CN101205054B - Minitype metal nickel mould producing method - Google Patents
Minitype metal nickel mould producing method Download PDFInfo
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- CN101205054B CN101205054B CN2007101153150A CN200710115315A CN101205054B CN 101205054 B CN101205054 B CN 101205054B CN 2007101153150 A CN2007101153150 A CN 2007101153150A CN 200710115315 A CN200710115315 A CN 200710115315A CN 101205054 B CN101205054 B CN 101205054B
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Abstract
The invention discloses a method for making a micro metal nickel mold. By adopting ultraviolet nano-imprint lithography and micro electroforming composite technology, the invention comprises the following basic technique flow: (1) a mother blank is lithographed by electron direct lithographing and dry etching; (2) a piece of glass taken as a substrate is cleaned and baked, with surface pretreated; (3) a Cr/Cu electroforming seed layer with a thickness of 90-110nm is sputtered on the glass substrate; (4) by taking the mother blank made by the step (1) as an imprint plate, a mold cavity microstructure is copied on ultraviolet organic light-cured substrate material by using a UV nano-imprint lithography technique; (5) a Cr/Cu or Au/Ti electroforming seed layer with a thickness of 8-12nm is deposited on the substrate material; (6) nickel with a depositional thickness of 300-500Mum is electroformed on the seed layer of the substrate material; (7) a metal backing is added; (8) after knockout, the metal nickel mold is obtained. The method has the advantages of low producing cost, simple technique and high producing effect, and can realize batch fabrication of submicron and nano-micro metal nickel mold with low cost.
Description
Technical field
The present invention relates to a kind of minisize mould manufacture method, relate in particular to a kind of minitype metal nickel mould producing method of low-cost mass.
Background technology
Process along with the MEMS industrialization, the MEMS (micro electro mechanical system) field is to the continuous growth of miniature product demand and improving constantly of quality requirement, little forming technique will obtain fast development, adapting to the requirement that miniature product is shaped, and will become another emerging high-tech area of industrial quarters.Although little forming technique has huge application potential and development space, face more and more stern challenge as the manufacturing of the core technology minisize mould in little forming technique, become the little fast-developing bottleneck that is shaped of restriction.Minisize mould can be divided into following several types according to the difference of shaping product: little mold for injection molding, minute-pressure casting mould, little punching press class mould, little forging mold and micro-embossing mould etc.Especially have bigger application potential and development space with little mold for injection molding and micro-embossing mould.The manufacturing of minisize mould, its difficult point is the processing of small die cavity or small convex-concave structure.The manufacture method of minisize mould mainly comprises following three kinds at present: fine cut (as fine turning, milling and grinding etc.); The fine special process (fine electric spark, electrochemistry, laser, ultrasonic wave, ion beam and electron beam etc.); Lithographic fabrication techniques (as LIGA and accurate LIGA, X-ray lithography, electron beam lithography and lithographic technique etc.).Micromachining technology generally is used for the processing of a millimeter magnitude part (miniaturized parts), and its machining accuracy can reach below the 100nm.Utilizing micromachine cutting working method making electrode or cutter to carry out the minisize mould manufacturing is a kind of processing method commonly used, the shaping of electrode is based on little electroforming, edm and line cutting processing, and the processing of cutting tool is processed as the master with grinding or high-speed milling.Therefore, the secondary process means that the micromechanics cut is generally made as minisize mould, its cavity dimension of directly processing and mostly is comparatively simple geometric structure such as revolving body or plane generally more than the millimeter level.But present miniature cut has outstanding advantage at the manufacture view of three-dimensional miniature mold.Though fine Special Working Technology relative complex in the mold cavity processing of hard-cutting material, complex profile and low rigidity material, has irreplaceable advantage.Wherein fine electric spark is processed being most widely used in the minisize mould manufacturing, but wherein the used microelectrode of fine electric spark processing itself is just made difficulty, and the surface roughness of processing back mould is difficult to reach requirement, need carry out follow-up grinding and polishing processing, thereby reduced production efficiency, so be of limited application.When mold cavity structure complexity and required precision were high, lithographic fabrication techniques was a kind of main manufacture craft.Especially the lithographic fabrication techniques that is representative with LIGA and accurate LIGA technology, although complex process, its machining accuracy is very high, and accessible depth-to-width ratio is bigger, and the processed mould cavity dimension is very little.In addition, methods such as electron-beam direct writing, proton beam processing and focused ion beam processing have the advantage that can not be substituted in the making of nano die (mother matrix or mask) at present, although its making precision is very high, also be not very desirable aspect the making of make efficiency and three-dimensional structure.But photoetching making will play an increasingly important role in the minisize mould manufacturing in future.Silicon mould and nickel mould are mainly used in present little shaping.
