CN101163805A - Clad member and printed-circuit board - Google Patents
Clad member and printed-circuit board Download PDFInfo
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- CN101163805A CN101163805A CNA2006800135055A CN200680013505A CN101163805A CN 101163805 A CN101163805 A CN 101163805A CN A2006800135055 A CNA2006800135055 A CN A2006800135055A CN 200680013505 A CN200680013505 A CN 200680013505A CN 101163805 A CN101163805 A CN 101163805A
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Abstract
A clad member low in thermal expansion coefficient and excellent in workability is provided. The clad member 1 comprises a core member 11 and skin members 12 cladded on both sides of the core member. The core member 11 is constituted by an aluminum alloy consisting of Si: 5 to 30 mass %, and the balance being aluminum alloy and impurities. The skin member 12 is constituted by aluminum or an aluminum alloy consisting of Al: 98 mass% or above, and the balance being impurities.
Description
The application requires Japanese patent application No.2005-132493 that submitted on April 28th, 2005 and the U.S. Provisional Application No.60/679 that submitted on May 11st, 2005, and 667 right of priority is introduced its complete disclosure as a reference fully at this.
The cross reference of related application
The application is based on the application that 35 U.S.C. § 111 (a) submit to, according to 35 U.S.C. § 119 (e) (1), requires the U.S. Provisional Application No.60/679 in submission on May 11st, 2005 according to 35 U.S.C. § 111 (b), 667 right of priority.
Technical field
The present invention relates to a kind of compound (clad) member, relate to the composite component of excellent processability especially, a kind of manufacture method of described composite component and the described member of use are as the printed circuit board (PCB) of substrate.
Background technology
The following knowledge that is described in the correlation technique of wherein having set forth the contriver and problem should not be understood that the admitting of knowledge of prior art.
As shown in Figure 1, printed circuit board (PCB) 1 comprise aluminium base 2, laminated insulation layer 3 on the aluminium base, on insulation layer 3 conductive layer 4 of laminated predetermined shape.On conductive layer 4, electronic component 5 engages with scolder 6.Usually, in such printed circuit board (PCB) 1, use the material of the fine aluminium of the good JIS 1xxx series of thermal conductance, and use Copper Foil as conductive layer 4 as substrate 2.
Yet as shown in table 1, because Copper Foil 4 is different with the thermal expansivity of aluminium base 2, that is, the thermal expansivity of Copper Foil 4 is about 17 * 10
-6The thermal expansivity of/K and aluminium base is about 24 * 10
-6/ K, because the difference of thermal expansivity, its multiple heating and cooling that produced by energy supply repeatedly (energization) make the warpage of printed circuit board (PCB) along relative direction.In addition, because the thermal expansivity of electronic component 5 is 2 * 10
-6To 8 * 10
-6/ K is different from copper 4 and thermal expansivity aluminium base 2, because stress, the warpage of multiple printed circuit board (PCB) 1 makes scolder 6 crackings.
For addressing this problem, propose to use by thermal expansivity be lower than milled sheet (rolled sheet) that the Al-Si alloy of JIS 1xxx series aluminum makes as aluminium base (referring to, the patent disclosure publication No.H06-41667 of Japanese not substantive examination (after this, patent document 1), the patent disclosure publication No.H02-61025 of Japanese not substantive examination (after this, patent document 2), the Japanese not patent disclosure publication No.2001-335872 (after this, patent document 3) of substantive examination).
In addition, the other manufacture method as the low aluminium base 2 of thermal expansivity has proposed following method: a kind of method that wherein according to powder metallurgical technique the Al-SiC synthetics of low thermal coefficient of expansion is molded as plate shape; With a kind of wherein in metal pattern, fill the Al-SiC synthetics under high pressure, inject the Al molten metal then or comprise the Al molten metal of Si castmethod (referring to, Japan is the patent disclosure No.2004-128451 of substantive examination (after this, patent document 4) not).
Although attempted suppressing rimose and occurring by reducing in insulation layer the elasticity of employed resin, it fails to satisfy fully the requirement of substrate reliability.
Yet in the milled sheet of describing in patent document 1,2 and 3, because Al-Si alloy poor in processability is rolled into thin plate with it and can causes the rimose edge, this makes it be difficult to the needed larger size panel of manufactured copper veneer sheet.
Disclosed method in the patent document 4 is difficult to make large-scale sheet, and its manufacturing is poor, the manufacturing cost height.In addition, too firmly consequently can not carry out cutting process by the substrate that this method forms, it is unfavorable for printed circuit board (PCB).
Explanation to the merits and demerits of disclosed various features, embodiment, method and device in other publications herein never is intended to limit the present invention.In fact, some feature of the present invention can overcome some shortcomings, still keeps simultaneously wherein disclosed some or all feature, embodiment, method and device.
Other targets of the present invention and advantage will be apparent in following preferred embodiment.
Summary of the invention
Consider the problem in above-mentioned and/or other association areas, developed the preferred embodiments of the present invention.The preferred embodiments of the present invention can significantly be improved existing method and/or device.
Except that other potential advantages, some embodiment can provide the composite component of the low and excellent processability of a kind of thermal expansivity, and it is suitable for printed circuit board (PCB).
Except that other potential advantages, some embodiment can provide a kind of manufacture method of described composite component.
Except that other potential advantages, some embodiment can provide a kind of printed circuit board (PCB) that uses described composite component.
Above-mentioned composite component has basis and lists [1] structure to [9] down.
