CN101099964A - LED chip surface fluorescent powder layer coating method - Google Patents
LED chip surface fluorescent powder layer coating method Download PDFInfo
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- CN101099964A CN101099964A CNA2007100048848A CN200710004884A CN101099964A CN 101099964 A CN101099964 A CN 101099964A CN A2007100048848 A CNA2007100048848 A CN A2007100048848A CN 200710004884 A CN200710004884 A CN 200710004884A CN 101099964 A CN101099964 A CN 101099964A
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- led chip
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- fluorescent powder
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- layer coating
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Abstract
The present invention is process of painting fluorescent powder layer to the surface of LED chip. The fluorescent powder is first mixture with glue to form homogeneous fluorescent glue, and the fluorescent glue is then painted to the front side and lateral sides of the LED chip homogeneously by means of simple screen printing process. Painting fluorescent powder layer to the surface of LED chip can convert the fluorescent emitting wavelength of the LED and makes it possible to produce LED devices of different colors.
Description
Technical field
The invention provides a kind of led chip surface fluorescent powder layer coating method.
Background technology
White light LEDs is used on the illumination or the light source of LCD panel light source block, and prospect enjoys the whole world to attract attention, and many manpowers are also bet by advanced countries such as Europe, the United States and Japan, and set up special mechanism urges white light LEDs R﹠D work.
White light LEDs is the light that multiple coloured light mixes, the form of white light that can see with human eyes needs two kinds of light to mix at least, two wavelength light (blue light+sodium yellow) or three-wavelength light (blue light+green light+red light), the mainstream technology of the white light of LED generation at present has three kinds of illumination modes: mainly be that the blue light single-chip adds yellow (YAG or TAG) fluorescent material.Second kind is that three chip three primary colors (blue light+green glow+ruddiness) colour mixture becomes white light, but needs circuit control just can obtain the color of stablizing, and cost is higher.The third is the following three-wavelength light that is expected, and especially adds RGB three color fluorescent material with the ultraviolet light chip, but for fear of the ultraviolet light chip, technical bottleneck does not break through smoothly on material and processing procedure, still can't the commercialization volume production.
Exciting yellow fluorescent powder (YAG or TAG) to produce white light with blue chip is the most general present technology, and cost is low, but homogeneity question is subjected to many restrictions.
The mode that the most generally is used at present LED encapsulation and fluorescent material coating is that fluorescent material evenly is mixed in silica gel or epoxide-resin glue, coats led chip with point gum machine with the mode of syringe point glue, reaches the effect that the led chip emission wavelength is changed.The mode of point gum machine point glue is after utilization gravity allows the silica gel that includes fluorescent material or epoxy resin flow led chip to be coated, so it is average that the thickness of fluorescent material still can't reach on the LED light-emitting area fully, can cause the wavelength conversion uneven, cause the photochromic skew of LED components and parts, photochromic unequal problem.
Summary of the invention
The present invention mainly provides a kind of led chip surface fluorescent powder layer coating method that makes the led chip surface fluorescent powder layer be evenly distributed.
For achieving the above object, solution of the present invention is: a kind of led chip surface fluorescent powder layer coating method is that fluorescent material and glue material are uniformly mixed into fluorescent glue in advance, utilizes web plate to be uniformly coated on the front and side surface of led chip luminescent layer again.
Employed half tone can be metal material, plastic material or other material.
Described half tone is provided with shielded area and aperture area.
Employed glue material is made up of glue materials such as silica gel, epoxy resin or liquid glasses.
Described led chip can place on clamp tool, the tinsel or on other bearing apparatus or the instrument.
Described tinsel can be a gold, silver, metal or alloy such as copper and aluminium.
Described led chip can be quaternary material and other various led chip materials such as binary materials such as GaN or AlGaNP.
The process of described screen painting can be various coating processes such as blade coating, spraying, roller coating, printing or transfer printing.
After adopting such scheme, the present invention utilizes half-tone screen printing method to be used to be coated with the LED phosphor powder layer, the fluorescent glue that will include fluorescent material via screen printing technology is uniformly coated on the surface of the front of led chip and lateral emitting layer, the thickness that phosphor powder layer is distributed is even, and then improve the uneven problem of conventional point glue phosphor powder layer, remove the uniformity to increase fluorescent material and to distribute, reduce the chance of fluorescent material heat absorption, extinction greatly, more can increase the effect of chip light source excitated fluorescent powder, to reach fully and more efficient mixed light effect.
