CN101128540B - Resin composition having low odor - Google Patents
Resin composition having low odor Download PDFInfo
- Publication number
- CN101128540B CN101128540B CN2006800049702A CN200680004970A CN101128540B CN 101128540 B CN101128540 B CN 101128540B CN 2006800049702 A CN2006800049702 A CN 2006800049702A CN 200680004970 A CN200680004970 A CN 200680004970A CN 101128540 B CN101128540 B CN 101128540B
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- China
- Prior art keywords
- resin
- zeolite
- resin composition
- sub
- low odor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims abstract description 57
- 239000010457 zeolite Substances 0.000 claims abstract description 81
- 229910021536 Zeolite Inorganic materials 0.000 claims abstract description 80
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims abstract description 80
- 229920005989 resin Polymers 0.000 claims abstract description 72
- 239000011347 resin Substances 0.000 claims abstract description 72
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 58
- 238000000465 moulding Methods 0.000 claims abstract description 50
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 40
- 229920001955 polyphenylene ether Polymers 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 21
- 235000012239 silicon dioxide Nutrition 0.000 claims description 20
- 229960001866 silicon dioxide Drugs 0.000 claims description 20
- 239000006229 carbon black Substances 0.000 claims description 15
- 239000011734 sodium Substances 0.000 claims description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 7
- 229910052708 sodium Inorganic materials 0.000 claims description 7
- 238000002425 crystallisation Methods 0.000 claims description 6
- 230000008025 crystallization Effects 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 229910052784 alkaline earth metal Chemical group 0.000 claims description 3
- 150000001342 alkaline earth metals Chemical group 0.000 claims description 2
- 229910052728 basic metal Inorganic materials 0.000 claims 1
- 150000003818 basic metals Chemical group 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 28
- 238000000034 method Methods 0.000 description 20
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 235000019241 carbon black Nutrition 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 12
- 239000006258 conductive agent Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 239000000654 additive Substances 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000001179 sorption measurement Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- -1 photostabilizer Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920006324 polyoxymethylene Polymers 0.000 description 6
- 239000011164 primary particle Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 235000012222 talc Nutrition 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 229930182556 Polyacetal Natural products 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920001893 acrylonitrile styrene Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 229920005669 high impact polystyrene Polymers 0.000 description 3
- 239000004797 high-impact polystyrene Substances 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 238000005342 ion exchange Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000000088 plastic resin Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004902 Softening Agent Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920006132 styrene block copolymer Polymers 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 238000001149 thermolysis Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- PNWJXICONNROSM-UHFFFAOYSA-N ethene;prop-2-enenitrile;styrene Chemical compound C=C.C=CC#N.C=CC1=CC=CC=C1 PNWJXICONNROSM-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical class OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 235000020777 polyunsaturated fatty acids Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/02—Wrappers or flexible covers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
Abstract
A resin composition that without detriment to the original various properties of thermoplastic resin, excels in the appearance of molding, and that has odor reduced at high-temperature heating of thermoplastic resin and high-temperature heating of resin molding. There is employed a low-odor resin composition comprising 100 pts.wt. of thermoplastic resin (A) and 0.1 to 5.0 pts.wt. of zeolite (B) ofthe formula: M<SUB>2/n</SUB>Ol<SUB>2</SUB>O<SUB>3</SUB>xSiO<SUB>2</SUB>H<SUB>2</SUB>O (1) wherein M is an ion-exchangeable univalent or bivalent metal; n is the atomic valence of metal represented byM; x is a silica coefficient (SiO<SUB>2</SUB>/Al<SUB>2</SUB>O<SUB>3</SUB> molar ratio) of 10 to 500, and y is a number of crystal water ranging from 0 to 7.
Description
Technical field
The present invention relates to resin composition having low odor, in more detail, when the present invention relates to reduce the melting mixing thermoplastic resin composition or the resin composition having low odor of the peculiar smell that produces during heat moulding product, and the IC pallet of the outward appearance excellence that this resin combination moulding is obtained.
Background technology
Because physical strength, formability, in light weight, outward appearance is excellent, thermoplastic resin uses with extensive fields such as materials and sundry goods in a large number in communication information business automation equipment purposes, precision instrument purposes, optical correlation purposes, tame electrical article, trolley part, medical use, building materials, agricultural.But, in order further to improve thermotolerance, weathering resistance, flame retardant resistance, static resistance, non-stick property and flowability etc., for most thermoplastic resin, need be when the melting mixing of this thermoplastic resin or additive such as mixture heat stablizer, antioxidant, UV light absorber, photostabilizer, fire retardant, static inhibitor, release agent, softening agent during moulding.
In addition, during the melting mixing thermoplastic resin or during forming process thermoplastic resin is heated to high temperature and carries out moulding, for example, styrene resin is mostly at 200～280 ℃ high-temperature molding, and poly (phenylene ether) resin or polycarbonate resin are mostly at 260 ℃～360 ℃ high-temperature molding.
Further, when the moulding product for example are to transmit in the situation of the IC pallet that uses in the operation in IC (integrated circuit (unicircuit)) manufacturing process or IC, cure operation below the existence: IC chip or wafer (wafer) etc. is put into the IC pallet, in baking oven, heat, so that the such volatile impunty of the small amount of moisture that is contained in the IC assemblage, alkali ion, Br ion or Cl ion is escaped.
