CN101206995B - 监测晶圆托盘平整性的方法 - Google Patents
监测晶圆托盘平整性的方法 Download PDFInfo
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- CN101206995B CN101206995B CN200610147626A CN200610147626A CN101206995B CN 101206995 B CN101206995 B CN 101206995B CN 200610147626 A CN200610147626 A CN 200610147626A CN 200610147626 A CN200610147626 A CN 200610147626A CN 101206995 B CN101206995 B CN 101206995B
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CN200610147626A CN101206995B (zh) | 2006-12-20 | 2006-12-20 | 监测晶圆托盘平整性的方法 |
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CN200610147626A CN101206995B (zh) | 2006-12-20 | 2006-12-20 | 监测晶圆托盘平整性的方法 |
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CN101206995A CN101206995A (zh) | 2008-06-25 |
CN101206995B true CN101206995B (zh) | 2010-05-19 |
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CN200610147626A Expired - Fee Related CN101206995B (zh) | 2006-12-20 | 2006-12-20 | 监测晶圆托盘平整性的方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101740432B (zh) * | 2008-11-27 | 2012-01-25 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的制造方法 |
CN101764075B (zh) * | 2008-12-25 | 2011-10-05 | 中芯国际集成电路制造(上海)有限公司 | 晶片背面缺陷的监测方法和系统 |
CN102867762B (zh) * | 2012-09-17 | 2016-04-27 | 上海华力微电子有限公司 | 一种量测晶圆检测机台稳定性和精确性的监控方法 |
CN110773536B (zh) * | 2018-07-31 | 2021-10-22 | 台湾积体电路制造股份有限公司 | 晶粒容器工作站、晶粒容器处理的系统及方法 |
JP7181028B2 (ja) * | 2018-09-03 | 2022-11-30 | 株式会社ディスコ | 加工装置のメンテナンス方法および加工装置 |
CN112864075A (zh) * | 2019-12-26 | 2021-05-28 | 南京力安半导体有限公司 | 晶圆几何参数以及晶圆上掩膜层的厚度的测量方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0455443B1 (en) * | 1990-05-01 | 1997-11-12 | Canon Kabushiki Kaisha | Positional deviation detecting method and apparatus |
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Patent Citations (1)
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EP0455443B1 (en) * | 1990-05-01 | 1997-11-12 | Canon Kabushiki Kaisha | Positional deviation detecting method and apparatus |
Non-Patent Citations (3)
Title |
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JP特开2001-255139A 2001.09.21 |
JP特开2002-373848A 2002.12.26 |
JP特开2004-138611A 2004.05.13 |
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CN101206995A (zh) | 2008-06-25 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING |
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Effective date of registration: 20111118 Address after: 201203 No. 18 Zhangjiang Road, Shanghai Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20181220 |
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CF01 | Termination of patent right due to non-payment of annual fee |