CN101136387A - Tape coiling structure applied to packag - Google Patents
Tape coiling structure applied to packag Download PDFInfo
- Publication number
- CN101136387A CN101136387A CNA2006101120701A CN200610112070A CN101136387A CN 101136387 A CN101136387 A CN 101136387A CN A2006101120701 A CNA2006101120701 A CN A2006101120701A CN 200610112070 A CN200610112070 A CN 200610112070A CN 101136387 A CN101136387 A CN 101136387A
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- winding
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- zone
- strip
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- 239000002184 metal Substances 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 238000004804 winding Methods 0.000 claims description 92
- 238000005538 encapsulation Methods 0.000 claims description 29
- 239000012528 membrane Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical group [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
This invention relates to a reel used in loading and packaging and roll film cover, in which, multiple penetrated holes are set near the edges of both sides of the reel to divide it into multiple regions with multiple metal pins in each, and a metal layer is set around each hole and metal layers of adjacent penetrated holes are connected with metal micro-strips.
Description
Technical field
The present invention relates to a kind of structure of winding, relate in particular to a kind of rewinding structure that is applied in semiconductor packages.
Background technology
Many now chip for driving all adopt the structure dress technology of Bare Die to make, and Bare Die structure dress mostly uses winding to encapsulate.Actual coil type encapsulation then comprises coil type carrying (Tape Carrier Package; TCP) encapsulation and coil type membrane of flip chip (Chip on Film; COF) type such as encapsulation.With regard to present stage, the chip for driving on the display panels (LCD Panel) mostly encapsulates (TCP) with the winding carrying or coil type membrane of flip chip (COF) is used as main packaged type.
The winding of being adopted in the coil type packaging technology is at pi (polyimide, PI) go up to form the pattern that includes interior pin (Inner Lead) pin circuitry and inside and outside being connected with outer pin (Outer Lead), to connect the pattern covers of inside and outside pin circuitry then with a kind of anti-scolder, and expose inside and outside pin.For example the interior bonds technology that is adopted in winding carrying encapsulation (TCP) technology is mainly coil type crystal grain and engages (TAB) automatically, and technology roughly can be distinguished into two sections: interior pin engages (Inner Lead Bonding:ILB); Outer pin engages (Outer Lead Bonding:OLB), and it is to utilize the winding that is equipped with metal pins to finish online with chip with interior pin joining technique.Engage (Wire Bonding) technology with traditional routing and compare, the metal pad spacing (Pad Pitch) that the advantage of winding carrying encapsulation is to dwindle chip.
Fig. 1 is the winding schematic diagram of the coil type carrying encapsulation of prior art.General winding may be partitioned into a plurality of regional 10, includes a plurality of metal pins 12 (interior pin or outer pin) and a plurality of through holes 14 (holes) that are distributed in the winding both sides of the edge in each zone 10.In addition, place, the both sides of the edge in zone 10 can also plate metal level 16, wherein also has a plurality of through holes 14 to be arranged at 16 of metal levels; Simultaneously, has the chip join zone 18 of rectangle in the winding, so that allow the metal salient point on the chip active surface be connected with interior metal pins in the winding, shown in Figure 1A by the place, rectangular area.In addition, the winding of coil type encapsulation can also be the winding of a kind of coil type membrane of flip chip (COF), shown in Figure 1B.In Figure 1B, because of the interior pin 12 of COF winding is directly to be attached in the winding, therefore can reach the following thin space requirement of Pad Pitch 40 μ m, in addition, the COF winding also has the chip join zone 18 of rectangle, so that allow the metal salient point on the chip active surface be connected with interior metal pins in the winding by the place, rectangular area, the while can also with the TCP shared device.
In order to reach the intensity of antistatic protection and reinforcement winding, in prior art, be to form a metal level respectively in the both sides of winding.Because the width of the metal level of prior art is bigger, its width regions is contained whole through hole, though can effectively increase the intensity of through hole, can be used for antistatic protection simultaneously, but also may when the winding transmission, produce particle problem, the qualification rate of the product of advanced high-density packages is exerted an influence.Therefore the present invention proposes a kind of rewinding structure with metal micro-strip, not only can dwindle the area of metal level significantly, the effect that can also have antistatic protection originally and increase through hole (hole) intensity.
Summary of the invention
In above-mentioned background of invention, in order to meet the demand of some interests on the industry, the invention provides a kind of rewinding structure with metal micro-strip, can be in order to dwindle the area of above-mentioned traditional metal level.
