CN101190480A

CN101190480A - Lead free tin soldering solder composition

Info

Publication number: CN101190480A
Application number: CNA2006101452923A
Authority: CN
Inventors: 李三莲; 王彰盟
Original assignee: SHENGMAO TECHNOLOGY Co Ltd
Current assignee: SHENGMAO TECHNOLOGY Co Ltd
Priority date: 2006-11-29
Filing date: 2006-11-29
Publication date: 2008-06-04

Abstract

The invention provides a soldering composition which comprises tin, copper and antimony or tin, copper, antimony and nickel which contain special metal composition proportion. The soldering has excellent welding performance and welding strength on the welding of metals such as nickel, copper, silver, etc. or the alloy.

Description

The solder composition of Pb-free solder

Technical field

The present invention refers to a kind of Pb-free solder solder composition that fuse material and solder side or mother metal are ambrose alloy silver or its alloy that can be applicable to weld especially relevant for the solder composition of Pb-free solder.

Background technology

Though electronic industry successful development now, because the plumbous toxicity and the whole world is for the control and the ban of lead, tinman's solder alloy faces a limited future; So all parts of the world have all taken up to research and develop suitable lead-free solder, so that replace terne metal.Welding when fuse is made in the past is many to be material with tin lead, and the mobile product of tin lead material is good, and required scaling powder amount only needs 1.6wt%, and coagulation surface does not have blowhole and glossy, so comparatively simple and easy on the processing procedure.And in unleaded trend, the most normal material that is used is the scolding tin of tin, silver, copper series.Because its coagulation surface has too many hole,, cause product bad so in the assembling that fuse is produced automatically, can make fuse can't be secured on the scolding tin because of the hole on surface.Show not good wetability and diffusion effect at wetability and tin, silver, copper series alloy in addition, make the insufficient strength of solder side, at the reliability of product doubt is arranged, so must solve above problem with new alloy with nickel.The fuse structure that promptly utilizes the continuous automatic production technology to make as shown in Figures 1 and 2, its fuse 1 includes the conduction end cap 12 that an insulation crust 11 and is fixed in this insulation crust 11 at least, this insulation crust 11 1 ends earlier with scolder 13 in conjunction with a conduction end cap 12, and extend towards the other end with a fuse 14 in inside, and then utilize scolder 13 to fix another conduction end cap 12, to form a fuse 1 structure.

Wherein, this conduction end cap 12 is after being formed by copper or its alloy punching, for preventing that copper generation oxidation is in its plating nickel on surface, but the wetability of nickel is not good, so use the general scolder (for example general lead-free welding material of use of tin 3.0% silver medal 0.5% bronze medal) can't the surperficial and relatively poor diffusion effect of smooth wetting nickel plating, and the spherical shapes that scolder 13 is formed as shown in the figure, can't make fuse 14 be fixed in insulation crust 11 central authorities, or can't be wetting in

insulation crust

11 and 12 of end caps of conduction and fixed insulation shell 11 makes that the welding yield is low excessively.

Figure of description

Fig. 1 is a structural perspective of commonly using fuse;

Fig. 2 commonly uses the structural representation that scolder is used for fixing fuse;

Fig. 3 is used for fixing another structural representation of fuse for Pb-free solder scolder among the present invention;

Fig. 4 is used for fixing the structural representation of fuse for Pb-free solder scolder among the present invention.

[figure number explanation]

1 fuse, 11 insulation crusts

12 conduction end caps, 13 scolders

14 fuses, 2 fuses

21 insulation crusts, 22 conduction end caps

23 Pb-free solder scolders, 24 fuses

Summary of the invention

In view of this, main purpose of the present invention is a kind of welding or as scolder of being used for, and the Pb-free solder solder composition with preferable diffusivity and wetability.

For reaching above-mentioned purpose, it includes the proportional tin of particular group, copper, antimony solder composition of the present invention, it utilizes antimony to increase the wetability of nickel and adds the ductility in man-hour, or the solder composition of specific composition ratio tin, copper, antimony, nickel, the nickel that wherein adds trace increases its heat-resisting quantity and high-temperature oxidation resistance, makes this scolder have preferable welding yield.

Another object of the present invention, be on the assembly line of high-speed automated fuse, in the assembling of fuse conduction end cap and insulation crust, scolder of the present invention has appropriate diffusivity to make scolder to form semi-moon shaped shape at the conduction end cap, and makes insulation crust can be fixed in airtight assembling thing of formation between scolder and the conduction end cap after the welding cooling closely.

The specific embodiment

The solder composition of Pb-free solder of the present invention, its solder composition includes: from 95% to 97.9% tin, from 2% to 3% copper, from 0.1% to 2% antimony, perhaps from 95% to 97.9% tin, from 2% to 3% copper, from 0.1% to 2% antimony, from 0.01% to 0.1% nickel, and tin, copper, antimony, nickel are tested and carry out difference to form the multiple scolder that mixes with preparation embodiment 1 to 6 and comparative example 1 and 2 according to the prescription of table 1.

First test is according to the Z-3197 of Japanese Industrial Standards (JIS), and different scolder constituents are to diffusible measurement, and its test result is as follows.

