CN101179144A - Dielectric filter and implementing method thereof - Google Patents
Dielectric filter and implementing method thereof Download PDFInfo
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- CN101179144A CN101179144A CNA2007101247980A CN200710124798A CN101179144A CN 101179144 A CN101179144 A CN 101179144A CN A2007101247980 A CNA2007101247980 A CN A2007101247980A CN 200710124798 A CN200710124798 A CN 200710124798A CN 101179144 A CN101179144 A CN 101179144A
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- dielectric filter
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- recess
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- bottom pcb
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Abstract
The invention discloses a dielectric filter and an implementing method thereof. The dielectric filter comprises a bottom PCB, a cavity, a baseplate and a housing; pins in the cavity are electrically connected with the baseplate; a predetermined interval is formed between the baseplate and the bottom PCB; a recession is formed on a bottom PCB; and two sides of the recession support the baseplate. As the dielectric filter and the implementing method thereof of the invention adopt the method of milling thinner or slotting at the bottom PCB in order to implement the dielectric filter; a gasket is not needed, nor are the process of purchasing raw material for gasket and the process of processing the gasket; the baseplate is directly assembled and welded on the bottom PCB with a small section of assembling and welding and a high degree of automation; the product has a low cost as well as a high rate of good product.
Description
Technical field
The present invention relates to dielectric filter and its implementation in a kind of electronic device, in particular, relate to a kind ofly mill product design and the implementation method that thin or fluting is realized specific purpose at the bottom of composite type dielectric filter PCB.
Background technology
Common composite type dielectric filter generally is made up of cavity, cavity contact pin, substrate, bottom PCB (Printed Circuit Board, printed circuit board), shell.Described substrate generally is an aluminum oxide substrate, also can be the substrate of other material.The substrate of various materials, the hereinafter unified substrate that abbreviates as.Described bottom pcb board generally is a FR4 sheet material, also can be other sheet material.
Some occasion in order to guarantee the electrical property of composite type dielectric filter, requires to keep between the bottom PCB of composite type dielectric filter and the substrate certain spacing (for example: spacing 〉=1mm).Current product design and the implementation method that generally adopts is as shown in Figure 1 in the industry: add pad 204 at bottom PCB 205 and 203 of substrates, pad 204 generally is that certain thickness sheet metal is arranged, for example: silver-plated copper sheet makes substrate 203 and bottom PCB 205 desired locations keep certain spacing; And then connect and assembling oscillator cavity and contact pin 202 and shell 201, constitute a dielectric filter 209 with assembling.The dielectric filter assembling process of the shim method that adopts in the current industry has been described as shown in Figure 1.Can see, in this product design and the implementation method, be by adding pad between bottom PCB and substrate, making bottom PCB and substrate keep a determining deviation.
The product design of above-mentioned shimming and implementation method, when producing in batches, generally need do following work:
1. pad: the raw-material buying of pad, the processing of pad is so that be processed into required size.
2. assembling and welding.The order of assembling and welding has different, is exemplified below:
Assembling and welding sequence example 2:(1) pad is welded to substrate, generally is the manual pad of placing, manual some tin cream, Reflow Soldering welding.(2) substrate that has welded pad is welded on the PCB of bottom, generally is to go up tin cream for earlier bottom PCB, puts glue then on the PCB of bottom, and the substrate that will weld pad then is put on the PCB of bottom Reflow Soldering welding then.
The product and the implementation method of shimming mentioned above have the following disadvantages: the one, and, need buying pad raw material and processing pad.The 2nd,, the product productibility is not good--and assembling and welding link are many in the production, production automation degree low (a plurality of manual link), and then cause the control of product quality difficulty big, for example: failure welding, few tin problem or the like.
Therefore, also there is defective in prior art, and awaits improving and development.
Summary of the invention
The object of the present invention is to provide a kind of dielectric filter and its implementation, requiring substrate and bottom PCB desired location to keep the occasion of a determining deviation, do not need pad, and then avoid the deficiency of shimming method in batch process.
The present invention is by the following technical solutions:
A kind of dielectric filter, it comprises bottom PCB, cavity, substrate and shell, the cavity contact pin of described cavity electrically connects described substrate, described substrate and described bottom PCB form preset space length, wherein, form a recess on described bottom PCB, described recess supported on both sides contacts described substrate.
Described dielectric filter, wherein, described recess is set to fluting.
Described dielectric filter, wherein, described recess is set to perforate.
Described dielectric filter, wherein, described recess is that thin recess is milled in the centre.
Described dielectric filter, wherein, described recess is that the edge mills thin recess.
Described dielectric filter, wherein, both sides are provided with stage portion in the described recess, are used for supporting the described substrate of contact.
A kind of implementation method of dielectric filter, it may further comprise the steps:
A, recess processing is carried out according to preset space length in the position of counterpart substrate on the PCB of bottom;
B, with substrate be welded on the bottom PCB described recess on, contact with the bottom PCB of described recess both sides;
C, the cavity contact pin of cavity is welded on the described substrate;
D, shell is covered described substrate and the described cavity outside, and be fixedly connected with described bottom PCB.
