CN1011206B - Method punching holes in the ueneer sheet for electric appliances - Google Patents

Method punching holes in the ueneer sheet for electric appliances

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Publication number
CN1011206B
CN1011206B CN86104935A CN86104935A CN1011206B CN 1011206 B CN1011206 B CN 1011206B CN 86104935 A CN86104935 A CN 86104935A CN 86104935 A CN86104935 A CN 86104935A CN 1011206 B CN1011206 B CN 1011206B
Authority
CN
China
Prior art keywords
laminate
hole
holding pad
punching
electrical equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CN86104935A
Other languages
Chinese (zh)
Other versions
CN86104935A (en
Inventor
山田収
村上硕哉
江里口秀纪
西憲次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN86104935A publication Critical patent/CN86104935A/en
Publication of CN1011206B publication Critical patent/CN1011206B/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/24—Perforating, i.e. punching holes
    • B21D28/26—Perforating, i.e. punching holes in sheets or flat parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

Abstract

The method, which is suitable for preventing occurrence of cracks between adjacent holes punched in the printed board, is carried out using a punching device comprising punches, a die and a hold-down by setting the area pressure of the hold-down to be equal to or greater than 20% of the tensile strength of the laminate, while the punching operation is effected at room temperature, thereby dispensing with heating of the laminate and enhancing the accuracy in the distance between the centres of the punched holes as well as the productivity thereof.

