CN101173751A

CN101173751A - High temperature bearing metal substrate of light processing equipment and manufacturing method thereof

Info

Publication number: CN101173751A
Application number: CNA2006101382085A
Authority: CN
Inventors: 蔡福星
Original assignee: YIDA TECHNOLOGY Co Ltd
Current assignee: YIDA TECHNOLOGY Co Ltd
Priority date: 2006-11-01
Filing date: 2006-11-01
Publication date: 2008-05-07

Abstract

The invention discloses a high temperature resistant metal base plate of a light processing device and the manufacture method thereof. The base plate is provided with a mirror face surface, a layer of superficial layer is plated on the mirror face surface, the moulding and the reversing are operated to make an inverse die body, the base plate with certain thickness is generated on the surface of the inverse die body through the electroform, when being filmed, the surface of the base plate is coarsened, then material is coated by vaporization through an evaporation coating way to form a surface layer on the surface of the base plate, the surface is coarsened by ion bombardment into nanometer coarse surface, when the material is coated by vaporization, the material is effectively combined in a state that the material is embedded into the surface with the size of atomics or an atomic group, to lead the stability of the combination of the material and the surface to be higher, the thickness of the base plate is thin, the high temperature of a bulb can be directly dropped away to achieve the purposes that the heat radiation is effective and the high temperature can be born, a lampshade with slight elasticity is utilized to be matched to produce a structure with adjustable light processing characteristic.

Description

Light processing equipment can bear the metal substrate and the manufacture method thereof of high temperature

Technical field:

The present invention relates to metal substrate and manufacture method thereof that a kind of light processing equipment can bear high temperature, especially refer to a kind of environment that very easily produces high temperature that is applicable to, as projector's speculum, or the mirror body of special hardness of needs and material physical properties or lampshade etc., by the special method for making of substrate and substrate and superficial layer plated film mode, can be high temperature resistant or the demand of other specific physical and can reach the certain heat radiation of substrate, and the stability of plated film is higher, has the height practical value.

Background technology:

Present reflector body and the lampshade that uses, be mostly with glass as base material, but glass is subjected to the restriction of physical characteristics of materials, the proportion height, and hardness is limited, and again can't be high temperature resistant, require very special product and place for certain physical characteristics, as the employed lamp shade and reflector of projector; Because projector is more and more higher to the requirement of lumen number at present, the power of bulb also increases thereupon, so its heat that is produced is high, and because of the little heat radiation of the environment in projector is difficult for, when bulb produces high when hot, lampshade near bulb must bear high temperature, only be subject to the physical property of lamp shade glass material, can't bear high temperature, though the material of bulb own can be high temperature resistant, the glass of reflection lampshade but can't bear, and promptly can't effectively promote the lumen number of the whole projection of projector, and therefore necessity of improvement arranged.

In view of glass can't be high temperature resistant and material is hard, can't cooperate moulding, make then for it with cast glass or abrading glass, so under the very high disappearance of its cost, having the dealer to develop with pottery replaces, very low of the success rate of ceramic sintering only, the moulding of reflecting surface precision more is difficult to control, does not also meet demands a large amount of and economically.

For this reason, the improvement that someone proposes to be correlated with, promptly as the 9413495 No. two " solid metal reflector and the method for making this solid metal reflector " patent of invention case of TaiWan, China, its content mainly contains three partly, promptly this reflector is to make with metal, and this solid metal reflector is to make again in this surface coating in the mode of removing material, and the design of radiator structure etc., therefore as can be known, its reflector changes with metal material to be made, and makes in the mode of removing material, so method for making and structure, maybe can solve glass material can't resistant to elevated temperaturesly lack, precisely because still there are many disappearances to overcome on the structure of itself, such as:

1. method for making does not meet economic benefit: its solid metal reflector is to make geometry in the mode of removing material, therefore its material promptly causes waste after removing, and the part of cooperative mechanical processing when removing material, because it is very high that its surperficial roughness requires, therefore, the precision of its processing is unusual height naturally, only at present with machining, its precision is high more also only can be about the degree of 0.001mm to 0.1umm, being difficult to improve precision, is not only for a bit and will arrive this precision again, but on whole, and this face is not to be a burnishing surface, even be complicated curved surface, very low of the yield of processing, and it is processed as the program of precise finiss processing, not only cause whole cost can not to be in any more, more do not meet benefit economically.

