CN101166682A - Substrate container with pressure equalization - Google Patents

Abstract

The present invention is a pod for containing a particulate sensitive substrate and for providing pressure equalization between the exterior and an interior environment of the pod and for minimizing gaseous fluid flow inside adjacent to the particulate sensitive substrate. The pod comprises a primary pod, a diaphragm positioned in a cover, the diaphragm having a normal undeflected position, the diaphragm deflectable from the normal undeflected position. Preferably, the pod comprises a secondary pod disposed in the primary pod defining a second enclosure for containing the particulate sensitive substrate. The pod may comprise a filter attached to the pod and providing gaseous fluid communication between the exterior of the pod and the interior of the pod. The diaphragm is responsive to rapid pressure changes and the filter is responsive to slower pressure changes and allows the diaphragm to return to its normal undeflected position.

Description

The substrate container that band is all pressed

Related application

The application's case advocate based on filed an application on February 27th, 2005 the 60/657th, file an application in No. 354 U.S. Provisional Application cases, on February 27th, 2005 the 60/657th, the right of the U.S. Provisional Application case that the numbering of filing an application in No. 355 U.S. Provisional Application cases and on February 18th, 2006 is still unknown (agency's shelves number be 2267.1110US01), these U.S. Provisional Application cases all are incorporated herein in full with way of reference.

Technical field

The present invention relates to the substrate carrier that can control particle contamination used in the quartz conductor manufacturing, and more specifically, relate to the light shield carrier that can transport and transport, be provided with equal pressing system in the controlled environment in described carrier around the substrate.

Background technology

Photolithography is one of them processing step that usually runs into when handling silicon wafer in semiconductor application.In photolithography, depositing coating photo sensitivity liquid polymers or photoresist on the wafer surface of silicon nitride, and using the template that has expected pattern to make wafer surface optionally be exposed to radiant subsequently.Usually, make UV-irradiation cross mask or light shield or reflect, so that expected pattern is projected on the wafer that is coated with photoresist from the surface of mask or light shield.Through the photoresist of overexposure part chemical modification can take place, and unaffected when removing unexposed photoresist at the work that makes wafer stand chemical medium subsequently, thereby stay the photoresist of the modification that presents the mask pattern shape just on wafer.Usually, make wafer stand etch process, removing the nitride layer part that is exposed, thereby on wafer, stay the nitride pattern that presents mask design just.

Trend in the described industry is to make chip more and more littler and/or that logic density is more and more higher, and this just need have more and more littler live width becoming gradually on the big wafer.Obviously, the degree that the fine degree of patterning and pattern can verily be copied on the wafer surface being carried out on the light shield surface is the factor of the quality of the final semiconductor product of influence.The resolution that pattern can be reproduced on the wafer surface depends on ultraviolet light wavelength used when pattern being projected on the wafer surface that scribbles photoresist.It is the DUV of 193nm that the lithography tool of prior art is to use wavelength, and it makes minimum feature size can reach the 100nm order of magnitude.The instrument of developing at present then uses the extreme ultraviolet light of 157nm, and (Extreme Ultraviolet, EUV), it makes body resolution can reach the following size of 70nm.

Light shield is very smooth glass board, and it comprises the pattern that will be reproduced on the wafer.Representative type light shield backing material is quartzy.Because the key element of modern integrated circuits has very little size, thereby make that not have pollutants on the significant surface (being patterned surface) of light shield most important, otherwise in treating process, these pollutantss may damaging surfaces or are made the anamorphose that is projected on the photoresist layer, thereby cause the quality of final products to make us and can't accept.Usually, as EUV during as photoetching process a part of, the critical particle diameter of non-patterned surface and patterned surface is respectively 0.1 μ m and 0.03 μ m.Usually, scribble optically transparent film on the patterned surface of light shield, film is made by nitrocellulose usually, and it is pasted on the framework and by frame supported, and is pasted on the light shield.Its effect be isolated pollutants and reduce by migrate to these pollutantss on the plane of delineation the printing defects that may cause.Yet peculiar to make transmittance cross light shield different with the DUV photolithography, and EUV extremely far away is the reflection that utilizes on the patterned surface.At present, do not provide transparent light shield protective film material in the affiliated technical field to EUV.Therefore, the reflective light mask (light shield) that is adopted in the EUV photolithography is polluted and is damaged more than light shield used in conventional photolithography is easier.This kind situation is to being exclusively used in any container of the photolithographic light shield design-calculated of EUV and having proposed higher functional requirement for holding, store, transport and transporting.

