CN101160531A

CN101160531A - Contact probe for a testing head having vertical probes for semiconductor integrated electronic devices

Info

Publication number: CN101160531A
Application number: CN200580049441.XA
Authority: CN
Inventors: 朱塞帕·克里帕; 斯特法诺·费利奇
Original assignee: EXPLORATION OF TECHNOLOGY Co Ltd
Current assignee: EXPLORATION OF TECHNOLOGY Co Ltd
Priority date: 2005-04-12
Filing date: 2005-04-12
Publication date: 2008-04-09
Also published as: AT504288A1; JP2008536141A; AT504288A5; CZ2007783A3; WO2006109328A1; AT504288B1

Abstract

A contact probe (20) for a tasting head is described, of the type wherein a plurality of these probes are inserted in guide holes realised in respective dies, the probe comprising a rod-shaped body (21) equipped at an end with at least a contact tip (22) effective to ensure the mechanical and electrical contact with a corresponding contact pad of an integrated electronic device to be tested. Advantageously, the rod-shaped body (21) has a non uniform cross section. Moreover, a testing head and a method for obtaining the contact probe according to the invention are described.

Description

Be used to have the contact probe of the measuring head of the Vertrical probe that semiconductor-integrated electronic device uses

Technical field

The present invention relates to a kind of contact probe that is used to have the measuring head of Vertrical probe, but described Vertrical probe Validity Test comprises a plurality of semiconductor-integrated electronic devices of a plurality of so-called contact chips.

More particularly, the present invention relates to a kind of contact probe that is used for such one type measuring head, in such measuring head, a plurality of probes are inserted in the guide hole that forms in corresponding tabular keeper or the plate, this probe comprises the shape body that at one end is equipped with at least one contact, and this contact can effectively be guaranteed with the Mechanical Contact of the corresponding contact chip of integrated electronic device to be tested and electrically contact.

The invention still further relates to a kind of method of obtaining this contact probe and comprising the measuring head of a plurality of described probes of being used to.

The present invention specifically but not exclusively relate to a kind of measuring head, this measuring head has Vertrical probe with the measuring semiconductor integrated electronic device, only is described with reference to this application for convenience of description below.

Background technology

As is known, measuring head comes down to a kind of like this device, and it can be used for a plurality of contact chips of semiconductor-integrated electronic device are electrically connected with the respective channel of the tester that this semiconductor-integrated electronic device is tested.

Detection and the isolation that the inferior device that has occurred in manufacturing step is carried out is provided in the test of carrying out on the integrated electronic device.Therefore before cutting was integrated in the electronic installation on semiconductor wafer or the silicon wafer and is assembled in them in the Chip Packaging, the use test head carried out electrical testing to described electronic installation so usually.

Thereby the measuring head with Vertrical probe comprises at least one pair of location that is separated from each other and keeps the parallel-plate or the tabular keeper of air gap, and a plurality of suitable moving contacting element.

Each plate that is called plate (die) in correlative technology field and following description is equipped with corresponding a plurality of perforation guide hole, each hole of plate is corresponding with the hole of another plate, wherein, each contact element or contact probe (element is alleg in following description and claim afterwards as described) are by sliding joint and guiding.Contact probe generally includes the lead of being made by the special alloy of electrical property and satisfactory mechanical property.

By each contact probe is pressed on the corresponding contact chip, make elastic bending in the air gap of mobile contact probe between two plates, thereby the good electrical between the contact chip of the probe of guaranteeing measuring head and integrated electronic device to be tested is connected.

These measuring heads usually in English term be called " Vertrical probe ".

In fact, known measuring head has the air gap that probe bends therein, and the suitable configurations by probe self or its plate helps this bending, as Fig. 1 schematically shows.

In this Fig. 1, measuring head 1 comprises upper sheet space 2 and lower sheet space 3 at least, and corresponding the going up that upper sheet space 2 and lower sheet space 3 have for contact probe 6 sliding joint connects guide hole 4 and connect guide hole 5 down.

Contact probe 6 has contravention or contact 7 at least.Specifically, contact chip 8 Mechanical Contact of contact 7 and integrated electronic device to be tested, described integrated electronic device and testing apparatus (not shown) electrically contact simultaneously, and this measuring head is the final element of described testing apparatus.

