CN101140823B - Transformer device structure and manufacture method - Google Patents
Transformer device structure and manufacture method Download PDFInfo
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- CN101140823B CN101140823B CN2006101267763A CN200610126776A CN101140823B CN 101140823 B CN101140823 B CN 101140823B CN 2006101267763 A CN2006101267763 A CN 2006101267763A CN 200610126776 A CN200610126776 A CN 200610126776A CN 101140823 B CN101140823 B CN 101140823B
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Abstract
The invention is a transformer structure and its manufacturing method, which at least comprises a magnetic core set with the first magnetic core unit and second magnetic core unit, a circuit wafer mounted between the first magnetic core unit and second magnetic core unit with winding circuit to form primary and at least one secondary winding, a plurality of pins set on the circuit wafer, and at least an interface layer equipped between the first magnetic core unit and the circuit wafer as well as/or between the second magnetic core unit and the circuit wafer. The transformer structure providedby the invention can not only fix the circuit wafer stably, but also can make the pins of the transformer possess optimized planeness through the setting of the interface layer. Besides, the inventio n also avoids minus effect of tin immersion when the transformer sets the contact pads linked with the system circuit wafer by surface mounting technology, and improves the reliability and stability of the products.
Description
Technical field
The present invention is about a kind of transformer device structure and method for making.
Background technology
Transformer (Transformer) is various electronic installation, for example power supply device or power supply change-over device, indispensable basic module during operation.Along with power supply device or power supply change-over device towards miniaturization and high-power trend development, transformer also needs the direction of and flat structure little towards volume to improve.See also Fig. 1, it is the structural representation of traditional transformer.As shown in Figure 1, traditional transformer 1 comprises circuit board 11, a plurality of pin 12, core sets 13 and retaining element 14, and wherein circuit board 11 for example can be sandwich construction and has the coiling circuit to form main coiling and secondary rolling thread (not shown).Circuit board 11 has through hole 111 and a plurality of guide hole 112 in addition, and wherein this through hole 111 is positioned at the middle section of circuit board 11, and described a plurality of guide hole 112 is formed at the two side portions of circuit board 11 substantially and is connected with the coiling circuit of circuit board 11.One end of described a plurality of pin 12 can be provided with, fix and be connected in a plurality of guide holes 112 of circuit board 11, and the other end of a plurality of pins 12 can be used for passing through surface mounting technology (Surface Mount Technology with a plurality of corresponding contact mat of system circuit board, SMT) connect (not shown), so that transformer 1 is fixed on the system circuit board.
Please consult Fig. 1 again, core sets 13 comprises first core section 131 and second core section 132, and wherein first core section 131 has the first side wall 1311 and first center pillar 1312, and 1312 of this first side wall 1311 and first center pillars form first recess 1313.In addition, second core section 132 has second sidewall 1321 and second center pillar 1322, and wherein 1322 of second sidewall 1321 and second center pillars form second recess 1323.First center pillar 1312 of first core section 131 and second center pillar 1322 of second core section 132 can partly be inserted the through hole 111 of circuit board 11, and circuit board 11 can be placed in 1323 of second recesses of first recess 1313 of first core section 131 and second core section 132, therefore when first core section 131, when the circuit board 11 and second core section 132 are combined, circuit board 11 can be placed between first core section 131 and second core section 132, and the through hole 111 of second center pillar 1322 of first center pillar 1312 that makes first core section 131 and second core section 132 by circuit board 11 connects or relative.
Retaining element 14 is an elastic clamping body, and this retaining element 14 can be used for fixing first core section 131, circuit board 11 and second core section 132 after first core section 131, circuit board 11 and 132 combinations of second core section.Has groove 1314,1324 on the outer surface of first core section 131 and second core section 132 respectively, therefore utilize the two ends of retaining element 14 to be fastened in respectively in the groove 1314,1324 of first core section 131 and second core section 132, can make first core section 131, circuit board 11 and second core section 132 fixing, just can utilize the electromagnetic coupled effect between the coiling circuit of core sets 13 and circuit board 11 whereby, to reach the purpose of voltage transitions, the structure after its combination as shown in Figure 2.In addition, be further fixing circuit board 11, traditional transformer 1 also utilizes some glue 15 to coat the fraction bottom surface of second recess 1323 of second core section 132, then circuit board 11 is installed on earlier on the bottom surface of second recess 1323 of second core section 132, carries out the combinator of first core section 131, circuit board 11 and second core section 132 afterwards again.