[1] a kind of composite component comprises core component and covers skin member on the both sides of described core component,
Wherein said core component is made of aluminium alloy, and described aluminium alloy comprises that Si:5 is aluminium and impurity to 30 quality % and trim thing, and
Wherein said skin member is made of aluminum or aluminum alloy, and described aluminium alloy comprises that Al:98 quality % or above and trim thing are impurity.
[2] according to the composite component of above-mentioned [1], wherein, in the described aluminium alloy that constitutes described core component, Fe concentration is 1 quality % or littler, and Ni concentration is 1 quality % or littler.
[3] according to the composite component of above-mentioned [1], wherein, in the described aluminium alloy that constitutes described core component, Cu concentration is 0.5 quality % or littler, Ti concentration is 0.3 quality % or littler, Cr concentration is 0.3 quality % or littler, and P concentration is 0.1 quality % or littler, and B concentration is 0.05 quality % or littler.
[4] according to the composite component of above-mentioned [1], wherein, in the described aluminium alloy that constitutes described core component, Mn concentration is 0.2 quality % or littler, and Mg concentration is 0.2 quality % or littler, and Zn concentration is 0.2 quality % or littler.
[5] according to the composite component of above-mentioned [1], wherein, in the described aluminium or described aluminium alloy that constitute described skin member, Si concentration is 1 quality % or littler, Fe concentration is 1 quality % or littler, and Cu concentration is 0.5 quality % or littler, and Mn concentration is 2 quality % or littler.
[6] according to the composite component of above-mentioned [5], wherein, described Mn concentration is 0.002 to 1.2 quality %.
[7] according to the composite component of above-mentioned [5], wherein, in the described aluminium or described aluminium alloy that constitute described skin member, Zn concentration is 0.5 quality % or littler, and the total concn of the element except that Al and Zn is 0.3 quality % or littler.
[8] according to the composite component of above-mentioned [1], the fraction of coverage of wherein said skin member is each surface 1 to 15%.
[9] according to the composite component of above-mentioned [1], the thickness of wherein said composite component is 0.1 to 5mm.
A kind of manufacture method of described composite component has the structure that basis is listd [10] down.
[10] a kind of manufacture method of composite component, the following steps that comprise:
By comprising that Si:5 is that being provided with by aluminium or Al concentration on two surfaces of plate of aluminium alloy manufacturing of Al and impurity is 98% or the plate made of the aluminium alloy above, that the trim thing is impurity to 30 quality %, trim thing; And
Described each plate of composite rolling is with engage pressure.
A kind of printed circuit board (PCB) has according to the structure of lising [11] to [13] item down.
[11] a kind of printed circuit board (PCB) comprises:
Aluminium base is by comprising core component and the composite component manufacturing that covers two lip-deep skin members of core material;
Insulation layer is laminated on the described aluminium base; And
The copper conductive layer is laminated on the described insulation layer,
The described core component of wherein said composite component is by the aluminium alloy manufacturing, and described aluminium alloy comprises that Si:5 is Al and impurity to 30 quality % and trim thing, and
Wherein said skin member is by the aluminum or aluminum alloy manufacturing, and described aluminium alloy comprises Al:98 quality % or above and trim thing is the aluminium alloy of impurity.
[12] according to the printed circuit board (PCB) of above-mentioned [11], wherein said insulation layer comprises insulating resin or wherein mixed the insulating resin mixture of heat-conducting filler in insulating resin.
[13], also be included in the lip-deep anodic oxide coating of described aluminium base according to the printed circuit board (PCB) of above-mentioned [11].
Will be according to following explanation and further in conjunction with the accompanying drawings above-mentioned and/or other aspects, feature and/or the advantage of understanding various embodiment.Under applicable situation various embodiment can comprise and/or get rid of different aspect, feature and/or advantage.In addition, various embodiment can be in conjunction with aspect other embodiment one or more or feature under applicable situation.The explanation of the aspect of specific embodiment, feature and/or advantage should not be understood that to limit other embodiment or claim.
The invention effect
The present invention who is stated according to above-mentioned [1], owing to form described composite component by the described skin member that on two surfaces of described core component, covers high ductibility, its excellent processability therefore can be with its rolling low thermal coefficient of expansion of guaranteeing covering material for thin plate simultaneously by described core component.Can obtain the surface of good treatment characteristic by described skin member.
According to the present invention who is stated in above-mentioned [2], the described low thermal coefficient of expansion of described composite component can be guaranteed more definitely.
According to the present invention who is stated in above-mentioned [3], can be close grain with the described grain formation of described core component.
According to the present invention who is stated in above-mentioned [4], the described excellent processability of described composite component can be guaranteed more definitely.
According to the present invention who is stated in above-mentioned [5], the described excellent processability of described composite component can be guaranteed more definitely.
According to the present invention who is stated in above-mentioned [6], can obtain the described good surface treatment characteristics of described composite component.
According to the present invention who is stated in above-mentioned [7], the described processibility of described composite component can be guaranteed more definitely.
According to the present invention who is stated in above-mentioned [8], the described excellent processability and the described low thermal coefficient of expansion of described composite component can be guaranteed more definitely.
Be applicable to because the element material that thermal expansion throws into question, for example aluminium base of printed circuit board (PCB) according to the composite component of the present invention of being stated in above-mentioned [9].
Use can be made the composite component of being stated in above-mentioned [1] according to the of the present invention described manufacture method of being stated in above-mentioned [10].
