TW200706658A - Clad member and printed-circuit board - Google Patents

Clad member and printed-circuit board

Info

Publication number
TW200706658A
TW200706658A TW095115332A TW95115332A TW200706658A TW 200706658 A TW200706658 A TW 200706658A TW 095115332 A TW095115332 A TW 095115332A TW 95115332 A TW95115332 A TW 95115332A TW 200706658 A TW200706658 A TW 200706658A
Authority
TW
Taiwan
Prior art keywords
printed
circuit board
clad member
aluminum alloy
clad
Prior art date
Application number
TW095115332A
Other languages
Chinese (zh)
Inventor
Ichiro Iwai
Kazuo Kimura
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200706658A publication Critical patent/TW200706658A/en

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

A clad member low in thermal expansion coefficient and excellent in workability is provided. The clad member 1 comprises a core member 11 and skin members 12 cladded on both sides of the core member. The core member 11 is constituted by an aluminum alloy consisting of Si: 5 to 30 mass%, and the balance being aluminum alloy and impurities. The skin member 12 is constituted by aluminum or an aluminum alloy consisting of Al: 98 mass% or above, and the balance being impurities.
TW095115332A 2005-04-28 2006-04-28 Clad member and printed-circuit board TW200706658A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005132493 2005-04-28
US67966705P 2005-05-11 2005-05-11

Publications (1)

Publication Number Publication Date
TW200706658A true TW200706658A (en) 2007-02-16

Family

ID=39298247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115332A TW200706658A (en) 2005-04-28 2006-04-28 Clad member and printed-circuit board

Country Status (2)

Country Link
CN (1) CN101163805A (en)
TW (1) TW200706658A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5909823B2 (en) * 2012-03-23 2016-04-27 グンゼ株式会社 Manufacturing method of composite member
DE102014007066B3 (en) * 2014-05-15 2015-01-29 Thyssenkrupp Ag Component and fusion welded construction
CN111270108B (en) * 2020-03-27 2021-08-24 江苏鼎胜新能源材料股份有限公司 Novel alloy high-strength PCB aluminum substrate aluminum material and preparation method thereof
CN114286494A (en) * 2020-09-27 2022-04-05 华为技术有限公司 PCB structure, manufacturing method thereof and electronic equipment

Also Published As

Publication number Publication date
CN101163805A (en) 2008-04-16

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