2. the reflection physical characteristic is difficult to performance: because the surface roughness after the material removal is very big, so the surface after the film plating can rise and fall with the roughness of its material list surface layer, and cause unnecessary scattering or reflection or transmission, reduce the condition of reflectivity or other physical characteristic (as concentration ratio or other special light physical characteristic), be difficult to meet consumer or producer's demand.

3. be difficult to complicated moulding: machinery is removed materials processing, the shape of its processing or structure must be considered the path of cutter turnover, shape and structure for complexity is difficult to remove materials processing, so the necessary ten minutes of the substrate shape that this technology is processed is simple and easy, so can't be in response to the demand of consumption market, so necessity of improvement is arranged.

4. cooling effect is limited: owing to be to make processing in the mode of removing material, its base material volume is big, and after the processing, the volume of timber is big, thickness is big, its heat transfer and radiating rate are limited, so need to do in addition the structure of heat radiation, cause overall volume to heighten, can't in narrow space, be provided with, and need to cooperate fan or bigger heat-dissipating fin, radiating effect is not good, so necessity of improvement is arranged.

Summary of the invention:

Technical problem solved by the invention is: at above-mentioned the deficiencies in the prior art, the metal substrate and the manufacture method thereof that provide a kind of light processing equipment can bear high temperature, can make the manufacturing of substrate more quick and convenient, thin thickness, thermal diffusivity be good, and surface treatment plated film associativity is more stable really, can reach functions such as high-cooling property, high stability, high applicability and high-quality.

In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of light processing equipment can bear the metal substrate of high temperature, this substrate is a metal plate, is characterized in: described substrate has a specular surface, and is coated with the layer of surface layer on this specular surface; This substrate is that electrotyping forming is made.

Above-mentioned light processing equipment can bear the manufacture method of high-temperature metal substrate, and described substrate is made by the electrotyping forming method, comprises the steps:

Moulding reverse: form the reverse body earlier, have the forming part opposite in this reverse body, go out the substrate of holotype form in order to direct electrotyping forming with substrate;

Electrotyping forming: the reverse body inserted carry out the electroforming operation in the electrotyping bath, make in forming part electroforming become to have the electroforming housing of thickness, promptly in forming part, mold the germule of substrate;

Plated film: cleaned at the specular surface of substrate earlier, and after the alligatoring operation, give the plated film operation again, on this specular surface, to form the splendid superficial layer of an associativity;

Forming parts: the substrate that aforementioned operation is finished carries out the trimming of thin portion, can become required part and promptly form substrate; Be combined into finished product after each part made up.

Above-mentioned light processing equipment can bear the manufacture method of the metal substrate of high temperature, also can not adopt the electrotyping forming method, and directly after being cleaned on the specular surface of substrate setting, carry out the alligatoring operation, it gives alligatoring with ion bombardment with specular surface, and directly gives plated film and form after alligatoring.

Compared with prior art, advantage of the present invention is:

1. method for making meets economic benefit: because the reverse body can be made in a large number, and also can be in a large number simultaneously for it electroforming the time, can a large amount of duplicating and making in the unit interval, and the stable and exquisiteness very of the quality after making, by electrotyping forming, make metallic atom after ionization, be incorporated on the reverse body, its form with the metal ion reduction is piled up moulding, its quality is very stable naturally, density is high, and fraction defective is extremely low, even complicated curved surface, electroforming also can be duplicated moulding easily, meets benefit economically.

