CN101118251A - Perpendicular detecting probe head, detecting probe head manufacturing method and modularized detecting probe card thereof - Google Patents
Perpendicular detecting probe head, detecting probe head manufacturing method and modularized detecting probe card thereof Download PDFInfo
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- CN101118251A CN101118251A CNA2006100995886A CN200610099588A CN101118251A CN 101118251 A CN101118251 A CN 101118251A CN A2006100995886 A CNA2006100995886 A CN A2006100995886A CN 200610099588 A CN200610099588 A CN 200610099588A CN 101118251 A CN101118251 A CN 101118251A
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Abstract
The present invention relates to a vertical type probe tip, a probe tip production method and a modularized probe card using the probe tip. The vertical type probe tip mainly comprises a basal plate, a circuit layer and a plurality of vertical type probes; wherein, the basal plate has a plurality of holding holes that run through a first surface and a second surface, and the circuit layer is formed on the first surface, each vertical type probe has a combined end and a probing end. The combined end is inserted in the holding holes of the basal plate and electrically connected to the circuit layer, and the probing end is projected from the second surface of the basal plate, the vertical type probes are partially fixed into the holding holes with resin, thereby making the vertical type probes have the effect of being firmly fixed and being not easily distorted.
Description
Technical field
The present invention relates to a kind of lens of integrated circuit testing equipment, the modularity probe that particularly relates to a kind of vertical probe head, probe manufacture method and use this probe.
Background technology
In the existing known testing apparatus in order to testing integrated circuits, be to visit the external terminal that touches a to-be-measured integrated circuit device or to outer lead with the plurality of probes on the probe, to test the electrical functionality of this integrated circuit, for the product of growing up fast in response to semiconductor technology, existing IC test structure develops into vertical probe carb by the conventional cantilever-type probe card, and it is a vertical probe head is connected a discoid printed circuit board (PCB) and to form that the assembling of this vertical probe carb is made.
Seeing also shown in Figure 1ly, is the schematic cross-section of existing known vertical probe head, and a kind of existing known vertical probe head 100 comprises a ceramic substrate 110 and a plurality of vertical probe 120.This ceramic substrate 110 has a upper surface 111 and a lower surface 112, the upper surface 111 of this ceramic substrate 110 is formed with a plurality of connection gaskets 113, those connection gaskets 113 are in order to those vertical probes 120 to be set, because this ceramic substrate 110 is to form for sintering, its internal wiring and the connection gasket that supplies those vertical probes 120 are set equidistantly can't dwindle, integrated circuit (IC) products test for the little spacing of high density can be had any problem, in addition, those vertical probes 120 only end weldering are located at this upper surface 111, in test process, need to repeat to press the external terminal that touches to-be-measured integrated circuit, be easy to cause the situation of bending and fracture.
This shows that above-mentioned existing vertical probe head, probe manufacture method and probe obviously still have inconvenience and defective, and demand urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new vertical probe head, probe manufacture method and the modularity probe of using this probe, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing vertical probe head, probe manufacture method and probe exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of new vertical probe head, probe manufacture method and the modularity probe of using this probe, can improve general existing vertical probe head, probe manufacture method and probe, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Fundamental purpose of the present invention is, overcome the defective that existing vertical probe head, probe manufacture method and probe exist, and provide a kind of new vertical probe head, probe manufacture method and the modularity probe of using this probe, technical matters to be solved be make by resin with the local sealing of those vertical probes in those device holes, and can make those vertical probes have firm and do not allow yielding effect, thereby be suitable for practicality more.
Another object of the present invention is to, overcome the defective that existing vertical probe head, probe manufacture method and probe exist, and provide a kind of new vertical probe head, probe manufacture method and the modularity probe of using this probe, technical matters to be solved is to make wherein that this substrate is to be semiconductor substrate, the material of this substrate is for silicon or as PI (polyimide, polyimide) film circuit board of material, and can help micro electronmechanical processing procedure, can make the spacing of those vertical probes reach minuteness space, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of vertical probe head that the present invention proposes, it comprises: a substrate has a first surface, a second surface and a plurality of device hole of running through this first surface and this second surface; One line layer, it is formed on this first surface of this substrate; And a plurality of vertical probes, each vertical probe has a binding end and and visits contravention, those binding ends be inserted in this substrate those the device holes in and be electrically conducted to this line layer, those the spy contraventions be to protrude in outside this second surface of this substrate.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid vertical probe head is to be filled with resin in wherein said those device holes, with those vertical probes of local sealing.