Therefore, if residual moisture or gaseous constituent among the IC bring critical defect then for the precision of IC, thereby to cure operation be very important operation.This cures in the operation, and IC is put into the IC pallet, in the baking chamber that is set to the temperature more than 120 ℃ moisture or impurity volatilization is removed.Recently, be to improve the reliability of IC, have stoving temperature is brought up to trend more than 150 ℃.
Like this, thermoplastic resin exist when the melting mixing of this thermoplastic resin or during moulding and during moulding product use etc. in heat problem such as generation peculiar smell, described peculiar smell is the peculiar smell of thermoplastic resin itself or the peculiar smell that the thermoplastic resin thermolysis causes, peculiar smell that the additive that is added during further for the moulding of thermoplastic resin causes because of thermolysis or gasification etc.Such peculiar smell has following problem: as foul smell, can significantly damage operating environment and surrounding enviroment.
In order to tackle the problems referred to above, for example, people disclose polyphenylene ether based resin composition (patent documentation 1), and described polyphenylene ether based resin composition comprises: (A) resin compound that formed by 100～50 weight % poly (phenylene ether) resins and 0～50 weight % styrene resin of 100 weight parts; (B) 5～40 weight part carbon blacks; (C) synthetic zeolite of 0.1～10 weight part, the micropore diameter of this synthetic zeolite are that the water adsorption power more than the 0.8nm, under 25 ℃/relative humidity of temperature, 10%/condition of normal pressure is more than the 20 weight %.But, in the patent documentation 1,, only pay attention to the water adsorption ability about synthetic zeolite, do not pay attention to the silicon-dioxide coefficient or the crystallization water yield of zeolite.In fact, among the embodiment of this patent documentation 1, only put down in writing the example that uses the low wetting ability zeolite of silicon-dioxide coefficient.Yet using water adsorption power is in the situation of the above synthetic zeolite of 20 weight %, has had to moulding product surface and has produced burnt hair (silvering mark), the relatively poor moulding product of outward appearance.
In addition, the resin additive is disclosed in the patent documentation 2, the malodorous inorganic powder that described resin produces when containing the mixing and moulding that can eliminate resin combination with additive is as main component, as this inorganic powder, can use the silico-aluminate of silicon-dioxide with specified proportion, metal oxide, aluminum oxide.But in the patent documentation 2, for having mixed the resin that specifically the provides resin combination of additive, about the record of moulding product outward appearance or physical strength, the silicon-dioxide coefficient of the inorganic powder of this concrete example is not lower in addition.
Patent documentation 1: the spy opens flat 07-138466 communique
Patent documentation 2: the spy opens flat 11-293032 communique
Summary of the invention
The above-mentioned problem of Wei Xie Decision, the moulding product (IC pallet etc.) that the invention provides a kind of resin combination and use this resin combination, described resin combination is the original various characteristics of lost heat plastic resin not, moulding product outward appearance excellence, and the peculiar smell that produces when the heating of high temperature such as the melting mixing of thermoplastic resin and forming process or during the heat at synthetic resin is reduced.
The inventor found that to have higher SiO by mixing in resin combination through further investigation
2/ Al
2O
3The zeolite of the silica alumina silicate of the high hydrophobicity of mol ratio can solve above-mentioned problem.Promptly, the inventor finds, by following means, resin composition having low odor etc. can be provided, described resin combination is the original various characteristics of lost heat plastic resin not, and in the time of can significantly reducing high temperature heating such as the melting mixing of this thermoplastic resin and forming process or the peculiar smell the during heat of moulding product produce, and also excellence very of the outward appearance of moulding product, thus the inventor has finished the present invention.
(1) resin composition having low odor with respect to 100 parts by weight of thermoplastic resin (A), has mixed the represented zeolite (B) of following formula (1) of 0.1～5.0 weight part, M in the described resin combination
2/nOAl
2O
3XSiO
2YH
2O (1)
In the formula (1), but M represents 1 valency of ion-exchange or the metal of divalent, and n represents the atomic valence of metal that M is represented, and x represents 10～500 silicon-dioxide coefficient (SiO
2/ Al
2O
3Mol ratio), y represents 0～7 crystallization water number.
(2) as 1 described resin composition having low odor, described thermoplastic resin (A) is made of polyphenylene ether (A-1) and styrene resin (A-2), and in this thermoplastic resin of 100 weight parts (A), comprise the above-mentioned polyphenylene ether (A-1) of 20～90 weight parts and the above-mentioned styrene resin (A-2) of 10～80 weight parts (below, be sometimes referred to as " thermoplastic resin (AA) ").
(3) resin composition having low odor, in the said composition with respect to 100 weight parts as (1) described resin composition having low odor, be mixed with 3.0～30 weight part carbon blacks (C).
(4) resin composition having low odor, in the said composition with respect to 100 weight parts as (2) described resin composition having low odor, be mixed with the carbon black (C) of 3.0～30 weight parts.
(5), with respect to the described thermoplastic resin of 100 weight parts (A), be mixed with the styrenic elastomerics (D) of 1～25 weight part in the said composition as any described resin composition having low odor in (1)～(4).
(6) as any described resin composition having low odor in (1)～(5), the M of wherein said zeolite (B) is a sodium.