Upper sheet space 2 and lower sheet space 3 spaced apart air gaps 9, thus allow contact probe 6 during the measuring head normal running, promptly deform when integrated electronic device to be tested contacts or tilt at this measuring head.And the size of last guide hole 4 and following guide hole 5 is decided to be guiding contact probe 6.

Fig. 1 represents measuring head 1, this measuring head 1 has the probe that do not stop (promptly, can be on corresponding slip in guide hole 4 and the following guide hole 5), described probe is associated with little bow strip that schematically shows with mark 10 or space transformer (space transformer).

In this case, contact probe 6 has another contact towards a plurality of contact chips 11 of space transformer 10, similar with contacting of integrated electronic device to be tested, by guaranteeing the excellent electric contact between probe and the space transformer 10 on the contact chip 11 that probe 6 is pressed to space transformer 10.

Specifically, according to the technology that is called Cobra, contact chip 6 has the structure of predeformation, wherein, as Fig. 2 schematically shows, between end that contacts with the contact chip 11 of space transformer 10 and the contact 7 on the contact chip 8 at integrated electronic device to be tested, offset d is arranged.

It is correct crooked in its operating period (promptly with integrated electronic device period of contact to be tested) that this pre-deformed configuration helps probe 6, and measuring head 1 not with also be like this under the situation that integrated electronic device to be tested contacts.

In addition, be inserted with the thin flexible insulating material film of usually making with polyimide 12 between upper sheet space 2 and lower sheet space 3, it can be during number of assembling steps remains on the appropriate location with the upper end of contact probe 6.

Specifically, the number of assembling steps of the measuring head of realizing according to the Cobra technology 1 is accurate especially.It may further comprise the steps:

-be schematically shown as Fig. 3, with each contact probe 6 in the respective side of contact 7 is inserted into hole the lower sheet space 3;

-be schematically shown as Fig. 4, the other end of contact probe 6 is pushed in the suitable flexible material film 12 of having holed gently, it is kept and the risk of not deviating from from this material membrane 12 by this material membrane 12, and

-in case as mentioned above all contact probes 6 are inserted flexible material film 12, just be applied with plate 2, utilize good technical that all contact probes 6 are centered in the corresponding aperture of realizing in the upper sheet space 2, be schematically shown as Fig. 5.

Consuming time very long according to desired this assembling mode of probe that the Cobra technology realizes, and have the risk that probe deformations may take place, and all very unstable when locking by upper sheet space 2.

In addition, during the normal running of measuring head 1, the risk that between flexible material film 12 and contact probe 6, has mechanical interference, this is because this film 12 finishes it after during the number of assembling steps end of probe 6 being remained on the task of appropriate location, still retaining clip is in measuring head 1, thereby mainly for having the large scale measuring head of a large amount of probes that gather, this film 12 brings serious problems can for the slip of probe self.

So-called by utilizing " Displacement plate " technology that also is well known that realizes measuring head, is schematically shown as Fig. 6, represents measuring head 1 components identical of 26S Proteasome Structure and Function and Fig. 1 here with identical Reference numeral.

In this case, contact probe 6 does not have preform, but realizes that with straight form it has the round section that all equates on its whole length, and to locate in the end be sharp substantially.

In order to realize the proper operation of contact probe 6, upper sheet space 2 and lower sheet space 3 be suitably displacement each other, to allow probe 6 preferably along the equidirectional bending.

Assembling according to the probe 6 in the measuring head of shifted plate technology realization is very rapidly simple, and does not need to use any flexible material film.Specifically, thereby upper sheet space 2 and lower sheet space 3 alignings are also aimed at corresponding guide hole 4 and 5, then contact probe 6 is inserted guide holes 4 and 5, the suitable amount that betwixt plate is shifted is in position just enough with the plate retaining then.

Yet this technology also has some shortcomings, specifically:

-be difficult to contact probe 6 is remained in their housing, promptly remain in the plate guide hole.In fact, although upper sheet space 2 and relative displacement between the lower sheet space 3 cause the friction between contact probe 6 and the corresponding guide hole 4 and 5, this friction always is not enough to probe is remained on the appropriate location.