It is following that the present invention is further described in conjunction with the accompanying drawings and embodiments:
Description of drawings
Fig. 1 is the half tone schematic diagram of printing usefulness;
Fig. 2 to Fig. 4 is the schematic diagram of first embodiment of the invention;
Fig. 5 to Fig. 8 is the schematic diagram of second embodiment of the invention;
Fig. 9 to Figure 12 is the schematic diagram of third embodiment of the invention.
Symbol description among the figure
1 half tone, 2 half tone blind zones, 3 led chips, 4 fluorescent glues
5 scrapers, 6 coating clamp tools, 7 half tones coating opening, 8 gold threads
9 package supports (substrate), 10 copper foil substrate 11LED wafers
The specific embodiment
Led chip surface fluorescent powder layer coating method of the present invention, evenly silica gel, epoxide-resin glue or the liquid glass glue of mixed fluorescent powder in advance before printing coating need to make earlier the half tone of printing usefulness, as shown in Figure 1, half tone 1 material can be a metal, as stainless steel, or material such as plastics.Need to distinguish aperture area and half tone blind zone 2 on the half tone, aperture area coating during fluorescent glue fluorescent glue can pass half tone and in the space below inserting and be bonded together with led chip, the half tone blind zone can stop that fluorescent glue passes through, so will not have fluorescent glue below the half tone blind zone, so original predetermined LED surface of exposing is as electrode etc., to can not be coated under the fluorescent glue, make follow-up procedure for processing, as routing, connection electrode etc., can normal operation and performance effect.The pattern of aperture area and half tone blind zone can be done any variation on the half tone simultaneously, injects composition and the colour temperature that the gold-tinted ratio of changing out behind the fluorescent glue is adjusted white light thereby therefore can adjust blue light by this.
Implementation method one: extremely shown in Figure 4 as Fig. 2, to cut apart placing respectively on the special-purpose clamp tool 6 or on the tinsel or on other bearing apparatus or the instrument of many of good led chips 3 (led chip can be quaternary material and other various led chip materials such as binary material such as GaN or AlGaNP) earlier, tinsel can be a gold, silver, metal or alloy such as copper and aluminium.Half tone 1 is positioned on the clamp tool opens, the fluorescent glue that will be pre-mixed fluorescent material then places on the version, push fluorescent glue with scraper 5 back and forth with suitable strength, fluorescent glue is pushed clamp-ons among the space of half tone below, and fill up in the space of clamp tool, led chip and half tone below; As shown in Figure 3, exist because of the blind zone is arranged on the half tone, can form room 7 below the blind zone and do not filled up by fluorescent glue, the room can make the electrode on the led chip expose, and is not covered by fluorescent glue.Then carry out fluorescent glue and solidify baking, after finishing led chip is taken off from clamp tool, form the led chip of single coating fluorescent glue, when carrying out follow-up encapsulation procedure chip is positioned over LED packaging conductor frame or substrate 9, electrode on the available gold thread 8 binding led chips and the electrode on packaging conductor frame or the substrate, form circuit pathways, the LED components and parts that encapsulation is finished can normal operation.
Implementation method two: to shown in Figure 8, carry out blind zone 2 among Fig. 5 on the half tone 1 in advance as Fig. 5.Led chip 3 is fixed in earlier on the copper foil 10 arranges, half tone 1 is positioned on the clamp tool 6 opens, the fluorescent glue that will be pre-mixed fluorescent material then places on the version, push fluorescent glue with scraper 5 back and forth with suitable strength, fluorescent glue is pushed clamp-ons among the space of half tone below, and fill up in the space of clamp tool, led chip and half tone below, as shown in Figure 7, because of there being the blind zone to exist on the half tone, can form room 7 below the blind zone is not filled up by fluorescent glue, the room can make the electrode on the led chip expose, and is not covered by fluorescent glue.With laser (Laser) or diamond cutter led chip is cut into single form together with fluorescent glue and copper foil then, as shown in Figure 8.