(7) as any described resin composition having low odor in (1)～(6), the silicon-dioxide coefficient x of wherein said zeolite (B) is 20～60.
(8) as any described resin composition having low odor in (1)～(7), wherein said zeolite (B) is a MFI type zeolite.
(9) moulding product, described moulding product are for obtaining any described resin composition having low odor moulding in (1)～(8).
(10) IC pallet, described IC pallet is for obtaining any described resin composition having low odor moulding in (3)～(8).
(11) as (1) described resin composition having low odor, wherein, described thermoplastic resin (A) is thermoplastic resin (AA), and the M of described zeolite (B) is a sodium, and the silicon-dioxide coefficient x of described zeolite (B) is 20～60, and described zeolite (B) is the MFI type.
(12) as (1) described resin composition having low odor, wherein, described thermoplastic resin (A) is thermoplastic resin (AA), the M of described zeolite (B) is a sodium, the silicon-dioxide coefficient x of described zeolite (B) is 20～60, described zeolite (B) is the MFI type, and with respect to the described thermoplastic resin of 100 weight parts (AA), is mixed with the styrenic elastomerics (D) of 1～25 weight part in the said composition.
(13) as (1) described resin composition having low odor, in the said composition with respect to 100 weight parts as (1) described resin composition having low odor, be mixed with the carbon black (C) of 3.0～30 weight parts, and, described thermoplastic resin (A) is thermoplastic resin (AA), and then in the described composition with respect to the described thermoplastic resin of 100 weight parts (AA), be mixed with the styrenic elastomerics (D) of 1～25 weight part.
(14) as (1) described resin composition having low odor, in the said composition with respect to 100 weight parts as (1) described resin composition having low odor, be mixed with the carbon black (C) of 3.0～30 weight parts, and, described thermoplastic resin (A) is thermoplastic resin (AA), and the M of described zeolite (B) is a sodium, and the silicon-dioxide coefficient x of described zeolite (B) is 20～60, and described zeolite (B) is the MFI type.
(15) as (1) described resin composition having low odor, in the said composition with respect to 100 weight parts as (1) described resin composition having low odor, be mixed with the carbon black (C) of 3.0～30 weight parts, and, described thermoplastic resin (A) is thermoplastic resin (AA), and in the described resin composition having low odor with respect to the described thermoplastic resin of 100 weight parts (AA), be mixed with the styrenic elastomerics (D) of 1～25 weight part, the M of further described zeolite (B) is a sodium, the silicon-dioxide coefficient x of described zeolite (B) is 20～60, and described zeolite (B) is the MFI type.
(16) IC pallet, described IC pallet is for obtaining any described resin composition having low odor moulding in (13)～(15).
(17) IC pallet, described IC pallet is for obtaining (4) described resin composition having low odor moulding.
Resin composition having low odor of the present invention can be made the moulding product under the situation of the original various characteristics of lost heat plastic resin (A) not.Further, with resin composition having low odor moulding of the present invention when making the moulding product, because the generation of the peculiar smell that the heat in the melting mixing of this resin combination or the forming process etc. causes is few, therefore can keep suitable operating environment and surrounding enviroment.
Embodiment
Hereinafter, content of the present invention is elaborated.In addition, in the application's specification sheets, the numerical value that uses "～" to comprise with expression to be put down in writing before and after it is as the meaning of lower value and higher limit.
Thermoplastic resin (A)
Be not particularly limited for the thermoplastic resin (A) that uses in the present invention, but can enumerate polycarbonate resin; Styrene resins such as polystyrene resin, acrylonitrile-styrene (AS) resin, acrylonitrile-butadiene-styrene (ABS) (ABS) resin, vinyl cyanide-ethene-vinylbenzene (AES) resin; Methacrylic resins such as polymethylmethacrylate (PMMA) resin; Polyoxymethylene (polyacetal) resin; Polyamide-based resins such as polyamide 6, polyamide 66, polymeric amide MXD; Modification polyphenylene ether (MODIFIED PP E) resin; Polyphenylene sulfide; Polyester resins such as polyethylene terephthalate (PET) resin, polybutylene terephthalate (PBT) resin; Thermoplastic resins such as liquid crystalline polymers, the perhaps polymer alloy that constitutes by these two or more at least thermoplastic resins.Wherein, polyamide-based resin, modification poly (phenylene ether) resin, polyester resin, polyoxymethylene (polyacetal) resin are preferred, because when they have the forming process that reduces thermoplastic resin greatly or the effect of the peculiar smell that causes of the pyroprocessing when using (amine or aldehydes that the raw material during for example, by resin manufacture, catalyzer, additive etc. produce).Especially the situation that is used for the IC pallet at described resin combination, there is the annealing operation before using and when IC uses, cures treatment process with the high temperature more than 120 ℃, to the effect as the reduction peculiar smell of the thermoplastic resin (for example, modification polyphenylene ether resin) of the raw material of this IC pallet is very effective.