Main purpose of the present invention is to provide a kind of winding of coil type membrane of flip chip encapsulation, be the formed soft base plate of macromolecular material, be divided into the chip join zone that comprises rectangle in a plurality of zones and each zone on it and be distributed in rectangular dies engaging zones a plurality of metal pins all around, wherein being characterized as of winding: between line of cut in the winding and winding both sides of the edge, a metal micro-strip is set.
Another main purpose of the present invention is to provide a kind of winding of coil type encapsulation, be the formed soft base plate of macromolecular material, be divided into the chip join zone that comprises rectangle in a plurality of zones and each zone and the chip join zone a plurality of metal pins all around that are distributed in rectangle, wherein being characterized as of this winding on it: a metal micro-strip all is set on the both sides of the edge of winding.
A main purpose more of the present invention is to provide a kind of winding of coil type encapsulation, be the formed soft base plate of macromolecular material, be provided with a plurality of through holes near the both sides of the edge of winding, and a plurality of metal pins at least one end face in chip join zone that in winding, is divided into the chip join zone that comprises rectangle in a plurality of zones and each zone and is distributed in rectangle, being characterized as of winding wherein: the metal level of a live width is all arranged around the through hole, and connect each this through hole with the metal micro-strip that is parallel to these winding both sides of the edge at least.
Description of drawings
Fig. 1 is the schematic diagram of metal micro-strip in the prior art;
Fig. 2 A～2C is the rewinding structure vertical view of coil type carrying encapsulation of the present invention;
Fig. 3 is the vertical view that the coil type of no through hole of the present invention carries the rewinding structure of encapsulation;
Fig. 4 A～4D is the rewinding structure vertical view of coil type membrane of flip chip encapsulation of the present invention; And
Fig. 5 A～5B is the rewinding structure vertical view of the coil type membrane of flip chip encapsulation of no through hole of the present invention
The main element description of symbols
10 zones
Pin in 12
14 through holes
16 metal levels
18 chip join zones
The zone of 30 winding
The composition surface of 31 winding
Pin in 32 metals
The both sides of the edge of 33 winding
34 through holes
35 chip join zones
36 metal micro-strip
37 lines of cut
38 outer pins
The metal level of 40 through holes
Embodiment
The present invention is a kind of rewinding structure that is used for the coil type encapsulation in this direction of inquiring into, simultaneously because the rewinding structure of coil type encapsulation has comprised winding carrying encapsulation (TCP) and coil type membrane of flip chip types such as (Chip on Film), so this two kinds of rewinding structures are described in preferred embodiment meeting of the present invention in detail.Yet except these were described in detail, the present invention can also use in other embodiments widely, and scope of the present invention do not limited, and it is as the criterion with claim.
At first, please refer to Fig. 2, is the vertical view of the specific embodiment of winding of the present invention.Winding of the present invention is to be divided into a plurality of regional 30 on the formed soft base plate of pi (PI), and a composition surface 31 is set in each zone 30, it is between the line of cut 37 of winding, circuit pattern (layout), a plurality of through hole 34 and a chip join zone 35 of pin 32 and outer pin (not being shown among the figure) in including on the composition surface 31, wherein through hole 34 is between the both sides of the edge 33 of line of cut 37 and winding, simultaneously, the shape in chip join zone 35 typically uses rectangular configuration.And then use welding resisting layer that the circuit pattern beyond the chip join zone 35 is covered, only expose the pin 32 that is positioned at the chip join zone, and in winding, form metal micro-strip 36.
In Fig. 2 of present embodiment A, above-mentioned metal micro-strip 36 is arranged at respectively on the both sides of the edge 33 of winding.In Fig. 2 of present embodiment B, the metal level 40 of a live width is all arranged around each through hole 34, and the metal level 40 around the adjacent through hole 34 is to be with 36 to connect so that at least one strip metal is little.Therefore, the metal level 40 that is connected constitutes a connection chain with metal micro-strip 36, and connection chain is between both sides of the edge 33 that are parallel to winding and line of cut 37; In addition, the connected mode of above-mentioned connection chain also can use metal micro-strip 36 to form connection at a side of metal level 40, shown in Fig. 2 C.
Above-mentioned Fig. 2 A, Fig. 2 B and Fig. 2 C disclose the rewinding structure that is used for winding carrying encapsulation (TCP) of the present invention.In above-mentioned rewinding structure, in the metal pin 32 can be arranged at chip join zone 35 around, two relative edges in chip join zone 35 or the two-phase in chip join zone 35 face the limit, cooperate the design of chip even, and can be arranged on arbitrary limit in chip join zone 35.In addition, the width of the metal level 40 around above-mentioned metal micro-strip 36 or the through hole can less than or equal 4 millimeters (mm).
