CN101123202A - Clamping device and method for mature making process - Google Patents
Clamping device and method for mature making process Download PDFInfo
- Publication number
- CN101123202A CN101123202A CNA2006101110254A CN200610111025A CN101123202A CN 101123202 A CN101123202 A CN 101123202A CN A2006101110254 A CNA2006101110254 A CN A2006101110254A CN 200610111025 A CN200610111025 A CN 200610111025A CN 101123202 A CN101123202 A CN 101123202A
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- Prior art keywords
- top board
- clamping device
- product
- chuck body
- elastic force
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
A holding device comprises an upper pressure plate, a lower pressure plate, a clamp substance, an up-and-down unit and an elasticity adjusting unit. The lower pressure plate is used to support products. The up-and-down unit is used to make the clamp substance and the upper pressure plate descend, thus the upper pressure plate and the lower pressure plate presses the product from both top and bottom. The two ends of the elasticity adjusting unit are fixed respectively on the upper pressure plate and the clamp substance. The elasticity adjusting unit provides the elasticity that the upper pressure plate presses the products.
Description
[technical field]
The invention relates to a kind of clamping device, particularly about a kind of clamping device with elastic force adjustment unit, the top board concora crush product that its elastic force adjustment unit can provide elastic force to make this clamping device.
[background technology]
In the injection molding glue envelope processing procedure of semiconductor packaging structure, employed material is macromolecule glue closure material (molding compound), and this macromolecule glue closure material is a kind of thermoset plastics.Demand based on product yield and production production capacity, the general mode that adopts is that the mature making process with whole macromolecule glue closure material was divided into for two stages, phase I is injecting glue and curing process, then product taking-up and pressure is inserted the baking box baking again with weight, to carry out the post curing processing procedure of second stage.
In detail, this post curing processing procedure is the product after sealing is impressed, and sends baking box baking to, its objective is by the roasting mode of heating, and makes this macromolecule glue closure material quicken to be cured to the stable state of complete slaking, to increase the reliability of product.In the process of baking, whole process is pressed on several semiconductor packaging structures with weight, or with resistant to elevated temperatures existing anchor clamps these several semiconductor packaging structures (as shown in Figure 1) of clamping of exerting pressure, finish up to baking, so to avoid because of the coefficient of expansion difference of multi-ply construction or because of amount of cure variation and the inhomogeneous warpage issues that is produced of filling.
See also shown in Figure 1ly again, existing anchor clamps 10 comprise a top board 12 and a lower platen 14, in order to respectively by these several semiconductor packaging structures 16 of exerting pressure up and down.This top board 12 is by screw or is directly fixed on this chuck body 18, and by a torque wrench 22 this top board 12 moved to apply pressure to this semiconductor packaging structure 16,120 kilograms of for example exerting pressure along driving screw 24 and guide rod 26.Yet, when abrasion take place assembly (for example driving screw), a gap 28 can occur and cause this several semiconductor packaging structure lifting surface area inequalities (as shown in Figure 2), reduce the ability that anchor clamps improve warpage.
In addition, refer again to shown in Figure 1ly, these anchor clamps comprise a dividing plate group in addition, are used for separating this several semiconductor packaging structures.This dividing plate group comprises a upper spacer 32, lower clapboard 34 and several central dividing plates 36, and this central dividing plate 36 is to be disposed between this upper spacer 32 and the lower clapboard 34.These several semiconductor packaging structures 16 are disposed between this upper spacer 32, central dividing plate 36 and the lower clapboard 34 in regular turn.
For example, please refer to shown in Figure 3ly, it shows when two semiconductor packaging structures 16 are held, the decomposing schematic representation of these two semiconductor packaging structures 16 and this dividing plate group.This upper spacer 32 and lower clapboard 34 are to be respectively the steel plate 42,46 of thickness 5mm and 44,48 compositions of glass plate of thickness 5mm, and the steel plate 42,46 of this upper spacer 32 and lower clapboard 34 is contacted with the top board 12 and the lower platen 14 of these anchor clamps 10 respectively.This central dividing plate 36 is the blue steel sheet of thickness 0.3mm, and is glutinous mutually to avoid these several semiconductor packaging structures 16.Yet because this blue steel sheet is too soft, so this blue steel sheet is out of shape with a certain semiconductor packaging structure warpage easily.