In the present invention, for modification polyphenylene ether resin, be preferably the modification polyphenylene ether resin (thermoplastic resin (AA)) that constitutes by 20～90 weight part polyphenylene ethers (A-1) and 10～80 parts by weight of styrene resinoids (A-2) as thermoplastic resin (A).Especially in the situation that is used for IC pallet purposes, the modification polyphenylene ether resin that constitutes by 40～90 weight part polyphenylene ethers (A-1) and 10～60 parts by weight of styrene resinoids (A-2) more preferably.By making polyphenylene ether is more than 20 weight parts, have and further to be suppressed at the load texturing temperature down or the trend of physical strength reduction, and by making polyphenylene ether is below 90 weight parts, have and further to suppress mobile and reduce, can simplify the trend of molding procedure, so be preferred.
Above-mentioned polyphenylene ether (A-1) is preferably the polymkeric substance that main chain has the represented structural unit of following formula (2).
(in the formula (2), R
1The expression carbonatoms is 1～3 low alkyl group, R
2And R
3Represent that independently of one another hydrogen atom or carbon atom are 1～3 low alkyl group.)
The polymkeric substance that main chain has the represented structural unit of this formula (2) can be homopolymer or multipolymer.
As polyphenylene ether (A-1), specifically, can enumerate poly-(2,6-dimethyl-1,4-phenylene) ether, poly-(2,6-diethyl-1, the 4-phenylene) ether, poly-(2,6-dipropyl-1,4-phenylene) ether, poly-(2-methyl-6-ethyl-1, the 4-phenylene) ether, poly-(2-methyl-6-propyl group-1,4-phenylene) ether etc. especially preferably gather (2,6-dimethyl-1, the 4-phenylene) ether, 2,6-xylenol/2,3,6-pseudocuminol multipolymer.
It is the polyphenylene ether of 0.3～0.6dl/g that polyphenylene ether used in the present invention (A-1) is preferably 30 ℃ the limiting viscosity that mensuration obtains in the chloroform.By limiting viscosity is set at more than the 0.3dl/g, the physical strength of resin combination has the trend of raising, in addition, by limiting viscosity is set at below the 0.6dl/g, the insufficient tendency that can further suppress mobile is arranged, so be preferred.
About styrene resin used in the present invention (A-2), but can enumerate the monomeric multipolymer of polymkeric substance, styrene monomer and other copolymerization of styrene monomer and styrenic graft copolymer etc.But, for example, can enumerate AS resin etc. as the monomeric multipolymer of styrene monomer and other copolymerization.As the styrenic graft copolymer, for example, can enumerate high-impact polystyrene (HIPS) resin, ABS resin, AES resin, AAS resin etc.As the manufacture method of styrene copolymer, can enumerate known methods such as emulsion polymerization, solution polymerization process, suspension polymerization or mass polymerization.
As styrene monomer, for example, can enumerate vinylbenzene, alpha-methyl styrene, p-methylstyrene etc., can preferably enumerate vinylbenzene.As can with the monomer of styrene monomer copolymerization, for example, can enumerate vinyl cyanide monomer such as vinyl cyanide, methacrylonitrile, (methyl) alkyl acrylates such as methyl acrylate, ethyl propenoate, propyl acrylate, methyl methacrylate, Jia Jibingxisuanyizhi, maleimide, N-phenylmaleimide etc. can preferably be enumerated vinyl cyanide base monomer, (methyl) alkyl acrylate.
Styrenic elastomerics (D)
In order further to improve shock strength, preferred benzene mixed vinyl elastomerics (D) in the thermoplastic resin in the present invention (A).About the styrenic elastomerics (D) of preferably sneaking among the present invention, can enumerate following segmented copolymer: hard section is made of styrene polymer, soft section by being selected from by polyhutadiene, at least a polymkeric substance in the group that polyisoprene and their hydrogenation thing are formed constitutes, specifically, can enumerate SBS (styrene/butadiene/styrene block copolymers), SIS (styrene/isoprene/styrene segmented copolymer), SEBS (the hydrogenation thing of styrene/ethylene/butylene/styrene block copolymer: SBS), SEPS (the hydrogenation thing of styrene/ethylene/propylene/styrene segmented copolymer: SIS) etc., preferred especially SEBS.
The composition of hard section of styrenic elastomerics (D) and soft section can suitably be selected in 10: 90 to 90: 10, preferred 10: 90 to 50: 50 scope usually, the combination of section block and this soft section block can be the diblock type firmly, also can be three block types.
With respect to 100 parts by weight of thermoplastic resin (A), the blending ratio of styrenic elastomerics (D) is preferably 1～25 weight part, more preferably 3～20 weight parts, more preferably 5～15 weight parts.Be set at more than 1 weight part by the blending ratio with styrenic elastomerics (D), what shock strength was arranged improves the even more ideal tendency of effect.In addition, being set at below 25 weight parts by the blending ratio with styrenic elastomerics (D), the rigidity that can suppress resin combination, the tendency that the texturing temperature under load reduces are arranged, is preferred therefore.
Zeolite (B)
Zeolite used in the present invention (B) is the represented material of following formula (1).The silico-aluminate of this zeolite (B) for constituting by the three-dimensional framework structure.
M
2/nO·Al
2O
3·xSiO
2·yH
2O (1)
(in the formula (1), but M represents 1 valency of ion-exchange or the metal of divalent, and n represents the atomic valence of metal that M is represented, and x represents 10～500 silicon-dioxide coefficient (SiO
2/ Al
2O
3Mol ratio), y represents 0～7 crystallization water number.)