Implementation method three: extremely shown in Figure 12 as Fig. 9, carry out blind zone 2 among Fig. 9 on the half tone 1 in advance, then as shown in figure 10, the LED wafer 11 of carrying out the Surface Groove processing in advance is fixed on the clamp tool 6, half tone 1 is positioned on the clamp tool 6 opens, the fluorescent glue that will be pre-mixed fluorescent material then places on the version, push fluorescent glue with scraper 5 back and forth with suitable strength, fluorescent glue is pushed clamp-ons among the space of half tone below, and fill up clamp tool, in the space of led chip and half tone below, as shown in figure 11, because of there being the blind zone to exist on the half tone, can form room 7 below the blind zone and do not filled up by fluorescent glue, the room can make the electrode on the led chip expose, and is not covered by fluorescent glue.With laser or diamond cutter led chip is cut into single form together with fluorescent glue and copper foil then, as shown in figure 12.
After led chip cuts into single form in implementation method two and the implementation method three, then carry out fluorescent glue and solidify baking, led chip will form single coating fluorescent glue after finishing, when carrying out follow-up encapsulation procedure chip is positioned over LED packaging conductor frame or substrate 9, electrode on the available gold thread 8 binding led chips and the electrode on packaging conductor frame or the substrate, form circuit pathways, the LED components and parts that encapsulation is finished can normal operation.
The process of the screen painting of indication of the present invention can be various coating processes such as blade coating, spraying, roller coating, printing or transfer printing.
Claims (8)
1, a kind of led chip surface fluorescent powder layer coating method is that fluorescent material and glue material are uniformly mixed into fluorescent glue in advance, utilizes web plate to be uniformly coated on the front and side surface of led chip luminescent layer again.
2, led chip surface fluorescent powder layer coating method as claimed in claim 1, its feature can be metal material, plastic material or other material at the half tone that uses.
3, led chip surface fluorescent powder layer coating method as claimed in claim 1 or 2, its feature is provided with shielded area and aperture area on half tone.
4, led chip surface fluorescent powder layer coating method as claimed in claim 1, its feature is made up of glue materials such as silica gel, epoxy resin or liquid glasses at the glue material that uses.
5, led chip surface fluorescent powder layer coating method as claimed in claim 1, its feature led chip therein can place on clamp tool, the tinsel or on other bearing apparatus or the instrument.
6, led chip surface fluorescent powder layer coating method as claimed in claim 5, its feature can be a gold at tinsel, silver, metal or alloy such as copper and aluminium.
7, led chip surface fluorescent powder layer coating method as claimed in claim 1, its feature can be quaternary material and other various led chip materials such as binary materials such as GaN or AlGaNP at led chip.
8, led chip surface fluorescent powder layer coating method as claimed in claim 1, its feature can be various coating processes such as blade coating, spraying, roller coating, printing or transfer printing in the process of screen painting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100048848A CN101099964A (en) | 2006-07-07 | 2007-02-07 | LED chip surface fluorescent powder layer coating method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610101225 | 2006-07-07 | ||
| CN200610101225.1 | 2006-07-07 | ||
| CNA2007100048848A CN101099964A (en) | 2006-07-07 | 2007-02-07 | LED chip surface fluorescent powder layer coating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101099964A true CN101099964A (en) | 2008-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100048848A Pending CN101099964A (en) | 2006-07-07 | 2007-02-07 | LED chip surface fluorescent powder layer coating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101099964A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102211073A (en) * | 2010-04-09 | 2011-10-12 | 海洋王照明科技股份有限公司 | Fluorescent powder planar coating device and method |
