CN101138813A - Lead-free solder for soft soldering - Google Patents
Lead-free solder for soft soldering Download PDFInfo
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- CN101138813A CN101138813A CNA2007101761550A CN200710176155A CN101138813A CN 101138813 A CN101138813 A CN 101138813A CN A2007101761550 A CNA2007101761550 A CN A2007101761550A CN 200710176155 A CN200710176155 A CN 200710176155A CN 101138813 A CN101138813 A CN 101138813A
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Abstract
The present invention relates to a lead-free solder for a soldering which is characterized in that the solder consists of materials with the following weight percentage: Cu from 0.1 percent to 1.0 percent, Ni from 0.1 percent to 0.2 percent, Ce from 0.01 percent to 0.10percent, Bi from 0.05percent to 2.0percent, Pr or/and Nd from 0.01percent to 0.10percent and the rest being Sn. The lead-free solder of the present invention, belonging to the environmental protecting products, has the advantages and effects of such as an anti-oxidation property, a mechanical property and corrosion resistance which can improve the performance of the solder, a uniform metallographic organization, refined grain, a good product quality, low cost and a proper reduction of the melting point.
Description
Technical field
The present invention relates to the lead-free solder that a kind of solder is used, particularly contain copper, nickel, cerium, bismuth, praseodymium, belong to the tin soldering alloys field or/and neodymium and surplus are the lead-free solder of tin.
Background technology
The fast development of electronics industry is more and more higher to the scolder performance demands, and the development of high integration, high-performance electronic Electrical Appliances Designing makes pad more and more littler, and is more and more higher to the requirement of reliability.The tradition tin-lead solder, lead and compound thereof belong to noxious material, bring bigger harm for human habitat and safety, two instructions of European Union's issue, electronic product, must not contain 6 kinds of harmful substances that comprise lead etc. from July 1st, 2006, lead stands in the breach, therefore the research of lead-free solder develops rapidly with application, from the Sn-Ag of bianry alloy, Sn-Bi, Sn-Cu, Sn-Zn develops into the Sn-Ag-Cu of ternary alloy three-partalloy, Sn-Cu-Bi, Sn-Cu-Ni, also have some multicomponent alloys, the unleaded multiple product that provides is provided, many enterprises have also carried out a lot of research and development work, and it is unleaded that electronics and IT products have been realized.Lead-free solder is progressively widely applied in China's electronics and information products manufacturing at present, in order better, more effectively to promote the unleaded process of China's electronics and IT products, formulated the lead-free solder industry standard at present, stronger to unleaded development, but the lead-free solder precious metal content that has is higher, the cost height, the fusing point that has is higher, and the wetability that has is not good enough to wait deficiency.
Summary of the invention
Purpose of the present invention is just for the shortcoming that overcomes above-mentioned prior art and not enough and lead-free solder that provide the solder of a kind of antioxygen property that improves scolder and mechanical performance to use, thereby for the processing and manufacturing of electronic product provides the welding material of high-quality, again end production cost can fall greatly simultaneously.
The objective of the invention is to be achieved through the following technical solutions:
The lead-free solder that a kind of solder is used is characterized in that it is made up of following weight percentages:
Copper 0.1～1.0%, cerium 0.01～0.10%, nickel 0.1～0.2%,
Bismuth 0.05～2.0%, praseodymium or neodymium 0.01～0.10% and surplus are tin.
The lead-free solder that a kind of solder is used is characterized in that it is made up of following weight percentages:
Copper 0.1～1.0%, nickel 0.1～0.2%, cerium 0.01～0.10%,
Bismuth 0.05～2.0%, praseodymium and neodymium 0.01～0.10% and surplus are tin, and the weight proportion of praseodymium and neodymium is 1: 1.
The preferable amount of raw material in the above-mentioned lead-free solder, copper are 0.5～0.7%, nickel is 0.15～0.2%, cerium is 0.02～0.05%.
Product of the present invention is to add Ce, Bi, Pr or/and the Nd component on the basis of traditional SnCuNi lead-free solder, wherein Ce it can the refinement alloy grain, metallographic structure is even, and can improve anti-folding and draw performance, add Bi and can suitably reduce fusing point, add Pr or/and Nd can improve antioxygen property and mechanical performance and rotproofness, therefore the performance of series of products of the present invention all is greatly improved.
Lead-free solder of the present invention is SnCuNiCeBiPr, SnCuNiCeBiNd and SnCuNiCeBiPrNd series of products.
The manufacture method of lead-free solder of the present invention, be earlier with Cu, Ni, Ce, Bi, Pr or/and Nd and tin manufacturing intermediate alloy again mixed smelting make product.