Aforesaid vertical probe head, wherein said resin are to be non-conductive glue.
Aforesaid vertical probe head, it comprises a plurality of scolders in addition, and it is electrically conducted those binding ends to this line layer.
Aforesaid vertical probe head, wherein said resin are to be conducting resinl.
Aforesaid vertical probe head, wherein said substrate are to be semiconductor substrate.
Aforesaid vertical probe head, wherein said substrate are to be a film circuit board.
The object of the invention to solve the technical problems also adopts following technical scheme to realize.The manufacture method of a kind of vertical probe head that proposes according to the present invention, it may further comprise the steps: a substrate is provided, and this substrate has a first surface and a second surface; Form a line layer on this first surface of this substrate; Form the plural devices hole in this substrate, those device holes are to run through this first surface and this second surface; And a plurality of vertical probes are set in this substrate, each vertical probe has a binding end and and visits contravention, those binding ends be inserted in this substrate those the device holes in and be electrically conducted to this line layer, those the spy contraventions be to protrude in outside this second surface of this substrate.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The manufacture method of aforesaid vertical probe head, it comprises in addition: fill and form resin in those device holes, with those vertical probes of local sealing.
The manufacture method of aforesaid vertical probe head, it is that one is connected in a connection strap that those of those vertical probes are visited contravention.
The manufacture method of aforesaid vertical probe head, those binding ends of wherein said those vertical probes are that one is connected in a connection strap.
The object of the invention to solve the technical problems also realizes in addition by the following technical solutions.A kind of modularity probe of using above-mentioned probe according to the present invention's proposition, it comprises: a vertical probe head, it comprises: a substrate, and it has a first surface, a second surface and a plurality of device hole of running through this first surface and this second surface; One line layer, it is to run through on this first surface of this substrate; And a plurality of vertical probes, each vertical probe is to have a binding end and to visit contravention, those binding ends be inserted in this substrate those the device holes in and be electrically conducted to this line layer, those the spy contraventions be to protrude in outside this second surface of this substrate; One printed circuit board (PCB); And an intermediary substrate, it is to be provided with between this vertical probe head and this printed circuit board (PCB).
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid modularity probe, it includes a connecting support in addition, and it is in conjunction with this vertical probe head and this printed circuit board (PCB).
Aforesaid modularity probe, wherein said connecting support has plurality of through holes, and include a plurality of fixed element and a pressing plate in addition, those retaining elements are bonded to this pressing plate by those through holes, in order to this connecting support, this intermediary substrate and this printed circuit board (PCB) of this vertical probe head of winding.
Aforesaid modularity probe, wherein said intermediary substrate includes a plurality of electric contacts, to be electrically conducted this vertical probe head and this printed circuit board (PCB).
Aforesaid modularity probe, wherein said those electric contacts are to be spring needle.
Aforesaid modularity probe is to be filled with resin in wherein said those device holes, with those vertical probes of local sealing.
Aforesaid modularity probe, wherein said substrate are to be semiconductor substrate.
Aforesaid modularity probe, the material of wherein said substrate are to be silicon.
Aforesaid modularity probe, wherein said substrate are to be a film circuit board.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, in order to achieve the above object, according to the present invention, a kind of vertical probe head mainly comprises a substrate, a line layer and a plurality of vertical probe.This substrate has a first surface, a second surface and a plurality of device hole of running through this first surface and this second surface, this line layer is to be formed on this first surface of this substrate, each vertical probe has a binding end and and visits contravention, those binding ends be inserted in this substrate those the device holes in and be electrically conducted to this line layer, those the spy contraventions be to protrude in outside this second surface of this substrate.