Description

Method punching holes in the ueneer sheet for electric appliances
The present invention relates to a kind of method, particularly this method that goes up punching with laminate (for example Jue Yuan laminate, copper clad laminate, printed circuit board (PCB)) at electrical equipment and be suitable for preventing in punch process, occurring defective, for example between adjacent holes, produce cracking.
The existing of punching applies an oil pressure thrust with in the device in hole punched device in punch process on the laminate that electrical equipment is used, and prevents cracking that extends out from the hole of going out and flange phenomenon and the interlayer segregation phenomenon that occurs with this around the hole.
But there is not measure to prevent between the hole of the close proximity of going out on the laminate of using on the electrical equipment, to occur cracking when coming punching with above-mentioned hole punched device.
In addition, since electrical equipment with laminate on punching to be heated 60～80 ℃ high temperature earlier to prevent between adjacent holes to produce cracking, and laminate will shrink when cooling, therefore can reduce the degree of accuracy of distance between the hole of going out, in addition, adopt a holding pad apply surface pressing with prevent from when electrical equipment carries out punching with laminate, to ftracture (do not comprise between adjacent holes and ftractureing), flange and the such requirement of interlayer segregation phenomenon, in now with method, do not specify yet.
The clear 60-72619 of Japanese Patent Application Publication file discloses a kind of method towards slicer board of coming that applies pressure-plate-force on fine sheet.In this open file, apply the pressure as the yield point that equals this sheet material at least of pressure-plate-force and carry out stamping-out on sheet material, the result is owing to stay the binder vestige of next ring-type round the hole of going out on sheet material having applied big pressure-plate-force on the sheet material.Big like this pressure-plate-force can only be applicable to such as on the such material that has ductility of metal.In other words, to such as the such fragile material of the substrate of printed circuit board (PCB) involved in the present invention, cracking will appear owing to using big like this pressure-plate-force around annular recess.These depressions will cause as the plating defective of short circuit with opening circuit the substrate that processes being used with cracking in the electroplating work procedure that carry out after following stamping procedure.Therefore, the disclosed technology of clear 60-72619 can not be applicable in the punching out of printed circuit board (PCB).
Therefore, the objective of the invention is to solve above-mentioned existing in prior technology problem, and prevent to produce cracking between adjacent holes on laminate during punching at electrical equipment, its method is to apply a predetermined holding pad unit are surface pressing in punch process, and punching is at room temperature carried out, thereby save operation, improved the size accuracy of going out the hole, also improve the productivity ratio of punching simultaneously the laminate heating.
For achieving the above object, method therefor of the present invention is characterised in that it has stipulated to apply a holding pad unit are surface pressing to this electrical equipment with laminate when using the hole punched device of being made up of drift, counterdie and holding pad, this pressure be set at be equal to or greater than described laminate tensile strength 20% but less than 45% of the tensile strength of this laminate.
In addition, feature of the present invention is that also the holding pad unit are surface pressing that is applied acts on each with one heart by around the hole that dashed, radius of its pressurization scope be equivalent to each hole that is dashed radius twice or more than the twice.
Brief description:
Fig. 1 uses method of the present invention in the side view of electrical equipment with the partly cut-away of laminate hole punched device;
Fig. 2 occurs in the plane of electrical equipment with the cracking on the laminate;
Fig. 3 is the side view of electrical equipment with laminate partly cut-away of material nowed forming in punch process;
The plane of Fig. 4 hoop stress that to be electrical equipment produce in punch process with laminate;
Fig. 5 is the curve of cracking incidence between the adjacent holes that electrical equipment is gone out on laminate;
Fig. 6 is the cutaway view that is used to change a holding pad of the unit are surface pressing that imposes on electrical equipment usefulness laminate;
Fig. 7 is the relation curve between the coverage of the holding pad unit are surface pressing that electrical equipment applies with laminate and cracking incidence.
Most preferred embodiment is detailed to be situated between:
Below in conjunction with accompanying drawing one embodiment of the present of invention are described.
Fig. 1 is the side view of partly cut-away of using the hole punched device of hole-punching method of the present invention.Hole punched device among the figure comprises a die shoe 1, that guide pillar 3 on the die shoe 1 is supported by cover compression spring 4 thereon by being fixed in, and can vertically upper and lower mobile upper bolster 2, be fixed on the counterdie that has through hole 5a 5 on the die shoe 1, drift 6 is corresponding by means of the through hole 5a that backing plate 7 and nest plate 8 with drift 6 fix in position are fixed in the upper bolster 2 up and down moulds 5.Holding pad 9 is fixed on the lower end of each suspension rod 10 that hangs on upper bolster 2, has guide hole 9a on the holding pad 9, and they align with corresponding through hole 5a.Electrical equipment is inserted between counterdie 5 and the holding pad 9 in place with laminate 11, compressor arm 12 passes upper bolster 2, backing plate 7 and nest plate 8, and its end props up holding pad 9.