In the printed circuit board (PCB) of the present invention of being stated according to above-mentioned [11], owing to use the composite component of being stated in above-mentioned [1] as aluminium base, the difference of the thermal expansivity between described aluminium base and the described conductive layer is little, also seldom causes warpage even repeat heating and cooling.As a result, the rimose that can suppress to be used for to engage the scolder of electronic component occurs.
According to the present invention who is stated in above-mentioned [12], between described insulation layer and the described aluminium base engage and described insulation layer and described conductive layer between engage good.
According to the present invention who is stated in above-mentioned [13], the excellent in adhesiveness between described aluminium base and the described insulation layer.
Description of drawings
Show preferred embodiment of the present invention by the example in the accompanying drawing, but be not limited to this, wherein:
Fig. 1 is the cross sectional view of printed circuit board (PCB) according to an embodiment of the invention; And
Fig. 2 is the sectional view of composite component according to an embodiment of the invention.
Embodiment
In the following paragraph, will be by case description preferred embodiments more of the present invention, but be not limited thereto.Should be appreciated that based on the disclosure those skilled in the art can carry out various other modifications based on the embodiment of these examples.
Fig. 2 shows the cross sectional view of composite component 10 according to an embodiment of the invention.
In the present invention, impurity in the aluminium alloy that constitutes core component 11 is represented the element outside Si and the Al, and be included as the characteristic of improving core component 11 and the element that increases, in the scope of the characteristic of not damaging core component 11 involved element, and involved inevitably during manufacture element.In an identical manner, impurity in the aluminum or aluminum alloy that constitutes skin member 12 is represented the element except that Al, and be included as the characteristic of improving skin member 12 and the element that increases, involved element in the scope of the characteristic of not damaging skin member 12, and involved inevitably element in the manufacturing processed.
In the aluminium alloy that constitutes core component 11, be the reason of Si inclusion (inclusion) importance and restriction Si concentration below.
Si reduces the necessary bioelement of the aluminum alloy heat coefficient of expansion.As shown in table 1, with the increase thermal expansivity reduction of Si concentration.In the present invention, used the aluminium alloy of the Si concentration of 5 to 30 quality %.If Si concentration less than 5 quality %, can not obtain the low thermal coefficient of expansion of wishing.On the other hand, if it surpasses 30 quality %, although thermal expansivity reduces the ductility deterioration.If the excessive deterioration of the ductility of core component 11 even skin member 12 is covered on the core component 11, rolls into thin plate with them and also becomes difficult.In addition, also be difficult to handle, for example, cutting (machining), boring, cutting are even after composite rolling.In addition, higher Si concentration causes the deterioration of thermal conductance, has caused for example printed circuit board (PCB) of member that member needing to be not suitable for heat dissipation.Consider thermal expansivity and be easy to and make or aftertreatment that preferred Si concentration is at 15 to 27 quality %.As shown in table 1, the thermal expansivity that comprises the aluminium alloy of 15 to 27 quality % falls into 19.6 * 10
-6/ K to 17.0 * 10
-6In the scope of/K, it is near 17 * 10
-6The thermal expansivity of the Cu of/K.As a result, use composite component 10 according to the present invention can reduce substrate 2 as far as possible as the substrate of printed circuit board (PCB) 1 thermal expansivity and difference as the thermal expansivity of the Copper Foil 4 of conductive layer.
The thermal expansivity and the thermal conductance of table 1 Al-Si alloy
| Alloy | Al-Si alloy Si content (quality %) trim thing: aluminium and impurity | Thermal expansivity [* 10 -6/K] | Thermal conductance [W/ (m-K)] |
| Si content | |||
| A | 1 | 23.2 | 236.6 |
| |
3 | 22.6 | 234.0 |
| |
5 | 22.1 | 231.4 |
| |
10 | 20.8 | 225.1 |
| E | 15 | 19.6 | 218.1 |
| F | 20 | 18.5 | 218.9 |
| G | 25 | 17.4 | 212.9 |
| H | 27 | 17.0 | 207.1 |
| I | 30 | 16.5 | 201.6 |
| J | 40 | 14.7 | 190.9 |
| Cu | 17.0 | 397.0 | |
| Pure Al | 23.5 | 238.0 | |
| Si | 7.6 | 138.5 | |
Can example Fe, Ni, Cu, Ti, Cr, P, B, Mn, Mg and Zn be as the impurity in the aluminium alloy of core component 11.
If content is little, Fe and Ni are the elements with the effect that reduces the alloy thermal expansivity.Yet, if comprise these a large amount of elements in the aluminium alloy, the processibility deterioration, composite rolling and/or rolling after can cause the difficulty of processing.Therefore, preferred Fe concentration is 1 quality % or littler, and the concentration of Ni is 1 quality % or littler.Preferred Fe concentration is 0.5 quality % or littler, and the concentration of Ni is 0.5 quality % or littler.