Yet because some glue 15 is provided on the fraction bottom surface of second recess 1323 of second core section 132, the out-of-flatness that the bottom surface of second recess 1323 of second core section 132 is become.In addition, the area of second recess 1323 of second core section 132 is less, thereby makes a glue operation be difficult for carrying out and control, and regular meeting has the situation of a glue amount inequality to take place, and causes circuit board 11 firmly to fix.In addition, when circuit board 11 is mounted on the bottom surface of second recess 1323 of second core section 132 earlier, because circuit board 11 can't entirely attach and be fixed in second core section 132, thereby make circuit board 11 present skewed with respect to the bottom surface of second recess 1323 of second core section 132, cause the evenness of a plurality of pins 12 of transformer 1 relatively poor and wayward, and then make transformer 1 eat the bad surface mounting technology that can't utilize of tin because of pin 12 firmly to be fixed on the system circuit board, even have influence on the stability and the reliability of product.In addition, if be arranged at traditional transformer 1 on the system circuit board and after carrying out the program of tin stove, some glue 15 can have the embrittlement phenomenon easily because of the relation of material, and this will cause the circuit board 11 of transformer 1 and core sets 13 firmly to fix.What is more, owing to still have the gap between the bottom surface of the bottom surface of second recess 1323 of the circuit board 11 and second core section 132 and/or first recess 1313 of first core section 131, and the air that is present between the gap is the bad conductive medium of heat, so traditional transformer 1 power supply device that power is promoted day by day and power supply change-over device and solution itself problem of dispelling the heat moderately.
Therefore, how to develop a kind of transformer device structure and method for making, to improve and to solve the problem that traditional dispensing technology was run into, real for pressing for the problem of solution at present.
Summary of the invention
Main purpose of the present invention is to provide a kind of transformer device structure and method for making, utilizes the importing of boundary layer to make the circuit board of this transformer can firmly fix and have concurrently the function of heat radiation.
Another object of the present invention is to provide a kind of transformer device structure and method for making, with the pin evenness of control transformer, so that make transformer can firmly fix and be connected in system circuit board by surface mounting technology.
Another purpose of the present invention is to provide a kind of transformer device structure and method for making, so that the circuit board in the transformer can firmly be fixed in core sets.
A further object of the present invention is to provide a kind of transformer device structure and method for making, with the technology of simplifying transformer and make things convenient for production line operation.
For reaching above-mentioned purpose, of the present invention one than broad sense embodiment for a kind of transformer device structure is provided, comprise at least: core sets has first core section and second core section; Circuit board is arranged between first core section and second core section, and has the coiling circuit to form main coiling and at least one secondary rolling thread; A plurality of pins are arranged on the circuit board; And at least one boundary layer, be arranged between first core section and the circuit board and/or between second core section and the circuit board, and circuit board entirely is arranged on the boundary layer, to be used for fixing circuit board in first core section and/or second core section.
According to described transformer device structure, wherein this circuit board also has through hole and a plurality of guide hole, wherein this through hole is positioned at the middle section of this circuit board substantially, and described a plurality of guide hole is formed at the two side portions of this circuit board substantially and is connected with this coiling circuit of this circuit board.
According to described transformer device structure, one end setting of wherein said a plurality of pins, fixing and be connected in described a plurality of guide holes of this circuit board, and the other end of described a plurality of pins is used for connecting by surface mounting technology with a plurality of corresponding contact mat of a system circuit board.
According to described transformer device structure, wherein this first core section has the first side wall and first center pillar, intercolumniation forms first recess in this first side wall and this first, and this second core section has second sidewall and second center pillar, and wherein intercolumniation forms second recess in this second sidewall and this second.
According to described transformer device structure, wherein this second center pillar of this first center pillar of this first core section and this second core section is inserted this through hole of this circuit board at least in part, be placed in to this circuit board section this first recess of this first core section and this second recess of this second core section, this two side portions of this circuit board is extended this core sets and is made described a plurality of pin extending downward or upward with the vertical in fact angle of this circuit board, and this boundary layer is arranged between this second recess of this second core section and this circuit board and/or is arranged between this first recess and this circuit board of this first core section.
According to described transformer device structure, wherein this boundary layer is the linkage interface layer, has smooth installed surface respectively on two opposite faces of this boundary layer, wherein this boundary layer has through hole, when this through hole is installed on the bottom surface of this second recess of the bottom surface of this first recess of this first core section and/or this second core section in this boundary layer, this first center pillar and/or this second center pillar are passed, wherein this boundary layer substantially with the bottom surface tool of this second recess of the bottom surface of this first recess of this first core section and/or this second core section area identical at least in fact, and the thickness of this boundary layer is even substantially.
According to described transformer device structure, wherein this boundary layer is the heat radiation paster.
According to described transformer device structure, wherein this transformer is the transformer of surface mounted component pattern.
According to described transformer device structure, also comprise at least one retaining element, this retaining element is used for fixing this first core section, this circuit board and this second core section when this first core section, this circuit board and the combination of this second core section.
According to described transformer device structure, wherein this retaining element is an elastic clamping body, and the outer surface of this first core section and this second core section has groove respectively, two ends for this retaining element are fastened in respectively in this groove of this first core section and this second core section, so that this first core section, this circuit board and this second core section are fixed.