Therefore, just having to provide a kind of clamping device and method, can solve aforesaid shortcoming.
[summary of the invention]
The object of the present invention is to provide a kind of clamping device, the top board concora crush product that its elastic force adjustment unit can provide elastic force to make this clamping device.
Another object of the present invention is to provide a kind of clamp method, the warpage when it can improve the product concora crush.
For reaching above-mentioned purpose, the invention provides a kind of clamping device, comprise a top board, a lower platen, a chuck body, a lifting unit and an elastic force adjustment unit.This lower platen is used to carry product.This lifting unit is used to make this chuck body and this top board to descend, and this top board and lower platen are respectively by this product of exerting pressure up and down like this.The two ends of this elastic force adjustment unit are individually fixed in this top board and this chuck body, in order to the elastic force that makes this this product of top board concora crush to be provided.
For reaching above-mentioned purpose, the invention provides a kind of clamp method, it is used for the mature making process of product, and this clamp method comprises the following step: a clamping device is provided, and it comprises top board and lower platen, and this lower platen is in order to carry this product; This top board is descended; And elastic force is provided, use so that this this product of top board concora crush.
Clamping device of the present invention and method thereof, wherein the elastic force adjustment unit of clamping device can be adjusted required elastic force automatically, so that complete this product of docile concora crush of this top board.This elastic force adjustment unit makes this top board on average apply pressure to this product, and then effectively promotes this clamping device and improve the warpage that occurs after this product by heating.
[description of drawings]
Fig. 1 is the schematic perspective view of the anchor clamps of prior art, and it shows several semiconductor packaging structures of clamping.
Fig. 2 is the side schematic view of the anchor clamps of prior art, the gap occurs between its demonstration anchor clamps and the dividing plate.
Fig. 3 is two semiconductor packaging structures of prior art and the decomposing schematic representation of dividing plate group.
Fig. 4 is the clamping device schematic perspective view of one embodiment of the present of invention, and it shows several semiconductor packaging structures of clamping.
Fig. 5 is the clamping device side schematic view of one embodiment of the present of invention, and its demonstration the gap can not occur.
Fig. 6 is the decomposing schematic representation of two semiconductor packaging structures of the present invention and dividing plate group.
[embodiment]
With reference to figure 4 and Fig. 5, it shows the clamping device of one embodiment of the present of invention.This clamping device 100 can be applicable to the mature making process of product 102 (for example several semiconductor packaging structures 116, it has the glue closure material).This clamping device 100 comprises a top board 112, lower platen 114, elastic force adjustment unit 150, a chuck body 118 and a lifting unit 120.This lower platen 114 is in order to carry product to be heated 102.These lifting unit 120 usefulness are so that this chuck body 118 and this top board 112 descend, and this top board 112 and lower platen 114 are respectively by this product 102 of exerting pressure up and down like this.For example, this lifting unit 120 can make this chuck body 118 and top board 112 move along driving screw 124 and at least one guide rod 126 by torque wrench 122 and apply pressure to this product, 120 kilograms of for example exerting pressure.
The two ends of this elastic force adjustment unit 150 are individually fixed in this top board 112 and this chuck body 118, so that this top board 112 effective these products 102 of concora crush and gap 128 (as shown in Figure 5) can not occur.This elastic force adjustment unit 150 comprises at least one elastic parts 152, the spring of for example high temperature resistant (200 degree Celsius).Preferably, this elastic force adjustment unit 150 comprises four elastic partss 152, and it is disposed between this top board 112 and this chuck body 118, and lays respectively at four corners on the surface 113 of this top board 112.This elastic parts 152 can be adjusted required elastic force automatically, so that these top board 112 these products 102 of complete docile concora crush.This elastic force adjustment unit 150 makes this top board 112 on average apply pressure to this product 102, and then effectively promotes this clamping device 100 and improve the warpage that these product 102 heating backs occur.