Cu and Cr are the elements that strengthens mechanical property.Ti and B are the small elements of crystal grain that makes in the alloy.If P concentration is 10 quality % or when above, P has that the Si of making crystal grain becomes sphere and the minor effect that becomes.Can be independently or add P as the compound of Cu and P.In these elements, if comprise a large amount of Cu, the processibility deterioration, its make carry out composite rolling and/or rolling after become difficulty and can cause the deterioration of thermal conductance of processing.Therefore, preferred Cu concentration is 0.5 quality % or littler.More preferably Cu concentration is 0.2 quality % or littler.Need therein in the application of heat dissipation person's character as printed circuit board (PCB), Cu concentration preferably falls in the above-mentioned scope with the protection thermal conductance.Comprise the deterioration that a large amount of Ti and Cr cause processibility in the aluminium alloy, its make be difficult to composite rolling and/or rolling after handle.Therefore, preferred Ti concentration is that 0.3 quality % or littler and Cr concentration are 0.3 quality % or littler.More preferably Ti concentration is that the concentration of 0.2 quality % or littler and Cr is 0.2 quality % or littler.In addition, P concentration surpasses 0.1 quality % and causes saturated and less economical effectiveness about the above-mentioned effect of Si crystal grain.Therefore, preferred P concentration is 0.1 quality % or littler.More preferably P concentration is between 0.0001 to 0.1 quality % (1 to 1000 quality ppm), more preferably 0.0003 to 0.01 quality % (3 to 100 quality ppm).In addition, a large amount of B can cause the machinability and the cutting of the deterioration of matrix material.Therefore, preferred B concentration is 0.05 quality % or littler.Especially preferred B concentration is 0.03 quality % or littler.
A large amount of Mn, the Mg and/or the Zn that are comprised in the aluminium alloy can cause the processibility deterioration, its make successively be difficult to composite rolling and/or rolling after handle.In addition, Mn and Mg also have the possibility of deterioration thermal conductance.Therefore, preferred Mn concentration is that 0.2 quality % or littler and Mg concentration are 0.2 quality % or littler.More preferably the concentration of Mn is 0.1 quality % or littler.More preferably Mg concentration is 0.1 quality %.As for Zn, there is the possibility of deterioration erosion resistance, therefore, preferred Zn concentration is 0.2 quality % or littler.More preferably Zn concentration is 0.1 quality % or littler.
Can comprise the above-mentioned impurity in the core component 11 inevitably, i.e. Fe, Ni, Cu, Ti, Cr, P, B, Mn, Mg and Zn.
On the other hand, skin member 12 itself has high ductibility and has guaranteed ductility as composite component 10.For preventing or reduce the appearance at rimose edge when the composite rolling, it is necessary using aluminium or Al concentration 98 quality % or above aluminium alloy.Al concentration less than 98 quality % causes insufficient ductility, and it easily causes the appearance at rimose edge when composite rolling.The preferred Al concentration of skin member 12 be 99 quality % or more than.98 quality % or above Al concentration are better than the Al-Si alloy on surface treatment characteristics, so the covering of skin member 12 has caused the surface treatment characteristics of the improvement that is better than core component 11.
Can example Si, Fe, Cu and Mn be as the element of the ductility of infringement skin member 12.Preferred Si concentration is 1 quality % or littler, and Fe concentration is 1 quality % or littler, and Cu concentration is 0.5 quality % or littler, and Mn concentration is 2 quality % or littler.More preferably Si concentration is 0.6 quality % or littler, and Fe concentration is 0.7 quality % or littler, and Cu concentration is 0.2 quality % or littler, and Mn concentration is 1.2 quality % or littler.
Except that above-mentioned, can example Zn as the element of infringement skin member 12.Preferred Zn concentration is 0.5 quality % or littler.The other impurity that is different from Al and Zn, for example, Cr, Ti or the like, preferably their total concn is 0.3 quality % or littler.Especially preferred Zn concentration is 0.1 quality % or littler, and the total concn that especially preferably is different from the element of Al and Zn is 0.15 quality % or littler.
In above-mentioned element, Mn has the surface treatment characteristics that improves the effect of splitting resistance (being difficult to cracking) in rolling back and do not sacrifice composite component 10 for example anodizing or conversion processing.Even in the unimpaired scope of composite component, comprise Mn, more specifically fall into the scope of the scope of 0.002 to 1.2 quality % with protection ductility though preferred Mn content is less, still can obtain above-mentioned effect in Mn concentration.Only consider the ductility of skin member 12, preferred Mn concentration is 0.05 quality % or littler.Under the preferential situation of surperficial splitting resistance, preferred Mn concentration is 0.3 to 1.2 quality %.
In composite component according to the present invention, the fraction of coverage of skin member is provided by following formula: fraction of coverage (%)=(thickness of skin member/compound member thickness) * 100%.Though fraction of coverage is unrestricted, preferably the fraction of coverage in a side is 1 to 15%.If it is fraction of coverage is less than 1%, not enough and when composite rolling, prevent the weak effect that the rimose edge occurs as the processibility of composite component 10.On the other hand, if fraction of coverage is 15%, processibility can strengthen comprehensively, and therefore setting fraction of coverage is nugatory above 15%.In addition, the thermal expansivity of skin member 12 is greater than core component, and therefore, if fraction of coverage surpasses 15%, the thermal expansivity of composite component also will increase.More preferably the fraction of coverage of each side is 5 to 10%.
Though the thickness of composite component 10 without limits, owing to can form it into thin plate with thickness of 0.1 to 5mm owing to the processibility of the improvement of the skin member that covers.Thin plate with above-mentioned thickness can be widely used for various application, for example, be used for printed circuit board (PCB) aluminium base, for example thermal shocking absorption component, the structural unit of IGBT (insulated gate bipolar transistor) for example are used to that the shell or the framework of various thermogenesis electronic components is installed or need alleviate other part or element owing to the problem of thermal expansion to be used for power component.Using under the situation of composite component 10 as substrate 2, especially preferred thickness is 0.5 to 4mm.