In addition, in an embodiment of the present invention, also chip join zone 35 can be hollowed out and form an opening (device hole) (not being shown among the figure), and, also be embodiments of the present invention for the formed winding of this kind structure.Simultaneously, winding of the present invention will be excised the part winding that is positioned at beyond the packaging body with winding along line of cut 37 after finishing encapsulation with chip, to finish the program of encapsulation, that is to say that after finishing the technology of Chip Packaging, the metal micro-strip in the winding of the present invention can be cut.
In addition, when the mode of using cylinder (Roller) is come the transmission winding, at this moment, then can not need through hole in the winding.So in the winding of winding carrying encapsulating structure of the present invention, can not have through hole, as shown in Figure 3.In Fig. 3 of present embodiment, above-mentioned metal micro-strip 36 is to be arranged on the both sides of the edge 33 of winding.Same, when the winding in the present embodiment after finishing encapsulation with chip, winding will be excised the part winding that is positioned at beyond the packaging body along line of cut 37, to finish the program of encapsulation.
Then, please refer to Fig. 4, is the vertical view of the rewinding structure of a kind of coil type membrane of flip chip of the present invention (COF).As shown in Figure 4, winding in the present embodiment is to be divided into a plurality of regional 30 on the formed soft base plate of pi (PI), and a composition surface 31 is set in each zone 30, between the line of cut 37 of winding, the circuit pattern (layout) of pin 32 and outer pin 38 in including on the composition surface 31, and then use welding resisting layer will connect the circuit pattern covering of inside and outside pin, only expose interior pin 32 and outer pin 38, and in winding, form metal micro-strip 36.
In Fig. 4 of present embodiment A, above-mentioned metal micro-strip 36 lays respectively between both sides through hole 34 and the line of cut 37.And in the 4B figure of present embodiment, above-mentioned metal micro-strip 36 is arranged on the both sides of the edge 33 of winding.In Fig. 4 of present embodiment C, the metal level 40 of live width is all arranged around each through hole 34, and the metal level 40 around the adjacent through hole 34 connects with metal micro-strip 36 at least.Therefore, the metal level 40 that is connected constitutes connection chain with metal micro-strip 36, and connection chain is positioned at the both sides of the edge 33 that are parallel to winding; In addition, the connected mode of above-mentioned connection chain also can use metal micro-strip 36 to form connection at a side of metal level 40, shown in Fig. 4 D.In addition, in the rewinding structure of present embodiment, pin 32 also can cooperate the design of chip that it is arranged to matrix form in the metal, or is arranged to tetragonal structure or is arranged to two two opposite rows structures etc.In addition, the width of the metal level 40 around above-mentioned metal micro-strip 36 or the through hole can less than or equal 4 millimeters (mm).
In addition, in an embodiment of the present invention, also chip join zone 35 can be hollowed out and form an opening (device hole) (not being shown among the figure), and, also be embodiments of the present invention for the formed winding of this kind structure.Same, when the winding in the present embodiment after finishing encapsulation with chip, winding will be excised the part winding that is positioned at beyond the packaging body along line of cut 37, to finish the program of encapsulation.
Same, when the mode of using cylinder (Roller) is come the winding of transmission coil type membrane of flip chip, at this moment, then can not need through hole in the winding.So in the winding of coil type package structure membrane of flip chip package of the present invention, can not have through hole, as shown in Figure 5.In Fig. 5 of present embodiment A, metal micro-strip 36 lays respectively between the both sides of the edge 33 and line of cut 37 of winding.And in Fig. 5 of present embodiment B, above-mentioned metal micro-strip 36 is arranged on the both sides of the edge 33 of winding.Same, when the winding in the present embodiment after finishing encapsulation with chip, winding will be excised the part winding that is positioned at beyond the packaging body along line of cut 37, to finish the program of encapsulation.
Clearly, feature of the present invention is with the roomy metal level microminiaturization in the prior art compared with the prior art, and does different settings in the position of little metal micro-strip.Apparently, according to the description among the top embodiment, the present invention has many corrections and difference.Therefore need be understood in the scope of its additional claim item, except above-mentioned detailed description, the present invention can also implement widely in other embodiments.Above-mentioned is preferred embodiment of the present invention only, is not in order to limit claim of the present invention; All other do not break away from the equivalence of being finished under the disclosed spirit and changes or improvement, all should be included in the claim.