For reaching above-mentioned purpose, of the present invention another than broad sense embodiment for a kind of manufacture method of transformer is provided, at least comprise step: provide circuit board, a plurality of pin, core sets and at least one boundary layer, wherein circuit board has the coiling circuit to form main coiling and at least one secondary rolling thread, described a plurality of pin is arranged on the circuit board, and this core sets has first core section and second core section; The bottom surface of the bottom surface of second recess of boundary layer is fixing and second core section that is installed on core sets and/or first recess of first core section; Circuit board is fixed and is installed on the boundary layer; And first core section, circuit board and second core section combined, and first core section, circuit board and second core section are fixed, to finish the making of transformer.
For reaching above-mentioned purpose, of the present invention another than broad sense embodiment for a kind of transformer device structure is provided, comprise at least: system circuit board has the coiling circuit to form main coiling and at least one secondary rolling thread in the subregion; Core sets has first core section and second core section, and first core section and second core section are arranged at two opposite faces of system circuit board respectively; And at least one boundary layer, be arranged between first core section and system circuit board and/or second core section and the system circuit board.
According to described transformer device structure, wherein this system circuit board also has first through hole, second through hole and third through-hole, and wherein this first through hole is substantially between this second through hole and this three through hole.
According to described transformer device structure, wherein this first core section has the first side wall and first center pillar, and intercolumniation forms first recess in this first side wall and this first; And this second core section has second sidewall and second center pillar, intercolumniation forms second recess in this second sidewall and this second, wherein this second center pillar of this first center pillar of this first core section and this second core section is inserted this first through hole of this system circuit board at least in part, and this second sidewall of this first side wall of this first core section and this second core section is from this two opposite face of this system circuit board and insert this second through hole and this third through-hole of this system circuit board at least in part.
According to described transformer device structure, wherein this boundary layer is the linkage interface layer, has smooth installed surface respectively on two opposite faces of this boundary layer, wherein this boundary layer has through hole, when this through hole is installed on the bottom surface of this second recess of the bottom surface of this first recess of this first core section and/or this second core section at this boundary layer, this first center pillar and/or this second center pillar are passed, wherein this boundary layer has identical in fact shape and area with the bottom surface of this second recess of the bottom surface of this first recess of this first core section and/or this second core section substantially, and the thickness of this boundary layer is even substantially.
According to described transformer device structure, wherein this boundary layer is the heat radiation paster.
Transformer device structure of the present invention and method for making are mainly utilized the importing of boundary layer, make between the bottom surface of its first recess that is arranged at first core section and the circuit board and/or between the bottom surface and circuit board of second recess of second core section, setting by boundary layer not only can make circuit board firmly fixing, and the pin that can make transformer has preferred evenness, and can not utilize surface mounting technology fixing when being connected in the relative contact mat of system circuit board at transformer, the bad problem of tin is eaten in generation, and then has improved the reliability and the stability of product.In addition, when the manufacturing of carrying out transformer and combination, boundary layer can be attached at the bottom surface of first recess of the bottom surface of second recess of second core section and/or first core section at an easy rate, so technology carries out and control easily, can not have the situation of a glue inequality to take place.In addition, if be arranged at transformer on the system circuit board and after carrying out the program of tin stove, boundary layer does not have the phenomenon of embrittlement yet, it is hereby ensured that circuit board firmly is fixed in the core sets.
Description of drawings
Fig. 1 is the structural representation of traditional transformer.
Fig. 2 is the combining structure schematic diagram of transformer shown in Figure 1.
Fig. 3 is the structural representation of the transformer of the preferred embodiment of the present invention.
Fig. 4 is the combining structure schematic diagram of transformer shown in Figure 3.
Fig. 5 shows the manufacture method schematic flow sheet of the transformer of the preferred embodiment of the present invention.
Fig. 6 is the structural representation of the transformer of another preferred embodiment of the present invention.
Fig. 7 is the combining structure schematic diagram of transformer shown in Figure 6.
Fig. 8 shows the manufacture method schematic flow sheet of the transformer of another preferred embodiment of the present invention.
Fig. 9 is the structural representation of the transformer of the another preferred embodiment of the present invention.
Wherein, description of reference numerals is as follows:
1: transformer 11: circuit board
12: pin 13: core sets
14: retaining element 15: some glue
111: through hole 112: guide hole
132: the second core section of 131: the first core section
1311: 1312: the first center pillars of the first side wall
2: transformer 21: circuit board
22: pin 23: core sets
24: retaining element 25: boundary layer
211: through hole 212: guide hole
213: side part 214: the side part
232: the second core section of 231: the first core section
2311: 2312: the first center pillars of the first side wall
Recess 2314 in 2313: the first: groove
2322: the second center pillars of 2321: the second sidewalls
Recess 2324 in 2323: the second: groove
251: through hole 3: transformer
31: system circuit board 33: core sets
35: 311: the first through holes of boundary layer
Through hole 313 in 312: the second: third through-hole
314: 331: the first core section of coiling circuit
3313: the first recesses of 3312: the first center pillars
3322: the second center pillars of 3321: the second sidewalls
S11～S14: the manufacturing process step of the transformer of the preferred embodiment of the present invention
S21～S24: the manufacturing process step of the transformer of another preferred embodiment of the present invention
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations on different embodiment, its neither departing from the scope of the present invention, and explanation wherein and the accompanying drawing usefulness that ought explain in itself, but not in order to restriction the present invention.