This elastic force adjustment unit can comprise at least one guide rod 154 in addition, and it is disposed at respectively in this elastic parts 152, in order to guide the compression direction of this top board 112.First end 156 of this guide rod 154 is fixed in this top board 112, and this guide rod 154 passes this chuck body 118, and second end 158 of this guide rod 154 protrudes in outside this chuck body 118 for example outstanding 7 millimeters.Second end 158 of this guide rod 154 is provided with a nut 162, in order to regulate the initial elastic force of this elastic parts 152, for example 88 kilograms.
Moreover according to clamp method of the present invention, it can be used for the mature making process of the glue closure material of product.This clamp method comprises the following step: a clamping device at first is provided, and it comprises top board and lower platen, and this lower platen is in order to carry this product.Then, this top board is descended.At last, provide an elastic force, use so that this this product of top board concora crush.This clamping device comprises a chuck body, a lifting unit and an elastic force adjustment unit in addition.This lifting unit is used so that this chuck body and this top board descend, and this top board and lower platen are respectively by this product of exerting pressure up and down like this.The two ends of this elastic force adjustment unit are individually fixed in this top board and this chuck body, make this this product of top board concora crush in order to this elastic force to be provided.
In addition, again with reference to figure 4 and Fig. 5, this grip device 100 comprises a dividing plate group in addition, in order to separate this several semiconductor packaging structures.This dividing plate group comprises a upper spacer 132, lower clapboard 134 and several central dividing plates 136, and this central dividing plate 136 is disposed between this upper spacer 132 and the lower clapboard 134.These several semiconductor packaging structures 116 are disposed between this upper spacer 132, this central dividing plate 136 and this lower clapboard 134 in regular turn.
For example, with reference to figure 6, it shows when two semiconductor packaging structures 116 are held, the decomposing schematic representation of these two semiconductor packaging structures 116 and this dividing plate group.This upper spacer 132 and lower clapboard 134 be respectively steel plate 142,146 (for example thickness 5 millimeters steel plate) and glass plate 144,148 (for example thickness 5 millimeters glass plate) form, and the steel plate 142,146 of this upper spacer 132 and lower clapboard 134 is contacted with this top board 112 and lower platen 114 respectively.This central dividing plate 136 is glass plate (for example thickness 5 millimeters glass plate), and is glutinous mutually to avoid these several semiconductor packaging structures 116, and avoids being out of shape with a certain semiconductor packaging structure warpage.
Claims (10)
1. clamping device, it comprises a top board, one in order to the lower platen that carries a product, chuck body and with so that the lifting unit that this chuck body and this top board descend, and this top board and lower platen are respectively by this product of exerting pressure up and down like this; It is characterized in that: it also comprises an elastic force adjustment unit, and its two ends are individually fixed in this top board and this chuck body, makes this this product of top board concora crush in order to an elastic force to be provided.
2. clamping device as claimed in claim 1, wherein this lifting unit comprises: a driving screw; At least one first guide rod; And a torque wrench, with so that this chuck body and top board move along this driving screw and guide rod and apply pressure to this product.
3. clamping device as claimed in claim 1, wherein this elastic force adjustment unit comprises at least one elastic parts, and it is disposed between this top board and this chuck body, and is positioned on the surface of this top board.
4. clamping device as claimed in claim 3, wherein this elastic force adjustment unit comprises four elastic partss, and it is disposed between this top board and this chuck body, and lays respectively on four corners on surface of this top board.
5. as claim 3 or the described clamping device of claim 4, wherein this elastic parts is the spring of the high temperature of anti-200 degree Celsius.