Specifically, during the maintenance and clean operation of measuring head 1, the risk that contact probe 6 is deviate from is much higher, and these operations are normally undertaken by air blast or ultrasound wave, and thereby on contact probe 6, produce mechanical stress, can promote contact probe 6 to deviate from from guide hole.

-owing to make the round section of the lead of contact probe 6, thus the distance between two adjacent probe of measuring head 1 is limited.

Specifically, measuring head between two adjacent probe, and thereby center at two contact chips of integrated electronic device to be tested between have intrinsic distance limit, be known in the industry as english term " spacing ".Specifically, Zui Xiao " spacing " value depends on the geometrical construction and the size of probe.For fear of the contact between the adjacent probe, measuring head 1 must satisfy following relation:

P＞F+G1

Wherein:

P is the distance values of device under test, that is, and and the distance between the center of two adjacent contacts;

 F is the diameter of contact probe 6; And

G1 is two safe distances between the adjacent contact probe 6.

Condition G1=0, promptly safe distance is zero, corresponding to probe collision.

Under the situation of circular probe, be schematically shown as Fig. 7, minimum spacing P1 adds that by the probe diameter  F corresponding with the guide hole diameter thickness G 1 of the wall that two adjacent holes are separated provides.

The current market demand is promoting the more and more finer and close device of design, and thereby the measuring head that need have an increasing contact probe of quantity test these devices, like this, keep the requirement of minor increment distance values to contradict between the probe with the current market demand.

The present invention based on technical matters be to provide a kind of like this contact probe, it has the required minimum spacing of the device under test of effectively reducing, reduces the structure of the risk that contact probe deviates from from guide hole simultaneously.

Summary of the invention

The present invention based on plan plot be to provide a kind of cross section inconstant contact probe, it makes can be easily near probe, and has guaranteed to reduce the risk that probe withdraws from from guide hole simultaneously.

Based on this plan plot, by as mentioned above and the contact probe that in the characteristic of claim 1, limits solved described technical matters.

And by as mentioned above and the measuring head that in the characteristic of claim 7, limits solved described technical matters.

And solved described technical matters in the characteristic of claim 15 by the method that being used to of limiting obtains contact probe.

To know feature and advantage from the following description that only provides with reference to accompanying drawing according to contact probe of the present invention and measuring head to embodiment of the present invention in the mode of indefiniteness embodiment.

Description of drawings

In the accompanying drawing:

Fig. 1 schematically shows first embodiment according to the measuring head of prior art;

Fig. 2 is the synoptic diagram of the measuring head of Fig. 1;

Fig. 3 to Fig. 5 schematically shows the assembly operation of the measuring head of Fig. 1;

Fig. 6 schematically shows the optional embodiment of the measuring head of Fig. 1;

Fig. 7 schematically shows the significant dimensions of the measuring head of Fig. 6;

Fig. 8 A to Fig. 8 D schematically shows first embodiment according to contact probe of the present invention;

Fig. 9 A to Fig. 9 D schematically shows second embodiment according to contact probe of the present invention;

Figure 10 A to Figure 10 D schematically shows the 3rd embodiment according to contact probe of the present invention;

Figure 11 A and Figure 11 B schematically show the details according to measuring head of the present invention;

Figure 12 A and Figure 12 B schematically show according to prior art with according to the structure of measuring head of the present invention;

Figure 13 A and Figure 13 B schematically show be in the different number of assembling steps according to measuring head of the present invention.

Embodiment

With reference to these accompanying drawings especially Fig. 8 A to Fig. 8 D, represent according to contact probe of the present invention with 20.

Contact probe 20 has shape body 21, and shape body 21 is equipped with at least one contravention or contact 22.Specifically, as described in the prior art as seen, the contact chip Mechanical Contact of contact 22 and integrated electronic device to be tested, described integrated electronic device and testing apparatus (not shown) electrically contact simultaneously, and this measuring head is the final element of described testing apparatus.

And, for example having under the situation of the probe that the measuring head that do not stop probe uses at sacrificial vessel, contact probe 20 and little bow strip or space transformer have second contact 23 towards a plurality of contact chips of this space transformer (spacetransformer) relatively.

According to the present invention advantageously, the shape body 21 of contact probe 20 has uneven cross section for its main underlap LL.

Specifically, the shape body 21 of contact probe 20 has 21A of first and second portion 21B at least, and they have profile different section S 1 and S2, as illustrating with magnification ratio among Fig. 8 B.