In addition, the skin member has improved surface treatment characteristics than core component, so its binding property about anodized coating and/or conversion coating is good.For this reason, in above-mentioned application, can also carry out surface treatment if desired.
Manufacture method according to composite component of the present invention is unrestricted.For example, can identical method make composite component 10 by the method that is used for known composite component.For example, by any known method for example cast, rolling and/or extruding makes its each raw material plate that has the raw material plate that is used for core component of predetermined composition and be used for the skin member, make these plates stand composite rolling then, if necessary be rolled into preset thickness then to be engaged with each other.In this case, because it is by rolling manufacturing, so can make large-sized composite component.Can also by coextrusion engage pressure core component material and skin construction material or by the tabular skin member fusion bond that will make respectively to core component simultaneously by composite casting casting core component and if necessary rollingly be preset thickness, make composite component 10.
As shown in Figure 1, printed circuit board (PCB) 1 according to the present invention comprises above-mentioned composite component substrate 10, is laminated to the insulation layer 3 on this aluminium base 10, is laminated to the Copper Foil as conductive layer 4 of the predetermined shape on the insulation layer 3.In this printed circuit board (PCB) 1, because the thermal expansivity of aluminium base 10 is low, the difference of the thermal expansivity of the thermal expansivity of aluminium base 10 and conductive layer 4 is little.Therefore, even the thermogravimetric that produces attached to the electronic component on the conductive layer 45 is added with hot and cold but, have warpage seldom, this has suppressed to occur cracking successively in scolder 6.
Can make insulation layer 3 by the insulating material that can directly or indirectly join composite component 10 to.The insulating resin mixture (composite) of particularly, can the example insulating resin or wherein having mixed heat-conducting filler in insulating resin is as insulating layer material.Such resin base insulation layer is good for the connectivity of aluminium base 2 and conductive layer 3, and more fragile than not with ceramic phase, and makes the large-sized substrate of manufacturing become possibility.It should be noted that in the present invention the material of insulation layer 3 is not limited to above-mentioned insulating resin or above-mentioned insulating resin mixture, and can be for example pottery.Under the situation of pottery, can use tackiness agent to join it to composite component 10.
The thermal resistance of insulating resin is good, and thermal expansivity is little, can be adhered to composite component 10, and excellent in adhesiveness.Resins, epoxy and polyimide resin can be used as the example of the such resin that has satisfied these conditions.Because particularly with its excellent in adhesiveness of Copper Foil, water absorbability is low, cost is low, and recommends Resins, epoxy.Because its chemical resistant properties is good, little along the thermal expansivity of thickness direction, can suppress deformation, and recommend polyimide resin.
In addition, by using the insulating resin mixture that has wherein mixed heat-conducting filler in insulating resin, can improve the thermal conductance of insulation layer, it can improve radiance successively.Preferred heat-conducting filler is the isolator of high thermal conductance and by metal oxide or metal nitride manufacturing.Particularly, SiO
2, Al
2O
3, BeO, MgO, Si
3N
4, BN and AlN can be used as example.Can be independently or with its any these heat-conducting filler that is used in combination.When the concentration in mixture increases, heat-conducting filler increased insulation layer 3 thermal conductance.Preferred concentration is 40 to 90 volume %.If it is less than 40 volume %, thermal conductance improve weak effect.On the other hand, if it surpasses 90 volume %,, cause the deterioration of radiance with the bounding force deterioration of flat tube.More preferably concentration is 60 to 80 volume %.The particle diameter of preferred heat-conducting filler is 10 to 40 μ m.
In each of above-mentioned two types insulation layer 3, thickness is preferably 0.01 to 0.5mm.
Can by any currently known methods for example hot pressing realize the joint of above-mentioned composite component 10, insulation layer 3 and conductive layer 4.
For example, under the situation of using thermosetting (thermosettimg) resin as the insulating resin that is used for insulation layer 3, following method can be used as example.That is, stacked conductive layer 4, insulation layer 3 and composite component 10.Then, press (pinch) its each upper and lower surface by stainless steel plate and pass through the heating of pad member pressure.This hot pressing has caused the sclerosis of insulation layer 3 and has joined insulation layer 3 to composite component 10 and conductive layer 4, has caused its integration (integration).Under the situation of a part that conductive layer 4 is joined to insulation layer 3, use strongback and backboard to engage.That is, conductive layer 4 joined on the strongback and the backboard in the hole by having corresponding conductive layer 4 is arranged on the insulation layer 3, be set to then on the composite component 10.Then, press by stainless steel plate and by cushion material pressure heating.Therefore, conductive layer 4 is joined to the predetermined position of insulation layer 3.Copper coin, Copper Foil and copper coating can be used as the example of the copper that is used for conductive layer.
For increasing the bond strength between composite component 10 and the insulation layer 3, also preferably on the surface of composite component 10, form anodized coating.In this case, insulating resin enters into the hole of anodized coating, and (anchoreffect) caused high bond strength owing to the grappling effect.The type of coating is unrestricted, and the coating that phosphatization (phosphate) is handled or vitriolization produces can be used as example.Strengthened surface treatment characteristics by the skin member, therefore about the excellent in adhesiveness of anodized coating according to composite component of the present invention.