(table 1)

Its test result such as table 1, wherein embodiment 1 to embodiment 5 is a tin, copper, antimony, the constituent of nickel different weight percentage, 6 of embodiment are tin, copper, the constituent of antimony, comparative example 1 and 2 then is a tin, the constituent of copper different weight percentage, comparative example 3 is a tin, the alloy of copper and silver, and the diffusivity that is used in copper surface or nickel surface respectively relatively in, though comparative example 1,2 and 3 diffusivity is higher,, to assemble in the scolding tin that its higher diffusivity makes other part smoothly but can climbing Tai Gao, then can't increase bonding area and intensity but diffusivity is too low, so the measured diffusivity of embodiment 1 to 6 is preferable.

Second test is according to (JIS) Z-3284, and different scolder constituents are to the measurement of wetting time and wetability, and its test result is as follows.

(table 2)

Its test result such as table 2, wherein embodiment 1 to embodiment 5 is the constituent of tin, copper, antimony, nickel different weight percentage, 6 of embodiment are the constituent of tin, copper, antimony, comparative example 1 and 2 then is the constituent of tin, copper different weight percentage, and the wetting time that is used in copper surface or nickel surface respectively relatively in, embodiment 1 to 6 measured wetting time is lower than the wetting time of comparative example 1, this wetting time is to measure the speed of solder attachment on copper surface or nickel surface, and low wetting time is the preferable characteristics of scolder; And wetability is the adhesive force between scolder and copper surface or the nickel surface, the effective strength pointer of solder attachment in bottom is provided, and also can learn that from table 1 and table 2 wetability and diffusion effect in its comparative example 1 are relatively poor, if be applied in the assembling of fuse, then form structure as shown in Figure 2, and the wetability of comparative example 2 is higher and diffusion effect is preferable, be applied in the assembling of fuse, then form structure as shown in Figure 3, above-mentioned two kinds of structures all can't produce preferable combination compactness, and EXAMPLE l to 6 then has preferable wetability and diffusivity.

And during the welding of Pb-free solder its solder joint (as weld pad, electrode, the part pin,) material, it mostly is conductive material such as copper and makes, in order to prevent conductive material generation oxidations such as copper, it is not good to form the solder joint moistened surface, cause failure welding, can plated with nickel protect in some cases, as fuse structure, as shown in Figure 4, its fuse 2 include at least an insulation crust 21 (, can be glass or material with insulating properties) and a conduction end cap 22 that is fixed in this insulation crust 21, this insulation crust 21 1 ends earlier with Pb-free solder scolder 23 in conjunction with a conduction end cap 22, and extend towards the other end with a fuse 24 in inside, and then utilize Pb-free solder scolder 23 to fix another conduction end cap 22, to form a fuse 2 structures; Wherein, this conduction end cap 22 is after being formed by copper or its alloy punching, in its surperficial plated with nickel, 24 of this fuses for example are the zinc-plated material of copper, this Pb-free solder scolder 23 then includes: from 95% to 97.9% tin, from 2% to 3% copper, from 0.1% to 2% antimony, to utilize antimony to increase and to add the ductility in man-hour to the wetability of nickel, make it have preferable wetability and diffusion effect, make scolder 23 to form semi-moon shaped shape at conduction end cap 22, and make insulation crust 21 can be fixed in airtight assembling thing of formation between scolder 23 and the conduction end cap 22 after the welding cooling closely, perhaps this Pb-free solder scolder 23 includes: from 95% to 97.9% tin, from 2% to 3% copper, from 0.1% to 2% antimony, from 0.01% to 0.1% nickel, the nickel that wherein adds trace increases its heat-resisting quantity and high-temperature oxidation resistance, makes this scolder have preferable welding yield.

As mentioned above, the invention provides the solder composition of a preferable feasible Pb-free solder, so offer the application of patent of invention in accordance with the law; Yet, above implementation and graphic shown in, be preferred embodiment of the present invention, be not to limit to the present invention with this, be with, approximate with structure of the present invention, device, feature etc., identical such as, all should belong to of the present invention founding within purpose and the claim.

Claims

1. the solder composition of a Pb-free solder, it includes:

From 95% to 97.9% tin;

From 2% to 3% copper;

From 0.1% to 2% antimony.

2. the solder composition of Pb-free solder according to claim 1, wherein this scolder contains the nickel of trace.

3. the solder composition of a Pb-free solder, it includes:

From 94.9% to 97.89% tin;

From 2% to 3% copper;

From 0.1% to 2% antimony;

From 0.01% to 0.1% nickel.

4. fuse structure, its fuse includes the conduction end cap that an insulation crust and is fixed in this insulation crust at least, and this conduction end cap is fixed in this insulation crust by scolder; It is characterized in that:

This solder composition includes: from 95% to 97.9% tin, from 2% to 3% copper, from 0.1% to 2% antimony.

5. fuse structure, its fuse includes the conduction end cap that an insulation crust and is fixed in this insulation crust at least, and this conduction end cap is fixed in this insulation crust by scolder; It is characterized in that:

This solder composition includes: from 95% to 97.9% tin, from 2% to 3% copper, from 0.1% to 2% antimony, from 0.01% to 0.1% nickel.

6. as fuse structure as described in claim 4 or 5, wherein this insulation crust is glass or material with insulating properties.

7. as fuse structure as described in claim 4 or 5, wherein this conduction end cap is after being formed by copper or its alloy punching, in plating nickel on surface.