Summary of the invention
Purpose of the present invention is exactly in order to solve problems such as present minisize mould complex manufacturing technology, production cost height and production efficiency are low, provides a kind of and has that production cost is low, technology simple, be fit to batch making sub-micron minitype metal nickel mould producing method.
To achieve these goals, the present invention takes following technical solution:
The preparation of minitype metal nickel mould of the present invention is based on ultraviolet light nano impression and little electroforming combination process.It adopts ultraviolet light nano impression and little electroforming combination process to realize the low-cost batch making of minitype metal nickel mould, and its typical process flow is:
(1) makes mother matrix with e-beam direct write lithography and dry etching;
(2) with glass be substrate, it is advanced to clean and the oven dry surface preparation;
(3) in the thick Cr/Cu electroforming Seed Layer of glass substrate sputter one deck 90-110nm;
(4) mother matrix made from step (1) is an impressing mould, adopts the UV nano-imprint process to copy the mold cavity micro-structural on the organic photocuring basis material of ultraviolet light;
(5) in thick Cr/Cu or the Au/Ti electroforming Seed Layer of basis material deposition 8-12nm;
(6) electroforming deposit thickness 300-500 μ m nickel on the basis material Seed Layer;
(7) additional metal backing;
(8) demoulding.
This technology combines the advantage of multiple fine processes such as electron-beam direct writing, nano impression and little electroforming.Have that production cost is low, technology is simple and advantage such as suitable batch making.The method is characterized in that whole technical process is by mastering, substrate preliminary treatment, sputtering seed layer, nano impression moulding, deposition electrification place Seed Layer, electroforming plated metal nickel, additional metal backing and the demoulding eight parts are formed on basis material.Specifically comprise following processing step:
1) mastering
The mother matrix that contains the mold cavity micro-structural with e-beam direct write lithography and dry etching preparation.
2) substrate preliminary treatment
Clean glass substrate, oven dry.
3) sputtering seed layer
In the thick Cr/Cu electroforming Seed Layer of the about 100nm of glass substrate sputter one deck.
4) UV nano impression moulding
The mother matrix made from step 1 is an impressing mould, adopts the UV nano-imprint process to copy the mold cavity micro-structural on the organic photocuring basis material of ultraviolet light.
5) on basis material, deposit Seed Layer
To the processing of substrate material surface conductionization, deposit thick Cr/Cu of the about 10nm of one deck or Au/Ti electroforming Seed Layer thereon.
6) electroforming metal nickel
Accurate little electroforming, electroforming plated metal nickel on the basis material Seed Layer forms transoid sub-micron micro-structural mould, deposited nickel layer thickness 300-500 μ m.
7) additional metal backing
Pour into a mould low-melting bismuth ashbury metal to the mould back side, metal-backed thickness 6mm is to strengthen the intensity of nickel shell.
8) demoulding
Solution-off (peeling off) is removed basis material.
Described basis material can select UV nano-imprint process such as MonoMat, PAK01, AMONIL MMS 3 and mrUVCur06 to use various photoresists.
Can adopt the fine cut or the fine special process to make three-dimensional micron-sized mother matrix, realize the making of complex three-dimensional micron precision micro metal mould.
Minisize mould with complicate three dimension microstructure can adopt contrary imprinting moulding technology.
For large tracts of land micro metal mould, can adopt stepping to repeat contrary imprinting moulding technology.
The invention has the beneficial effects as follows: manufacture craft is simple, and the low and productivity ratio advantages of higher of production cost has realized the low-cost prepared in batches of sub-micron and nanometer minitype metal nickel mould.