Described implementation method, wherein, the processing mode of described recess adopts and mills thin technology.
Described implementation method, wherein, the processing mode of described recess adopts grooving processes.
Described implementation method, wherein, described recess both sides also are processed to form stage portion, are used for welding and touch described substrate.
A kind of dielectric filter provided by the present invention and its implementation, compared with prior art, owing to adopted and milled mode thin or fluting at bottom PCB and realize dielectric filter, do not need pad, also just need not to do the process of the processing of the raw-material buying of pad, pad; Substrate is directly assembled and is welded on the PCB of bottom, and assembling and welding link are few, but the degree height of automated production; Product volume production cost is low, product yield height.
Description of drawings
Fig. 1 is the dielectric filter building block principle sketch of the shim method of prior art;
Fig. 2 is that bottom PCB of the present invention mills the product of thin (edge mills thin) and the principle sketch of implementation method;
Fig. 3 is that bottom PCB of the present invention the mills product of thin (edge mills the thin step edge that is) and the principle sketch of implementation method;
Fig. 4 is that bottom PCB of the present invention the mills product of thin (milling thin position is the PCB below) and the principle sketch of implementation method;
Fig. 5 is that bottom PCB of the present invention the mills product of thin (milling thin position is the PCB below, mills the thin step edge that is) and the schematic diagram of implementation method;
Fig. 6 is the product of PCB fluting in bottom of the present invention (edge fluting) and the principle sketch of implementation method;
Fig. 7 is the product of PCB fluting in bottom of the present invention (the edge fluting is step edge) and the principle sketch of implementation method;
Fig. 8 is the product of PCB fluting in bottom of the present invention (slotting position is the PCB below) and the principle sketch of implementation method;
Fig. 9 is the product of PCB fluting in bottom of the present invention (slotting position is the PCB below, and slotting is step edge) and the principle sketch of implementation method.
Embodiment
Below in conjunction with accompanying drawing, each preferred embodiment of the present invention is described in more detail.
As shown in Figure 2, be first preferred embodiment of the present invention, it has carried out the edge and has milled thinly on bottom PCB 303, mill thin recess 304 to form the edge, and the both sides of milling thin recess 304 at this edge are set to the welding contacting part 305 of supporting substrate 302.Mill thinly by this edge, between described bottom PCB and described substrate 302, can form preset space length, so that form dielectric filter.Again described cavity 301 is welded on described bottom PCB and the described substrate 302, the cavity contact pin of wherein said cavity is welded on the described substrate 302, shell 306 is covered on described substrate 302 and the described cavity 301 afterwards, and fixedly install together with described bottom PCB, promptly finish dielectric filter of the present invention.
In above-mentioned production technology and the dielectric filter structure, therefore its production process and to mill thin technology be that prior art is known, repeats no more.
As shown in Figure 4, be second preferred embodiment of the present invention, it has carried out milling thin processing on bottom PCB 303, promptly the precalculated position is milled thin on described bottom PCB 303, to mill thin recess 404 in the middle of forming, the both sides of milling thin recess 404 in this centre are set to the welding contacting part 405 of supporting substrate 302.Mill thin technology by this, under the position of the described substrate 302 of welding on the described bottom PCB, can form recess, guarantee to form preset space length between described bottom PCB and the described substrate 302, so that form dielectric filter.Again described cavity 301 is welded on described bottom PCB and the described substrate 302, the cavity contact pin of wherein said cavity is welded on the described substrate 302, shell 306 is covered on described substrate 302 and the described cavity 301 afterwards, and fixedly install together with described bottom PCB, promptly finish dielectric filter of the present invention.
As shown in Figure 6, be the 3rd preferred embodiment of the present invention, it has carried out edge fluting processing on bottom PCB 303, promptly the edge fluting is carried out in the precalculated position on described bottom PCB 303, to form fluting 504, be set to the welding contacting part 505 of supporting substrate 302 in the both sides of this fluting 504.By this grooving processes, under the position of the described substrate 302 of welding on the described bottom PCB, can form otch, guarantee can form preset space length between described bottom PCB and the described substrate 302, so that form dielectric filter.Again described cavity 301 is welded on described bottom PCB and the described substrate 302, the cavity contact pin of wherein said cavity is welded on the described substrate 302, shell 306 is covered on described substrate 302 and the described cavity 301 afterwards, and fixedly install together with described bottom PCB, promptly finish dielectric filter of the present invention.
As shown in Figure 8, be the 4th preferred embodiment of the present invention, it has carried out middle fluting processing on bottom PCB 303, and promptly perforate is carried out in the precalculated position on described bottom PCB 303, to form perforate 604, be set to the welding contacting part 605 of supporting substrate 302 in the both sides of this perforate 604.By this grooving processes, under the position of the described substrate 302 of welding on the described bottom PCB, can form hole portion, guarantee can form preset space length between described bottom PCB and the described substrate 302, so that form dielectric filter.Again described cavity 301 is welded on described bottom PCB and the described substrate 302, the cavity contact pin of wherein said cavity is welded on the described substrate 302, shell 306 is covered on described substrate 302 and the described cavity 301 afterwards, and fixedly install together with described bottom PCB, promptly finish dielectric filter of the present invention.