2. every physical characteristic is good: because substrate shell-like structure rapid heat dissipation, and surface exquisiteness very, surface after bombarding with ion, how also to belong to the rice rough surface, but when plated film, because its surface exquisiteness very, how alligatoring also belongs to the rice form, so behind plated film, be to put down with atomizing benefit, so its surface accuracy height very, when so carrying out the reflection of optics or curved fire, can effectively react efficient height very, the part that lost efficacy can be reduced to minimumly, can effectively satisfy and comprise: concentration ratio or other special light physical characteristic demand.

3. can reach complicated moulding: by reverse body rapid shaping, its forming part very easily moulding need not extra processing, the moulding immediately of its shape or structure, so the formed substrate of this technology must reach with actual needs, with demand in response to the consumption market.

4. radiating efficiency height: but because the very thin direct heat transfer of this substrate thickness, the structure that need not to do to dispel the heat in addition can reach the required efficient of dispelling the heat, and also can be provided with in narrow space, more need not to change fan or bigger heat-dissipating fin, has the effect of enhancement.

Description of drawings:

Fig. 1 is a substrate schematic perspective view of the present invention.

Fig. 2 is the schematic diagram that substrate of the present invention is incorporated into finished product.

Fig. 3 is the method and the work flow schematic diagram of integral electroforming moulding of the present invention.

Fig. 4 is the method and the work flow three-dimensional appearance schematic diagram of integral electroforming moulding of the present invention.

Fig. 5 is another substrate embodiment schematic perspective view of the present invention.

Fig. 6 a is a lampshade moulding reverse body schematic diagram of the present invention.

Fig. 6 b is body formed conducting layer coated schematic diagram of lampshade moulding reverse of the present invention.

Fig. 6 c is body formed surface forming substrate of a lampshade moulding reverse of the present invention schematic diagram.

Fig. 7 is the schematic diagram of the relative structure of lampshade resilient engagement light processing equipment of the present invention.

Fig. 8 is the relative structure action of the lampshade resilient engagement light processing equipment schematic diagram that the present invention sees.

Label declaration:

10 substrates, 11,12 junction surfaces

13 films face 14 joint portions of making a list

20 superficial layers, 30 methods of forming

31 moulding reverses, 32 electrotyping formings

33 plated film operations 330 are cleaned

331 alligatoring, 332 plated films

34 forming parts, 35 finished products

40 reverse bodies, 41 forming parts

The specific embodiment:

For further understanding structure of the present invention, feature and other purpose, now with as after preferred embodiment, attached with graphic detailed description as after, only the illustrated embodiment of this legend for the usefulness of explanation, is not to be the unique restriction in the patent application only.

Please cooperate and consult Fig. 1-shown in Figure 2, the structural form of electrotyping forming substrate 10 of the present invention is a metal plate, and the metal thin shell structural form of architecture basics that should integral body for forming with electrotyping forming, this substrate 10 have combine with 10 of substrates first, two junction surfaces (11,12), according to the legend of present embodiment as can be known, this first junction surface 11 is a rectangle convex cylinder form, second junction surface 12 then is the perforation that an area is same as first junction surface, 11 sectional areas, and has the specular surface 13 of certain area on these substrate 10 end faces, straight forming goes out the requirement of minute surface standard, to reduce and to reduce the step of other mirror finish, after this specular surface 13 gives rational alligatoring, become a superficial layer 20 with the plated film operation again, and each substrate 10 is integral with first out of the ordinary relative junction surface 11 and second junction surface, 12 mutual pegging graft, and each superficial layer 20 is oppositely arranged, and this each superficial layer 20 can be a reflecting film structure, it can be the rete of a total reflection, also can be the mould layer of a half reflection, more can reflect or the condition of printing opacity or collection is designed to have special absorbing structure at different light characteristics; With the example structure of Fig. 1-Fig. 4, the superficial layer 20 on this substrate 10 is a reflectance coating, so after the entire combination, can form a condenser tube ferrule structure, pass in the space that light is surrounded by each substrate 10, can by around reflection center on, form the light beam of a straight line.