Obviously, in view of the lip-deep accurate body of mask patternization is damaged because of cliding friction and wearing and tearing easily, thereby make, handle, transport, carry, unnecessary or unexpected contact takes place is very disadvantageous for transportation or memory period.The second, the lip-deep any particle contamination of light shield all might make light shield damage is enough to have a strong impact on any final products that use this light shield to obtain by in treating process.Handling, transporting and transport in the process, may in holding the controlled environment of light shield, produce particulate.Cliding friction and the wearing and tearing that cause thus are exactly a contaminate particulate source.In transportation, light shield its desired position of slipping away in the light shield container then for example is another particulate source.When taking out light shield with automated manner from container and being located in treatment facility, this kind light shield of offing normal also might misplace, thereby might cause the quality of final products unpredictable.Also can cause particulate to produce and opportunities for contamination placing and shift out light shield to the cliding friction in the lithographic equipment process from container.At last, the vibrations of container and vibration may be passed to light shield and hold the assembly of light shield, thereby cause friction and produce particulate together.

Traditionally, light shield is to be transported in the fabrication shop that will use light shield in a container, and between each time used with other container storage in fabrication shop.Transporting container is dropped after use usually.Light shield when being transferred in its storage container fabrication shop, container can be formed another opportunities for contamination from transporting.Light shield is transported utensil and the conventional need of employed container in fabrication shop is differed greatly.Combined will the elimination of this container double-duty is transferred to the particulate intrusion fabrication shop's usefulness container processes and producing chance from transporting container, but can bring huge design challenge.For example, this kind container will need to tackle the great variety of bar pressure in transportation, for example relevant with height above sea level and temperature traverse variation.In addition, also much higher when shifting to the requirement of cushioning ability in the transportation than in fabrication shop, carrying out controlled manipulator.

Some Consideration mentioned above also is applicable to semiconductor wafer substrate.Owing to have recognized that especially in storage, processing and around wafer, need to have controlled environment between the delivery period, prior art has developed out the isolation technology method, its container by being provided for holding wafer, make wafer can keep can not invaded relatively, and realize control near near the environment the wafer by particulated matter.

Wafer normally is transported to fabrication shop in transfer cask, be transferred to subsequently in the independent container, and independent container is used for managing memory chip between the step throughout in fabrication shop.The wafer of 200mm normally transports in leak free plastics " transportation utensil ", these leak free plastics " transportation utensil " or support by the edge with alternate matrix form perhaps use sheeting spacer vertical pile with " Coin stacker formula wafer transportation utensil (coin stackwafer shipper) " form.Be used for managing the industrial standard container that holds the 200mm wafer between the step throughout and be called standard mechanical interface box or SMIF box, and have the door of drop-bottom in fabrication shop.For the wafer of 300mm, its transportation utensil is called front open type transport case or FOSBS, is used for managing throughout the container that holds wafer between the step and then is called front open type unified standard box or FOUPS.The light shield of being stored between each manufacturing step in fabrication shop usually is stored in the drop-bottom container that is similar to standard SMIF box now, and is called light shield SMIP box or RSP.

Even when substrate (being wafer and light shield) when being in this kind controlled environment, because of the pressure of the air of catching in the controlled environment change or because of when the container rapid movement and/or in the upset volume of air of catching (for example only because of opening and the container that closes) time caused turbulent flow of catching air, be present in controlled environment in-to-in particulate and also can be moved.In addition, thin wall-type transportation utensil or FOSBS may experience the wall motion because of the pressure relevant with height above sea level changes, and cause that the air of being caught in the controlled environment is moved.Temperature traverse can form convection current in container.The change in size of container and assembly thereof can be damaged the function of support and fixed mechanism, causes the wafer dislocation and/or the substrate warpage that are carried in the container.Because of the wall of container change in size that fluctuation of pressure causes can be damaged the capping of carrier and the sealing between the door, thereby particulate can be invaded in the carrier.