See also Fig. 3, it is the structural representation of the transformer of the preferred embodiment of the present invention.As shown in Figure 3, transformer 2 of the present invention can be for example surface mounted component (Surface Mount Device, SMD) transformer of pattern, and its structure comprises circuit board 21, a plurality of pin 22, core sets 23 and at least one boundary layer 25, wherein circuit board 21 for example can be sandwich construction and has the coiling circuit to form main coiling and at least one secondary rolling thread (not icon), because the coiling line design of circuit board 21 is conventionally known to one of skill in the art, do not describing in detail at this.Circuit board 21 also has through hole 211 and a plurality of guide hole 212, wherein this through hole 211 is positioned at the middle section of circuit board 21 substantially, and described a plurality of guide hole 212 is formed at the two side portions 213,214 of circuit board 21 substantially and is connected with the coiling circuit of circuit board 21.One end of described a plurality of pin 22 can be provided with, fix and be connected in a plurality of guide holes 212 of circuit board 21, and the other end of a plurality of pin 22 can be used for connecting (not shown) with a plurality of corresponding contact mat of system circuit board by surface mounting technology.
Please consult Fig. 3 again, core sets 23 comprises first core section 231 and second core section 232, and wherein first core section 231 has the first side wall 2311 and first center pillar 2312, and 2312 of this first side wall 2311 and first center pillars form first recess 2313.In addition, second core section 232 has second sidewall 2321 and second center pillar 2322, and wherein 2322 of this second sidewall 2321 and second center pillars form second recess 2323.First center pillar 2312 of first core section 231 and second center pillar 2322 of second core section 232 can be inserted the through hole 211 of circuit board 21 at least in part, and circuit board 21 can partly be placed in 2323 of second recesses of first recess 2313 of first core section 231 and second core section 232, therefore when first core section 231, when the circuit board 21 and second core section 232 are combined, partial circuit plate 21 can be placed between first core section 231 and second core section 232, and the through hole 211 of second center pillar 2322 of first center pillar 2312 that makes first core section 231 and second core section 232 by circuit board 21 connects or relative.In addition, the two side portions 213,214 of circuit board 21 can be extended out core sets 23 and pin 22 can be extended with vertical in fact angle downward or upward with circuit board 21.
In addition, be further fixing circuit board 21, transformer 2 boundary layer 25 can be arranged between second recess 2323 of second core section 232 and the circuit board 21 and/or be arranged at first recess 2313 of first core section 231 and circuit board 21 between (not icon), owing to have smooth installed surface respectively on two opposite faces of boundary layer 25, therefore when combination first core section 231, when the circuit board 21 and second core section 232, circuit board 21 can utilize boundary layer 25 earlier and install and be fixed in second recess 2323 of second core section 232 and/or utilize boundary layer 25 and install and be fixed in first recess 2313 of first core section 231, carry out first core section 231 afterwards again, the combinator of the circuit board 21 and second core section 232, the structure after its combination as shown in Figure 4.
In certain embodiments, boundary layer 25 is the linkage interface layer, this linkage interface layer has smooth installed surface respectively on its two opposite face, and boundary layer 25 has through hole 251, this through hole 251 can pass second center pillar 2322 and/or first center pillar 2312 when boundary layer 25 is installed on the bottom surface of first recess 2313 of the bottom surface of second recess 2323 of second core section 232 and/or first core section 231.In addition, boundary layer 25 substantially with the suitable at least in fact area of bottom surface tool of first recess 2311 of the bottom surface of second recess 2321 of second core section 232 or first core section 231, and its thickness is even substantially, therefore smooth installed surface can be provided, boundary layer 25 can be entirely be attached at after circuit board 21 is installed.Therefore, boundary layer 25 not only can make circuit board 21 firmly fixing, and can make the pin 22 of transformer 2 have preferred evenness, and can not utilize surface mounting technology fixing when being connected in the relative contact mat of system circuit board at transformer 2, the bad problem of tin is eaten in generation, and then has improved the reliability and the stability of product.In addition, when the manufacturing of carrying out transformer 2 and combination, boundary layer 25 can be attached at the bottom surface of first recess 2313 of the bottom surface of second recess 2323 of second core section 232 and/or first core section 231 at an easy rate, therefore technology is carried out and control easily, can not have the situation of a glue inequality to take place.In addition, if be arranged at transformer 2 on the system circuit board and after carrying out the program of tin stove, boundary layer 25 does not have the phenomenon of embrittlement yet, it is hereby ensured that circuit board 21 firmly is fixed in the core sets 23.
