CN101106866A - Production technology for high-precision fully resistance carbon film overlapping board - Google Patents
Production technology for high-precision fully resistance carbon film overlapping board Download PDFInfo
- Publication number
- CN101106866A CN101106866A CNA2007100707262A CN200710070726A CN101106866A CN 101106866 A CN101106866 A CN 101106866A CN A2007100707262 A CNA2007100707262 A CN A2007100707262A CN 200710070726 A CN200710070726 A CN 200710070726A CN 101106866 A CN101106866 A CN 101106866A
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- CN
- China
- Prior art keywords
- carbon film
- carbon
- resistance
- film resistor
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 132
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 132
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000005516 engineering process Methods 0.000 title claims abstract description 20
- 238000007639 printing Methods 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 9
- 238000003475 lamination Methods 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000013461 design Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 230000004075 alteration Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a printing technology for high-resistance carbon film layer. The problem to be solved is that the provided technology can effectively realize resistance control on a high-resistance carbon film lamination, further to improve production efficiency and reduce production cost. The technical proposal is that the production technology for the high-precision whole-resistance carbon film laminated plate includes a production technology for a carbon film surface adhering plate in which a carbon film resistor is printed during printing process for the carbon film lamination. The printing process of the carbon film resistor is performed by following steps in sequence: firstly, determining proportion of the conductive carbon ink; and secondly, printing the conductive carbon ink on copper coil contact points at two ends of a resistor on the circuit board to form a carbon film resistor. The geometric shape of the carbon film resistor is determined by the following relationship: resistance of the carbon film resistor is equal to resistance of the formula of the carbon ink multiplied by length of the carbon film resistor and then divided by width of the carbon film resistor, in which the resistance of the carbon film resistor is determined by thickness of the carbon film resistor and the proportion of the conductive carbon ink, and width of the carbon film resistor is determined by thickness of the printed film.
Description
Technical field
The present invention relates to a kind of production technology of printed substrate, especially the typography of high value carbon film layer.
Background technology
Printed circuit is exactly on insulating substrate, by predetermined design, is printed as printed substrate, printed element or conductive pattern that both combine.Printed substrate then is the conductive pattern that is electrically connected between the components and parts providing on the insulating substrate.Employed printed substrates such as current digitlization audio frequency and video household appliances recreation device product generally all adopt single face (carbon film) plate, two-sided (carbon slurry holeization, silver slurry perforated, metal pore-formed plate) plate.Traditional printed substrate only uses so far as a kind of bearer circuit of basis.
High-precision fully resistance carbon film overlapping board, it then is the resistance characteristic that has taken into full account carbon film self, resistance according to customer requirements, method by the physics wire mark, with the Copper Foil contact point two ends (be former resistor assembling position) of electric conductive carbon printing ink bat printing to former resistor, replace existing components and parts to mount the resistor of usefulness, or resistance slippage switch etc., the manufacturing cost (comprising production and processing cost and resistor expense) of each assembly plant reduced greatly with this.Though business circles have dropped into the great effort material resources to the development high-precision fully resistance carbon film overlapping board in recent years, because the resistance of high resistant carbon film overlapping can't realize accurately printing according to customer requirements, so fail always.
So, go up the resistor that uses at various printed substrates (as digitlization audio frequency and video household appliances wiring board) both at home and abroad at present, all buy special-purpose patch resistor from the market, in assembling, weld assembling.Not only inefficiency, manufacturing cost significantly improve, and product quality can't further improve.
Summary of the invention
Technical problem to be solved by this invention is the weak point that overcomes the above-mentioned background technology, a kind of fully resistance carbon film overlapping board production technology is provided, this technology should be able to realize the resistance control of high resistant carbon film overlapping effectively, and then enhances productivity, reduces production costs.
Technical scheme provided by the invention is: production technology for high-precision fully resistance carbon film overlapping board, comprise the carbon membrane surface mounting board production technology, and when the carbon film overlapping printing operation of carrying out wherein, print carbon film resistor; The printing of carbon film resistor is carried out according to the following steps successively:
One, sets up the proportioning of electric conductive carbon printing ink
According to the Standard resistance range of the resistor of user's needs, carry out the proportioning of electric conductive carbon printing ink and regulate; The resistance value of the feasible carbon film resistor of being printed reaches the regulation requirement;
Two, electric conductive carbon printing ink is printed to wiring board
By silk screen printing, with the two ends Copper Foil contact point of the resistor of electric conductive carbon printing ink print to the wiring board, to form carbon film resistor.