According to the present invention advantageously, first section S 1 has at least a size bigger than the correspondingly-sized of second section S 2, deviates to prevent the guide hole that contact probe 20 forms from plate, and this will see below better.

Specifically, it may be noted that from Fig. 8 B the longitudinal size X1 of first section S 1 of part 21A is than the big (X1＞X2) of the corresponding longitudinal size X2 of second section S 1.And the longitudinal size Y1 of first section S 1 is than the little (Y1＜Y2) of the corresponding longitudinal size Y2 of second section S 2.

It is also conceivable that the contact probe 20 shown in Fig. 8 C and Fig. 8 D, wherein, with the antithesis ground mutually of the probe shown in Fig. 8 A and Fig. 8 B, near the longitudinal size X1 of first section S 1 of the part 21B the contact is than the little (X1＜X2), and longitudinal size Y1 is than the corresponding longitudinal size Y2 of second section S 2 (Y1＞Y2) greatly of the corresponding longitudinal size X2 of second section S 2.

According to the present invention advantageously, can be based on from the probe that forms in a conventional manner by the round section lead and obtain the uneven contact probe 20 in cross section.It is two different-thickness that the part 21A of the shape body 21 of this round section lead and

contact probe

20 and 21B flatten accordingly, thereby obtains contact probe 20, and it has the first roughly rectangular section S 1 and second section S 2 of band rounded edges.

Can also only accordingly lead be flattened with the part 21A of shape body 21 or a part among the 21B, for example accordingly lead is flattened with the 21A of first, thereby obtain the first square-section S1 of band rounded edges, and the second round section S2, as Fig. 9 A and Fig. 9 B schematically show.Equally can be only accordingly lead be flattened, thereby obtain the second square-section S2 of the first round section S1 and band rounded edges, as Fig. 9 C and Fig. 9 D schematically show with part 21B.

Can obtain the uneven contact probe 20 in cross section according to the present invention based on the probe that has the square-section and its part is flattened equally, thereby obtain to have first section S 1 of rectangle and the contact probe 20 of second section S 2, as Figure 10 A and Figure 10 B and Figure 10 C and Figure 10 D schematically show.

Specifically, the contact 23 corresponding cross sections with towards space transformer of contact probe 20 have such profile, and this profile has a size at least than with big towards the correspondingly-sized of the profile in contact 22 corresponding contact probes 20 cross sections of device under test.

In fact, shown in Figure 10 B, the lateral dimension X1 of first section S 1 is bigger than the lateral dimension X2 of second section S 2, and shown in Figure 10 D, the longitudinal size Y1 of first section S 1 is bigger than the longitudinal size Y2 of second section S 2.

More generally, contact probe 20 according to the present invention has and utilizes arbitrarily but mutually different cross section of plural shape that several current available technology obtain.

In preferred implementation of the present invention, contact probe 20 utilizes the method that may further comprise the steps to obtain:

One provides the lead of the shape body 21 that can effectively realize contact probe 20; And

One makes this lead distortion (for example by flattening) accordingly with at least a

portion

21A or 21B, thereby obtains the profile cross section different with the conductor cross-section profile in this part, so obtains the uneven contact probe 20 in cross section.

And the method according to this invention can comprise the step with the other parts pressing of the shape body 21 of contact probe 20.

According to the present invention advantageously, the uneven contact probe 20 in cross section can solve with probe (this influences known shifted plate vertical technology) relevant problem.

In fact, as seen with reference to the prior art,, provide contact probe usually with the circular guide holes that in plate up and down, forms according to this shifted plate technology.Therefore, these guide holes can not guarantee that contact probe is maintained in the measuring head.Probe is easy to skid off corresponding guide hole, and is particularly all the more so during the clean operation that utilizes the liquid solution cleaning to carry out usually by means of air blast or by ultrasound wave.

According to the present invention advantageously, the uneven contact probe 20 in cross section is with to have differently contoured appropriate well between the upper sheet space 24 of measuring head and lower sheet space 25 relevant, as Figure 11 A and 11B schematically show.Specifically, the hole of lower sheet space 25 has section S F2, the profile of section S F2 is corresponding substantially with the profile of second section S 2 of the second portion 21B of contact probe 20, and the hole of upper sheet space 24 has section S F1, and the combination (union) of the profile of the part 21A of the profile of section S F1 and contact probe 20 and the section S 1 of 21B and S2 is corresponding.