In certain embodiments, boundary layer 25 can be a heat radiation paster (thermal pad), the inside of this boundary layer 25 is made by the material of tool some higher thermal conductivity coefficient, and has smooth installed surface respectively on its two opposite face, makes boundary layer 25 have the function that connects with heat radiation simultaneously.Therefore, when boundary layer 25 is the heat radiation paster, originally be present in the gap between the bottom surface of first recess 2313 of gap between the bottom surface of second recess 2323 of the circuit board 21 and second core section 232 and/or the circuit board 21 and first core section 231, just can utilize boundary layer 25 to fill up, to provide heat to pass the path, with radiating efficiency that promotes transformer 2 integral body and the problem that solves the heat radiation aspect than low thermal resistance.
See also Fig. 5, it shows the manufacture method schematic flow sheet of the transformer of the preferred embodiment of the present invention.As shown in Figure 5, the manufacture method of transformer 2 of the present invention comprises step: at first, shown in step S11, circuit board 21, a plurality of pin 22, core sets 23 and at least one boundary layer 25 are provided, wherein a plurality of pins 22 are arranged on the circuit board, and the structural principle of circuit board 21, a plurality of pin 22, core sets 23 and boundary layer 25 and function are as previously mentioned, do not repeat them here.Then, shown in step S12, the bottom surface of the bottom surface of second recess 2323 of boundary layer 25 is fixing and second core section 232 that is installed on core sets 23 and/or first recess 2313 of first core section 231.Then, shown in step S13, circuit board 21 is fixed and is installed on the boundary layer 25.Afterwards, shown in step S14, first core section 231, circuit board 21 and second core section 232 are combined, to finish the making of transformer 2.
See also Fig. 6, it is the structural representation of the transformer of another preferred embodiment of the present invention.As shown in Figure 6, transformer 2 of the present invention can be for example transformer of surface mounted component pattern, and its structure comprises circuit board 21, a plurality of pin 22, core sets 23, at least one retaining element 24 and at least one boundary layer 25, wherein circuit board 21 for example can be sandwich construction and has the coiling circuit to form main coiling and at least one secondary rolling thread (not icon), because the coiling line design of circuit board 21 is conventionally known to one of skill in the art, do not describing in detail at this.Circuit board 21 has through hole 211 and a plurality of guide hole 212 in addition, wherein this through hole 211 is positioned at the middle section of circuit board 21 substantially, and described a plurality of guide hole 212 is formed at the two side portions 213,214 of circuit board 21 substantially and is connected with the coiling circuit of circuit board 21.One end of described a plurality of pin 22 can be provided with, fix and be connected in a plurality of guide holes 212 of circuit board 21, and the other end of a plurality of pin 22 can be used for connecting (not shown) with a plurality of corresponding contact mat of system circuit board by surface mounting technology.
Please consult Fig. 6 again, core sets 23 comprises first core section 231 and second core section 232, and wherein first core section 231 has the first side wall 2311 and first center pillar 2312, and 2312 of this first side wall 2311 and first center pillars form first recess 2313.In addition, second core section 232 has second sidewall 2321 and second center pillar 2322, and wherein 2322 of this second sidewall 2321 and second center pillars form second recess 2323.First center pillar 2312 of first core section 231 and second center pillar 2322 of second core section 232 can be inserted the through hole 211 of circuit board 21 at least in part, and circuit board 21 can partly be placed in 2323 of second recesses of first recess 2313 of first core section 231 and second core section 232, therefore when first core section 231, when the circuit board 21 and second core section 232 are combined, partial circuit plate 21 can be placed between first core section 231 and second core section 232, and the through hole 211 of second center pillar 2322 of first center pillar 2312 that makes first core section 231 and second core section 232 by circuit board 21 connects or relative.In addition, the two side portions 213,214 of circuit board 21 can be extended out core sets 23 and pin 22 can be extended with vertical in fact angle downward or upward with circuit board 21.
Retaining element 24 can be used for fixing first core section 231, circuit board 21 and second core section 232 after first core section 231, circuit board 21 and 232 combinations of second core section.In certain embodiments, this retaining element 24 is an elastic clamping body, has groove 2314,2324 on the outer surface of first core section 231 and second core section 232 respectively, therefore utilize the two ends of retaining element 24 to be fastened in respectively in the groove 2314,2324 of first core section 231 and second core section 232, can make first core section 231, circuit board 21 and second core section 232 fixing, just can utilize the electromagnetic coupled effect between the coiling circuit of core sets 23 and circuit board 21 whereby, to reach the purpose of voltage transitions.In addition, be further fixing circuit board 21, transformer 2 boundary layer 25 can be arranged between second recess 2323 of second core section 232 and the circuit board 21 and/or be arranged at first recess 2313 of first core section 231 and circuit board 21 between (not icon), owing to have smooth installed surface respectively on two opposite faces of boundary layer 25, therefore when combination first core section 231, when the circuit board 21 and second core section 232, circuit board 21 can utilize boundary layer 25 earlier and install and be fixed in second recess 2323 of second core section 232 and/or utilize boundary layer 25 and install and be fixed in first recess 2313 of first core section 231, carry out first core section 231 afterwards again, the combinator of the circuit board 21 and second core section 232, the structure after its combination as shown in Figure 7.