The method of prior art (especially aspect the chip container) is externally to utilize breather apparatus between environment and the inner controlled volume of air.Breather apparatus provides the path of flowing through for air.The filter that is folded in the path is expected to provide barrier, invades the controlled environment of carrier from external environment condition to stop particulate.Yet as indicated above, used light shield has very tiny and accurate body in the EUV photoetching process, thereby the critical particle diameter of the non-patterned surface of light shield and patterned surface only is respectively about 0.1 μ m and 0.03 μ m.For low particle diameter like this, filter has very little aperture with needs, thus the fluid stream that flows through filter is caused very large resistance, thereby needs bigger filter surfaces long-pending.To using the alternative method be bigger than the filter face area is to change in response to suddenly pressure more slowly, and the pressure suddenly that is for example run into when transporting this kind container changes.These two kinds of methods all do not meet people's expectation, because a design objective of light shield SMIF box is to make controlled volume keep minimum, thereby can effectively seal to prevent the particulate intrusion it.Make the controlled space minimum that is placed with light shield, provide bigger filter area to realize that in controlled space all pressing is conflicting target simultaneously.

Wish to make the particulate that in controlled environment, produces or otherwise introduce or exist can not fall on the light shield.Thus, preferable making will be carried light shield and therein for avoiding the space minimum of the environment that particle contamination must be controlled.Also wish to make the air in the controlled space to keep being relatively static.For example, the corresponding pressure reduction big and suddenly of wall of container and the deflection that occurs can cause pressure wave in controlled space, thus force particle suspension and migration then.

Therefore, need a kind ofly both to be suitable as the transportation utensil, also to be suitable in fabrication shop the substrate container of storage substrate between the various processes.Need a kind of particulate that can stop better to produce and during container traffic and folding, make the particulate disturbance in the substrate container or the minimized container that moves.Also need a kind of equal pressing system, its should be balanced effectively pressure between the inner controlled environment of carrier and the carrier extraneous air, and air is invaded or move out controlled environment and make the turbulent flow minimum of the air that is not present in already in the controlled environment.

Summary of the invention

The present invention is a kind of box that is used to hold to the substrate of particulate sensitivity, is used for providing between the outside of described box and internal environment all pressing and being used to make the inside flow of gaseous fluid near described substrate to the particulate sensitivity to minimize.Described box comprises: main box, it comprises pedestal and capping, described capping is configured with the recessed inside face relative with outside face, described capping is suitable for meshing described pedestal with removing, to define first shell with first volume between described recessed inside face and described pedestal, described capping has perforate.Described box also comprises the barrier film that is arranged in described capping, described barrier film has normally not deflected position, described barrier film with second volume of the external communications of described box with or not between the three volumes that the external fluid of described box is communicated with do not divide described first volume, described barrier film can be with respect to described not deflected position generation deflection normally.At last, described box comprises the auxiliary box that is arranged in the described main box, described auxiliary box comprises bottom and top, described top is suitable for carrying out interface with described bottom, to define second shell that holds described substrate to the particulate sensitivity by second enclosure volume being used to of characterizing, described bottom comprises supporting construction, to be used for described substrate to the particulate sensitivity to be immobilizated in above it with removing, and described top comprises fixed sturcture, to be used for fixing described substrate to the particulate sensitivity when the engagement of described top and described bottom.

In exemplary embodiment, described barrier film is located with one heart with respect to described substrate essence to the particulate sensitivity wherein.At least a portion of operate portions is provided with the concentric raised ridge structure.In another embodiment, described barrier film comprises the operate portions that can move to deflected position from described normal not deflected position.In less important embodiment, described operate portions comprises first and second portion, and described first is the porous gaseous fluid not, and the permeable gaseous fluid of described second portion.

In less important embodiment, described box can comprise filter, and described filter is attached to described box and provides gaseous fluid to be communicated with between the inside of the outside of described box and described box.In box as claimed in claim 1, described barrier film has operate portions, and at least a portion of described operate portions is provided with the concentric raised ridge structure.

In preferred embodiment, described barrier film is to be made by elastomeric material.The main box that another embodiment is provided with the capping of dome-shaped wall and is positioned at auxiliary box is all located with one heart with described barrier film.Described auxiliary box enters particulate by the limited part with air gap barrier is provided.In the 3rd embodiment, described main box is provided with elastic sealing element.

The feature of preferred embodiment of the present invention and advantage provide all pressures of quick response, and this is particularly conducive to box simultaneously as conveying arrangement and is used in fabrication shop, especially stores the device of light shield (or wafer) between the various processes.

The feature of preferred embodiment of the present invention and advantage provide a kind of light shield SMIF box of the EUV of being particularly suitable for photoetching technique.