When the hole punched device stated of chatting face to face in the use carried out the punching of laminate 11, this hole punched device was fixed on the table top (not shown) of stamping machine, the required impulse force F of punching on laminate 11 1Act on the upper bolster 2, simultaneously thrust F 2Put on the compressor arm 12.At holding pad 9 with above-mentioned thrust F 2Pressing under the situation of laminate 11, drift 6 is at impulse force F 1Effect under pass penetrated bed pressing plate 11 behind the guide hole 9a of holding pad 9 and enter in the through hole 5a in the counterdie 5.So just gone out the hole of preliminary dimension in laminate 11 at electrical equipment.
The present invention is not subjected to the influence of the device of exerting pressure of any kind, and any equipment as the double-acting hydraulic press can be used, as long as it can apply impulse force F 1With thrust F 2Just.
In the above-described embodiments, set up at 0 kgf/millimeter at the unit are surface pressing of holding pad 9 2Condition under, when changing the diameter d of institute's punching and electrical equipment with the ratio d/t between the thickness t of laminate 11, cracking 14 has as shown in Figure 2 appearred in the thickness direction along laminate 11 around the hole of going out 13.Cracking 14 makes laminate 11 become substandard products, because they have reduced the electric property of laminate, especially they have reduced on the laminate 11 insulaion resistance between the adjacent holes 13,13 and can cause short circuit between the laminate upper conductor.
In order to find out the reason that produces cracking 14 punch process is carried out detailed research, horizontal direction that shown in Figure 3 is when the less laminate of the d/t of laminate ratio or horizontal material flow and 15 have increased, along with the lateral flow increase of material, the annular projection 16 that produces around respective aperture 13 also scales up.Found thus corresponding go out hole 13 around the hoop stress σ that produces owing to the action of drift 6 θAlso increase, thereby produced perpendicular to stress σ θThe crack, form above-mentioned cracking 14(Fig. 2).
As for the precautionary measures of taking at the generation of above-mentioned cracking, holding pad 9 thrusts are put on electrical equipment go out hole 13 annular projection 16 on every side to reduce the hoop stress σ that produces cracking with suppressing on the laminate 11 θMeasure be considered to effective.
Produce cracking 14(Fig. 2 at drift 6 to the hole punched device that uses Fig. 1) in the research carried out, the single face gap between drift 6 and the counterdie 5 remained under 5% the condition and change thrust F 2, obtained result as shown in Figure 5.
The abscissa of Fig. 5 is holding pad unit are surface pressing (q) and tensile strength (σ B) ratio, ordinate then is the ratio between the thickness (t) of the diameter of going out hole 13 (d) in the laminate 11 and laminate 11 when occurring cracking between adjacent holes.Article three, curve
A（ (P-d/2)/(d/2) ＝3.0） B（ (P-d/2)/(d/2) ＝4.0） C（ (P-d/2)/(d/2) ＝5.0）
The incidence of representing cracking respectively.Q(holding pad unit are surface pressing above-mentioned) be thrust F 2Divided by the numerical value of laminate 11 with the contact area of holding pad 9, P then is two adjacent spacings of going out between the hole 13,13.
Can know from Fig. 5 and to find out that q is set in the tensile strength sigma that is equal to or greater than laminate 11 when holding pad unit are surface pressing B20% but less than 45% o'clock, must prevent between the adjacent holes 13,13 to produce cracking.
In addition, use one on the one side of electrical equipment, have with laminate one 1 millimeter high and diameter as D and with holding pad 17(Fig. 6 of the concentric annular concentric projection 17b of guide hole 17a) and holding pad unit are surface pressing is set under 20% the fixed numbers of laminate tensile strength, when producing pressuring action in this scope the cracking incidence is studied, the variable of this research is diameter D.
Research the results are shown in Fig. 7, its ordinate is a cracking incidence (%), abscissa is the external diameter (D) of the annular projection on the holding pad and the ratio of punching hole diameter (d), and Fig. 7 illustrates on the holding pad 17 and applies the influence of the area of thrust to the cracking incidence with laminate 11 to electrical equipment.Curve E(holding pad unit are surface pressing/tensile strength=0.2 from Fig. 7) can clearly be seen that, the effective range that makes holding pad pressure prevent from effectively to ftracture to produce be its radius be at least laminate 11 each go out the scope of twice of the radius in hole, simultaneously holding pad unit are surface pressing need be equal to or greater than laminate tensile strength 20% but less than 45% of its tensile strength, prevent the generation of ftractureing.
As mentioned above, the method according to this invention punching can at room temperature be carried out, the contraction of the hole centre-to-centre spacing that heating causes when so just avoiding punching fully, also prevent simultaneously in the punch process this electrical equipment with laminate on issuable cracking between the adjacent holes, like this, the degree of accuracy of the size in hole and productivity ratio have all improved.