In certain embodiments, boundary layer 25 is the linkage interface layer, this linkage interface layer has smooth installed surface respectively on its two opposite face, and boundary layer 25 has through hole 251, this through hole 251 can pass second center pillar 2322 and/or first center pillar 2312 when boundary layer 25 is installed on the bottom surface of first recess 2313 of the bottom surface of second recess 2323 of second core section 232 and/or first core section 231.In addition, boundary layer 25 substantially with the suitable at least in fact area of bottom surface tool of first recess 2311 of the bottom surface of second recess 2321 of second core section 232 or first core section 231, and its thickness is even substantially, therefore smooth installed surface can be provided, boundary layer 25 can be entirely be attached at after circuit board 21 is installed.Therefore, boundary layer 25 not only can make circuit board 21 firmly fixing, and can make the pin 22 of transformer 2 have preferred evenness, and can not utilize surface mounting technology fixing when being connected in the relative contact mat of system circuit board at transformer 2, the bad problem of tin is eaten in generation, and then has improved the reliability and the stability of product.In addition, when the manufacturing of carrying out transformer 2 and combination, boundary layer 25 can be attached at the bottom surface of first recess 2313 of the bottom surface of second recess 2323 of second core section 232 and/or first core section 231 at an easy rate, therefore technology is carried out and control easily, can not have the situation of a glue inequality to take place.In addition, if be arranged at transformer 2 on the system circuit board and after carrying out the program of tin stove, boundary layer 25 does not have the phenomenon of embrittlement yet, it is hereby ensured that circuit board 21 firmly is fixed in the core sets 23.
In certain embodiments, boundary layer 25 can be a heat radiation paster, and the inside of this boundary layer 25 is made by the material of tool some higher thermal conductivity coefficient, and has smooth installed surface respectively on its two opposite face, makes boundary layer 25 have the function that connects with heat radiation simultaneously.Therefore, when boundary layer 25 is the heat radiation paster, originally be present in the gap between the bottom surface of first recess 2313 of gap between the bottom surface of second recess 2323 of the circuit board 21 and second core section 232 and/or the circuit board 21 and first core section 231, just can utilize boundary layer 25 to fill up, to provide heat to pass the path, with radiating efficiency that promotes transformer 2 integral body and the problem that solves the heat radiation aspect than low thermal resistance.
See also Fig. 8, it shows the manufacture method schematic flow sheet of the transformer of another preferred embodiment of the present invention.As shown in Figure 8, the manufacture method of transformer 2 of the present invention comprises step: at first, shown in step S21, circuit board 21, a plurality of pin 22, core sets 23, at least one retaining element 24 and at least one boundary layer 25 are provided, wherein a plurality of pins 22 are arranged on the circuit board, and the structural principle of circuit board 21, a plurality of pin 22, core sets 23, retaining element 24 and boundary layer 25 and function are as previously mentioned, do not repeat them here.Then, shown in step S22, the bottom surface of the bottom surface of second recess 2323 of boundary layer 25 is fixing and second core section 232 that is installed on core sets 23 and/or first recess 2313 of first core section 231.Then, shown in step S23, circuit board 21 is fixed and is installed on the boundary layer 25.Afterwards, shown in step S24, first core section 231, circuit board 21 and second core section 232 are combined, and utilized retaining element 24 that first core section 231, circuit board 21 and second core section 232 is fixing, to finish the making of transformer 2.
See also Fig. 9, it is the structural representation of the transformer of the another preferred embodiment of the present invention.As shown in Figure 9, transformer 3 of the present invention can be the flat-plate transformer that for example is embedded at system circuit board, and its structure comprises system circuit board 31, core sets 33 and at least one boundary layer 35, and wherein system circuit board 31 for example can be sandwich construction and has coiling circuit 314 to form main coiling and at least one secondary rolling thread in the subregion.System circuit board 31 has first through hole 311, second through hole 312 and third through-hole 313 in addition, and wherein this first through hole 311 is substantially between second through hole 312 and third through-hole 313, and coiling circuit 314 mainly is surrounded on the periphery of this first through hole 311.
Core sets 33 comprises first core section 331 and second core section 332, and wherein first core section 331 has the first side wall 3311 and first center pillar 3312, and 3312 of this first side wall 3311 and first center pillars form first recess 3313.In addition, second core section 332 has second sidewall 3321 and second center pillar 3322, and wherein 3322 of this second sidewall 3321 and this second center pillars form second recess 3323.First center pillar 3312 of first core section 331 and second center pillar 3322 of second core section 332 be first through hole 311 of imbedding system circuit board 31 partly, and first core section 331 and second core section 332 are arranged at two opposite faces of system circuit board 31 respectively, and second sidewall 3321 that makes the first side wall 3311 of first core section 331 and second core section 332 from two opposite faces of system circuit board 31 and at least in part second through hole 312 of imbedding system circuit board 31 and third through-hole 313 and connect or relatively.