By technique scheme, vertical probe head of the present invention, probe manufacture method and use the modularity probe of this probe to have following advantage at least:
1, vertical probe head of the present invention, probe manufacture method and the modularity probe of using this probe, its substrate is to have a plurality of device holes of running through a first surface and a second surface, so that a plurality of binding ends of a plurality of vertical probes are to be inserted in those device holes of this substrate and to be electrically conducted a line layer to this substrate, and a plurality of spy contraventions of those vertical probes are to protrude in outside this second surface of this substrate, by resin with the local sealing of those vertical probes in those device holes, and can make those vertical probes have firm and do not allow yielding effect, thereby be suitable for practicality more.
2, to make this substrate wherein be to be semiconductor substrate in the present invention, the material of this substrate is for silicon or as PI (polyimide, polyimide) film circuit board of material, and can be very beneficial for micro electronmechanical processing procedure, can make the spacing of those vertical probes reach minuteness space, thereby be suitable for practicality more.
In sum, the invention relates to a kind of vertical probe head, probe manufacture method and the modularity probe of using this probe.This vertical probe head mainly comprises a substrate, a line layer and a plurality of vertical probe.This substrate has a plurality of device holes of running through a first surface and a second surface, and this line layer is to be formed on this first surface, each vertical probe has a binding end and and visits contravention, those binding ends be inserted in this substrate those the device holes in and be electrically conducted to this line layer, those visit contravention is to protrude in outside this second surface of this substrate, by resin with the local sealing of those vertical probes in those device holes, make those vertical probes have firm and on-deformable effect.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure, manufacture method or function, be a significant progress in technology, and produced handy and practical effect, and more existing vertical probe head, probe manufacture method and probe have the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic cross-section that has known vertical probe head now.
Fig. 2 is according to first specific embodiment of the present invention, a kind of schematic cross-section of vertical probe head.
Fig. 3 A to Fig. 3 F is according to first specific embodiment of the present invention, the schematic cross-section of this vertical probe head manufacture process.
Fig. 4 is that the spy contravention of those vertical probes is connected in the schematic cross-section on the connection strap according to first specific embodiment of the present invention.
Fig. 5 is according to first specific embodiment of the present invention, a kind of schematic cross-section that makes up the modularity probe of this vertical probe head.
Fig. 6 is according to second specific embodiment of the present invention, and another kind of vertical probe is inserted in the schematic cross-section in the plural devices hole of a substrate.
Fig. 7 is that the binding end of those vertical probes is connected in the schematic cross-section on the connection strap according to second specific embodiment of the present invention.
Fig. 8 is according to the 3rd specific embodiment of the present invention, the schematic cross-section of an another kind of vertical probe and a substrate.
Fig. 9 is according to the 3rd specific embodiment of the present invention, the schematic cross-section of the local sealing of this vertical probe in the plural devices hole of this substrate.
Figure 10 is according to the 3rd specific embodiment of the present invention, makes up the schematic cross-section of the modularity probe of this vertical probe head.
100: vertical probe head 110: ceramic substrate
111: upper surface 112: lower surface
113: connection gasket 120: vertical probe
200: vertical probe head 210: substrate
211: first surface 212: second surface
213: device hole 220: line layer
230: vertical probe 231: binding end
232: visit contravention 240: insulation course
250: protective seam 260: resin
270: scolder 280: connection strap
290: connecting support 291: through hole
310: intermediary substrate 311: electricity touches element
312: through hole 320: printed circuit board (PCB)
321: internal wiring 322: outer connection pad
323: combined hole 330: retaining element
340: packing ring 350: pressing plate
410: vertical probe 411: binding end
412: visit contravention 420: connection strap
500: vertical probe head 510: substrate
511: device hole 520: line layer
521: connection gasket 530: vertical probe
531: binding end 532: visit contravention
540: connection strap 550: resin
610: intermediary substrate 611: electricity touches element
612: through hole 620: printed circuit board (PCB)
621: interior connection pad 622: internal wiring
631: setting element 632: binding member
640: pressing plate 650: connecting support
651: adhesive coating 652: pilot hole
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, vertical probe head, probe manufacture method that foundation the present invention is proposed and modularity probe khaki embodiment, structure, feature and the effect thereof of using this probe, describe in detail as after.