The geometry of described carbon film resistor is determined according to following formula:
Carbon film resistor resistance=carbon oil side's resistance * carbon film resistor length ÷ carbon film resistor width;
Wherein: carbon oil side's resistance is determined according to the proportioning of the electric conductive carbon printing ink of the thickness of carbon resistor and setting, and the thickness of carbon film resistor is determined by printing film sheet thickness.
The beneficial effect of production technology for high-precision fully resistance carbon film overlapping board provided by the invention is: 1, the resistance of the carbon film resistor printed can be controlled at (resistor resistance control deviation area requirement is in ± 20%) in the prescribed limit; 2, owing to utilized carbon film characteristic (different side's resistance), use the carbon film layer to print to replace each Electronics Factory employed resistor part in the mounting of components and parts, make the carbon film layer realize the function of plate resistor element, substitute the technological innovation of other material, broken through the application of carbon film material, significantly reduce manufacturing cost, satisfied the production needs that the digitlization sound is looked household appliances.
Description of drawings
Fig. 1 is the schematic diagram of the printing carbon film resistor among the present invention.
Fig. 2 is the printing carbon film resistor position view in the circuit board among the present invention.
Fig. 3 is the wiring board schematic diagram among Fig. 2.
Fig. 4 is the printing carbon film resistor design diagram of original subscriber among the embodiment.
Embodiment
The carbon membrane surface mounting board production technology comprises blanking, number hole drill hole, printed wiring layer successively, prints solder mask, prints protective layer, prints carbon film layer, punching out profile, electric-examination test, packaging process.This production technology belongs to conventional production process, wherein also can increase silver slurry via hole silk screen printing process as required.
And production technology for high-precision fully resistance carbon film overlapping board is in the printing carbon film layer operation of above-mentioned technical process, carries out printing when carbon film overlapping is printed carbon film resistor; The printing of carbon film resistor is carried out according to the following steps successively:
One, sets up the proportioning of electric conductive carbon printing ink
According to the Standard resistance range of the resistor of user's needs, carry out the proportioning of electric conductive carbon printing ink and regulate; The resistance value of the feasible carbon film resistor of being printed reaches the regulation requirement; The composition of described electric conductive carbon printing ink and proportioning determine to be common process.
Two, electric conductive carbon printing ink is printed to wiring board
By silk screen printing, with the electric conductive carbon printing ink print to the wiring board to form carbon film resistor, the two ends of carbon film resistor are printed directly on two Copper Foil resistance contacts of wiring board; Described silk screen printing is to print the common process that the carbon film layer adopts.
Key point of the present invention is length, width and the thickness by the control carbon film resistor, obtains to set the carbon film resistor of resistance, and when printing with carbon film resistor the resistance contact on the direct communication line plate.
The geometry of carbon film resistor determines according to following formula:
Carbon film resistor resistance=carbon oil side's resistance * carbon film resistor length ÷ carbon film resistor width;
Wherein: carbon oil side's resistance is according to the proportioning decision of the electric conductive carbon printing ink of the thickness of carbon film resistor and setting;
And the thickness of carbon film resistor belongs to the common process that the carbon film layer is printed by the decision of printing film sheet thickness.
Because the length of the carbon film resistor that is obtained generally all has bigger increase, thereby general employing can back and forth be spiraled, and (as shown in Figure 1: the distance that a point is ordered to b is the length of carbon film resistor to mode, d is the width of carbon film resistor), to reduce occupied wiring board area.
Among Fig. 3 also as can be known; When carbon film resistor needs cross-line to connect (when connecting contact 3 and contact 4 respectively), on wiring board 1, print an insulating barrier 2 (printing of insulating barrier also is a common process) usually earlier, carbon film resistor is printed on this insulating barrier then; When realizing that cross-line connects, can realize isolated insulation with the printed wire 7 on the wiring board again like this.
Embodiment 1: the resistance that customer requirements is striden the resistor bridge device is 500 ± 20% Ω.
