CN101145428A - Low spoilage module type transformer packaging structure - Google Patents
Low spoilage module type transformer packaging structure Download PDFInfo
- Publication number
- CN101145428A CN101145428A CNA2007100444182A CN200710044418A CN101145428A CN 101145428 A CN101145428 A CN 101145428A CN A2007100444182 A CNA2007100444182 A CN A2007100444182A CN 200710044418 A CN200710044418 A CN 200710044418A CN 101145428 A CN101145428 A CN 101145428A
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- copper
- transformer
- packaging structure
- type transformer
- aluminium base
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
A module-type transformer packaging structure with low loss is provided, wherein a switch tube, a rectifier tube and a transformer coil, as the power elements of a transformer circuit, are arranged on an Al-based Cu-coated board which is laminated from a Cu coating layer, a heat-conducting insulating layer and an Al substrate in order by compression and connection technique; a transformer and the power elements are arranged on the Cu-coated board; and the Al substrate is exposed after package. The invention has the advantages that the Al-based Cu-coated board has both the common PCB function and the excellent heat radiation function, and the volume of the low-loss module-type transformer package is reduced.
Description
Technical field
The present invention relates to a kind of encapsulating structure, particularly a kind of low spoilage module type transformer packaging structure.
Background technology
The thermal source of modular transformer comes from HF switch pipe, transformer coil and magnetic core, rectifying tube, under the certain situation of circuit structure, element form, the core content that improves thermal design is exactly the thermal resistance that will reduce the each several part heater members, improves its heat dispersion.
Summary of the invention
Technical problem of the present invention is that a kind of low spoilage module type transformer packaging structure with excellent heat dispersion performance will be provided.
In order to solve above technical problem, the invention provides a kind of low spoilage module type transformer packaging structure, transformer circuit power component switching tube, rectifying tube, transformer coil are installed in the aluminium base copper-clad plate, aluminium base structure for covering copper plate is followed successively by and covers copper layer, heat-conducting insulation material layer, metal substrate, the employing compression joint technique is combined with each other, transformer, power component are installed in the copper-clad plate, and after the embedding, metal substrate is exposed.
Described heat-conducting insulation material layer, its thickness are tens of microns.
Described metal substrate, it is aluminium base or is copper base that compare with traditional epoxy glass cloth laminated board PCB material, metal substrate has better heat radiating effect.
Aluminium base copper-clad plate has the incomparable advantage of other materials:
1) aluminium base is to cover the base material that copper layer circuit rely and supported, good especially radiating equipment, and aluminium base structure for covering copper plate is followed successively by and covers copper layer, heat-conducting insulation material layer, aluminium base, forming with the compression joint technique compacting, thermal-conduction resistance is very little, can obtain good radiating effect;
2) have good insulation performance performance and mechanical performance, aluminium base copper-clad plate is the two-layer conductor that is up and down, can guarantee good heat-conducting effect, can guarantee good insulation performance performance and mechanical performance again, relies on the intermediate layer fully---heat-conducting insulation material layer and compression joint technique.
Superior effect of the present invention is: aluminium base copper-clad plate has the function of common PCB, has good performance of heat dissipation again, has reduced the volume of low spoilage module type transformer encapsulation.
Description of drawings
Fig. 1 is the structural representation of aluminium base copper-clad plate of the present invention;
Fig. 2 is the structural representation of common copper-clad plate;
The number in the figure explanation
1-cover the copper layer; 2-heat-conducting insulation material layer;
3-aluminium base; 4-insulating barrier.
Embodiment
See also shown in the accompanying drawing, the invention will be further described.
Shown in the structural representation of Fig. 1 aluminium base copper-clad plate of the present invention, the invention provides a kind of low spoilage module type transformer packaging structure, transformer circuit power component switching tube, rectifying tube, transformer coil are installed in the aluminium base copper-clad plate, aluminium base structure for covering copper plate is followed successively by and covers copper layer 1, heat-conducting insulation material layer 2, metal substrate, the employing compression joint technique is combined with each other, transformer, power component are installed in the copper-clad plate, and after the embedding, metal substrate is exposed.