Natural zeolite and synthetic zeolite are arranged in the zeolite, the wetting ability zeolite that silicon-dioxide coefficient low (less than 10) arranged in the synthetic zeolite (for example, A type zeolite, X type zeolite, y-type zeolite etc.) and the hydrophobic zeolite (for example, MFI type zeolite) of silicon-dioxide coefficient height (more than 10).
At this, zeolite used in the present invention (B) is a hydrophobic zeolite, considers preferred MFI type zeolite from be easy to the acquisition aspect by market.This hydrophobic MFI type zeolite has 3 dimension grid structures, and described 3 dimension grid structures have the micropore inlet that is formed by 10 yuan of oxygen rings, and constitutes by the linearity micropore with spination micropore that they are reported to the leadship after accomplishing a task, and for example, preferred effective micropore diameter is 5～6
Ellipse, micropore volume be that 0.15～0.25mL/g, specific surface area are 300～550m
2The MFI type zeolite of/g, more preferably effective apearture directly is 5～6
Ellipse, micropore volume be that 0.15～0.25mL/g, specific surface area are 300～450m
2The MFI type zeolite of/g.
Zeolite used in the present invention (B) need be the represented zeolite of above-mentioned formula (1), but and as 1 valency of the represented ion-exchange of M or the metal of divalent, preferred as alkali or alkaline-earth metal, more preferably sodium.In addition, in formula (1), preferred silicon-dioxide coefficient x be 20～100 and crystallization water number y be 0～7 zeolite.Further, preferably the water adsorption power under 25 ℃/relative humidity of temperature 10%/non-pressurized condition is less than the zeolite of 20 weight %, more preferably the water adsorption power under the same terms is less than the zeolite of 15 weight %, and the water adsorption power under further preferred the same terms is less than the zeolite of 10 weight %.
Especially above-mentioned formula (1) represented, silicon-dioxide coefficient x be 20～60 and water adsorption power under 25 ℃/relative humidity of temperature 10%/non-pressurized condition have high heat resistance and high hydrophobicity less than the zeolite of 10 weight %, and also have by the moulding product that the resin composition having low odor that has mixed this zeolite obtains and not produce burnt hair and the very excellent feature of outward appearance.
The average primary particle diameter of zeolite used in the present invention (B) is preferably 0.1～20 μ m, more preferably 0.2～10 μ m, more preferably 0.5～5 μ m.Be set at more than the 0.1 μ m by average primary particle diameter zeolite (B), the tendency that has the melt viscosity of resin combination not become too high, and by described average primary particle diameter being set at below the 20 μ m, have and further to suppress because therefore the tendency of the bad order that the surface irregularity of moulding product etc. cause is preferred.
With respect to 100 parts by weight of thermoplastic resin (A), the blending ratio of zeolite used in the present invention (B) is 0.1～5.0 weight part, is preferably 0.2～3.0 weight part.If the blending ratio of zeolite (B) is less than 0.1 weight part, then the reduction effect of peculiar smell is less; Even mix the zeolite that surpasses 5.0 weight parts, can not expect the effect that peculiar smell further reduces, reduce such problem but also have physical strength.
Conductive agent (C)
In order to give resin combination static resistance or electroconductibility, also can the hybrid conductive agent in the resin composition having low odor of the present invention (preferably contain the resin combination of thermoplastic resin (A), zeolite (B) or contain the resin combination of thermoplastic resin (A), zeolite (B), styrenic elastomerics (D), especially preferably contain the resin combination of modification polyphenylene ether resin) as the thermoplastic resin in the above-mentioned resin combination (A).As conductive agent, can use electroconductibility organic substance or electroconductibility inorganic substance.Example as conductive agent, can enumerate ionic organic surface active agent, nonionic organic surface active agent, polymeric antistatic agent, polymeric antistatic agent, carbon black, carbon fiber, carbon whisker, hollow carbon fibril (hollow carbon fibril), steel fiber, metal-powder, metal oxide etc. with ionic functional group with polyoxyethylene glycol unit.As conductive material, consider preferred electroconductibility inorganic substance from the less angle of generation of the volatile matter that adheres to and cause by the resinoid decomposition of polyphenylene ether of volatile matter.As the electroconductibility inorganic substance, can preferably enumerate, carbon black (C-1), carbon fiber and hollow carbon fibril etc., and from considering preferred especially carbon black (C-1) in price.As carbon black (C-1), can enumerate natural graphite, synthetic graphite, carbon black etc., but, preferably use Powdered and granular carbon black wherein for synthetic graphites such as acetylene black and furnace blacks.As furnace black, specifically can enumerate the rising sun HS-500 of Ketjen black EC (trade(brand)name) that Netherland Akzo society makes and Ketjen black EC-600J (trade(brand)name), the manufacturing of ASAHICARBON Co., Ltd. etc.
About conductive agent (C) (particularly, carbon black (C-1)) blending ratio, with respect to 100 weight parts resin composition having low odor of the present invention (resin composition having low odor that preferably contains polyphenylene ether (A-1), styrene resin (A-2), zeolite (B)), conductive agent (C) is preferably 3.0～30 weight parts, more preferably 4.0～25 weight parts, more preferably 5.0～20 weight parts.By the blending ratio that makes conductive agent (C) is more than 3.0 weight parts, has the trend of easier performance electroconductibility, is preferred therefore.Especially described resin combination is used in the situation of conductive resin composition as the IC pallet, dust or dirt easily adhere to, and are not preferred therefore.In addition, by the combined amount that makes conductive agent (C) is below 30 weight parts, have the trend of the dispersiveness reduction of the conductive agent (for example carbon black) that can suppress in the resinous principle, the intensity of the flowability of resin combination, moulding product and outward appearance are tending towards better thus, therefore preferred described scope.