Seeing also shown in Figure 2ly, is according to first specific embodiment of the present invention, a kind of schematic cross-section of vertical probe head.In first specific embodiment of the present invention, a kind of vertical probe head 200 comprises a substrate 210, a line layer 220 and a plurality of vertical probe 230, wherein:
Above-mentioned substrate 210 is to select semiconductor substrate for use, is beneficial to make the plural devices hole 213 that little spacing forms.In the present embodiment, the material of this substrate 210 is to be silicon, perhaps the material of this substrate 210 also can be selected pottery, flame-proof cover copper foil epoxy paper-laminate (FR-3, FR-4) or Bismaleimide Triazine (Bismaleimide Triazine for use, BT) resin or for example polyimide (polyimide, PI) film circuit board of material.This substrate 210 has the device hole 213 that a first surface 211, a second surface 212 and those run through 212 of this first surface 211 and this second surfaces; Those device holes 213 are can utilize laser erosion to burn or the ion electric paste etching is formed.
Above-mentioned line layer 220 is to be formed on the first surface 211 of this substrate 210, and the material of this line layer 220 can be copper, gold or aluminium.
In addition, an insulation course 240 can be formed between the first surface 211 and this line layer 220 of this substrate 210, is beneficial to the electrically distribution of isolated this line layer 220.
Above-mentioned a plurality of vertical probes 230, in those vertical probes 230, each vertical probe 230 has a binding end 231 and and visits contravention 232, can utilize micro electronmechanical (Micro-Electro-Mechanical System, MEMS) processing procedure is with those vertical probes 230 of formation in a row, wherein:
Those binding ends 231 are to be inserted in those device holes 213 of this substrate 210, and are electrically conducted to this line layer 220 with a plurality of scolders 270, are filled with resin 260 in those device holes 213, with those vertical probes 230 of local sealing.In the present embodiment, this resin 260, be for non-conductive glue (Non-Conductive Paste, NCP).
Those visit contravention 232, are to protrude in outside this second surface 212 of this substrate 210, touch the lead-in wire or the external terminal (figure does not draw) of a to-be-measured integrated circuit device with spy.The material of those vertical probes 230 is the alloys that can be nickel, gold, copper, tungsten, titanium, palladium or above-mentioned metal.Preferably, but be that the suitable oxidizing film is handled in this device hole 213, electrically disturb or leakage current to prevent that this substrate 210 from producing with those vertical probes 230.
This insulation course 240, in the present embodiment, be for polyimide (Polyimide, PI).
In addition, on this line layer 220 coating one protective seam 250, to cover the circuit on this line layer 220 and to prevent those scolder 270 overflows.
Because those vertical probes 230 are to insert in those device holes 213, again by resin 260 with those vertical probe 230 local sealing in those device holes 213, and make those vertical probes 230 have firm and do not allow yielding effect.
Seeing also shown in Fig. 3 A to Fig. 3 F, is according to first specific embodiment of the present invention, the schematic cross-section of this vertical probe head manufacture process, and a kind of manufacture method of this vertical probe head 200 of the present invention may further comprise the steps:
As shown in Figure 3A, at first, provide a substrate 210, this substrate 210 has a first surface 211 and a second surface 212, is to be formed with an insulation course 240 on this first surface 211 of this substrate 210, in the present embodiment, this insulation course 240 be for polyimide (Polyimide, PI).
Then, shown in Fig. 3 B, a line layer 220 is to be formed at this first surface 211 of this substrate 210 and to be positioned on this insulation course 240, and on this line layer 220 coating one protective seam 250 and patterning in addition.
Afterwards, shown in Fig. 3 C, form a plurality of device holes 213 of running through 212 of this first surface 211 and this second surfaces with laser erosion firing method.