Like this, guaranteed that contact probe 20 is maintained in the plate of the measuring head that comprises these plates and a plurality of contact probe 20.In fact, each contact probe 20 all can not move owing to the hole of lower sheet space 25, and the cross section in described hole has at least a size littler than the correspondingly-sized in the cross section of at least one part 21A of contact probe 20.

In other words, what the measuring head of Huo Deing had a contact probe 20 like this preferably deviates from direction, specifically be to deviate from towards upper sheet space 24 from lower sheet space 25, the guide hole of lower sheet space 24 has prevented any motion in opposite direction, and described guide hole is shaped aptly and to have at least one size littler than the correspondingly-sized of the cross section profile of probe portion 21A.

Obtained measuring head more reliably like this, made to prevent washing and the cleaning that contact probe 20 withdraws from from measuring head self.For this reason, use is just enough towards the air-flow of the lower sheet space 25 promotion contact probes 20 that contact probe can not withdraw from, perhaps, can under the situation of any risk that does not have probe to deviate from, wash and clean along any direction in the both direction by stopping that by means of suitable lid probe deviates from from upper sheet space.

According to the present invention advantageously, the uneven contact probe 20 in cross section can also solve the problem relevant with the assembling of the measuring head that comprises them.

Specifically, with upper sheet space 24 and lower sheet space 24 and corresponding guide hole is overlapping and only by just enough towards the guide hole that lower sheet space 25 has begun to insert contact probe 20 overlapping from upper sheet space 24.

Therefore plate separates about making, and allows contact probe 20 to slide just enough in the guide hole of upper sheet space 24.

Under the situation of upper sheet space 24 and lower sheet space 25 mutual displacements, the plate up and down that is in spaced position is stopped, perhaps before stopping plate, between them, insert partition 26, so just finished according to measuring head assembling of the present invention.

Can find out directly that this package technique ratio is in prior art, for example the package technique of using in the Cobra technology is faster and safer.

In the practice, not only simpler more reliable to the described assembling that the measuring head that comprises the uneven contact probe 20 in a plurality of cross sections carries out, but also significantly reduced the execution time.

At last, according to the present invention advantageously, the uneven contact probe 20 in cross section can solve and the relevant problem of the needed minimum spacing of device under test.

As can be seen from the prior art previously, the minimum pitch value of device under test is subjected to the restriction of actual conditions, that is, the cross section of realizing the lead of contact probe is circular.In fact, under the situation according to the contact probe of existing techniques in realizing, minimum pitch value adds that by the diameter of guide hole the thickness G 1 of two partition walls between the adjacent holes provides, as schematically showing among Figure 12 A.

According to the present invention advantageously, the uneven contact probe 20 in cross section can make minimum spacing reduce, and the amount that reduces equates with decrease in the cross section between the section S 1 of the shape body 21 of contact probe 20 and the S2, as schematically showing among Figure 12 B.

Figure 13 A and Figure 13 B are illustrated in the mode of embodiment and realize in the shifted plate technology and comprise a plurality of measuring heads 30 according to contact probe 20 of the present invention.

Specifically, after assembling contact probe 20 between upper sheet space 24 and lower sheet space 25, make the displacement of these plates allowing the probe bending, as schematically showing by arrow F among the 13A.Like this, contact probe 20 has preferred bending direction.

And, the partition 26 (being expressed as housing or partition sometimes) of alterable height can be set, thereby can correctly be adjusted in the power in the bending step, as schematically showing among Figure 13 B.

In the preferred implementation according to measuring head of the present invention, plate specifically is that lower sheet space 25 comprises very long guide hole at least.These guide holes can obtain by the thickness that increases plate itself, and perhaps the plural thin plate sheet that overlaps each other by use in simpler mode perhaps also can obtain by the plate that uses two extremely thin (thereby being easy to boring) positioned apart.Therefore can obtain the basic to each other long guide hole of aiming at.

Under the situation of shifted plate technology,, can also use the guide hole that obtains by skew boring in order to help contact probe 20 along the preferred orientations bending.And in this case, guide hole can overlap each other or plural plate acquisition positioned apart by use, and its mesopore drills through to offset slightly to each other.