According to the former design (see figure 4) of user, its carbon film resistor 6 length 1.5cm, width: 0.2cm uses the fixed carbon mimeograph of 25 Ω/ (" " represents square centimeter, and film thickness is at 25 ч m) to brush.By computing formula provided by the invention, in 500 ± 20% Ω scopes, the length of carbon film resistor is done design alteration, that is: for guaranteeing the resistor resistance
Carbon film resistor length=carbon film resistor resistance * carbon film resistor width ÷ uses fixedly carbon oil side's resistance=500 Ω * 0.2cm ÷ 25 Ω=4cm.
Carbon film resistor length has been done accordingly after changing (carbon film resistor 8 shapes after changing as shown in Figure 1) by this length, and actual resistance, is met consumers' demand between 480～520 Ω fully through the batch tracking measurement.
Embodiment 2: the resistance that customer requirements is striden the resistor bridge device is 300 ± 20% Ω.
According to the former design of user, its carbon film resistor length 2cm, width: 0.3cm uses the fixed carbon mimeograph of 25 Ω/ (" " represents square centimeter, and film thickness is at 25 ч m) to brush.By computing formula provided by the invention, in 300 ± 20% Ω scopes, the length of carbon film resistor is done design alteration, that is: for guaranteeing the resistor resistance
Carbon film resistor length=carbon film resistor resistance * carbon film resistor width ÷ uses fixedly carbon oil side's resistance=300 Ω * 0.3cm ÷ 25 Ω=3.6cm.
Carbon film resistor length has been done accordingly after changing (carbon film resistor shape after changing as shown in Figure 1) by this length, and actual resistance, is met consumers' demand between 280～330 Ω fully through the batch tracking measurement.
Embodiment 3: the resistance that customer requirements is striden the resistor bridge device is 1000 ± 20% Ω.
According to the former design of user, its carbon film resistor length 2cm, width: 0.15cm uses the fixed carbon mimeograph of 25 Ω/ (" " represents square centimeter, and film thickness is at 25 ч m) to brush.By computing formula provided by the invention, in 1000 ± 20% Ω scopes, the length of carbon film resistor is done design alteration, that is: for guaranteeing the resistor resistance
Carbon film resistor length=carbon film resistor resistance * carbon film resistor width ÷ uses fixedly carbon oil side's resistance=1000 Ω * 0.15cm ÷ 25 Ω=6cm.
Carbon film resistor length has been done accordingly after changing (carbon film resistor shape after changing as shown in Figure 1) by this length, and actual resistance, is met consumers' demand between 960～1050 Ω fully through the batch tracking measurement.
Claims (2)
1. production technology for high-precision fully resistance carbon film overlapping board comprises the carbon membrane surface mounting board production technology, prints carbon film resistor when the carbon film overlapping printing operation of carrying out wherein; The printing of carbon film resistor is carried out according to the following steps successively:
One, sets up the proportioning of electric conductive carbon printing ink
According to the Standard resistance range of the resistor of user's needs, carry out the proportioning of electric conductive carbon printing ink and regulate;
Two, electric conductive carbon printing ink is printed to wiring board
By silk screen printing, with the two ends Copper Foil contact point of the resistor of electric conductive carbon printing ink print to the wiring board, to form carbon film resistor.