Then, shown in Fig. 3 D, those vertical probes 230 in a row connect with a connection strap 280, and in those vertical probes 230, each vertical probe 230 is to have a binding end 231 and to visit contravention 232.See also shown in Figure 4, be according to first specific embodiment of the present invention, the spy contravention of those vertical probes is connected in the schematic cross-section on the connection strap, in the present embodiment, it is that one is connected in this connection strap 280 that those of those vertical probes 230 are visited contravention 232, those binding ends 231 of those vertical probes 230 are that this second surface 212 by this substrate 210 is inserted in those device holes 213 of this substrate 210, and those visit contraventions 232 is to protrude in outside this second surface 212 of this substrate 210.
Then, shown in Fig. 3 E, resin 260 is to be filled in those device holes 213, with those vertical probes 230 of local sealing.
Afterwards; shown in Fig. 3 F; with mode of printing a plurality of scolders 270 are formed at those binding ends 231, those vertical probes 230 are electrically conducted to this line layer 220, this patterned protective layer 250 can prevent that those scolder 270 overflows from avoiding polluting this line layer 220.At last, remove this connection strap 280 and promptly form as shown in Figure 2 vertical probe head 200.
In addition, seeing also shown in Figure 5ly, is according to first specific embodiment of the present invention, a kind of schematic cross-section that makes up the modularity probe of this vertical probe head.According to first specific embodiment of the present invention, these vertical probe head 200 intermediary substrate 310 capable of being combined and printed circuit board (PCB)s 320 are to constitute a kind of modularity probe.
Above-mentioned vertical probe carb 200 comprises a substrate 210, a line layer 220 and a plurality of vertical probe 230, wherein:
This substrate 210 is to have a first surface 211, a second surface 212 and a plurality of device hole 213 of running through 212 of this first surface 211 and this second surfaces;
This line layer 220 is to be formed on this first surface 211 of this substrate 210;
Those vertical probes 230, each vertical probe 230 wherein has a binding end 231 and and visits contravention 232, in the present embodiment, those binding ends 231 are that this second surface 212 by this substrate 210 is inserted in those device holes 213 of this substrate 210 and with a plurality of scolders 270 and is electrically conducted to this line layer 220, those visit contravention 232 is to protrude in outside this second surface 212 of this substrate 210, touches the lead-in wire or the external terminal (figure does not draw) of a to-be-measured integrated circuit device with spy.
Above-mentioned intermediary substrate 310, include a plurality of electric contacts 311, spring needle (pogopin) for example, those electric contacts 311 are that the interior connection pad (figure does not draw) of contact mat (figure do not draw) and this printed circuit board (PCB) 320 corresponding to this substrate 210 is provided with, with the contact mat of this line layer 220 of this substrate 210 of being electrically conducted this vertical probe head 200 and the interior connection pad of this printed circuit board (PCB) 320.
Above-mentioned printed circuit board (PCB) 320 is to be formed with a plurality of internal wirings 321 and a plurality of outer connection pad 322, is located at an integrated circuit testing equipment for this modularity probe card.
This vertical probe head 200 includes a connecting support 290 in addition, and this connecting support 290 is to be the framework kenel, and it is to be incorporated into the periphery of this substrate 210 and to have plurality of through holes 291.
In addition, this modularity probe includes plurality of fixed element 330 in addition, bolt for example, those retaining elements 330 are those through holes 291 by this connecting support 290, the plurality of through holes 312 of this intermediary substrate 310 and a plurality of combined holes 323 of this printed circuit board (PCB) 320, and be bonded to a screw that is positioned at the pressing plate 350 of these printed circuit board (PCB) 320 opposite sides, so that linking, this vertical probe head 200, this intermediary substrate 310 and this printed circuit board (PCB) 320 constitute a modularity probe.
Preferably, 310 of this substrate 210 and this intermediary substrates and this intermediary substrate 310 and 320 of this printed circuit board (PCB)s are respectively to have a packing ring 340, to increase this substrate 210, this intermediary substrate 310 and these printed circuit board (PCB) 320 triangular adaptations.