Described heat-conducting insulation material layer 2, its thickness are tens of microns.
Described metal substrate, it is aluminium base 3 or is copper base that compare with traditional epoxy glass cloth laminated board PCB material, metal substrate has better heat radiating effect.
Aluminium base copper-clad plate has the incomparable advantage of other materials:
1) aluminium base 3 is to cover the base material that copper layer circuit rely and supported, good especially radiating equipment, and aluminium base structure for covering copper plate is followed successively by and covers copper layer 1, heat-conducting insulation material layer 2, aluminium base 3, forming with the compression joint technique compacting; And shown in the structural representation of the common copper-clad plate of Fig. 2, common structure for covering copper plate is followed successively by and covers copper layer 1, insulating barrier 4; Thermal-conduction resistance of the present invention is very little, is 1/5 of common copper-clad plate thermal-conduction resistance, thereby can obtain good radiating effect
2) have good insulation performance performance and mechanical performance, aluminium base copper-clad plate is the two-layer conductor that is up and down, can guarantee good heat-conducting effect, can guarantee good insulation performance performance and mechanical performance again, rely on the intermediate layer fully---heat-conducting insulation material layer 2 and compression joint technique, dielectric voltage withstand reaches 6000VAC, and insulation resistance is more than 1013 Ω, and thermal shock and mechanical performance are also very good.
Claims (3)
1. low spoilage module type transformer packaging structure, it is characterized in that: transformer circuit power component switching tube, rectifying tube, transformer coil are installed in the aluminium base copper-clad plate, aluminium base structure for covering copper plate is followed successively by and covers copper layer, heat-conducting insulation material layer, metal substrate, the employing compression joint technique is combined with each other, transformer, power component are installed in the copper-clad plate, after the embedding, metal substrate is exposed.
2. by the described a kind of low spoilage module type transformer packaging structure of claim 1, it is characterized in that: described heat-conducting insulation material layer, its thickness are tens of microns.
3. by the described a kind of low spoilage module type transformer packaging structure of claim 1, it is characterized in that: described metal substrate, it is aluminium base or is copper base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710044418A CN101145428B (en) | 2007-07-31 | 2007-07-31 | Low spoilage module type transformer packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710044418A CN101145428B (en) | 2007-07-31 | 2007-07-31 | Low spoilage module type transformer packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101145428A true CN101145428A (en) | 2008-03-19 |
| CN101145428B CN101145428B (en) | 2012-10-10 |
Family
ID=39207867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710044418A Active CN101145428B (en) | 2007-07-31 | 2007-07-31 | Low spoilage module type transformer packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101145428B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102360808A (en) * | 2008-12-26 | 2012-02-22 | Tdk株式会社 | Coil substrate structure, substrate holding structure, and switching power supply |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2063334U (en) * | 1989-09-04 | 1990-10-03 | 南开大学 | Metal printed circuit board |
| CN2134033Y (en) * | 1992-06-16 | 1993-05-19 | 南开大学 | High heat elimination printed circuit board |
| US6420953B1 (en) * | 2000-05-19 | 2002-07-16 | Pulse Engineering. Inc. | Multi-layer, multi-functioning printed circuit board |
| CN1159762C (en) * | 2001-12-28 | 2004-07-28 | 西安交通大学 | Process for preparing integrated electric and electronic module based on discrete elements |
| CN2655512Y (en) * | 2003-09-05 | 2004-11-10 | 上海德律风根微电子股份有限公司 | Power module for diesel engine common rail system controlling unit |
-
2007
- 2007-07-31 CN CN200710044418A patent/CN101145428B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102360808A (en) * | 2008-12-26 | 2012-02-22 | Tdk株式会社 | Coil substrate structure, substrate holding structure, and switching power supply |
| CN102360808B (en) * | 2008-12-26 | 2014-07-02 | Tdk株式会社 | Coil substrate structure, substrate holding structure, and switching power supply |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101145428B (en) | 2012-10-10 |
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