CN101100020B - Method for manufacturing perforation in the plate thing - Google Patents
Method for manufacturing perforation in the plate thing Download PDFInfo
- Publication number
- CN101100020B CN101100020B CN2007101274545A CN200710127454A CN101100020B CN 101100020 B CN101100020 B CN 101100020B CN 2007101274545 A CN2007101274545 A CN 2007101274545A CN 200710127454 A CN200710127454 A CN 200710127454A CN 101100020 B CN101100020 B CN 101100020B
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- China
- Prior art keywords
- laser beam
- processing
- hole
- perforation
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention relates to a method for manufacturing through hole on a board articles processing by means of laser beam. The method is very suitable for manufacturing through hole on layered articles, wherein making sure to ensure high anti-forgery safety. The aim of the present invention is to provide a method, which prevents ash generation as well as manufacturing arbitrary shape holes on plastic or other combustible material as much as possible. The present invention is characterized in that to make the laser beam move with a closed curvilinear shape on the margin of the through hole being made, wherein the intensity and motion speed of the laser beam must should be chose to ensure the depth of the artifactitious hole area be part of the whole depth of the hole being made and to implement multiple process, wherein the cross section of the hole keeps the same of small during the next process.
Description
Technical field
The present invention relates to a kind of method that is used for being processed in tabular object manufacturing perforation by means of laser beam.
This method is particularly suitable on the stratiform object, making the perforation of taper, wherein must guarantee high antiforgery security.
Background technology
Known in the prior art perforation through the cylindrical or prismatic well format of stamped.Disadvantageous at this is that less antiforgery security is only guaranteed in such perforation.
For this reason, in order to guarantee safety of files, the particularly perforation of processing taper under the situation of the file of multilayer.This perforation can produce thus, and promptly burnouting by regulation by means of the laser beam of controlling, those should process the material of the position of bellmouth.At this, except not carefully and neatly done edge configuration, also disadvantageously be, burning can not be controlled so as to the tapering of obtaining qualification, and a large amount of ashes occurs and generate, and this causes the pollution do not expected.
For the retrofit workpiece, use by means of processing method especially for the laser beam of laser drill.Importantly accurate as far as possible repeatable and as far as possible little following process expense for this high-quality workpiece retrofit of carrying out by means of laser beam and little processing.
For example known method and device, wherein laser beam is by means of the deflection of Trepanier Optical devices.Disadvantageous at this is only to make circular hole.The tapering of regulation that can not manufacturing hole.
In other a kind of known method, workpiece is by means of the x-y-working table movement.Disadvantageously at this be, workpiece must be moved and the trajectory accuracy of workpiece motion s littler than the trajectory accuracy of the laser beam that is directed.Can not reach the hole tapering of regulation in addition.
Known a kind of method by means of laser beam retrofit workpiece in DE 197 45 280 A1, the laser beam that wherein is used to produce cutting curve is along a curvilinear motion.This method divides a plurality of steps to carry out, the device that wherein uses a modularization to constitute.Laser beam passed through three module bootings before being mapped on the workpiece; Wherein rotate hitting a little of laser beam by means of first module; Change laser beam hitting a little on workpiece by means of second module, and change the inject angle of laser beam with respect to surface of the work by means of three module.The use of said method needs high equipment and technology expense and is not suitable for processing combustible material owing to add the high-energy-density that uses man-hour at metal.
Summary of the invention
The objective of the invention is to, a kind of method of the above-mentioned type is provided, it avoids the hole that ash generates and arbitrary shape is processed in permission in combustible material as far as possible.
According to the present invention, above-mentioned purpose realizes by means of a kind of method with the characteristic that in claim 1, provides and by means of a kind of device with the characteristic that in claim 5, provides.
Each favourable structure provides in the dependent claims.
The application's content also is the combination arbitrarily of each single characteristic of describing.
Scheme of the present invention is arranged to, and perforation to be processed is not fired, but utilizes a little laser beam ring cutting of intensity to remove, and wherein the diameter of ring is middle at various height changes.
For this reason, laser beam moves on the edge of perforation to be processed along the curve of a sealing, thereby cuts out a dish with selectable shape of cross section and thickness.So select in this intensity of laser beam and movement velocity; Make the degree of depth of bore region of processing only be hole to be processed total depth a part and implement repeatedly processing successively, wherein the cross-sectional area of machining area keeps identical or reduces in each next processing.Only the material of smaller portions is converted into ash and reaches high machining accuracy in this method.Also advantageously, the shape of inlet port and outlet and size can be selected in a wider context.
A favourable structure of method of the present invention is arranged to, and is processed in one by realizing on a plurality of folded mutually up and down layer object that constitutes.At this, in each process, process a layer at least.Under such object situation, can remove the dish that utilizes the laser beam excision with simple mode.