Claims (3)

1, use a kind of hole punched device of forming by drift, counterdie and holding pad electrical equipment with laminate on the method for punching, it is characterized in that with described holding pad unit are surface pressing be set at the tensile strength that is equal to or greater than described laminate 20% but less than 45% of the tensile strength of this laminate.
2, according to claim 1 electrical equipment with laminate on the method for punching, it is characterized in that described setting holding pad unit are surface pressing be applied on the laminate each go out the hole around and in the concentric with it scope, the radius of this scope is equal to or greater than the described twice of going out the radius in hole.
3, according to claim 2 electrical equipment with laminate on the method for punching, it is characterized in that applying described unit are surface pressing with compressing annular projection this laminate, that be formed on this holding pad around each hole.
CN86104935A 1985-08-07 1986-08-07 Method punching holes in the ueneer sheet for electric appliances Expired CN1011206B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60172350A JPS6234798A (en) 1985-08-07 1985-08-07 Method of punching printed substrate
JP172350/85 1985-08-07

Publications (2)

Publication Number Publication Date
CN86104935A CN86104935A (en) 1987-02-04
CN1011206B true CN1011206B (en) 1991-01-16

Family

ID=15940269

Family Applications (1)

Application Number Title Priority Date Filing Date
CN86104935A Expired CN1011206B (en) 1985-08-07 1986-08-07 Method punching holes in the ueneer sheet for electric appliances

Country Status (5)

Country Link
JP (1) JPS6234798A (en)
KR (1) KR870002754A (en)
CN (1) CN1011206B (en)
GB (1) GB2179884B (en)
SG (1) SG48189G (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2663807A1 (en) * 1990-06-26 1991-12-27 Philips Composants APPARATUS AND SYSTEM FOR PUNCHING PRINTED CIRCUITS.
DE4041507A1 (en) * 1990-12-22 1992-06-25 Bosch Gmbh Robert METHOD FOR JOINING A CONDUCTOR FILM WITH AN ELECTRICAL COMPONENT, DEVICE PRODUCED BY IT, AND DEVICE FOR ASSEMBLING A CONDUCTOR FILM
DE19751238A1 (en) * 1997-11-19 1999-05-27 Feintool Int Holding Press tool for making precision components from strip material, and method for servicing tool
JP3930300B2 (en) * 2001-11-20 2007-06-13 日本碍子株式会社 Punching die for simultaneous punching
JP4646908B2 (en) * 2004-05-10 2011-03-09 株式会社 ベアック Trimming apparatus and trimming method
CN101637926B (en) * 2009-07-28 2013-06-19 珠海元盛电子科技股份有限公司 Steel knife die for making bonding course and method for making bonding course
CN102189565A (en) * 2010-03-17 2011-09-21 车兆丰 Sheet device packaging blind hole paper tape and stamping method and special stamping die thereof
JP5197870B1 (en) * 2012-02-11 2013-05-15 株式会社メイク・ア・ボックス Punching machine balance correction sheet manufacturing method, punching machine balance correction type, punching machine balance correction method, and punching machine balance correction sheet
CN102886425A (en) * 2012-09-17 2013-01-23 芜湖市续元工贸有限公司 Punching die of sheet metal part
CN102990710A (en) * 2012-10-29 2013-03-27 茅惠杰 Improved punching structure
CN103753642B (en) * 2013-11-08 2015-12-30 青岛盈科精密橡塑有限公司 A kind of positioning molding mould for polymer high-viscosity glue product
CN106604556B (en) * 2017-02-23 2018-01-19 江西联益电子科技有限公司 A kind of PCB processing unit (plant)
CN106925812B (en) * 2017-03-10 2018-09-18 长沙天恒测控技术有限公司 Unpowered drill for electrical sheet surface insulation resistance measuring device
CN109721235A (en) * 2019-01-22 2019-05-07 江苏先河激光技术有限公司 Mobile phone display screen sliver apparatus and mobile phone display screen system of processing
CN110014476B (en) * 2019-04-12 2020-11-10 江苏神通阀门股份有限公司 Use method of rubber diaphragm punching shear die
CN110154154B (en) * 2019-05-29 2021-06-15 安徽大华半导体科技有限公司 Rib cutting forming device
CN110202638B (en) * 2019-06-12 2021-06-04 惠州市盈帆实业有限公司 Manufacturing method of counter bore of composite circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB465197A (en) * 1934-07-27 1937-04-27 Charles Hathaway Howland Shear Improvements relating to the cold working of materials
GB465198A (en) * 1934-07-27 1937-04-27 Charles Hathaway Howland Shear Improvements relating to the mechanical working of substances
GB465196A (en) * 1935-07-27 1937-04-27 Charles Hathaway Howland Shear Improvements relating to the production of cold flow in substances
JPS59169799A (en) * 1983-03-15 1984-09-25 塩出　高睦 Hydraulic precise punching press

Also Published As

Publication number Publication date
GB8619051D0 (en) 1986-09-17
CN86104935A (en) 1987-02-04
GB2179884B (en) 1989-04-05
JPS6234798A (en) 1987-02-14
GB2179884A (en) 1987-03-18
SG48189G (en) 1989-12-08
KR870002754A (en) 1987-04-06

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