In addition, see also Figure 6 and Figure 7, Fig. 6 is according to the present invention's second specific embodiment, another kind of vertical probe is inserted in the schematic cross-section in the plural devices hole of a substrate, Fig. 7 is that the binding end of those vertical probes is connected in the schematic cross-section on the connection strap according to the present invention's second specific embodiment.Second specific embodiment of the present invention is the another kind of manufacture method that discloses above-mentioned vertical probe head 100, and a plurality of binding ends 411 of a plurality of vertical probes 410 are that one is connected in a connection strap 420.In the present embodiment, a plurality of spy contraventions 412 of those vertical probes 410 are that the first surface 211 by a substrate 210 is inserted in the plural devices hole 213 of this substrate 210, and further to make those visit contraventions 412 be to protrude in outside the second surface 212 of substrate 210, visit lead-in wire or the external terminal (not drawing among the figure) that touches a to-be-measured integrated circuit device during for test, resin 260 fillings are formed in those device holes 213 those vertical probes 410 of local sealing after curing.Remaining manufacture method roughly can be same as the first above-mentioned specific embodiment.After removing connection strap 420, in those binding ends 411, reflow is electrically conducted to this line layer 220 those vertical probes 410 can to form a plurality of scolders (figure does not draw).This patterned protective layer 250 is to prevent that those scolder overflows from avoiding polluting this line layer 220, removes this connection strap 420 and promptly forms a vertical probe head.
In addition, see also Fig. 8 and shown in Figure 9, Fig. 8 is according to the present invention's the 3rd specific embodiment, the schematic cross-section of an another kind of vertical probe and a substrate, Fig. 9 is according to the present invention's the 3rd specific embodiment, the schematic cross-section of the local sealing of this vertical probe in the plural devices hole of this substrate.The 3rd specific embodiment of the present invention is the manufacture method that discloses another kind of vertical probe head.
As shown in Figure 8, provide a substrate 510, this substrate 510 is to have a plurality of device holes 511 of running through its upper and lower surface, and a line layer 520 is on this substrate 510.In the present embodiment, this substrate 510 is to be a kind of film circuit board, can form intensive circuit and connection gasket 521.Before vertical probe was set, a plurality of vertical probes 530 were to be connected to a connection strap 540, and each vertical probe 530 is to have a binding end 531 and to visit contravention 532.
Afterwards, as shown in Figure 9, those binding ends 531 are to be inserted in those device holes 511 of this substrate 510, and insert resin 550 in those device holes 511, solidify this resin 550 again, to reach those vertical probes 530 of local sealing.
In the present embodiment, this resin 550 is to be conducting resinl, so can directly those vertical probes 530 be electrically conducted those connection gaskets 521 or the structure of other plated-through-hole (figure does not draw) to this line layer 520, at this moment, those visit contravention 532 is to protrude in outside this substrate 510, touches integrated circuit component to be measured for spy.Again this connection strap 540 is removed, can make a vertical probe head 500 (as shown in figure 10).
In addition, seeing also shown in Figure 10ly, is according to the 3rd specific embodiment of the present invention, makes up the schematic cross-section of the modularity probe of this vertical probe head.In the 3rd specific embodiment of the present invention, this vertical probe head 500 can be incorporated into an intermediary substrate 610 and a printed circuit board (PCB) 620, constitute another kind of modularity probe, this vertical probe carb is substrate 510, line layer 520 and the vertical probe 530 that comprises as above-mentioned film circuit board.
This substrate 510 has a plurality of device holes 511 of running through its upper and lower surface.
This line layer 520 is to be formed on this substrate 510, and this line layer 520 has a plurality of connection gaskets 521.
Those vertical probes 530, wherein, each vertical probe 530 is to have a binding end 531 and to visit contravention 532, one resin 550 be those vertical probes 530 of local sealing those binding ends 531 in this substrate 510 those the device holes 511 in, this resin 550 is to be conducting resinl, those vertical probes 530 can be electrically conducted those connection gaskets 521 or the structure of other plated-through-hole (figure does not draw) to this line layer 520, those visit contravention 532 is to protrude in outside this substrate 510, touches integrated circuit component to be measured for spy.
A plurality of electric contacts 611 of above-mentioned intermediary substrate 610 the interior connection pad 621 that the position is contact mat (figure do not draw) and this printed circuit board (PCB) 620 corresponding to this substrate 510 is set, to be electrically conducted this vertical probe head 500 and this printed circuit board (PCB) 620.