Description of drawings

Fig. 1 is the block diagram of the capping of main embodiment according to the present invention;

Fig. 2 is the exploded drawings of the container assembly of the exemplary embodiment according to the present invention;

Fig. 3 is the pedestal of the main embodiment according to the present invention and the block diagram that is supported in the substrate on the pedestal;

Fig. 4 is the capping of the exemplary embodiment according to the present invention and the face upwarding stereogram of auxiliary box assembly;

Fig. 5 A is main embodiment according to the present invention, comprises the decomposition sectional side view of container assembly of the assembly of isolated system;

Fig. 5 B is the sectional side view according to the container that assembles of the embodiment of the invention;

Fig. 6 A is the sectional side view of the container that assembles of alternate embodiment according to the present invention;

Fig. 6 B is the three-dimensional cutaway view of the container that assembles of alternate embodiment according to the present invention;

Fig. 7 A is according to the not scheme drawing of the exemplary seal of deformation form that is in of the present invention;

Fig. 7 B is the scheme drawing of form after the distortion of Fig. 7 A example illustrated sealing member;

Fig. 8 A is the detailed cutaway view of looking, its figure explanation capping of alternate embodiment and engagement between the pedestal according to the present invention;

Fig. 8 B is the detailed cutaway view of looking, its figure explanation capping of main embodiment and engagement between the pedestal according to the present invention, and it shows capping contact pedestal;

Fig. 9 is the scheme drawing of the barrier film of less important embodiment according to the present invention;

Figure 10 is the scheme drawing of the barrier film of less important embodiment according to the present invention;

Figure 11 is for embodying the block diagram of front-open wafer container of the present invention; And

Figure 12 is the upward view of container shown in Figure 11.

The specific embodiment

To mainly the present invention be described in this article, but the present invention also is applicable to FOUPS, FOSBS, wafer SMIF box and used other controlled environment containers in semiconductor processes industry or other similar industries with reference to light shield SMIF box.Referring to Fig. 1-5, light shield container 10 (being also referred to as light shield " box ") comprise substantially can with pedestal (being also referred to as " door ") 18 cappings that cooperate hermetically 14, to be used from storage, to transport and to transport the airtight sealing environment 22 of light shield 26 at light shield container 10 inner sealings.Light shield 26 can have various sizes, comprises the light shield of diameter be 5 ", 6 ", 7 ", 8 ", 150mm and 200mm, and it is positioned at sealed environment 22, and effectively with can be present in light shield container 10 exterior fumes isolated.

Use for carry out automation in various types of wafer fabrication equipment, pedestal 18 is provided with and meets semiconductor equipment and the material world (Semiconductor Equipment and MaterialsInternational, the SEMI) body of standard.In exemplary embodiment, pedestal 18 is consistent with the similar pedestal on light shield " SMIF " (standard mechanical interface) box that is used for the well-known etching system in affiliated field at least in part.For example, as shown in Fig. 6 a, pedestal 18 has lower surface 30 (not shown)s by area occupied 36 (not shown)s that periphery 34 defines and has, and lower surface 30 is relative with the upper surface 38 that separates by side 42 and lower surface 30.Lower surface 30 is provided with the body that meets the SMIF standard, with semiconductor processing equipment (not shown) compatibility.The pedestal 18 that conforms to SMIF also is suitable for can being coupled to capping 14 by pedestal-bolt lock mechanism (not shown) with removing, and pedestal-bolt lock mechanism can be opened by the breech lock opening device (not shown) that meets SEMI.Referring to the 4th, 995, No. 430 US Patent that had by the application's case owner and be incorporated herein with way of reference.Each container component is preferable to be made by durable polymer by penetrating the manufacturing process that mould moulding process or other are fit to.Poly-mer can be transparent, so that can see light shield 26.In addition, these elements static that can dissipate.Can be in order to make the transparent of these box elements and the example of the material of the static that can dissipate is a polymethyl methacrylate.Perhaps, these box elements also can be made by the opaque polycarbonate through filled with carbon fibers of the static that can dissipate, and comprise (or a plurality of) transparent window (not shown), see light shield 26 so that can see through form.One be chosen as, it can be made by transparent polycarbonate again.As to the substituting of polycarbonate, each element can further be made by flame resistance polyethers acid imide.Should be appreciated that in alternate embodiment, each box element also can be made by other materials.It is preferable makes by penetrating mold forming, but also contains other known manufacture methods.Promptly set forth a kind of exemplary light shield SMIF box in the 6th, 216, No. 873 US Patent giving Asyst Technologies company, the content of described US Patent is incorporated herein with way of reference.The use of SMIF box for photomask in EUV uses then is disclosed in the 6th, 906, No. 783 US Patent, and described US Patent is incorporated herein with way of reference.