Other compositions (E)
As required, except that above-mentioned (A)～(D) composition, can also add and mix following composition in the resin composition having low odor that the present invention is correlated with: such as fire retardants such as phosphoric acid ester or condensed phosphoric acid esters; Such as UV light absorber such as hindered amines, benzotriazole category, benzophenone, epoxiess; Such as thermo-stabilizers such as hindered phenol compound, phosphite ester compound or phosphinate (phosphonite) compounds and zinc oxide; Antioxidant, pigment, dyestuff, lubricant, such as polyunsaturated fatty acid ester, such as release agents such as polyolefins waxes; Additives such as softening agent, static inhibitor, sliding modifying agent, solubilizing agent; The fluorine-type resin that has the effect of dripping when preventing to burn such as multipolymer of fluoride polymer, tetrafluoro ethylene polymer, tetrafluoraoethylene-hexafluoropropylene copolymer, tetrafluoroethylene and not fluorine-containing vinyl monomer etc.; Such as strongtheners such as glass fibre, glass flake, carbon fiber, steel fibers; Such as whiskers such as potassium titanate, aluminum borate, Calucium Silicate powder; Such as mineral fillers such as mica, talcum, clays.For the addition means of these additives, can utilize the conventional known method of their characteristic of performance suitably to implement.
As the method that is used to obtain resin composition having low odor of the present invention, can use following method: (for example utilize various mixing rolls, single screw mixing machine and multiscrew mixing roll, Banbury mixer, roller, Brabender plasticity machine (Brabender Plastogram) etc.), with thermoplastic resin (A) and zeolite (B), conductive agent of Tian Jiaing (C) and/or styrenic elastomerics (D) and other additives (E) melting mixing together as required, perhaps with their part mixing in advance after, merge with other compositions, and then carry out mixing (comprising the method for using masterbatch); Perhaps, the additive (E) that adds as required (for example is dissolved in appropriate solvent, hydrocarbon and their derivatives such as hexane, heptane, benzene,toluene,xylene) in or with suspended state, with thermoplastic resin (A) and zeolite (B), the conductive agent (C) that adds as required and/or the resin combination blended solution mixing method of styrenic elastomerics (D) etc.
In the present invention, consider from industrial cost's angle, the mixing method of preferred molten, but not limited by this.In melting mixing, preferably use single screw rod or twin screw extruder.
About using resin composition having low odor of the present invention to come the method for moulding product such as moulding IC pallet, consider from the formedness aspect of production efficiency, use injection molding situation many, but be not particularly limited, and the general employed method of forming of thermoplastic resin is also applicable, for example, forming methods such as the thermoforming of slush molding, extrusion moulding, use sheet moulding product, rotoforming.
For moulding product of the present invention, be used for the situation of IC pallet, as thermoplastic resin (A), preferably use modification poly (phenylene ether) resin (for example, above-mentioned thermoplastic resin (AA)).
Embodiment
Below, the present invention is described in more detail by embodiment, but as long as the present invention is no more than its main points, not limited by following examples.The evaluation assessment of resin composition having low odor in embodiment and the comparative example and moulding product is following carries out.
(1) peculiar smell A: in extruding the resin composition having low odor process, in the place of the die orifice 50cm of distance twin screw extruder (screw diameter 30mm), 5 people hear peculiar smell, provide evaluation score with following benchmark, and are evaluation score with proprietary gross score.
Peculiar smell B: the izodtest sheet is packed in the Erlenmeyer flask of 300ml band grinding port plug, and after 3 hours, 5 people hear peculiar smell, provide evaluation score with following benchmark 140 ℃ of heating, and are evaluation score with proprietary gross score.
The evaluation score metewand
1 fen very faint peculiar smell
2 fens faint peculiar smell
The peculiar smell that 3 partial volumes are easily felt
4 fens strong peculiar smell
5 fens unusual intensive peculiar smell
(2) outward appearance of moulding product: the generation state of the burnt hair of the square sheet metal forming product of visual observation 50mm * 90mm * 3.2mm thickness, ripple (flow mark) etc., from the moulding product of outward appearance excellence, be evaluated as successively ◎, zero, △ and * four ranks.
(3) cantilever beam impact strength: according to ASTM-D256, under unnotched situation, each measure 5 test films, represent cantilever beam impact strength (below, note by abridging be IZ) with 5 mean value at 23 ℃.
(4) texturing temperature under load:, under the condition of 1.82MPa, be determined at the texturing temperature (below, note by abridging be DTUL) under the load according to ASTM D648.
(5) surface resistivity: use the square sheet metal forming product of 50mm * 90mm * 3.2mm thickness, any 3 places are measured with low-resistivity instrument (Lorester) or high resistivity instrument (Hirester) (Mitsubishi chemical Co., Ltd's manufacturing).(to 10
4The molding of the value that ohm is above uses the high resistivity instrument, to 10
4The following molding of ohm uses the low-resistivity instrument.)