Example
Alloy B in the Al-Si alloy shown in the table 1 has been shown to trim thing (balance) composition of J in table 2.Use as the Al-Si alloy B of core component material to shown in J and the table 3 as in the composition manufacturing table 4 of skin member as an example shown in 1 to 23 with table 5 in the composite component shown in the example 1 to 7 as a comparison.
For the core component material, make base by multiple mould (book mold), made base stand soak in 10 hours to handle (soaking treatment) air cooling then by holding it in 490 ± 10 ℃.In addition, form it into the thickness of 15mm to obtain the core component raw material plate thus by carrying out the face cutting.For the skin construction material, be used for the raw material plate of skin member by the manufacturing of pressure rolling base.About being used for the raw material plate of skin member, prepared three types different raw material plate of thickness, i.e. 2mm (10.5% fraction of coverage), 1.5mm (8.3% fraction of coverage), 0.5mm (3.1% fraction of coverage).
Then, on two surfaces of the raw material plate that is used for core component, be provided for the raw material plate of skin member, heated 2 hours down at 500 ℃, become 9mm so that about 2 to 10% rolling draft (rollingreduction) is rolling up to its thickness then, and further become 3mm up to its thickness so that about 10 to 20% rolling draft is rolling.In addition, cold rolling becomes 1mm to make composite component 10 as shown in Figure 2 thus up to its thickness.The alloy symbol of core component and skin member and the fraction of coverage of a side have been shown in table 4 and table 5.
In comparative example 8 to 12, individually core component is rolled down to the thickness of 1mm.
Measure and with independent the core component relatively thermal expansivity and the thermal conductance of each composite component.
The thermal expansivity and the thermal conductivity of the independent core component shown in table 4 and the table 5 are drawn from table 1.
Test and estimate the processibility and the surface treatment characteristics of each composite component by the following method.Evaluation result is concentrated in table 4 and table 5 and is illustrated.
(processibility)
It is estimated based on following standard, the length (from the rimose edge length of side) at the rimose edge that the side edge of the width of covering material produces when relying on composite rolling.
◎: 2mm or littler
Zero: 2mm or more than, but less than 4mm
△: 4mm or more than, but less than 7mm
*: 7mm or more than
(surface treatment characteristics-anodizing)
Make composite component the sulfuration (sulfate) bath at 1.5A/dm
2Current density, 20 ℃, stand anodizing under the 15V/V% to form the film of 1 μ m thickness thus.Then, the anodic oxide coating of formation is amplified 100 times under opticmicroscope, and has calculated the square interior pit number of visual field of 10mm.The surface treatment characteristics that can estimate less pit is more excellent.
◎: 3 pits or still less
Zero: 4 to 10 pit
*: 11 pits or more
Table 2 core component composition
| Alloy | Core component composition (quality %) trim thing: Al | ||||||||||
| Si | Fe | Ni | Cu | Ti | Cr | P | B | Mn | Mg | Zn | |
| B: compare |
3 | 0.1 | 0.01 | 0.2 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
| C: |
5 | 0.1 | 0.01 | 0.2 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
| |
10 | 0.1 | 0.01 | 0.2 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
| E: invention composition | 15 | 0.1 | 0.01 | 0.2 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
| F: invention composition | 20 | 0.1 | 0.01 | 0.2 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
| G: invention composition | 25 | 0.1 | 0.01 | 0.2 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
| H: invention composition | 27 | 0.2 | 0.01 | 0.2 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
| I: invention composition | 30 | 0.2 | 0.01 | 0.3 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
| J: compare composition | 40 | 0.1 | 0.01 | 0.2 | 0.01 | 0.01 | 0.005 | 0.01 | 0.01 | 0.01 | 0.01 |
Table 3 skin member
| The skin member | Skin member composition (quality %) trim thing: Al | ||||||
| Al | Si | Fe | Cu | Mn | Zn | Or the like | |
| A: invention composition | 99.1 | 0.12 | 0.44 | 0.02 | 0.01 | 0.01 | 0.3 |
| B: invention composition | 99.6 | 0.08 | 0.23 | 0.01 | 0.01 | 0.01 | 0.05 |
| C: invention composition | 98.45 | 0.2 | 0.2 | 0.05 | 1.0 | 0.05 | 0.05 |
| D: compare composition | 97.5 | 0.8 | 0.8 | 0.5 | 0.1 | 0.2 | 0.1 |
Table 4 composite component (example)
| Core component (): Si amount | Skin member note 1) | The fraction of coverage of skin member (%) | Thermal expansivity [* 10 -6/K] | Thermal conductance [W/ (mK)] | Processibility | Surface treatment characteristics | ||||
| Core component | Composite component | Core component | Composite component | |||||||
| Example | 1 | C(5) | b | 10.5 | 22.1 | 22.4 | 231.4 | 229.0 | ◎ | ◎ |
| 2 | D(10) | b | 10.5 | 20.8 | 21.4 | 225.1 | 224.0 | ◎ | ◎ | |
| 3 | E(15) | b | 10.5 | 19.6 | 20.4 | 218.1 | 218.5 | ◎ | ◎ | |
| 4 | F(20) | b | 10.5 | 18.5 | 19.6 | 218.9 | 219.1 | ◎ | ◎ | |
| 5 | G(25) | b | 10.5 | 17.4 | 18.7 | 212.9 | 214.4 | ◎ | ◎ | |
| 6 | H(27) | b | 10.5 | 17.0 | 18.4 | 207.1 | 209.8 | ◎ | ◎ | |
| 7 | I(30) | b | 10.5 | 16.5 | 18.0 | 201.6 | 205.5 | ◎ | ◎ | |
| 8 | E(15) | a | 10.5 | 19.6 | 20.5 | 218.1 | 220.6 | ◎ | ○ | |
| 9 | F(20) | a | 10.5 | 18.5 | 19.7 | 218.9 | 221.2 | ◎ | ○ | |