In certain embodiments, boundary layer 35 is the linkage interface layer, this linkage interface layer has smooth installed surface respectively on its two opposite face, and boundary layer 35 has through hole 351, this through hole 351 can pass second center pillar 3322 and/or first center pillar 3312 when boundary layer 35 is installed on the bottom surface of first recess 3313 of the bottom surface of second recess 3323 of second core section 332 and/or first core section 331.In addition, boundary layer 35 substantially with the identical in fact shape and the area of bottom surface tool of first recess 3311 of the bottom surface of second recess 3321 of second core section 332 or first core section 331, and its thickness is even substantially, therefore can provide smooth installed surface, make first core section 331 and/or second core section 332 can entirely be attached at system circuit board 31.In certain embodiments, boundary layer 35 can be the heat radiation paster, and the inside of this boundary layer 35 is made by the material of tool some higher thermal conductivity coefficient, and has smooth installed surface respectively on its two opposite face, makes boundary layer 35 have the function that connects with heat radiation simultaneously.Therefore, when boundary layer 35 is the heat radiation paster, originally be present in the gap between the bottom surface of first recess 3313 of gap between the bottom surface of second recess 3323 of the system circuit board 31 and second core section 332 and/or the system circuit board 31 and first core section 331, just can utilize boundary layer 35 to fill up, to provide heat to pass the path, with radiating efficiency that promotes transformer 3 integral body and the problem that solves the heat radiation aspect than low thermal resistance.
In sum, transformer device structure of the present invention and method for making are mainly utilized the importing of boundary layer, make between the bottom surface of its first recess that is arranged at first core section and the circuit board and/or between the bottom surface and circuit board of second recess of second core section, setting by boundary layer not only can make circuit board firmly fixing, and the pin that can make transformer has preferred evenness, and can not utilize surface mounting technology fixing when being connected in the relative contact mat of system circuit board at transformer, the bad problem of tin is eaten in generation, and then has improved the reliability and the stability of product.In addition, when the manufacturing of carrying out transformer and combination, boundary layer can be attached at the bottom surface of first recess of the bottom surface of second recess of second core section and/or first core section at an easy rate, so technology carries out and control easily, can not have the situation of a glue inequality to take place.In addition, if be arranged at transformer on the system circuit board and after carrying out the program of tin stove, boundary layer does not have the phenomenon of embrittlement yet, it is hereby ensured that circuit board firmly is fixed in the core sets.
Claims (16)
1. transformer device structure comprises at least:
Core sets has first core section and second core section;
Circuit board is arranged between this first core section and this second core section, and has the coiling circuit to form main coiling and at least one secondary rolling thread;
A plurality of pins are arranged on this circuit board; And
At least one boundary layer, be arranged between this first core section and this circuit board and/or between this second core section and this circuit board, and this circuit board entirely is arranged on this boundary layer, to be used for fixing this circuit board in this first core section and/or this second core section.
2. transformer device structure as claimed in claim 1, wherein this circuit board also has through hole and a plurality of guide hole, wherein this through hole is positioned at the middle section of this circuit board substantially, and described a plurality of guide hole is formed at the two side portions of this circuit board substantially and is connected with this coiling circuit of this circuit board.
3. transformer device structure as claimed in claim 2, one end setting of wherein said a plurality of pins, fixing and be connected in described a plurality of guide holes of this circuit board, and the other end of described a plurality of pins is used for connecting by surface mounting technology with a plurality of corresponding contact mat of a system circuit board.
4. transformer device structure as claimed in claim 2, wherein this first core section has the first side wall and first center pillar, intercolumniation forms first recess in this first side wall and this first, and this second core section has second sidewall and second center pillar, and wherein intercolumniation forms second recess in this second sidewall and this second.
5. transformer device structure as claimed in claim 4, wherein this second center pillar of this first center pillar of this first core section and this second core section is inserted this through hole of this circuit board at least in part, be placed in to this circuit board section this first recess of this first core section and this second recess of this second core section, this two side portions of this circuit board is extended this core sets and is made described a plurality of pin extending downward or upward with the vertical in fact angle of this circuit board, and this boundary layer is arranged between this second recess of this second core section and this circuit board and/or is arranged between this first recess and this circuit board of this first core section.
6. transformer device structure as claimed in claim 4, wherein this boundary layer is the linkage interface layer, has smooth installed surface respectively on two opposite faces of this boundary layer, wherein this boundary layer has through hole, when this through hole is installed on the bottom surface of this second recess of the bottom surface of this first recess of this first core section and/or this second core section in this boundary layer, this first center pillar and/or this second center pillar are passed, wherein this boundary layer substantially with the bottom surface tool of this second recess of the bottom surface of this first recess of this first core section and/or this second core section area identical at least in fact, and the thickness of this boundary layer is even substantially.
7. transformer device structure as claimed in claim 1, wherein this boundary layer is the heat radiation paster.
8. transformer device structure as claimed in claim 1, wherein this transformer is the transformer of surface mounted component pattern.
9. transformer device structure as claimed in claim 1 also comprises at least one retaining element, and this retaining element is used for fixing this first core section, this circuit board and this second core section when this first core section, this circuit board and the combination of this second core section.