2. production technology for high-precision fully resistance carbon film overlapping board according to claim 1 is characterized in that the geometry of described carbon film resistor is determined according to following formula:
Carbon film resistor resistance=carbon oil side's resistance * carbon film resistor length ÷ carbon film resistor width;
Wherein: carbon oil side's resistance is determined according to the proportioning of the electric conductive carbon printing ink of the thickness of carbon resistor and setting, and the thickness of carbon film resistor is determined by printing film sheet thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100707262A CN100518438C (en) | 2007-08-07 | 2007-08-07 | Production technology for high-precision fully resistance carbon film overlapping board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100707262A CN100518438C (en) | 2007-08-07 | 2007-08-07 | Production technology for high-precision fully resistance carbon film overlapping board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101106866A true CN101106866A (en) | 2008-01-16 |
| CN100518438C CN100518438C (en) | 2009-07-22 |
Family
ID=39000474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100707262A Expired - Fee Related CN100518438C (en) | 2007-08-07 | 2007-08-07 | Production technology for high-precision fully resistance carbon film overlapping board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100518438C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102928671A (en) * | 2012-11-13 | 2013-02-13 | 大连太平洋电子有限公司 | Testing method of printed wiring board conductive ink resistance value |
| CN103763795A (en) * | 2014-01-20 | 2014-04-30 | 新乡市杰达精密电子器件有限公司 | Producing method of thick film heating element and method for determining using amount of resistor paste |
| WO2014106332A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Carbon ink printing device |
| CN107305444A (en) * | 2016-04-19 | 2017-10-31 | 施政 | Detection system and method |
| CN108123203A (en) * | 2017-12-18 | 2018-06-05 | 刘伟 | A kind of black coating power splitter of resistance |
| CN108826065A (en) * | 2018-07-31 | 2018-11-16 | 江门黑氪光电科技有限公司 | A kind of manufacturing method using film resistance LED light strip |
| CN110421987A (en) * | 2019-07-25 | 2019-11-08 | 东莞福哥电子有限公司 | One kind having of different shapes equal valued resistors printing process |
| CN111565520A (en) * | 2020-04-17 | 2020-08-21 | 廖章明 | Resistor, preparation method of in-mold electronic film, resistor and in-mold electronic film |
| CN117693088A (en) * | 2023-12-29 | 2024-03-12 | 中山市成源光电科技有限公司 | Method for dimming and toning COB light source |
-
2007
- 2007-08-07 CN CNB2007100707262A patent/CN100518438C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102928671A (en) * | 2012-11-13 | 2013-02-13 | 大连太平洋电子有限公司 | Testing method of printed wiring board conductive ink resistance value |
| WO2014106332A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Carbon ink printing device |
| CN103763795A (en) * | 2014-01-20 | 2014-04-30 | 新乡市杰达精密电子器件有限公司 | Producing method of thick film heating element and method for determining using amount of resistor paste |
| CN103763795B (en) * | 2014-01-20 | 2015-06-10 | 新乡市杰达精密电子器件有限公司 | Producing method of thick film heating element and method for determining using amount of resistor paste |
| CN107305444A (en) * | 2016-04-19 | 2017-10-31 | 施政 | Detection system and method |
| CN108123203A (en) * | 2017-12-18 | 2018-06-05 | 刘伟 | A kind of black coating power splitter of resistance |
| CN108826065A (en) * | 2018-07-31 | 2018-11-16 | 江门黑氪光电科技有限公司 | A kind of manufacturing method using film resistance LED light strip |
| CN110421987A (en) * | 2019-07-25 | 2019-11-08 | 东莞福哥电子有限公司 | One kind having of different shapes equal valued resistors printing process |
| CN110421987B (en) * | 2019-07-25 | 2021-08-10 | 东莞福哥电子有限公司 | Equal-resistance resistor printing method with different shapes |
| CN111565520A (en) * | 2020-04-17 | 2020-08-21 | 廖章明 | Resistor, preparation method of in-mold electronic film, resistor and in-mold electronic film |
| CN117693088A (en) * | 2023-12-29 | 2024-03-12 | 中山市成源光电科技有限公司 | Method for dimming and toning COB light source |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100518438C (en) | 2009-07-22 |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HANGZHOU LUTONG PRINTED CIRCUIT SCIENCE CO., LTD. Free format text: FORMER OWNER: XU LIJUN Effective date: 20091225 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20091225 Address after: Zhejiang province Ling'an city streets Qianwang Qianwang Street No. 220 Patentee after: Hangzhou Lutong Printed Circuit Space Co., Ltd. Address before: Zhejiang city of Ling'an province Qianwang Street No. 220 Hangzhou Lu Tong carbon film circuit Co. Ltd. Patentee before: Xu Lijun |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090722 Termination date: 20110807 |
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| RR01 | Reinstatement of patent right |
Former decision: cessation of patent right due to non-payment of the annual fee Former decision publication date: 20121003 |
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| ASS | Succession or assignment of patent right |
Owner name: XU LIJUN Free format text: FORMER OWNER: HANGZHOU LUTONG PRINTED CIRCUIT SPACE CO., LTD. Effective date: 20140129 |
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Effective date of registration: 20140129 Address after: 311300 Zhejiang city of Ling'an Province Jincheng Street Xiyuan District 5 Building Room 304 Patentee after: Xu Lijun Address before: 311300 Zhejiang city of Ling'an province Qianwang Qianwang Street Street No. 220 Patentee before: Hangzhou Lutong Printed Circuit Space Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090722 Termination date: 20150807 |
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