| 10 | G(25) | a | 10.5 | 17.4 | 18.8 | 212.9 | 216.5 | ◎ | ○ | |
| 11 | H(27) | a | 10.5 | 17.0 | 18.5 | 207.1 | 211.9 | ◎ | ○ | |
| 12 | E(15) | c | 10.5 | 19.6 | 20.4 | 218.1 | 212.2 | ○ | ○ | |
| 13 | F(20) | c | 10.5 | 18.5 | 19.5 | 218.9 | 212.8 | ○ | ○ | |
| 14 | G(25) | c | 10.5 | 17.4 | 18.6 | 212.9 | 208.1 | ○ | ○ | |
| 15 | H(27) | c | 10.5 | 17.0 | 18.3 | 207.1 | 203.5 | ○ | ○ | |
| 16 | E(15) | b | 8.3 | 19.6 | 20.3 | 218.1 | 218.4 | ◎ | ◎ | |
| 17 | F(20) | b | 8.3 | 18.5 | 19.3 | 218.9 | 219.1 | ◎ | ◎ | |
| 18 | G(25) | b | 8.3 | 17.4 | 18.4 | 212.9 | 214.1 | ◎ | ◎ | |
| 19 | H(27) | b | 8.3 | 17.0 | 18.1 | 207.1 | 209.2 | ◎ | ◎ | |
| 20 | E(15) | b | 3.1 | 19.6 | 19.8 | 218.1 | 218.2 | ◎ | ◎ | |
| 21 | F(20) | b | 3.1 | 18.5 | 18.8 | 218.9 | 219.0 | ◎ | ◎ | |
| 22 | G(25) | b | 3.1 | 17.4 | 17.8 | 212.9 | 213.3 | ◎ | ◎ | |
| 23 | H(27) | b | 3.1 | 17.0 | 17.4 | 207.1 | 207.9 | ◎ | ◎ | |
Note 1) a:Al concentration 98 quality % or above, b:Al concentration 99 quality % or above, c: add Mn
Table 5 composite component (comparative example)
Note 1) a:Al concentration 98 quality % or above, b:Al concentration 99 quality % or above, c: add Mn, d:Al concentration less than 98 quality %
According to the result shown in the table 4, the processibility that is appreciated that the composite component of each example is better than independently core component and it can be manufactured thin plate.In addition, kept the low thermal coefficient of expansion of core component, so it is the aluminium sheet of low-thermal-expansion most ofly.In addition, by regulating the foreign matter content in the core component, thermal conductance is also high.No.8 to 12 compares with comparative example, because the covering of skin member, surface treatment characteristics is enhanced than independent core component.
On the other hand, because the thermal expansivity height of comparative example 1 core component, it can not be used for the low composite component of thermal expansion.Because the Si content of the core component of comparative example 2 is too much, even it is also not enough to have covered skin member processibility.Shown in comparative example 8 to 12,, it rollingly also can produced the rimose edge when the thin plate even use identical core component.In addition, shown in comparative example 3 to 7, even use Al concentration less than the aluminium of 98 quality % as the skin member, still not enough for the composite component processibility, and can not produce good composite component.
Industrial usability
According to the low and excellent processability of composite component thermal expansion of the present invention.Therefore, can form thin plate.Can be extensive use of composite component as construction material, for example, because the aluminium base that is used for printed circuit board (PCB) that thermal expansion has problems.
Though the present invention can be included in many different forms, but many exemplary embodiments have here been described, should be appreciated that simultaneously with the disclosure should be thought of as example that principle of the present invention is provided and such example be not intended to limit the invention to wherein describe and/or the preferred embodiment of example wherein.
Though described exemplary embodiment of the present invention here, but the present invention is not limited to wherein described various preferred embodiments, but comprise that those skilled in the art recognize based on the disclosure have element of equal value, modification, omission, combination (for example crossing over the aspect of various embodiment), any and all embodiment of accommodation and/or alternate.Broadly explain the restriction in the claim and be not limited in this specification sheets or at the described example of Period of Litigation of application, the example will be interpreted as non-exclusive based on employed language in the claim.For example, in the disclosure, term " preferably " is non-exclusive and means " preferred, but be not limited to ".Period of Litigation in the disclosure and application, to only adopt parts (means) to add function or step and add the function restriction, wherein, in this restriction, have all following conditions for the restriction of concrete claim: a) clearly state " be used for ... parts " or " be used for ... step "; B) clearly state correlation function; And c) do not state structure, material or realize the details of this structure.In the Period of Litigation of the disclosure and this application, use term " the present invention " and " invention " as reference to one or more aspects in the disclosure.Language the present invention or invention should be interpreted as the discriminating of criticality irrelevantly, should be interpreted as being applied to all aspects and embodiment (promptly should be understood the present invention and have many aspects and embodiment) by inappropriate, should be by inappropriate scope that be interpreted as restriction application or claim.At the Period of Litigation of the disclosure and this application, term " embodiment " can be used for describing any aspect, feature, method or step, its any combination and/or its any part, or the like.In some instances, various embodiment comprise the eclipsed feature.In the lawsuit process of the disclosure and this case, adopt following breviary term: " for example mean; " " e.g. " and mean " NB " of " attention ".