Description of drawings
Fig. 1 is that the present invention makes minitype metal nickel mould processing technology routine figure;
Fig. 2 is a mastering schematic diagram of the present invention;
Fig. 3 is an imprinting moulding schematic diagram of the present invention;
Fig. 4 is that little electrotyping forming of the present invention is made the minitype metal nickel mould schematic diagram.
Embodiment
The present invention is described in further detail below in conjunction with drawings and Examples.
The technology path for preparing minitype metal nickel mould based on ultraviolet light nano impression and little electroforming combination process comprises referring to Fig. 1: 1. mastering; 2. substrate preliminary treatment; 3. sputtering seed layer; 4. UV nano impression moulding; 5. deposit Seed Layer; 6. electroplating deposition nickel; 7. additional metal backing; 8. the demoulding.
1) mastering
Use the e-beam direct write lithography system, follow an exposure scanpath to continuously change the ability of its exposure dose owing to it has, thereby can on electric lithography glue, obtain the continually varying exposure depth.Utilize this characteristic, can on electric lithography glue, form the micro-nano structure of 3D shape.Therefore, the mother matrix that contains the mold cavity micro-structural with e-beam direct write lithography and dry etching preparation.Fig. 2 is the principle schematic of making mother matrix by e-beam direct write lithography and dry etching.A figure is deposition one deck ito thin film on glass substrate, adopts PECVD sputter SiO subsequently
2, its thickness determines according to prepared microstructure graph, and at SiO
2Last rotation is coated with shop electron beam resist PMMA; B figure adopts e-beam direct write lithography to make microstructure graph, and the back of developing obtains the microstructure features figure on electron beam resist; C figure is dry etching SiO
2D figure forms the mother matrix that contains the mold cavity micro-structural for after removing photoresist.
2) substrate preliminary treatment
Adopt nitrogen current and method for suppersonic cleaning that quartz glass substrate is cleaned, remove greasy dirt, the quartz glass substrate after the cleaning toasted 3 hours in 180 ℃ of baking ovens.
3) sputtering seed layer
The thick Cr/Cu plating seed layer of the about 100nm of sputter one deck on the substrate.
4) UV nano impression moulding
Fig. 3 is the schematic diagram of mold cavity micro-structural imprinting moulding of the present invention.A is coated with the used photoresist (the organic photocuring basis material of ultraviolet light) of shop UV nano impression for Rotating with Uniform on the Seed Layer surface among the figure.B utilizes the mould of the mother matrix of step 1 making as impression, presses to after aligning to be coated with to be layered on on-chip photoresist.C adopts ultraviolet light from masterplate back side illuminaton basis material, behind the exposure curing molding, and the demoulding.D removes residual photoresist for using reactive ion etching RIE (Reactive Ion Etching), copies the mold cavity micro-structural behind development, the post bake on basis material.
5) deposition Seed Layer
To the processing of substrate material surface conductionization, deposit thick Cr/Cu of the about 10nm of one deck or Au/Ti electroforming Seed Layer thereon.
6) electroforming plated metal nickel
Use accurate little electroforming process, electroforming deposit thickness 300-500 μ m nickel on the basis material Seed Layer.
Select the prescription of Watts nickel-plating liquid commonly used in the industry,, add the normal dissolving that nickel chloride guarantees anode with the main component of nickelous sulfate as electrolyte.This plating bath safeguards that easily simple to operate, deposition velocity is fast, and coating stress is little.Concrete prescription and process conditions are as follows:
Nickelous sulfate NiSO
47H
2O 240g/L
Nickel chloride NiCl
26H
2O 20g/L
Boric acid H
3BO
320g/L
Lauryl sodium sulfate 0.05g/L
PH value 3.5
30 ℃-50 ℃ of working temperatures
Current density 1A/cm
2-2.5A/cm
2
The alr mode middling speed stirs
7) additional metal backing
In order to strengthen the intensity of nickel shell, need the additional metal backing, consider that the fusing point of bismuth ashbury metal is low, good fluidity, cubical expansivity is little when solidifying, and can reduce the advantages such as distortion of shell, can be so select for use the low-melting bismuth ashbury metal of this alloy as back lining materials.To mould back side cast bismuth ashbury metal, metal-backed thickness 6mm.Concrete thickness can be adjusted according to the application of reality.