Generally speaking, light shield 26 has first surface 54 and patterned surface 58.Described in the background technology part, patterned surface has very tiny body, and therefore can not contact with other surfaces (for example surface of light shield container 10) as mentioned.Usually, light shield 26 is supported in the circumference office on light shield surface 54 and 58, and the peripheral part does not contain pattern and thereby is not easy to be damaged when contact light shield supporting construction.Light shield container 10 comprise in sealed environment 22, be positioned at respectively on the pedestal 18 and capping 14 on light shield supporting mechanism 100 and light shield fixed mechanism 104.Fig. 6 a and 6b show the elevational cross-sectional view and the three-dimensional cutaway view of light shield container 10 respectively.In exemplary embodiment, capping 14 is rectangular substantially with pedestal 18, and wherein on the plane of essence perpendicular to side 42, light shield supporting pad 218 is positioned on light shield support frame 200 and the light shield fixed frame 208 light shield 26 in alternate light shield supporting pad 218 upper supports.Light shield support frame 200 and light shield fixed frame 208 operationally are coupled to again respectively from pedestal 18 and capping 14 and extend and be fixed to elastomeric support column 110 in pedestal 18 and the capping 14 and relative flexible fastening post 208.Pillar stiffener and fixed leg all are adapted at having low rigidity on axial direction (z direction) and the horizontal direction (being x and/or y direction), so that any vibrations on corresponding these directions and vibrational load and deform and deflection.Light shield fixed leg 112 is fit to match with light shield pillar stiffener 110, with when capping 14 is meshed with pedestal 18, light shield fixed leg 112 and light shield pillar stiffener 110 are out of shape on the z direction, on the surface 54 and 58 of light shield 26, keeping continuous Offset, thereby light shield 26 is fixed on the desired position that is sandwiched between capping 14 and the pedestal 18.Be understood by those skilled in the art that the layout of light shield pillar stiffener 110 and light shield fixed leg 112 will alleviate the influence of the vibrations of mount pad (being pedestal 18 and/or capping 14) to light shield 26.

Light shield support frame 200 and light shield fixed frame 208 can be rigidity by essence, the non-corpuscular property material of the static that can dissipate is made, and for example (for example) made by the polyetheretherketone (" PEEK ") through filled with carbon fibers.When light shield container 10 runs into the vibration that makes elastomeric support column 110 and flexible fastening post 112 be tending towards deflection or shock loads, the light shield support frame 200 of rigidity moves as the entity that essence is rigidity with 208 meetings of light shield fixed frame, limit pillar stiffener and fixed leg deflection and the quality damping is provided being used to, be in desired form in light shield container 10 thereby light shield 26 is remained.In alternate embodiment, light shield fixed frame 208 and light shield support frame 200 form the auxiliary box 400 with auxiliary environment 405 being cooperated with pedestal 18 by capping 14 to cooperate in the main airtight sealing environment 22 that forms.Auxiliary environment 405 is communicated with airtight sealing environment 22 fluids, but the air that held in the auxiliary environment 405 are not prone to turbulent flow relatively because the volume of air that is comprised is less and sealed environment 22 and auxiliary environment 405 between have the fluid flow path of complications.

In the embodiment of capping 14 and pedestal 18, the periphery 428 of capping 14 is around 42 location, side of pedestal 18, so that pedestal 18 is contained in the cavity 432 fully.In addition, on pedestal 18, provide elastic sealing element 510 shown in Fig. 7 a and 7b.Sealing member 510 comprises the elastic material rod 514 with lower sealing surface 518 and back seal face 522.Resilent finger 528 extends from lower surface 518.The size of finger 528 is fit to be received on pedestal 18 upper surfaces in formed " U " shape circumferential groove 532 with press-fit manner.As shown in Fig. 8 a and the 8b, when being arranged in groove 532 fully, sealing member 510 is placed to and makes the upper surface 38 of lower sealing surface 518 in the face of pedestal 18.Groove 532 is pressed close to the contact point 536 of light shield fixed frame 208 on upper surface 38 and is extended with one heart.The inside face 436 of capping 14 is provided with a plurality of edges 548 alternate, that essence is parallel, and these edges 548 are around the regional of inside face 36 and have " V " tee section profile.The size at edge 548 and position make the back seal face 522 of its contact resilient sealing member 510, so that seal a plurality of air cavitys 568, thereby and externally provide sealing barrier between environment and the leak free controlled environment 22.These a plurality of sealed engagement and air cavity 568 form high resistance to flow between controlled environment 22 and external environment condition.With reference to the together application case " vibrations of box for photomask and vibration isolation system (Shock and Vibration Isolation System For a Reticle Pod) " of filing an application simultaneously with the application's case, just can understand the effect of the elastic sealing element and the rebound resilience strut member of auxiliary box best, the inventor of application case is Gregerson, Halbmaier, Sumner, Wiseman, Tieben and Strike together, and the content of application case is incorporated herein with way of reference.

