TW200706658A - Clad member and printed-circuit board - Google Patents
Clad member and printed-circuit boardInfo
- Publication number
- TW200706658A TW200706658A TW095115332A TW95115332A TW200706658A TW 200706658 A TW200706658 A TW 200706658A TW 095115332 A TW095115332 A TW 095115332A TW 95115332 A TW95115332 A TW 95115332A TW 200706658 A TW200706658 A TW 200706658A
- Authority
- TW
- Taiwan
- Prior art keywords
- printed
- circuit board
- clad member
- aluminum alloy
- clad
- Prior art date
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
A clad member low in thermal expansion coefficient and excellent in workability is provided. The clad member 1 comprises a core member 11 and skin members 12 cladded on both sides of the core member. The core member 11 is constituted by an aluminum alloy consisting of Si: 5 to 30 mass%, and the balance being aluminum alloy and impurities. The skin member 12 is constituted by aluminum or an aluminum alloy consisting of Al: 98 mass% or above, and the balance being impurities.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005132493 | 2005-04-28 | ||
US67966705P | 2005-05-11 | 2005-05-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200706658A true TW200706658A (en) | 2007-02-16 |
Family
ID=39298247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095115332A TW200706658A (en) | 2005-04-28 | 2006-04-28 | Clad member and printed-circuit board |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101163805A (en) |
TW (1) | TW200706658A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5909823B2 (en) * | 2012-03-23 | 2016-04-27 | グンゼ株式会社 | Manufacturing method of composite member |
DE102014007066B3 (en) * | 2014-05-15 | 2015-01-29 | Thyssenkrupp Ag | Component and fusion welded construction |
CN111270108B (en) * | 2020-03-27 | 2021-08-24 | 江苏鼎胜新能源材料股份有限公司 | Novel alloy high-strength PCB aluminum substrate aluminum material and preparation method thereof |
CN114286494A (en) * | 2020-09-27 | 2022-04-05 | 华为技术有限公司 | PCB structure, manufacturing method thereof and electronic equipment |
-
2006
- 2006-04-28 CN CNA2006800135055A patent/CN101163805A/en active Pending
- 2006-04-28 TW TW095115332A patent/TW200706658A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN101163805A (en) | 2008-04-16 |
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