Wherein, the method for making of this substrate 10 be the electrotyping forming method for it, its method of forming 30 comprises: moulding reverse 31: form earlier reverse body 40 as shown in Figure 4, have the forming part 41 opposite with substrate 10 in this reverse body 40, go out the substrate 10 of holotype form in order to direct electrotyping forming;

Electrotyping forming 32: reverse body 40 inserted carry out the electroforming operation in the electrotyping bath, make that electroforming becomes certain thickness electroforming housing in forming part 41, promptly in forming part 41, mold the germule of substrate 10;

Plated film operation 33: promptly earlier clean 330 operations with the specular surface 13 of substrate 10, after cleaning 330 operations, rice alligatoring 331 these specular surfaces 13 in addition how, plated film 332 in addition makes the splendid superficial layer 20 of formation one associativity on specular surface 13 again.Forming parts 34: the substrate 10 that aforementioned operation is finished carries out the trimming of thin portion, can become required part.

After above-mentioned each part made up, in addition combination was finished product 35, and the visual demand of this combination is with welding or then even with the fixing light pipe finished product that can finish as shown in Figure 2 of band.

In the aforesaid forming method, reverse body 40 can the plastics injection molding method or die cast metal moulding or metal plating moulding or other molding mode made, that its material can be is cured, rubber, gypsum or metal material; And the reverse body 40 after its moulding can be the conduction mould, maybe can not conduct electricity mould, if can not conduct electricity mould the time, can directly adhere to one deck conducting film earlier in forming part 41, and in order to the electroforming of conduction, this conducting film can be silver conducting film; This reverse body 40 is still needed before electroforming and is carried out surface treatment, as inserting in the electrotyping bath after the steps such as cleaning, degreasing, activation and conduction again.

The principle of aforesaid electroforming is suitable with plating, and only the thicknesses of layers of electroplating is thinner, about about tens of microns, and the thickness of electrotyping forming is between hundreds of microns are to several centimetres, all can be for it, therefore after moulding, its substrate 10 has been hardened to the required physical characteristic of product; And in its electrocasting employed metallic solution for containing: gold, silver, copper, nickel, iron, platinum, aluminium, cobalt, manganese, tantalum, zirconium, tungsten, molybdenum, the chemical solution that elements such as germanium etc. and hydrogen-oxygen or chlorine and sulphur and boron fluorine phosphorus form, and the material that main electroforming forms can comprise: gold, silver, copper, nickel, iron, platinum, aluminium, cobalt, manganese, tantalum, zirconium, tungsten, molybdenum, metallic element or alloys such as germanium, more can become a composite electroformed material, as carbon, silicon, the nickel composite wood, the composite wood of aluminium oxide and nickel etc., wherein, germanium can be worked as the some of the absorber of solar energy for infrared penetration.

And aforementioned specular surface 13 at substrate 10 is cleaned 330 operations, and cleaning 330 then is to carry out alkali or acid or go to steep operation at this specular surface 13, so that the certain cleaning of specular surface 13, in order to adhering to of film;

Because very little of these specular surface 13 roughness, therefore how giving again, the alligatoring of meter level gets final product, promptly specular surface 13 is given alligatoring 331 with ion bombardment (Ion Beam sputtering), and it is can the nitrogen ion or argon ion or the Xe ion program of carrying out this ion bombardment, with mode alligatoring that specular surface 13 is hit with ion it;

332 of plated films are plated the superficial layer 20 of thin film form to finish whole plated film 33 operations with evaporation or plating or other plated film mode, and its superficial layer 20 is when forming, the particle that should combine with specular surface 13 can directly enter in the hole of ion bombardment, form a structure of firmly grasping really, and become superficial layer 20 structures of a high-bond.