Above-mentioned printed circuit board (PCB) 620 more is formed with a plurality of internal wirings 622 and a plurality of outer connection pad 623, can be located at an integrated circuit testing equipment for this modularity probe card.
Can by an adhesive coating 651 this vertical probe head 500 be attached at the connecting support 650 of a metal material earlier, in addition a plurality of setting elements 631 be fixed in a pressing plate 640 and pass this printed circuit board (PCB) 620, this intermediary substrate 610 (through hole 612), with this vertical probe head 500, to locate the relative position of this vertical probe head 500.
Preferably, this connecting support 650 also has a plurality of pilot holes 652, can be chimeric for those setting elements 631, and to locate the relative position of this connecting support 650 and this vertical probe head 500.And with this connecting support 650 in conjunction with this vertical probe head 500 and this intermediary substrate 610 to printed circuit board (PCB) 620, it can utilize plurality of fixed element 632 to pass this printed circuit board (PCB) 620 to reach the relation of good combination in conjunction with this connecting support 650 and this pressing plate 640.Therefore, this vertical probe head 500, this intermediary substrate 610 and this printed circuit board (PCB) 620 can link formation one modularity probe.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (20)
1. vertical probe head is characterized in that it comprises:
One substrate, it has a first surface, a second surface and a plurality of device hole of running through this first surface and this second surface;
One line layer, it is formed on this first surface of this substrate; And
A plurality of vertical probes, each vertical probe have a binding end and and visit contravention, and those binding ends are to be inserted in those device holes of this substrate and to be electrically conducted to this line layer, and those spy contraventions are to protrude in outside this second surface of this substrate.
2. vertical probe head according to claim 1 is characterized in that in wherein said those device holes be to be filled with resin, with those vertical probes of local sealing.
3. vertical probe head according to claim 2 is characterized in that wherein said resin is to be non-conductive glue.
4. vertical probe head according to claim 3 is characterized in that it comprises a plurality of scolders in addition, and it is electrically conducted those binding ends to this line layer.
5. vertical probe head according to claim 2 is characterized in that wherein said resin is to be conducting resinl.
6. vertical probe head according to claim 1 is characterized in that wherein said substrate is to be semiconductor substrate.
7. vertical probe head according to claim 1 is characterized in that wherein said substrate is to be a film circuit board.
8. the manufacture method of a vertical probe head is characterized in that it may further comprise the steps:
One substrate is provided, and this substrate has a first surface and a second surface;
Form a line layer on this first surface of this substrate;
Form the plural devices hole in this substrate, those device holes are to run through this first surface and this second surface; And
A plurality of vertical probes are set in this substrate, each vertical probe has a binding end and and visits contravention, those binding ends be inserted in this substrate those the device holes in and be electrically conducted to this line layer, those the spy contraventions be to protrude in outside this second surface of this substrate.
9. the manufacture method of vertical probe head according to claim 8 is characterized in that it comprises in addition: fill and form resin in those device holes, with those vertical probes of local sealing.
10. the manufacture method of vertical probe head according to claim 8 is characterized in that those spy contraventions of wherein said those vertical probes are that one is connected in a connection strap.
11. the manufacture method of vertical probe head according to claim 8, those binding ends that it is characterized in that wherein said those vertical probes are that one is connected in a connection strap.
12. a modularity probe of using above-mentioned probe is characterized in that it comprises:
One vertical probe head, it comprises:
One substrate, it has a first surface, a second surface and a plurality of device hole of running through this first surface and this second surface;
One line layer, it is to run through on this first surface of this substrate; And
A plurality of vertical probes, each vertical probe are to have a binding end and to visit contravention, and those binding ends are to be inserted in those device holes of this substrate and to be electrically conducted to this line layer, and those spy contraventions are to protrude in outside this second surface of this substrate;
One printed circuit board (PCB); And
One intermediary substrate, it is to be provided with between this vertical probe head and this printed circuit board (PCB).