10. transformer device structure as claimed in claim 9, wherein this retaining element is an elastic clamping body, and the outer surface of this first core section and this second core section has groove respectively, two ends for this retaining element are fastened in respectively in this groove of this first core section and this second core section, so that this first core section, this circuit board and this second core section are fixed.
11. the manufacture method of a transformer comprises step at least:
Circuit board, a plurality of pin, core sets and at least one boundary layer are provided, wherein this circuit board has the coiling circuit to form main coiling and at least one secondary rolling thread, described a plurality of pin is arranged on this circuit board, and this core sets has first core section and second core section;
The bottom surface of the bottom surface of second recess of this boundary layer is fixing and this second core section that is installed on this core sets and/or first recess of this first core section;
This circuit board is fixed and is installed on this boundary layer; And
This first core section, this circuit board and this second core section are combined, and this first core section, this circuit board and this second core section are fixed, to finish the making of this transformer.
12. a transformer device structure comprises at least:
System circuit board has the coiling circuit to form main coiling and at least one secondary rolling thread in the subregion;
Core sets has first core section and second core section, and this first core section and this second core section are arranged at respectively on two opposite faces of this system circuit board; And
At least one boundary layer is arranged between this first core section and this system circuit board and/or this second core section and this system circuit board.
13. transformer device structure as claimed in claim 12, wherein this system circuit board also has first through hole, second through hole and third through-hole, and wherein this first through hole is substantially between this second through hole and this third through-hole.
14. transformer device structure as claimed in claim 13, wherein this first core section has the first side wall and first center pillar, and intercolumniation forms first recess in this first side wall and this first; And this second core section has second sidewall and second center pillar, intercolumniation forms second recess in this second sidewall and this second, wherein this second center pillar of this first center pillar of this first core section and this second core section is inserted this first through hole of this system circuit board at least in part, and this second sidewall of this first side wall of this first core section and this second core section is from this two opposite face of this system circuit board and insert this second through hole and this third through-hole of this system circuit board at least in part.
15. transformer device structure as claimed in claim 14, wherein this boundary layer is the linkage interface layer, has smooth installed surface respectively on two opposite faces of this boundary layer, wherein this boundary layer has through hole, when this through hole is installed on the bottom surface of this second recess of the bottom surface of this first recess of this first core section and/or this second core section at this boundary layer, this first center pillar and/or this second center pillar are passed, wherein this boundary layer has identical in fact shape and area with the bottom surface of this second recess of the bottom surface of this first recess of this first core section and/or this second core section substantially, and the thickness of this boundary layer is even substantially.
16. transformer device structure as claimed in claim 12, wherein this boundary layer is the heat radiation paster.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101267763A CN101140823B (en) | 2006-09-05 | 2006-09-05 | Transformer device structure and manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101267763A CN101140823B (en) | 2006-09-05 | 2006-09-05 | Transformer device structure and manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101140823A CN101140823A (en) | 2008-03-12 |
| CN101140823B true CN101140823B (en) | 2010-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101267763A Active CN101140823B (en) | 2006-09-05 | 2006-09-05 | Transformer device structure and manufacture method |
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| CN (1) | CN101140823B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6094251B2 (en) * | 2013-02-19 | 2017-03-15 | Tdk株式会社 | Coil device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6377150B1 (en) * | 2000-07-13 | 2002-04-23 | Randy Thomas Heinrich | Apparatus and method for facilitating heat dissipation in an electrical device |
| US6741155B2 (en) * | 2001-05-14 | 2004-05-25 | Sanken Electric Co., Ltd. | Transformer |
| US6927661B2 (en) * | 2003-03-05 | 2005-08-09 | Tdk Innoveta Inc. | Planar transformer and output inductor structure with single planar winding board and two magnetic cores |
| CN1747083A (en) * | 2004-09-10 | 2006-03-15 | 深圳普达电源技术有限公司 | PCB assembled and integrated transformer with high-density big current power conversion |
| CN2796045Y (en) * | 2005-05-13 | 2006-07-12 | 台湾东电化股份有限公司 | Transformer structure |
-
2006
- 2006-09-05 CN CN2006101267763A patent/CN101140823B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6377150B1 (en) * | 2000-07-13 | 2002-04-23 | Randy Thomas Heinrich | Apparatus and method for facilitating heat dissipation in an electrical device |
| US6741155B2 (en) * | 2001-05-14 | 2004-05-25 | Sanken Electric Co., Ltd. | Transformer |
| US6927661B2 (en) * | 2003-03-05 | 2005-08-09 | Tdk Innoveta Inc. | Planar transformer and output inductor structure with single planar winding board and two magnetic cores |
| CN1747083A (en) * | 2004-09-10 | 2006-03-15 | 深圳普达电源技术有限公司 | PCB assembled and integrated transformer with high-density big current power conversion |
| CN2796045Y (en) * | 2005-05-13 | 2006-07-12 | 台湾东电化股份有限公司 | Transformer structure |
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| Publication number | Publication date |
|---|---|
| CN101140823A (en) | 2008-03-12 |
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