Because substrate 10 of the present invention forms with 40 electroforming of reverse body, and this reverse body 40 can plastics penetrate or other rapid shaping mode for it, so it can be made in a large number, and precision also can penetrate the requirement of mould precision by plastics, can make same high-precision mold produce a large amount of high-precision reverse bodies 40, can in same electrotyping bath, carry out large quantities of whiles during electroforming in addition, the visual electrotyping bath size of quantity in unit interval and carry out a large amount of copy job, and substrate 10 forms that form can be cast according to reverse body 40 forming parts 41, and whole one-tenth one shell shape, it can become a part monomer, need not to do in addition support or other supporting construction, promptly can be single component and uses.

The also visual different difform designs that need of this substrate 10, as shown in Figure 5, the both sides of its substrate 10 can be provided with the joint portion 14 of groove shape in addition, and this joint portion 14 can be ccontaining relatively in addition the end of two substrates 10 in wherein, and spot welding moulding in addition, and can become the structure of a light pipe, same, also the forming part 41 of reverse body 40 directly can be formed the structural form of a lampshade, shown in Fig. 6 a-Fig. 6 c, so reverse body 40A can mold substrate 10A by aforementioned same steps as, and carry out plated film operation 33 more direct applying on the product, think the usefulness of lampshade, by its shell design, make heat that bulb sends can be directly reach the other end by the reflecting surface of lampshade, and shed by the protruding end face of this arc, because the path of its heat transfer and thickness are as thin as a wafer, it is more quick to dispel the heat, and the characteristic of its metal material can reach heat-resisting effect.

By aforementioned analysis as can be known, the part that the substrate 10 of electrotyping forming can be monomer uses, so its scope ten minutes applicatory is extensive, can be the speculum of the speculum on general reflection lampshade, plane, concavo-convex speculum and free form surface etc., also can be as light-pipe structure shown in the present, or can be reflective colour wheel (color wheel), structures such as speculum that can twist or metal CD.

Wherein, shown in Fig. 6 a-Fig. 6 c, it is the method for making and the structure of the speculum of a single-curved surface; Wherein, same with different manufacture moulding reverses 31 to mold reverse body 40A with forming part 41A, and when this reverse body 40A be non-when being an electric conductor, it can be preset with one deck conductive layer 42 earlier in forming part 41A surface, can go out substrate 10A in electrotyping forming 32, and after the specular surface 13A of substrate 10A carries out plated film operation 33, can become a part product and use; And the present invention meets the scope that the thickness of economic scale electrotyping forming 32 can be used by 0.1mm to 2.5mm, if demand with heat radiation, 0.1mm can meet the requirements to 0.3mm, and the system of the pyroconductivity in the principle of thermal conductance is inversely proportional to the thickness that heat passes, so thickness can reach the demand in the heat radiation between aforementioned thickness.

Also can cooperate summary rubber-like lampshade substrate 10B structure as shown in Figure 7, this substrate 10B can omit the rubber-like plate body for 32 one-tenth one by electrotyping forming, this substrate 10B center can be provided with a pulling piece 15 in addition, and with respect to this substrate 10B one support member 51 is set on every side in light processing equipment 50, this substrate 10B is by the drawing of the pulling piece 15 of central authorities, and substrate 10B periphery is support member 51 supports, use the bent arc rate that changes substrate 10B integral body, can change the angle of substrate 10B optically focused or projection or divergent rays, as shown in Figure 8, can reach the purpose of light specially treated.

Claims

1. a light processing equipment can bear the metal substrate of high temperature, and this substrate is a metal plate, it is characterized in that: described substrate has a specular surface, and is coated with the layer of surface layer on this specular surface; This substrate is that electrotyping forming is made.

2. light processing equipment according to claim 1 can bear the metal substrate of high temperature, it is characterized in that: the metal thin shell structure of the overall structure of described substrate basis for forming, this substrate with electrotyping forming have with substrate between two junction surfaces that combine.