In a word, according to the present invention advantageously, the uneven contact probe 20 in cross section can solve following problem:

The problem that the probe that the known shifted plate vertical technology of-reference is seen is deviate from;

The problem of the assembling that-reference known " Cobra " technology is seen;

-can realize minimum spacing and good electrical contact.

Claims

1. contact probe (20) that is used for measuring head, described measuring head is such one type measuring head, in this measuring head, a plurality of described probes are inserted in the guide hole that forms in corresponding tabular keeper or the plate, described probe comprises the shape body (21) that at one end is equipped with at least one contact (22), this contact (22) can effectively be guaranteed with the Mechanical Contact of the corresponding contact chip of integrated electronic device to be tested and electrically contact, described contact probe (20) is characterised in that described shape body (21) has uneven cross section.

2. contact probe according to claim 1 (20), it is characterized in that, described shape body (21) has first (21A) and second portion (21B), and described first (21A) has different first cross section (S1) of profile and second cross section (S2) with described second portion (21B).

3. contact probe according to claim 2 (20) is characterized in that, described first cross section (S1) has the correspondingly-sized of a size greater than described second cross section (S2) at least.

4. contact probe according to claim 2 (20) is characterized in that, described first cross section (S1) and described second cross section (S2) are for having the rectangle of rounded edges.

5. contact probe according to claim 2 (20) is characterized in that, described first cross section (S1) is circular, and described second cross section (S2) is for having the rectangle of rounded edges.

6. contact probe according to claim 2 (20) is characterized in that, described first cross section (S1) and described second cross section (S2) are rectangle.

7. a measuring head (30), this measuring head (30) is such one type measuring head, promptly this measuring head (30) comprises a plurality of contact probes that are inserted in the guide hole that forms in upper sheet space (24) and the lower sheet space (25), described measuring head (30) is characterised in that described contact probe (20) is according to each formation in the claim 1 to 6.

8. measuring head according to claim 7 (30) is characterized in that, described lower sheet space (25) has hole, cross section (SF2), and the profile in hole, described cross section (SF2) is corresponding substantially with the profile in the cross section (S2) of described contact probe (20).

9. measuring head according to claim 7 (30) is characterized in that, described upper sheet space (24) has hole, cross section (SF1), and the profile in hole, described cross section (SF1) is corresponding with the combination of the profile of the different cross section of described contact probe (20).

10. measuring head according to claim 9 (30) is characterized in that, the described profile in the described cross section (SF1) in described hole is provided by the combination of two rectangular profile that have rounded edges.

11. measuring head according to claim 9 (30) is characterized in that, the described profile in the described cross section (SF1) in described hole is provided by circular contour and the combination that has the rectangular profile of rounded edges.

12. measuring head according to claim 9 (30) is characterized in that, the described profile in the described cross section (SF1) in described hole is provided by the combination of two rectangular profile.

13. measuring head according to claim 7 (30) is characterized in that, described upper sheet space (24) and described lower sheet space (25) stagger each other aptly.

14. measuring head according to claim 7 (30) is characterized in that, this measuring head (30) is included in the partition (26) between described upper sheet space (24) and the described lower sheet space (25).

15. a method that is used to obtain the uneven contact probe in cross section (20), this method may further comprise the steps:

-lead with predetermined profile cross section of the shape body (21) that can effectively realize described contact probe (20) is provided; And

-make described lead and described shape body (21) at least a portion (21A, 21B) distortion accordingly, thereby obtain profile phase for the different cross section of the described predetermined profile of described lead.

16. method according to claim 15 is characterized in that, described deforming step comprises the step with at least a portion pressing of described lead.

17. method according to claim 16 is characterized in that, carries out described pressing step on the other parts of described lead.

18. measuring head according to claim 7 (30) is characterized in that, described plate (24,25) has slotted hole.

19. measuring head according to claim 18 (30) is characterized in that, makes described plate (24,25) form the thickness with increase by overlapping a plurality of thin plate sheets or by isolated aptly a pair of thin plate sheet to each other.

20. measuring head according to claim 19 (30) is characterized in that, described plate (24,25) has the guide hole that staggers each other.