and system for checking negative film of circuit board |
| CN103438850A (en) * | 2013-08-28 | 2013-12-11 | 河南理工大学 | Online glass interval detecting method |
| CN107449385A (en) * | 2017-08-09 | 2017-12-08 | 济南浪潮高新科技投资发展有限公司 | A kind of spacing detection method and device of part position number |
| CN109270084A (en) * | 2018-11-02 | 2019-01-25 | 郑州云海信息技术有限公司 | The method, apparatus and medium of PCB mass are determined based on detection ICT measuring point |
| CN111174744A (en) * | 2019-12-30 | 2020-05-19 | 深圳市一博科技股份有限公司 | Method for screening and calculating physical spacing between test points on PCB |
-
2008
- 2008-01-17 CN CN2008100011513A patent/CN101216301B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101644734B (en) * | 2008-08-07 | 2012-10-10 | 和硕联合科技股份有限公司 | Method and system for checking negative film of circuit board |
| CN103438850A (en) * | 2013-08-28 | 2013-12-11 | 河南理工大学 | Online glass interval detecting method |
| CN107449385A (en) * | 2017-08-09 | 2017-12-08 | 济南浪潮高新科技投资发展有限公司 | A kind of spacing detection method and device of part position number |
| CN109270084A (en) * | 2018-11-02 | 2019-01-25 | 郑州云海信息技术有限公司 | The method, apparatus and medium of PCB mass are determined based on detection ICT measuring point |
| CN111174744A (en) * | 2019-12-30 | 2020-05-19 | 深圳市一博科技股份有限公司 | Method for screening and calculating physical spacing between test points on PCB |
| CN111174744B (en) * | 2019-12-30 | 2022-02-18 | 深圳市一博科技股份有限公司 | Method for screening and calculating physical spacing between test points on PCB |
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| Publication number | Publication date |
|---|---|
| CN101216301B (en) | 2012-07-25 |
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