(embodiment 1)
(Mitsubishi Eng Plastic Corp. makes at polyacetal resin, trade(brand)name: Iupital (registered trademark) F20-01: brief note is for POM in table 1) in the synthetic high silica zeolites of the mixed MFI type shown in the table 1, this zeolite is marshy land chemical industry (strain) manufacturing, trade(brand)name: Mizucasieves EX-122, silicon-dioxide coefficient x is 33, and effective apearture directly is 5～6
Ellipse, and micropore volume is 0.15～0.25mL/g, specific surface area is 300～450m
2/ g, average primary particle diameter are 2.0 μ m, and the water adsorption power under 25 ℃/relative humidity of temperature 10%/non-pressurized condition is 6 weight %, and metal M is Na, and crystallization water number y is 0～7 (below, note by abridging be MFI type zeolite).Setting resin temperature is that 200 ℃, screw speed are under the 100rpm, with the said mixture melting mixing, and makes particle with the twin screw extruder of 30mm.The dry resulting granules of the hot air dryer that use temperature is 80 ℃ is after 4 hours, use the injection moulding machine (the system SG125 of Sumitomo heavy-duty machine tool society) of 125 tons of mold clamping pressures, at the barrel design temperature is that 190 ℃, die temperature are 80 ℃ of following injection moldings, to estimate moulding product outward appearance, cantilever beam impact strength, evaluation result is listed in table 1.
(comparative example 1)
Replace the MFI type zeolite among the embodiment 1, with the mixed A type zeolite shown in the table 1 (Japanese chemical industry (strain) is made, trade(brand)name: Zeostar NX-110P, silicon-dioxide coefficient x is 2.6, effective apearture directly is 9
Average primary particle diameter is 3 μ m, and the water adsorption power under 25 ℃/relative humidity of temperature 10%/non-pressurized condition is 25 weight %, and below brief note is X type zeolite), other aspects and embodiment 1 carry out in the same manner.Evaluation result is listed in table 1.
(comparative example 2)
The MFI type zeolite in not adding embodiment 1, other aspects and embodiment 1 carry out in the same manner.Evaluation result is listed in table 1.
[table 1]
(embodiment 2)
Prepare raw material as follows.
(1) poly-(2,6-dimethyl-1,4-phenylene) ether resin (30 ℃ the limiting viscosity of measuring in chloroform is 0.38dl/g, is designated hereinafter simply as PPE for Mitsubishi Eng Plastic Corp.'s manufacturing, trade(brand)name: Iupital (registered trademark) PX100F)
(2) styrene resin: HIPS, weight-average molecular weight (Mw) is 200000, melt flow rate (MFR) (MFR) is 3.2g/10 minute, A﹠amp; M society system, HT478
(3) MFI type zeolite (employed zeolite among the embodiment 1)
(4) conductive carbon black: Netherlands Akzo makes Ketjen black EC (being designated hereinafter simply as Ketjen black EC)
(5) styrenic elastomerics (SEBS): shell chemistry system, trade(brand)name: Clayton G1652 (being designated hereinafter simply as SEBS, hard section: soft section=29: 71)
(6) talcum: the talcum K-5 (being designated hereinafter simply as talcum) that utilizes silane coupling agent (γ-metacryloxy propyl trimethoxy silicane) to handle that Ishihara Sangyo Kaisha, Ltd. makes
(7) stablizer: the zinc oxide that reagent is 1 grade (below, abbreviate zinc oxide as)
With the ratio shown in the table 2 the above-mentioned raw materials mixing is obtained mixture, use the single screw extrusion machine of the screw diameter of limit, field machinery (strain) manufacturing as 40mm, at the barrel design temperature is that 270～320 ℃, screw rod speed of rotation are with this mixture fusion, mixing under the condition of 50rpm, and extrude, thereby produce the particulate state conductive resin composition.
The hot air dryer that use temperature is 110 ℃, with resulting granules shape conductive resin composition after dry 4 hours, the IS150 type injection moulding machine that uses toshiba machine to make, at the barrel design temperature is that 290～330 ℃, die temperature are to carry out injection molding under 120 ℃, and estimate moulding product outward appearance, cantilever beam impact strength, texturing temperature, surface resistivity under load, evaluation result is listed in following table 2.
(comparative example 3)
Replace the MFI type zeolite among the embodiment 2, with the mixed X type zeolite shown in the table 2 (Nippon Chemical Ind makes, trade(brand)name: Zeostar NX-110P, silicon-dioxide coefficient x is 2.6, effective apearture directly is 9
Average primary particle diameter is 3 μ m, and the water adsorption power under 25 ℃/relative humidity of temperature 10%/non-pressurized condition is 25 weight %, is designated hereinafter simply as X type zeolite), other aspects are to carry out in the same manner with embodiment 2.Evaluation result is listed in table 2.
(comparative example 4)
The MFI type zeolite in not adding embodiment 2, other aspects and embodiment 2 carry out in the same manner.Evaluation result is listed in table 2.