8) demoulding
Adopt rare KOH solution removal basis material of acetone or 2%.If but micro-structural is complicated, just needs to use extremely rare KOH solution removal photoresist in order to control speed of etching, otherwise in dispose procedure, may stress deformation take place or damage is pushed in expansion.
Fig. 4 is the present invention makes the micro metal mould by electroforming plated metal nickel a principle schematic.A is thick Cr/Cu or the Au/Ti electroforming Seed Layer of the deposition about 10nm of one deck on matrix surface among the figure.B is an electroforming deposit thickness 300-500 μ m metallic nickel on the basis material Seed Layer.C is the additional metal backing.D is the demoulding, and solution-off (peeling off) obtains minitype metal nickel mould after removing basis material.
The mother matrix that the present invention makes can be used multiple times the making minitype metal nickel mould.Described organic photocuring basis material can select UV nano-imprint process such as MonoMat, PAK01, AMONIL MMS 3 and mrUVCur06 to use various photoresists.
Claims (5)
1. a minitype metal nickel mould producing method is characterized in that, it adopts ultraviolet light nano impression and little electroforming combination process to realize the low-cost batch making of minitype metal nickel mould, and its typical process flow is:
(1) makes mother matrix with e-beam direct write lithography and dry etching; Preparing the mother matrix method that contains the mold cavity micro-structural with e-beam direct write lithography and dry etching is,
1. deposition one deck ito thin film on the glass substrate adopts PECVD sputter SiO subsequently
2, its thickness determines according to prepared microstructure graph, and at SiO
2Last rotation is coated with shop electron beam resist PMMA;
2. make microstructure graph with e-beam direct write lithography, the back of developing obtains the microstructure features figure on electron beam resist;
3. dry etching SiO
2
4. after removing photoresist, form the mother matrix that contains the mold cavity micro-structural;
(2) with glass be substrate, it is advanced to clean and the oven dry surface preparation;
(3) in the thick Cr/Cu electroforming Seed Layer of glass substrate sputter one deck 90-110nm;
(4) mother matrix made from step (1) is an impressing mould, adopts the UV nano-imprint process to copy the mold cavity micro-structural on the organic photocuring basis material of ultraviolet light; Concrete grammar is:
1. Rotating with Uniform is coated with the used photoresist of shop UV nano-imprint process on the Seed Layer surface, adopts the organic photocuring basis material of ultraviolet light;
2. utilize mother matrix that step (1) makes mould, press to after aligning to be coated with and be layered on on-chip photoresist as impression;
3. adopt ultraviolet light from masterplate back side illuminaton basis material, behind the exposure curing molding, the demoulding;
4. use reactive ion etching RIE to remove residual photoresist, on basis material, produce the mold cavity micro-structural behind development, the post bake;
(5) in thick Cr/Cu or the Au/Ti electroforming Seed Layer of basis material deposition 8-12nm;
(6) electroforming deposit thickness 300-500 μ m nickel on the basis material Seed Layer;
(7) additional metal backing;
(8) demoulding.
2. minitype metal nickel mould producing method according to claim 1 is characterized in that, described basis material selects the UV nano-imprint process to use various photoresists.
3. minitype metal nickel mould producing method according to claim 1 is characterized in that, described step (1) adopts the fine cut or the fine special process to make three-dimensional micron-sized mother matrix, realizes the making of complex three-dimensional micron precision micro metal mould.
4. minitype metal nickel mould producing method according to claim 1 is characterized in that, when described step (4) has down the minisize mould of complicate three dimension microstructure of Qie Tezheng in making, adopts contrary imprinting moulding technology.
5. minitype metal nickel mould producing method according to claim 1 is characterized in that, described step (4) adopts stepping to repeat imprinting moulding technology for large tracts of land micro metal mould.
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| CN2007101153150A CN101205054B (en) | 2007-12-11 | 2007-12-11 | Minitype metal nickel mould producing method |
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|---|---|---|---|
| CN2007101153150A CN101205054B (en) | 2007-12-11 | 2007-12-11 | Minitype metal nickel mould producing method |
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| CN101205054A CN101205054A (en) | 2008-06-25 |
| CN101205054B true CN101205054B (en) | 2011-03-30 |
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