The raw material that product of the present invention adopts is the refined tin of stanniferous 99.95%, the smart copper of cupric 99.5%, the metallic cerium that contains cerium 99.99%, nickeliferous 99.9% smart nickel, bismuth 99.99%, praseodymium and neodymium 99.00%, be the market sale modular product, in the strict control of blending process, strict in process of production control technological parameter, adopt monitoring automatically at the melting intermediate alloy, strict control proportioning is to stablize the chemical composition equilibrium melting point during congruent melting refining.
The cerium that adds in this product is a rare earth element, 789 ℃ of fusing points, 3426 ℃ of boiling points, density 6.77g/cm
3, it is the grey active metal, easily oxidation loses light and translates heating flame in air, being soluble in acid, is alloy material, but its deoxidation, desulfurization, even crystal grain thinning, raising mechanical performance and oxidation resistance, can reduce fusing point, 935 ℃ of praseodymium fusing points, density 6.769g/cm
3, its antioxygen property and mechanical performance obviously improve, 1024 ℃ of neodymium fusing points, density 7.007g/cm
3, can improve high-temperature behavior, air-tightness and the corrosion resistance of alloy.
This product has carried out performance relatively through detecting with existing SnAgNi lead-free solder, and it the results are shown in Table 1
Table 1 performance relatively
| Item compared | The SnAgNi lead-free solder | Lead-free solder of the present invention |
| Rate of spread % | 75.0 | 77.0-78.3 |
| Wetability (mN) | 61.0 | 65.6-66.0 |
| Fusing point (℃) | 227-230 | 215.0-220.0 |
| Metallographic (amplifying 200 times) | Metallographic structure is inhomogeneous, crystal grain is thicker | Metallographic structure is even, grain refinement |
| Resistivity (μ ' Ω .cm) | 1.495 | 1.30-1.32 |
| The QFP 45 ° of tension tests (N) that go between | 23.30 | 24.00-24.25 |
| Slice component solder joint shearing test (N) | 27.10 | 30.00-3 1.20 |
Comparing result shows that the every index of product of the present invention is improved, and is the welding material of high-quality.
Because antioxygen property, mechanical performance and the rotproofness taking technique scheme that compared with the prior art the technology of the present invention is had to improve scolder, more even, the grain refinement of its metallographic structure has suitably reduced fusing point, good product quality, cost is low, belongs to the advantage and the effect of environment-friendly products.
The specific embodiment
Embodiment
| Embodiment | Raw material components consumption (kg) | |||||||
| Sn | Cu | Ni | Ce | Bi | Pr | Nd | Pr+Nd 1∶1 | |
| 1 | 97.78 | 0.1 | 0.10 | 0.01 | 2.0 | 0.01 | ||
| 2 | 97.78 | 0.5 | 0.15 | 0.02 | 1.5 | 0.05 | ||
| 3 | 98.47 | 0.7 | 0.20 | 0.05 | 0.50 | 0.08 | ||
| 4 | 98.57 | 1.0 | 0.18 | 0.1 | 0.05 | 0.1 | ||
| 5 | 96.70 | 1.0 | 0.1 | 0.1 | 2.0 | 0.1 | ||
| 6 | 97.52 | 0.7 | 0.15 | 0.05 | 1.5 | 0.08 | ||
| 7 | 98.73 | 0.5 | 0.20 | 0.02 | 0.5 | 0.05 | ||
| 8 | 99.65 | 0.1 | 0.18 | 0.01 | 0.05 | 0.01 | ||
| 9 | 99.04 | 0.7 | 0.1 | 0.01 | 0.05 | 0.1 | ||
| 10 | 97.60 | 0.1 | 0.2 | 0.05 | 2.0 | 0.05 | ||
| 11 | 97.74 | 1.0 | 0.15 | 0.1 | 1.0 | 0.01 | ||
Product testing result in the above-mentioned table:
The testing result of embodiment 1: the rate of spread: 77.0%, wetability: 65.6mN, fusing point: 215 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.30 μ ' Ω .cm, QFP 45 ° of tension test: the 24.25N that go between, slice component solder joint shearing test: 30.00N.
The testing result of embodiment 2: the rate of spread: 77.2%, wetability: 65.4mN, fusing point: 217 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.30 μ ' Ω .cm, QFP 45 ° of tension test: the 24.23N that go between, slice component solder joint shearing test: 31.20N.
The testing result of embodiment 3: the rate of spread: 77.8%, wetability: 65.8mN, fusing point: 218 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.31 μ ' Ω .cm, QFP 45 ° of tension test: the 24.00N that go between, slice component solder joint shearing test: 31.10N.
The testing result of embodiment 4: the rate of spread: 78.3%, wetability: 66.0mN, fusing point: 220 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.30 μ ' Ω .cm, QFP 45 ° of tension test: the 24.22N that go between, slice component solder joint shearing test: 31.05N
The testing result of embodiment 5: the rate of spread: 78.1%, wetability: 65.7mN, fusing point: 220 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.32 μ ' Ω .cm, QFP 45 ° of tension test: the 24.10N that go between, slice component solder joint shearing test: 31.10N.