13. modularity probe according to claim 12 is characterized in that it includes a connecting support in addition, it is in conjunction with this vertical probe head and this printed circuit board (PCB).
14. modularity probe according to claim 13, it is characterized in that wherein said connecting support has plurality of through holes, and include a plurality of fixed element and a pressing plate in addition, those retaining elements are bonded to this pressing plate by those through holes, in order to this connecting support, this intermediary substrate and this printed circuit board (PCB) of this vertical probe head of winding.
15. modularity probe according to claim 12 is characterized in that wherein said intermediary substrate includes a plurality of electric contacts, to be electrically conducted this vertical probe head and this printed circuit board (PCB).
16. modularity probe according to claim 15 is characterized in that wherein said those electric contacts are to be spring needle.
17. modularity probe according to claim 12 is characterized in that in wherein said those device holes be to be filled with resin, with those vertical probes of local sealing.
18. modularity probe according to claim 12 is characterized in that wherein said substrate is to be semiconductor substrate.
19. modularity probe according to claim 12, the material that it is characterized in that wherein said substrate are to be silicon.
20. modularity probe according to claim 12 is characterized in that wherein said substrate is to be a film circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100995886A CN101118251A (en) | 2006-08-01 | 2006-08-01 | Perpendicular detecting probe head, detecting probe head manufacturing method and modularized detecting probe card thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100995886A CN101118251A (en) | 2006-08-01 | 2006-08-01 | Perpendicular detecting probe head, detecting probe head manufacturing method and modularized detecting probe card thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101118251A true CN101118251A (en) | 2008-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100995886A Pending CN101118251A (en) | 2006-08-01 | 2006-08-01 | Perpendicular detecting probe head, detecting probe head manufacturing method and modularized detecting probe card thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101118251A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102012470A (en) * | 2009-09-04 | 2011-04-13 | 日月光半导体（上海）股份有限公司 | Electrical test adapter plate of sealing base plate and method thereof |
| CN104237667A (en) * | 2013-06-24 | 2014-12-24 | 旺矽科技股份有限公司 | Detection device |
| CN110389242A (en) * | 2018-04-16 | 2019-10-29 | 中国探针股份有限公司 | Insulating part and its probe base applied to probe base |
| CN111060772A (en) * | 2019-12-31 | 2020-04-24 | 瑞斯康达科技发展股份有限公司 | Test system and test method |
| CN113030536A (en) * | 2019-12-24 | 2021-06-25 | 爱思开海力士有限公司 | Probe card and method for manufacturing the same |
| CN113376503A (en) * | 2021-04-29 | 2021-09-10 | 苏州通富超威半导体有限公司 | Device manufacturing method for chip testing |
-
2006
- 2006-08-01 CN CNA2006100995886A patent/CN101118251A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102012470A (en) * | 2009-09-04 | 2011-04-13 | 日月光半导体（上海）股份有限公司 | Electrical test adapter plate of sealing base plate and method thereof |
| CN104237667A (en) * | 2013-06-24 | 2014-12-24 | 旺矽科技股份有限公司 | Detection device |
| CN110389242A (en) * | 2018-04-16 | 2019-10-29 | 中国探针股份有限公司 | Insulating part and its probe base applied to probe base |
| CN110389242B (en) * | 2018-04-16 | 2023-02-21 | 台湾中国探针股份有限公司 | Insulating part applied to probe base and probe base thereof |
| CN113030536A (en) * | 2019-12-24 | 2021-06-25 | 爱思开海力士有限公司 | Probe card and method for manufacturing the same |
| US11933818B2 (en) | 2019-12-24 | 2024-03-19 | SK Hynix Inc. | Probe test card and method of manufacturing the same |
| CN111060772A (en) * | 2019-12-31 | 2020-04-24 | 瑞斯康达科技发展股份有限公司 | Test system and test method |
| CN113376503A (en) * | 2021-04-29 | 2021-09-10 | 苏州通富超威半导体有限公司 | Device manufacturing method for chip testing |
| CN113376503B (en) * | 2021-04-29 | 2022-12-06 | 苏州通富超威半导体有限公司 | Device manufacturing method for chip testing |
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