In the exemplary embodiment shown in Fig. 7 a and the 7b, the shape of sealing member 510 is in fact as undeformable Greek alphabet Π.The finger 528 of Π shape elastic sealing element 510 is received in the groove 532.Be provided with three alternate parallel edges 547,548 and 549, make when capping 14 cooperates with pedestal 18, the top of contact barrier film 510 in the zone of parallel edges 549 between each finger of Π, parallel edges 547 and 549 is then at the end contact seal part 510 near sealing member.This kind arrange to make as long as capping 14 and pedestal 18 are combined together, just keep in touch two surfaces of capping 14 and pedestal 18 of sealing member 510.When taking off pedestal 18, sealing member 510 is from returning with the maximum contact point " bullet " of pedestal 18, thereby avoids when barrier film 510 adheres on the pedestal 18 and cause forming particulate.

Sealing member 510 both can be and solidly also can be hollowly, had for example in the shape shown in Fig. 7 a and the 7b.It can by other suitable synthetic resin known in for example silicone rubber, Koroseal or the affiliated field etc. not cohesive material make.

As shown in Fig. 1,2,4,5A, 6A and the 6B, capping 14 comprises overhead guard 410 and sidewall 420, and sidewall 420 circumferentially extends out from overhead guard 410, ends at from the periphery 428 that roof shifts out, to define the cavity 432 with inside face 436.As indicated above, by capping 14 is matched with pedestal 18, form the controlled environment 22 of airtight sealing between the upper surface 38 of the inside face 436 of capping 14 and pedestal 18, wherein periphery 428 is contained in the cavity 432 around the side 42 and the pedestal 18 of pedestal 18.

Overhead guard 410 further comprises the structure that defines air extractor vent 444, and air extractor vent 444 is used to make the controlled environment 22 in the light shield container 10 to be communicated to the outside of light shield container 10.Annular mounting flange 448 with outer circle wall 452 is around air extractor vent 444, and outer circle wall 452 is alarmmed and ended at the top end face 456 away from light shield container 10 from overhead guard 410.Flexible diaphragm cap 460 is received in slidably in the outer circle wall 452 and around outer circle wall 452 and locatees, to cover on air extractor vent 444 tops.Flexible diaphragm 470 shown in Figure 3 adheres to and is sealed on the end face 456, is sandwiched in by suitable fastening and fixing means between the diaphragm cap 460 of end face 456 and ventilation.Flexible diaphragm 470 is a dish, has to be used to the circumferential groove 474 that the circumferential ridge of structural rigidity is provided and is positioned at its periphery proximal end face 456 places, and circumferential groove 474 is suitable for contacting barrier film hermetically by appropriate fastening and fixing means.Barrier film separates the external environment condition of controlled environment 22 with light shield container 10.The volume that changes controlled environment 22 by diaphragm movement can make the pressure in the controlled environment 22 change to reach balance, thereby the functional relation maintenance essence between the volume of the internal pressure that makes controlled environment 22 and controlled environment 22 is invariable.