The application possibility that another one is favourable is to make the perforation of taper, wherein laser beam is moved on a circuit orbit and the diameter of circuit orbit increases along with the degree of depth and reduces.
Not only can cut out circular perforation, and can cut out perforation, for example have the perforation of rectangle or oval cross section with any cross-sectional shape.
Possible in addition is that perforation constitutes the cone at oblique angle or has the cone shape of the axis of symmetry that is obliquely installed with respect to surface normal arbitrarily.
The embodiment that the another one of method is favourable is; Intensity of laser beam and/or movement velocity change along with working depth; What meet purpose especially is, along with the degree of depth of processed punched areas increases and reduces these parameters, so that obtain constant removal speed.
Description of drawings
Below will set forth the present invention in detail by an embodiment.This embodiment relates on folded mutually up and down plate and makes cone-type piercer.Wherein:
Fig. 1 is manufacturing hole in a conventional manner;
Hole of making in a conventional manner of Fig. 2;
Fig. 3 is through the manufacturing hole that rotatablely moves of laser tool;
One of Fig. 4 makes the hole of accomplishing;
Step-like hole of Fig. 5;
The vertical view of the object of a processing of Fig. 6;
The sketch map of Fig. 7 processing unit (plant).
The specific embodiment
Make the traditional method of perforation burnouting through laser beam shown in Fig. 1.The laser beam 1.1 that is produced by laser tool 1 moves downward perpendicular to board plane during processing and the material of each single plate 2.1,2.2,2.3 that burnouts.
Fig. 2 shows the cutaway view of the structure with the perforation of making in this way.
Fig. 3 shows the processing according to the inventive method.At this, laser beam 1.1 implement one additional around the rotatablely moving an of vertical axis, thereby cut out dish 3 respectively by each plate to be processed 2.1,2.2,2.3.Laser beam 1.1 moves on the edge of perforation to be processed along the curve of a sealing, and wherein the intensity of laser beam 1.1 and movement velocity are so selected, and makes cross section along with the degree of depth increase of the punched areas of processing and reduce.
Made perforation is shown in Fig. 4.
In the example that is used on the multilayer file, making bellmouth shown in Fig. 5.Shown in situation under on eight folded mutually up and down plates 2.1 to 2.8, cut out the hole that has different-diameter at four-stage.
Vertical view at the object of a processing shown in Fig. 6.Cutting curve 4 and a dish that cuts out 3 of a visible circle on plate 2.1.
Fig. 7 sets forth the device of the processing method that is used for embodiment of the present invention.Shown in situation under, on 5 folded mutually up and down plates 2.1 to 2.5, process a step-like hole that dwindles downwards, it has three different bore dias.Horizontally extending laser beam 1.1 is via a CO via 400W power in sketch map
2Laser tool produces and hits deflecting mirror 5.Deflecting mirror 5 is provided with and by means of controlled drive unit motion around two axis that are perpendicular to one another swingably; Thereby laser beam can be on workpiece to be processed;, implement the curve of a sealing arbitrarily and cut out a unshowned dish on one of them at plate 2.1 to 2.5 in an illustrated embodiment by workpiece.Laser beam 1.1 by deflecting mirror 5 guiding at first cuts out a disk along circuit orbit a guiding with the plate 2.1 of processing top and by plate 2.1 in an illustrated embodiment.And then, laser beam 1.1 guides on circuit orbit a at this, thereby cuts out a dish with same diameter by plate 2.2.Then, laser beam 1.1 moves on circuit orbit b and cuts out a dish that has corresponding than minor diameter by plate 2.3.Laser beam 1.1 intactly cuts out dish around circuit orbit c guiding and by plate 2.4 and 2.5 twice in the course of work below.Can cut out the dish that respectively has diameter identical or that progressively dwindle successively in this way.Particularly advantageously be, combining with circular diameter and with relatively little laser tool power through the control rotary speed to stop the heat intensive of material to be processed, thereby also can process combustible material such as plastics perhaps even paper.Different with the equipment that is used for the processing metal workpiece; Wherein because the high thermal conductivity of material to be processed must apply high energy density and therefore need be with the laser beam vernier focusing in should realizing the plane that material is removed; List down folded mutually plate and utilize device of the present invention to realize to process continuously one, and need not on the follow-up corresponding height position that focuses on processing plane of laser beam 1.1.For this reason, need not the beam deflecting apparatus of trouble essential for metal processing at this.For beam deflection, only need a deflecting mirror 5 that can center on two axis swings.