In Fig. 3, Fig. 5, Fig. 7, various embodiments of the present invention shown in Figure 9, be among above-mentioned described each embodiment, increased processing technology, promptly form stage portion 400 in the both sides of described recess, so just can strengthen milling recess size thin or that each processing technology of slotting forms, so that can install described substrate 302, described substrate 302 touches on described step 400 and can be supported, and weld in the top surface edge of described substrate and described bottom PCB, the brace welding also can be adopted in its welding position 500 shown in each figure.
In dielectric filter of the present invention and its implementation, the design implementation of described dielectric filter obviously is not limited to the various embodiments described above.Dielectric filter product of the present invention and production thereof realize that technology has following advantage:
The one,, mill thin or grooving processes by bottom PCB, size on demand, position are milled thin or fluting at the bottom of dielectric filter PCB, make substrate and bottom PCB desired location keep a determining deviation; Simultaneously substrate can directly be welded on the PCB of bottom, also can be substrate and bottom PCB is welded together by brace, as when the step mode is set.
The 2nd,, the whole production work simplification has reduced the assembling process of pad, and can carry out automated production, and its volume production cost is low, and has reduced artificial factor, has improved the product yield.
Should be understood that above-mentioned description at preferred embodiment of the present invention is comparatively concrete, can not therefore think the restriction to scope of patent protection of the present invention, scope of patent protection of the present invention should be as the criterion with claims.
Claims (10)
1. dielectric filter, it comprises bottom PCB, cavity, substrate and shell, the cavity contact pin of described cavity electrically connects described substrate, described substrate and described bottom PCB form preset space length, it is characterized in that, form a recess on described bottom PCB, described recess supported on both sides contacts described substrate.
2. dielectric filter according to claim 1 is characterized in that, described recess is set to fluting.
3. dielectric filter according to claim 1 is characterized in that described recess is set to perforate.
4. dielectric filter according to claim 1 is characterized in that, described recess is that thin recess is milled in the centre.
5. dielectric filter according to claim 1 is characterized in that, described recess is that the edge mills thin recess.
6. according to the arbitrary described dielectric filter of claim 2 to 5, it is characterized in that both sides are provided with stage portion in the described recess, be used for supporting the described substrate of contact.
7. the implementation method of a dielectric filter, it may further comprise the steps:
A, recess processing is carried out according to preset space length in the position of counterpart substrate on the PCB of bottom;
B, with substrate be welded on the bottom PCB described recess on, contact with the bottom PCB of described recess both sides;
C, the cavity contact pin of cavity is welded on the described substrate;
D, shell is covered described substrate and the described cavity outside, and be fixedly connected with described bottom PCB.
8. implementation method according to claim 7 is characterized in that, the processing mode of described recess adopts and mills thin technology.
9. implementation method according to claim 7 is characterized in that, the processing mode of described recess adopts grooving processes.
10. according to Claim 8 or 9 described implementation methods, it is characterized in that described recess both sides also are processed to form stage portion, be used for welding and touch described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101247980A CN101179144A (en) | 2007-11-27 | 2007-11-27 | Dielectric filter and implementing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101247980A CN101179144A (en) | 2007-11-27 | 2007-11-27 | Dielectric filter and implementing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101179144A true CN101179144A (en) | 2008-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2007101247980A Pending CN101179144A (en) | 2007-11-27 | 2007-11-27 | Dielectric filter and implementing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104467728A (en) * | 2014-11-28 | 2015-03-25 | 广东大普通信技术有限公司 | Crystal oscillator grounding method and crystal oscillator |
| CN109755698A (en) * | 2019-01-30 | 2019-05-14 | 苏州市协诚五金制品有限公司 | A kind of structure for the Ceramic Dielectric Filter being installed on pcb board |
| CN111108644A (en) * | 2018-05-10 | 2020-05-05 | 深圳市大富科技股份有限公司 | Cavity filter, filter cavity and preparation method thereof |
-
2007
- 2007-11-27 CN CNA2007101247980A patent/CN101179144A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104467728A (en) * | 2014-11-28 | 2015-03-25 | 广东大普通信技术有限公司 | Crystal oscillator grounding method and crystal oscillator |
| CN104467728B (en) * | 2014-11-28 | 2018-04-27 | 广东大普通信技术有限公司 | A kind of crystal oscillator earthing method and crystal oscillator |
| CN111108644A (en) * | 2018-05-10 | 2020-05-05 | 深圳市大富科技股份有限公司 | Cavity filter, filter cavity and preparation method thereof |
| CN111108644B (en) * | 2018-05-10 | 2022-05-03 | 深圳市大富科技股份有限公司 | Cavity filter, filter cavity and preparation method thereof |
| CN109755698A (en) * | 2019-01-30 | 2019-05-14 | 苏州市协诚五金制品有限公司 | A kind of structure for the Ceramic Dielectric Filter being installed on pcb board |
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Open date: 20080514 |