Be understood by those skilled in the art that the pressure reduction suddenly, big between controlled environment 22 and the external environment condition may need barrier film that deflection big, suddenly takes place, thus in controlled environment 22 the build-up of pressure ripple.As indicated above, this kind situation is that people are undesirable.As shown in Fig. 5 B, another embodiment of the present invention provides filtration channel 1000 to connect the volume of external environment condition and controlled environment 22.An embodiment of this kind filtration channel is a composite diaphragm 488 shown in Figure 9.Barrier film 488 is flexible dish-shaped barrier films, has the convex ridge and the circumferential groove 474 that are used to provide structural rigidity, but has the middle section of being made by filter material 490.Contaminate particulate can not enter so that the air in the external environment condition can enter in the light shield container 10 by filtration channel is provided, and filter material 490 can provide under higher pressure reduction all presses response faster.488 less relatively pressure reduction of barrier film in response to more frequent appearance, but the less pressure reduction of this kind does not provide and can overcome flow path resistance and make surrounding air cross the pressure potential of the micro-aperture of filter.Secondly, filter material 490 is regulated the deflection of barrier films, so that barrier film-combination of filters moves volume of air in the controlled environment 22 in the quasistatic mode of extraordinary image piston pump, but not produces violent displacement by the motion suddenly of flexible diaphragm.

In alternate embodiment, can be by the flexible diaphragm 470 that increases of the flow channel 1000 shown in Fig. 5 B, flow channel 1000 is positioned in the vessel rightly, filters the barrier (not shown) and is communicated with controlled environment 22 to pass.Embodiment makes light shield container 10 comprise thin segment 1005 in appropriate position, serving as barrier film when having or do not have the aided filter flow channel, as shown in Fig. 6 B.Preferably, thin segment deflection and adapt to the volume change of about volume change of 7% to 10% and preferable 30%, and therefore other walls of its deflection container are much bigger.Thin segment can be present in the below of automation flange 1015.

The example of barrier film can be film gas filter or analogue.The example that strides across the filtration barrier of filtration channel can be the through hole that penetrates light shield container 10, wherein is inserted with double burned powdered-metal gas filter, or similar filter that may be known in affiliated field.

Another embodiment of light shield container 10 provides grounding path, so that static dissipates from the end face of light shield 26 and the wall of bottom surface process light shield support and interrupter and light shield container 10.Protect light shield 26 Electrostatic Discharge can not occur thus.Described method and device are discussed giving in the 6th, 513, No. 654 US Patent of Asyst Technologies company, the content of described US Patent is incorporated herein with way of reference.

Referring to Figure 11 and 12, the front-open wafer container 1020 that configuration is used for the 300mm wafer has Qianmen 1022, and Qianmen 1022 has key hole 1024 and reaches a part that discharges the bolt lock mechanism 1026 of described door from housing parts 1030 as being used for breech lock.Show sidewall 1040 receivability handles 1042 among the figure, bottom side 1046 has motion male part 1050, and the top side has manipulator carrying flange 1054.These containers can utilize the present invention by utilizing barrier film mentioned above.It is well-known to utilize filter 1055 all to press in these containers.Wafer-level in these containers is placed and with alternate array format vertically stacked.Barrier film can place on the bottom side of wall construction, with the wafer co-axially align.Other positions that are suitable for barrier film can be Qianmen, top side, sidewall or rear wall.The air extractor vent 1064 that barrier film 1058 can attach independent shell 1060 and pass described wall.Shell can be assembled or be soldered on the housing.In addition, but in these containers, can be fit to define the thin segment of the independently moving that separates with thicker wall on every side.

The foregoing description is intended to illustration and non-limiting the present invention.Other embodiment also belong in the scope of claims.Although above with reference to specific embodiment the present invention is described, yet the those skilled in the art will know that can make change on concrete form, this does not deviate from spirit of the present invention and scope.

Claims (19)

1. box that is used to hold to the substrate of particulate sensitivity is used for providing between the outside of described box and internal environment and all presses and be used to make the inside flow of gaseous fluid near described substrate to the particulate sensitivity to minimize, and the feature of described box is to comprise:

Main box, it comprises pedestal and capping, and described capping is configured with the recessed inside face relative with outside face, and described capping is suitable for meshing described pedestal with removing, to define first shell with first volume between described recessed inside face and described pedestal, described capping has a perforate;

Be arranged in the barrier film of described capping, described barrier film has normally not deflected position, described barrier film with second volume of the described external communications of described box with or not between the three volumes that the described external fluid of described box is communicated with do not divide described first volume, described barrier film can be with respect to described not deflected position generation deflection normally; And

Auxiliary box, it is arranged in the described main box, described auxiliary box comprises bottom and top, described top is suitable for carrying out interface with described bottom, to define second shell that is held described substrate to the particulate sensitivity by second enclosure volume being used to of characterizing, described bottom comprises supporting construction, to be used for and can described substrate to the particulate sensitivity to be immobilizated in above it with removing, and described top comprises fixed sturcture, to be used for fixing described substrate to the particulate sensitivity when the engagement of described top and described bottom.