Claims (13)
1. composite component comprises core component and covers skin member on the both sides of described core component,
Wherein said core component is made of aluminium alloy, and described aluminium alloy comprises that Si:5 is aluminium and impurity to 30 quality % and trim thing, and
Wherein said skin member is made of aluminum or aluminum alloy, and described aluminium alloy comprises that Al:98 quality % or above and trim thing are impurity.
2. according to the composite component of claim 1, wherein, in the described aluminium alloy that constitutes described core component, Fe concentration is that 1 quality % or littler and Ni concentration are 1 quality % or littler.
3. according to the composite component of claim 1, wherein, in the described aluminium alloy that constitutes described core component, Cu concentration is 0.5 quality % or littler, Ti concentration is 0.3 quality % or littler, Cr concentration is 0.3 quality % or littler, and P concentration is 0.1 quality % or littler, and B concentration is 0.05 quality % or littler.
4. according to the composite component of claim 1, wherein, in the described aluminium alloy that constitutes described core component, Mn concentration is 0.2 quality % or littler, and Mg concentration is 0.2 quality % or littler, and Zn concentration is 0.2 quality % or littler.
5. according to the composite component of claim 1, wherein, in the described aluminium or described aluminium alloy that constitute described skin member, Si concentration is 1 quality % or littler, Fe concentration is 1 quality % or littler, and Cu concentration is 0.5 quality % or littler, and Mn concentration is 2 quality % or littler.
6. according to the composite component of claim 5, wherein, described Mn concentration is 0.002 to 1.2 quality %.
7. according to the composite component of claim 5, wherein, in the described aluminium or described aluminium alloy that constitute described skin member, Zn concentration is 0.5 quality % or littler, and the total concn of the element except that Al and Zn is 0.3 quality % or littler.
8. according to the composite component of claim 1, the fraction of coverage of wherein said skin member is each surface 1 to 15%.
9. according to the composite component of claim 1, the thickness of wherein said composite component is 0.1 to 5mm.
10. the manufacture method of a composite component may further comprise the steps:
By comprising that Si:5 is that being provided with by aluminium or Al concentration on two surfaces of plate of aluminium alloy manufacturing of Al and impurity is 98% or the plate made of the aluminium alloy above, that the trim thing is impurity to 30 quality %, trim thing; And
Described each plate of composite rolling is with engage pressure.
11. a printed circuit board (PCB) comprises:
Aluminium base is by comprising core component and the composite component manufacturing that covers two lip-deep skin members of core material;
Insulation layer is laminated on the described aluminium base; And
The copper conductive layer is laminated on the described insulation layer,
The described core component of wherein said composite component is by the aluminium alloy manufacturing, and described aluminium alloy comprises that Si:5 is Al and impurity to 30 quality % and residuum, and
Wherein said skin member is by the aluminum or aluminum alloy manufacturing, and described aluminium alloy comprises Al:98 quality % or above and trim thing is an impurity.
12. according to the printed circuit board (PCB) of claim 11, wherein said insulation layer comprises insulating resin or wherein mixed the insulating resin mixture of heat-conducting filler in insulating resin.
13., also be included in the lip-deep anodic oxide coating of described aluminium base according to the printed circuit board (PCB) of claim 11.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP132493/2005 | 2005-04-28 | ||
| JP2005132493 | 2005-04-28 | ||
| US60/679,667 | 2005-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101163805A true CN101163805A (en) | 2008-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800135055A Pending CN101163805A (en) | 2005-04-28 | 2006-04-28 | Clad member and printed-circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN101163805A (en) |
| TW (1) | TW200706658A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104203448A (en) * | 2012-03-23 | 2014-12-10 | 郡是株式会社 | Method for producing composite member |
| CN106413978A (en) * | 2014-05-15 | 2017-02-15 | 蒂森克虏伯钢铁欧洲股份公司 | Construction element |
| CN111270108A (en) * | 2020-03-27 | 2020-06-12 | 江苏鼎胜新能源材料股份有限公司 | Novel alloy high-strength PCB aluminum substrate aluminum material and preparation method thereof |
| CN114286494A (en) * | 2020-09-27 | 2022-04-05 | 华为技术有限公司 | PCB structure, manufacturing method thereof and electronic equipment |
-
2006
- 2006-04-28 TW TW095115332A patent/TW200706658A/en unknown
- 2006-04-28 CN CNA2006800135055A patent/CN101163805A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104203448A (en) * | 2012-03-23 | 2014-12-10 | 郡是株式会社 | Method for producing composite member |
| CN104203448B (en) * | 2012-03-23 | 2016-06-08 | 郡是株式会社 | The manufacture method of composite component |
| CN106413978A (en) * | 2014-05-15 | 2017-02-15 | 蒂森克虏伯钢铁欧洲股份公司 | Construction element |
| CN106413978B (en) * | 2014-05-15 | 2020-04-07 | 蒂森克虏伯钢铁欧洲股份公司 | Component |
| CN111270108A (en) * | 2020-03-27 | 2020-06-12 | 江苏鼎胜新能源材料股份有限公司 | Novel alloy high-strength PCB aluminum substrate aluminum material and preparation method thereof |
| CN114286494A (en) * | 2020-09-27 | 2022-04-05 | 华为技术有限公司 | PCB structure, manufacturing method thereof and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200706658A (en) | 2007-02-16 |
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