6. clamping device as claimed in claim 5, wherein this elastic force adjustment unit comprises at least one second guide rod in addition, it is disposed at respectively in this spring, in order to guide the compression direction of this top board, wherein first end of this second guide rod is fixed in this top board, and this second guide rod passes this chuck body, and second distal process of this second guide rod is for outside this chuck body, on second end of second guide rod, be provided with nut in order to the initial elastic force of regulating this elastic parts.
7. clamping device as claimed in claim 1, other comprises a dividing plate group, and in order to separate this number of products, this dividing plate group comprises a upper spacer, a lower clapboard and several central dividing plates, this central dividing plate is disposed between this upper spacer and the lower clapboard, and wherein this central dividing plate is a glass plate.
8. clamping device as claimed in claim 1, wherein this product has the glue closure material, and this clamping device is the mature making process that is applied to the glue closure material of this product.
9. clamp method, it is used for the mature making process of product, and this clamp method comprises the following step: a clamping device is provided, and it comprises top board and lower platen, and this lower platen is in order to carry this product; This top board is descended; And elastic force is provided, use so that this this product of top board concora crush.
10. clamp method as claimed in claim 9, wherein this clamping device comprises in addition: chuck body; Lifting unit is used so that this chuck body and this top board descend, and this top board and lower platen are respectively by this product of exerting pressure up and down like this; And the elastic force adjustment unit, its two ends are individually fixed in this top board and this chuck body, make this this product of top board concora crush in order to this elastic force to be provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101110254A CN101123202B (en) | 2006-08-09 | 2006-08-09 | Clamping device and method for mature making process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101110254A CN101123202B (en) | 2006-08-09 | 2006-08-09 | Clamping device and method for mature making process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101123202A true CN101123202A (en) | 2008-02-13 |
| CN101123202B CN101123202B (en) | 2010-07-28 |
Family
ID=39085460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101110254A Expired - Fee Related CN101123202B (en) | 2006-08-09 | 2006-08-09 | Clamping device and method for mature making process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101123202B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103876265A (en) * | 2014-03-11 | 2014-06-25 | 安徽省金天柱农业科技有限公司 | Cooked flake wrapping machine |
| CN104934360A (en) * | 2015-06-24 | 2015-09-23 | 天津大学 | Clamp capable of independently loading and sintering multiple large-area chips with different thicknesses under constant pressure |
| CN107732000A (en) * | 2017-10-23 | 2018-02-23 | 武汉理工大学 | Pressue device, thermoelectricity thick film and flexible thermo-electric device applied to thick film hot pressed sintering |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1229810B (en) * | 1988-11-11 | 1991-09-13 | Pirelli Cavi Spa | PROCEDURE AND EQUIPMENT FOR INSERTING A RIGID SUPPORT IN A SLEEVE FOR ELECTRIC CABLE JOINTS. |
| JPH09168928A (en) * | 1995-10-20 | 1997-06-30 | Fuji Photo Film Co Ltd | Work piece positioning device |
| US7048267B2 (en) * | 2003-12-05 | 2006-05-23 | 3M Innovative Properties Company | Adhesively mounted angled clamp device |
-
2006
- 2006-08-09 CN CN2006101110254A patent/CN101123202B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103876265A (en) * | 2014-03-11 | 2014-06-25 | 安徽省金天柱农业科技有限公司 | Cooked flake wrapping machine |
| CN104934360A (en) * | 2015-06-24 | 2015-09-23 | 天津大学 | Clamp capable of independently loading and sintering multiple large-area chips with different thicknesses under constant pressure |
| CN107732000A (en) * | 2017-10-23 | 2018-02-23 | 武汉理工大学 | Pressue device, thermoelectricity thick film and flexible thermo-electric device applied to thick film hot pressed sintering |
| CN107732000B (en) * | 2017-10-23 | 2020-01-31 | 武汉理工大学 | Pressurizing device applied to thick film hot-pressing sintering, thermoelectric thick film and flexible thermoelectric device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101123202B (en) | 2010-07-28 |
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Granted publication date: 20100728 Termination date: 20170809 |
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