List of numerals
1 laser tool
1.1 laser beam
2 plates
3 dishes
4 cutting curves
5 deflecting mirrors
A, b, c processes track
Claims (3)
1. one kind is used for being processed in tabular file manufacturing cone-type piercer so that the method for antiforgery security to be provided by means of laser beam; Said file has a plurality of folded mutually up and down layers; Processing at least one layer and from corresponding layer, cut out and remove a dish wherein respectively in each procedure of processing; Wherein the intensity and the movement velocity of laser beam (1.1) are chosen to; Make that the depth of cut in each procedure of processing only is the part of the total depth of said perforation, it is characterized in that processing has the file of less heat conductivity and laser beam (1.1) is moved on the edge of perforation to be processed with the form of the curve (4) of a sealing; And in several in succession stages successively, implement processing, wherein keep curve shape or curve shape in the next process segment, to have less area.
2. the method for claim 1 is characterized in that, laser beam (1.1) moves on a circuit orbit.
3. according to claim 1 or claim 2 method is characterized in that, along with the degree of depth of the punched areas of processing increases, reduces the intensity and/or the movement velocity of laser beam (1.1).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006031429.8 | 2006-07-05 | ||
| DE102006031429A DE102006031429B4 (en) | 2006-07-05 | 2006-07-05 | Method for producing conical perforations in plate-shaped documents |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101100020A CN101100020A (en) | 2008-01-09 |
| CN101100020B true CN101100020B (en) | 2012-01-18 |
Family
ID=38556375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101274545A Active CN101100020B (en) | 2006-07-05 | 2007-07-05 | Method for manufacturing perforation in the plate thing |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101100020B (en) |
| DE (1) | DE102006031429B4 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8237080B2 (en) * | 2008-03-27 | 2012-08-07 | Electro Scientific Industries, Inc | Method and apparatus for laser drilling holes with Gaussian pulses |
| CN103212859A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Method for cutting thick materials by laser |
| CN103894743B (en) * | 2014-03-19 | 2015-12-02 | 温州大学 | A kind ofly foam sheet metal laser accurate drilling method and device auxiliary |
| JP5992026B2 (en) * | 2014-10-24 | 2016-09-14 | 株式会社アマダホールディングス | LASER CUTTING METHOD, CONTROL DEVICE AND PROGRAMMING DEVICE IN LASER CUTTING MACHINE |
| CN104759759A (en) * | 2015-03-28 | 2015-07-08 | 大族激光科技产业集团股份有限公司 | Laser drilling method of glass substrate with chamfered through hole |
| US11571768B2 (en) * | 2017-08-16 | 2023-02-07 | General Electric Company | Manufacture of cooling holes for ceramic matrix composite components |
| CN109109457B (en) * | 2018-08-03 | 2022-05-24 | 常州龙润激光科技有限公司 | Anilox roll and manufacturing method thereof |
| CN111660018A (en) * | 2019-03-05 | 2020-09-15 | 陕西坤同半导体科技有限公司 | Metal mask and punching method thereof |
| CN114939733B (en) * | 2022-04-24 | 2024-05-14 | 武汉华工激光工程有限责任公司 | Laser processing method and device for improving quality of green ceramic chip through hole |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1225862A (en) * | 1998-02-10 | 1999-08-18 | 日本熔接株式会社 | Laser beam machining device |
| US6444948B1 (en) * | 1997-10-15 | 2002-09-03 | Daimlerchrysler Ag | Fine and micro-machining process for workpieces by means of laser beams |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19960797C1 (en) * | 1999-12-16 | 2001-09-13 | Mtu Aero Engines Gmbh | Method for producing an opening in a metallic component |
| US6627844B2 (en) * | 2001-11-30 | 2003-09-30 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling |
| DE10162379B4 (en) * | 2001-12-19 | 2005-04-21 | Wetzel Gmbh | Method of making a microbore |
| DE202005011521U1 (en) * | 2005-07-19 | 2005-10-06 | Bundesdruckerei Gmbh | Security system for book type document especially a passport has security markings applied to each page |
-
2006
- 2006-07-05 DE DE102006031429A patent/DE102006031429B4/en active Active
-
2007
- 2007-07-05 CN CN2007101274545A patent/CN101100020B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6444948B1 (en) * | 1997-10-15 | 2002-09-03 | Daimlerchrysler Ag | Fine and micro-machining process for workpieces by means of laser beams |
| CN1225862A (en) * | 1998-02-10 | 1999-08-18 | 日本熔接株式会社 | Laser beam machining device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006031429B4 (en) | 2010-11-04 |
| CN101100020A (en) | 2008-01-09 |
| DE102006031429A1 (en) | 2008-01-10 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: LULA MATT CO., LTD. Free format text: FORMER OWNER: PROCARD GMBH Effective date: 20130130 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130130 Address after: Germany, Mark, Suhl Patentee after: Lula & Co., Ltd. Address before: Germany, Mark, Suhl Patentee before: Procard GmbH |