Claims (10)
1. the winding of a membrane of flip chip encapsulation, it is the formed soft base plate of macromolecular material, is divided on it in a plurality of zones and each above-mentioned these zone a plurality of metal pins all are set, and it is characterized by:
One metal micro-strip is set between the both sides of the edge of this winding and the line of cut.
2. winding according to claim 1 is characterized by further to be provided with in above-mentioned these zones on chip join zone and this chip join zone and has opening.
3. winding according to claim 1 is characterized by near the two edges of this winding, all further is provided with a plurality of through holes.
4. the winding of a coil type encapsulation, it is the formed soft base plate of macromolecular material, is divided on it in a plurality of zones and each above-mentioned these zone a plurality of metal pins all are set, and it is characterized by:
One metal micro-strip all is set on the both sides of the edge of this winding.
5. according to claim 4 described winding, it is characterized by further to be provided with in above-mentioned these zones on chip join zone and this chip join zone and have opening.
6. according to claim 4 described winding, it is characterized by near the two edges of this winding, all further be provided with a plurality of through holes.
7. the winding of a coil type encapsulation, it is the formed soft base plate of macromolecular material, be provided with a plurality of through holes near the both sides of the edge of this winding, and in this winding, be divided in a plurality of zones and each above-mentioned these zone a plurality of metal pins all are set, it is characterized by:
Around each above-mentioned through hole a metal level with live width is set all, and connects each above-mentioned through hole with at least one metal micro-strip that is parallel to these winding both sides of the edge.
8. according to claim 7 described winding, it is characterized by further to be provided with in above-mentioned these zones on chip join zone and this chip join zone and have opening.
9. according to claim 7 described winding, it is characterized by macromolecular material is pi.
10. according to claim 7 described winding, it is characterized by the metal micro-strip that connects each above-mentioned through hole is to form connection chain with the metal level that connects this through hole one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101120701A CN101136387A (en) | 2006-08-29 | 2006-08-29 | Tape coiling structure applied to packag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101120701A CN101136387A (en) | 2006-08-29 | 2006-08-29 | Tape coiling structure applied to packag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101136387A true CN101136387A (en) | 2008-03-05 |
Family
ID=39160362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101120701A Pending CN101136387A (en) | 2006-08-29 | 2006-08-29 | Tape coiling structure applied to packag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101136387A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098671A (en) * | 2010-10-01 | 2016-11-09 | Lg伊诺特有限公司 | Carrying belt and manufacture method thereof for TAB encapsulation |
| CN108615698A (en) * | 2016-12-09 | 2018-10-02 | 南茂科技股份有限公司 | tape conveying device |
| CN110491281A (en) * | 2019-08-09 | 2019-11-22 | 深圳市华星光电技术有限公司 | Flip chip component and display panel assembly |
| CN110519930A (en) * | 2019-08-27 | 2019-11-29 | 江苏上达电子有限公司 | A method of it prevents from generating metallic foreign body in COF winding production |
| CN110600451A (en) * | 2018-06-12 | 2019-12-20 | 南茂科技股份有限公司 | Flexible circuit substrate and chip-on-film package structure |
-
2006
- 2006-08-29 CN CNA2006101120701A patent/CN101136387A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098671A (en) * | 2010-10-01 | 2016-11-09 | Lg伊诺特有限公司 | Carrying belt and manufacture method thereof for TAB encapsulation |
| CN108615698A (en) * | 2016-12-09 | 2018-10-02 | 南茂科技股份有限公司 | tape conveying device |
| CN108615698B (en) * | 2016-12-09 | 2020-10-16 | 南茂科技股份有限公司 | Tape conveying device |
| CN110600451A (en) * | 2018-06-12 | 2019-12-20 | 南茂科技股份有限公司 | Flexible circuit substrate and chip-on-film package structure |
| CN110600451B (en) * | 2018-06-12 | 2021-03-30 | 南茂科技股份有限公司 | Flexible circuit substrate and chip-on-film package structure |
| CN110491281A (en) * | 2019-08-09 | 2019-11-22 | 深圳市华星光电技术有限公司 | Flip chip component and display panel assembly |
| WO2021027076A1 (en) * | 2019-08-09 | 2021-02-18 | Tcl华星光电技术有限公司 | Chip on film assembly and display panel assembly |
| CN110519930A (en) * | 2019-08-27 | 2019-11-29 | 江苏上达电子有限公司 | A method of it prevents from generating metallic foreign body in COF winding production |
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Open date: 20080305 |