The testing result of embodiment 6: the rate of spread: 77.5%, wetability: 65.6mN, fusing point: 218 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.31 μ ' Ω .cm, QFP 45 ° of tension test: the 24.00N that go between, slice component solder joint shearing test: 30.50N.
The testing result of embodiment 7: the rate of spread: 77.7%, wetability: 65.5mN, fusing point: 217 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.30 μ ' Ω .cm, QFP 45 ° of tension test: the 24.22N that go between, slice component solder joint shearing test: 30.20N.
The testing result of embodiment 8: the rate of spread: 77.1%, wetability: 66.0mN, fusing point: 216 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.32 μ ' Ω .cm, QFP 45 ° of tension test: the 24.23N that go between, slice component solder joint shearing test: 31.10N
The testing result of embodiment 9: the rate of spread: 77.5%, wetability: 65.6mN, fusing point: 218 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.30 μ ' Ω .cm, QFP 45 ° of tension test: the 24.00N that go between, slice component solder joint shearing test: 30.40N.
The testing result of embodiment 10: the rate of spread: 78.1%, wetability: 65.9mN, fusing point: 217 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.32 μ ' Ω .cm, QFP 45 ° of tension test: the 24.25N that go between, slice component solder joint shearing test: 30.7.00N.
The testing result of embodiment 11: the rate of spread: 77.6%, wetability: 66.0mN, fusing point: 220 ℃, metallographic (amplifying 200 times): metallographic structure is even, grain refinement, resistivity: 1.32 μ ' Ω .cm, QFP 45 ° of tension test: the 24.21N that go between, slice component solder joint shearing test: 31.10N.
Claims (3)
1. lead-free solder that solder is used is characterized in that it is made up of following weight percentages:
Copper 0.1～1.0%, nickel 0.1～0.2%, cerium 0.01～0.10%,
Bismuth 0.05～2.0%, praseodymium or neodymium 0.01～0.10% and surplus are tin.
2. lead-free solder that solder is used is characterized in that it is made up of following weight percentages:
Copper 0.1～1.0%, nickel 0.1～0.2%, cerium 0.01～0.10%,
Bismuth 0.05～2.0%, praseodymium and neodymium 0.01～0.10% and surplus are tin, and the weight proportion of praseodymium and neodymium is 1: 1.
3. the lead-free solder that solder according to claim 1 and 2 is used is characterized in that copper consumption 0.5～0.7% in the described lead-free solder, nickel consumption 0.15～0.2%, cerium consumption 0.02～0.05%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101761550A CN100528457C (en) | 2007-10-22 | 2007-10-22 | Lead-free solder for soft soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101761550A CN100528457C (en) | 2007-10-22 | 2007-10-22 | Lead-free solder for soft soldering |
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| Publication Number | Publication Date |
|---|---|
| CN101138813A true CN101138813A (en) | 2008-03-12 |
| CN100528457C CN100528457C (en) | 2009-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101761550A Expired - Fee Related CN100528457C (en) | 2007-10-22 | 2007-10-22 | Lead-free solder for soft soldering |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101564803B (en) * | 2008-07-15 | 2011-11-23 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
| CN103014411A (en) * | 2012-12-25 | 2013-04-03 | 东南大学 | Sn-Nd-Ni intermediate alloy and preparation method thereof |
| CN113770589A (en) * | 2021-10-09 | 2021-12-10 | 浙江亚通焊材有限公司 | Lead-free solder for high-performance electronic industry |
| CN114535860A (en) * | 2022-02-21 | 2022-05-27 | 红河学院 | Pr or Sm reinforced Sn-58Bi lead-free solder |
-
2007
- 2007-10-22 CN CNB2007101761550A patent/CN100528457C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101564803B (en) * | 2008-07-15 | 2011-11-23 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
| CN103014411A (en) * | 2012-12-25 | 2013-04-03 | 东南大学 | Sn-Nd-Ni intermediate alloy and preparation method thereof |
| CN113770589A (en) * | 2021-10-09 | 2021-12-10 | 浙江亚通焊材有限公司 | Lead-free solder for high-performance electronic industry |
| CN113770589B (en) * | 2021-10-09 | 2023-02-28 | 浙江亚通新材料股份有限公司 | Lead-free solder for high-performance electronic industry |
| CN114535860A (en) * | 2022-02-21 | 2022-05-27 | 红河学院 | Pr or Sm reinforced Sn-58Bi lead-free solder |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100528457C (en) | 2009-08-19 |
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| C14 | Grant of patent or utility model | ||
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