[table 2]
By table 1 and table 2, to compare with the situation of using the common employed X type zeolite of present known document, low peculiar smell of the present invention resin combination hot in nature can suppress peculiar smell.And, can confirm that the outward appearance of the moulding product of use said composition is also excellent.Further, result by table 2 also can confirm, except that low peculiar smell and outward appearance were good, low peculiar smell of the present invention resin combination hot in nature had the IC pallet needs electroconductibility with resin combination etc. the desired surface resistivity of resin combination, physical strength and thermotolerance simultaneously.
Industrial applicibility
Resin composition having low odor of the present invention is expected for communication information business automation equipment purposes, precision instrument purposes, optical correlation purposes, family's electrical article, automobile component, medical application, building materials, the agriculture widely neighborhood such as materials, sundry goods of using. Be used for the IC pallet by expectation especially.
Claims (8)
1. resin composition having low odor, in the described resin combination with respect to 100 parts by weight of thermoplastic resin, (A) mixed the following formula of 0.1 weight part～5.0 weight parts, (1) represented zeolite, (B), thermoplastic resin, (A) be by polyphenylene ether, (A-1) and styrene resin, (A-2) thermoplastic resin of Gou Chenging, (AA), described 100 parts by weight of thermoplastic resin, (A) contain the described polyphenylene ether of 20 weight parts～90 weight parts, (A-1) and the described styrene resin of 10 weight parts～80 weight parts, (A-2)
M
2/nO·Al
2O
3·xSiO
2·yH
2O (1)
In the formula (1), M represents basic metal or alkaline-earth metal; N represents the atomic valence of metal that M is represented; X represents with SiO
2/ Al
2O
3The silicon-dioxide coefficient of molar ratio computing, it is 10～500; Y represents the crystallization water number, and it is 0～7.
2. resin composition having low odor as claimed in claim 1 with respect to the described thermoplastic resin (AA) of 100 weight parts, is mixed with the styrenic elastomerics (D) of 1 weight part～25 weight parts in the described resin combination.
3. resin composition having low odor with respect to the described resin composition having low odor of the claim 1 of 100 weight parts, is mixed with the carbon black (C) of 3.0 weight parts～30 weight parts in the said composition.
4. resin composition having low odor as claimed in claim 1, the M of wherein said zeolite (B) is a sodium.
5. resin composition having low odor as claimed in claim 1, the silicon-dioxide coefficient x of wherein said zeolite (B) is 20～60.
6. resin composition having low odor as claimed in claim 1, wherein said zeolite (B) are MFI type zeolite.
7. moulding product, described moulding product obtain any described resin composition having low odor moulding of claim 1～6.
8.IC pallet, described IC pallet is for obtaining the described resin composition having low odor moulding of claim 3.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP037235/2005 | 2005-02-15 | ||
| JP2005037235 | 2005-02-15 | ||
| PCT/JP2006/302493 WO2006088003A1 (en) | 2005-02-15 | 2006-02-14 | Low-odor resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101128540A CN101128540A (en) | 2008-02-20 |
| CN101128540B true CN101128540B (en) | 2010-05-19 |
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| CN2006800049702A Active CN101128540B (en) | 2005-02-15 | 2006-02-14 | Resin composition having low odor |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101194205B1 (en) |
| CN (1) | CN101128540B (en) |
| WO (1) | WO2006088003A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MX2009005494A (en) * | 2006-12-01 | 2009-06-03 | Basf Se | Styrene-containing polymers containing a zeolite of the mfi type. |
| JP2018531293A (en) * | 2015-10-07 | 2018-10-25 | イメリス タルク ユーロープ | Filled composition |
| JP7245030B2 (en) * | 2018-11-20 | 2023-03-23 | Ｐｓジャパン株式会社 | Styrene-based resin composition, sheet, and molded article |
| JP7245031B2 (en) * | 2018-11-20 | 2023-03-23 | Ｐｓジャパン株式会社 | Styrene-based resin composition, sheet, and molded article |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5677068A (en) * | 1993-12-27 | 1997-10-14 | Solvay (Societe Anonyme) | Composition based on propylene polymer and object manufactured from this composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0657137A (en) * | 1992-08-07 | 1994-03-01 | Toray Ind Inc | Polyphenylene sulfide resin composition |
| JP2000044768A (en) * | 1998-07-29 | 2000-02-15 | Mitsubishi Engineering Plastics Corp | Highly slidable polyacetal resin composition and highly slidable molded article |
| JP4511656B2 (en) * | 1999-10-19 | 2010-07-28 | コニンクリーケ デーエスエム ナムローゼ フェンノートシャップ | Thermoplastic resin composition |
| FR2819812B1 (en) * | 2001-01-23 | 2005-04-01 | Atofina | TRAPPING A RESIDUAL MONOMER CONTAINING AT LEAST ONE EPOXY FUNCTION IN A THERMOPLASTIC COMPOSITION |
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2006
- 2006-02-14 WO PCT/JP2006/302493 patent/WO2006088003A1/en active Application Filing
- 2006-02-14 CN CN2006800049702A patent/CN101128540B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5677068A (en) * | 1993-12-27 | 1997-10-14 | Solvay (Societe Anonyme) | Composition based on propylene polymer and object manufactured from this composition |
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| Title |
|---|
| JP平6-57137A 1994.03.01 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101128540A (en) | 2008-02-20 |
| KR20070117580A (en) | 2007-12-12 |
| KR101194205B1 (en) | 2012-10-29 |
| WO2006088003A1 (en) | 2006-08-24 |
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