2. box as claimed in claim 1 is characterized in that described barrier film locatees with one heart with respect to described substrate essence to the particulate sensitivity wherein.

3. box as claimed in claim 2 is characterized in that described barrier film comprises the operate portions that can move to deflected position from described normal not deflected position.

4. box as claimed in claim 3 is characterized in that described operate portions comprises first and second portion, and described first is the porous gaseous fluid not, and the permeable gaseous fluid of described second portion.

5. box as claimed in claim 1 is characterized in that further comprising filter, and described filter is attached to described box and provides gaseous fluid to be communicated with between the described inside of the described outside of described box and described box.

6. box as claimed in claim 1 is characterized in that described barrier film has operate portions, and at least a portion of described operate portions is provided with the concentric raised ridge structure.

7. box as claimed in claim 6 is characterized in that described barrier film is to be made by elastomeric material.

8. box as claimed in claim 7, it is characterized in that described capping is to be made of first housing section and second housing section, described first housing section has the perforate that size is approximately the size of described barrier film, described second housing section covers the described perforate of described first housing section, and described second housing section and described barrier film define described second volume.

9. box as claimed in claim 8 is characterized in that described second housing section comprises dome-shaped wall, and described second housing section comprise a pair of in the horizontal direction from described dome-shaped wall along horizontal outward extending projection.

10. box as claimed in claim 1, it is characterized in that described main box, described auxiliary box and described barrier film all with one heart the location.

11. box as claimed in claim 1, it is characterized in that described auxiliary box enters particulate by the limited part with air gap provides barrier.

12. box as claimed in claim 1, it is characterized in that described pedestal has surface up, and the described top of described auxiliary box has peripheral lip down, and wherein said peripheral lip is not in contact with it in the face of described pedestal, thereby is defined in the described towards the gap of extending between the upper surface of described antelabium and described pedestal.

13. one kind is used to hold at least one box to the substrate of particulate sensitivity, is used for providing between the outside of described box and internal environment all pressing and being used to make the inside flow of gaseous fluid near described substrate to the particulate sensitivity to minimize, the feature of described box is to comprise:

Housing section, it has the opening that defines doorframe;

Door, its size is suitable for being received in the described doorframe, and described door comprises the bolt lock mechanism with retractible latching portion, being used for and the engagement of described doorframe, thereby described door is anchored in the described doorframe, and the described housing that wherein is fastened with described door defines first volume;

Substrate support, it is arranged in the described box, is used for described at least one substrate to the particulate sensitivity can be immobilizated in controlled sealed inner with removing; And

Barrier film, it is attached on the described box and is positioned to make described controlled sealed inner and described external environment condition is isolated, and described barrier film deflection is with the pressure reduction between the outside of the inside that compensates described box and described box.

14. box as claimed in claim 13, it is characterized in that described substrate is the semiconductor wafer that diameter is at least about 300mm, wherein said housing section has bottom side, left side, right side and front side, and described doorframe is positioned on the described front side, and wherein in the described inside of described box, described substrate support is included in a plurality of wafer shelves that are arranged in row on described left side and the described right side, and has the motion male part on the wherein said bottom side.

15. box as claimed in claim 14 is characterized in that described barrier film is the elastic diaphragm that is attached to described housing.

16. box as claimed in claim 14 is characterized in that described barrier film is arranged in described door.

17. box as claimed in claim 13 is characterized in that described box also comprises the filter that is used to provide the permeable gaseous fluid of further all pressing.

18. box as claimed in claim 13, it is characterized in that further comprising the auxiliary box that is positioned at described housing and door, described auxiliary box has top and bottom, described bottom is attached on the described door, and described top can be positioned on the described bottom with removing, when described housing and described door engagement, described top and the engagement of described housing.

19. wafer case that is used for a plurality of wafers of fixing, the feature of described box is the housing section that comprises door and be used to admit described door, described container further comprises flexible removable barrier film and filter, one side of described flexible removable barrier film is communicated with the described external fluid of described box, and a relative side and the described internal fluid communication of described box, one side of described filter is communicated with the described external fluid of described box, and a relative side and the described internal fluid communication of described box make described barrier film and filter provide the described inside of described box to described exterior all pressures thus.

Images