3. light processing equipment according to claim 2 can bear the metal substrate of high temperature, it is characterized in that: the wherein junction surface in described two junction surfaces is the rectangle convex cylinder, and another junction surface then is same as the perforation of aforementioned junction surface sectional area for area.

4. light processing equipment according to claim 1 can bear the metal substrate of high temperature, it is characterized in that: described specular surface is located on the substrate end-face, and this specular surface forms with the plated film operation after giving how rice alligatoring again.

5. light processing equipment according to claim 1 can bear the metal substrate of high temperature, it is characterized in that: described substrate is an elastic construction, and the light processing equipment of this substrate has the support that supports this substrate relatively.

6. one kind as the described light processing equipment of above-mentioned claim 1 manufacture method that can bear the high-temperature metal substrate, it is characterized in that: described substrate is made by the electrotyping forming method, comprises the steps:

7. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: the mode of described each part combination is for welding, then or with band fixing.

8. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described reverse body is made with plastics injection molding method or die cast metal molding mode or metal plating molding mode.

9. the manufacture method that can bear the metal substrate of high temperature according to claim 6 or 8 described light processing equipments, it is characterized in that: described reverse body is made by cured, rubber, gypsum or metal.

10. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described reverse body maybe can not conduct electricity mould for the conduction mould.

11. light processing equipment according to claim 10 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described conducting film is silver or copper conducting film.

12. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described reverse body need carry out inserting in the electrotyping bath after the surface treatment before electroforming again.

13. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: employed metallic solution is the chemical solution of gold, silver, copper, iron, platinum, aluminium, cobalt, manganese, tantalum, zirconium, tungsten, molybdenum, germanium and hydrogen-oxygen or chlorine and sulphur and the formation of boron fluorine P elements in the described electrotyping forming, and the material that main electroforming forms can comprise: gold, silver, copper, iron, platinum, aluminium, cobalt, manganese, tantalum, zirconium, tungsten, molybdenum, Ge element or alloy more can become a composite electroformed material.

14. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described alligatoring operation is the rice alligatoring for how, promptly specular surface is given alligatoring with ion bombardment, and its program of carrying out this ion bombardment with nitrogen ion or argon ion or Xe ion.

15. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described cleaning to what carry out alkali or acid at this specular surface goes to steep operation.

16. the manufacture method that can bear the metal substrate of high temperature according to claim 6 or 14 described light processing equipments, it is characterized in that: described plated film is then plated the superficial layer of one or more layers film morphology to finish whole plated film operation with evaporation or plating mode, and its superficial layer is when forming, the particle that should combine with specular surface can directly enter in the hole of ion bombardment, becomes the surface layer structure of a high-bond.

17. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described substrate both sides are provided with the joint portion of groove shape in addition, and this joint portion can ccontaining relatively another substrate the end in wherein, and spot welding moulding in addition.

18. light processing equipment according to claim 6 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described substrate is applicable to the speculum or the light-pipe structure of the speculum on reflection lampshade, plane, concavo-convex speculum and free form surface, or be reflective colour wheel, speculum that can twist or metal compact disk structure.

19. a light processing equipment can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: this method is to carry out the alligatoring operation after being cleaned on the specular surface of the substrate of tool specular surface, it gives alligatoring with ion bombardment with specular surface, and directly gives plated film and form after alligatoring.

20. light processing equipment according to claim 19 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: the program that the ion alligatoring in the bombardment of described ion is carried out this ion bombardment with nitrogen ion or argon ion or Xe ion, with the mode alligatoring that specular surface is hit with ion.

21. light processing equipment according to claim 19 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described cleaning to what carry out alkali or acid at this specular surface goes to steep operation.

22. light processing equipment according to claim 19 can bear the manufacture method of the metal substrate of high temperature, it is characterized in that: described plated film is plated the superficial layer of one or more layers film morphology to finish whole plated film operation with evaporation or plating mode, and its superficial layer is when forming, the particle that should combine with specular surface can directly enter in the hole of ion bombardment, becomes the surface layer structure of a high-bond.