| CN102290498A (en) * | 2011-05-27 | 2011-12-21 | 协鑫光电科技（张家港）有限公司 | Method for manufacturing LED (light-emitting diode) capable of generating white light by plane fluorescent powder of chip step |
| CN102738370A (en) * | 2012-07-04 | 2012-10-17 | 深圳市聚飞光电股份有限公司 | Led packaging method |
| CN102795005A (en) * | 2012-07-09 | 2012-11-28 | 厦门飞德利照明科技有限公司 | Fluorescent powder silk-screen printing technology of LED (light emitting diode) module |
| CN102931328A (en) * | 2012-11-28 | 2013-02-13 | 北京半导体照明科技促进中心 | Manufacturing method of LED (Light-Emitting Diode) packaging body |
| CN102956797A (en) * | 2012-11-23 | 2013-03-06 | 天津三安光电有限公司 | Manufacturing method for LED (Light Emitting Diode) |
| CN104128305A (en) * | 2014-07-31 | 2014-11-05 | 广东威创视讯科技股份有限公司 | Smearing process and device applied to LEDs |
| CN104185907A (en) * | 2011-09-21 | 2014-12-03 | Ev集团E·索尔纳有限责任公司 | Method for producing a polychromizing layer and substrate and also light-emitting diode having a polychromizing layer |
| CN105431236A (en) * | 2013-04-20 | 2016-03-23 | 玛太克司马特股份有限公司 | Particulate coating or distribution method |
| CN105702836A (en) * | 2016-04-26 | 2016-06-22 | 苏州瑞而美光电科技有限公司 | Silk screen packaging method for white light semiconductor lighting module |
| CN106129227A (en) * | 2016-09-26 | 2016-11-16 | 麦科勒（滁州）新材料科技有限公司 | A kind of fluorescent material that wraps up is in LED flip chip upper surface and the method on top layer, side |
| CN108212698A (en) * | 2018-03-12 | 2018-06-29 | 黄琴 | A kind of double-colored temperature LED light source point glue equipment of flexibility |
| CN111842015A (en) * | 2019-04-28 | 2020-10-30 | 江苏长电科技股份有限公司 | Printing apparatus and printing method |
| CN113488456A (en) * | 2021-06-25 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
| CN115055334A (en) * | 2022-06-01 | 2022-09-16 | 绍兴欧柏斯光电科技有限公司 | Intelligent glue spraying device applied to nixie tube and control method thereof |
-
2007
- 2007-02-07 CN CNA2007100048848A patent/CN101099964A/en active Pending
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102211073B (en) * | 2010-04-09 | 2013-06-05 | 海洋王照明科技股份有限公司 | Fluorescent powder planar coating device and method |
| CN102211073A (en) * | 2010-04-09 | 2011-10-12 | 海洋王照明科技股份有限公司 | Fluorescent powder planar coating device and method |
| CN102290498A (en) * | 2011-05-27 | 2011-12-21 | 协鑫光电科技（张家港）有限公司 | Method for manufacturing LED (light-emitting diode) capable of generating white light by plane fluorescent powder of chip step |
| CN104185907B (en) * | 2011-09-21 | 2017-11-24 | Ev集团E·索尔纳有限责任公司 | Manufacture the method and substrate and the light emitting diode with multicolor layer of multicolor layer |
| CN104185907A (en) * | 2011-09-21 | 2014-12-03 | Ev集团E·索尔纳有限责任公司 | Method for producing a polychromizing layer and substrate and also light-emitting diode having a polychromizing layer |
| CN102738370B (en) * | 2012-07-04 | 2015-03-18 | 深圳市聚飞光电股份有限公司 | Led packaging method |
| CN102738370A (en) * | 2012-07-04 | 2012-10-17 | 深圳市聚飞光电股份有限公司 | Led packaging method |
| US9231172B2 (en) | 2012-07-09 | 2016-01-05 | Xiamen Friendly Lighting Technology Co., Ltd. | Screen printing method of LED module with phosphor |
| WO2014008788A1 (en) * | 2012-07-09 | 2014-01-16 | 厦门飞德利照明科技有限公司 | Phosphor screen printing process of led module |
| CN102795005A (en) * | 2012-07-09 | 2012-11-28 | 厦门飞德利照明科技有限公司 | Fluorescent powder silk-screen printing technology of LED (light emitting diode) module |
| CN102795005B (en) * | 2012-07-09 | 2015-12-02 | 厦门飞德利照明科技有限公司 | A kind of fluorescent material silk-screen printing technique of LED module |
| WO2014079338A1 (en) * | 2012-11-23 | 2014-05-30 | 厦门市三安光电科技有限公司 | Manufacturing method for light emitting diode |
| CN102956797A (en) * | 2012-11-23 | 2013-03-06 | 天津三安光电有限公司 | Manufacturing method for LED (Light Emitting Diode) |
| CN102956797B (en) * | 2012-11-23 | 2015-01-07 | 天津三安光电有限公司 | Manufacturing method for LED (Light Emitting Diode) |
| CN102931328A (en) * | 2012-11-28 | 2013-02-13 | 北京半导体照明科技促进中心 | Manufacturing method of LED (Light-Emitting Diode) packaging body |
| CN102931328B (en) * | 2012-11-28 | 2016-05-11 | 北京半导体照明科技促进中心 | A kind of preparation method of LED packaging body |
| CN105431236A (en) * | 2013-04-20 | 2016-03-23 | 玛太克司马特股份有限公司 | Particulate coating or distribution method |
| CN105431236B (en) * | 2013-04-20 | 2017-06-13 | 玛太克司马特股份有限公司 | The coating of bulk material or distribution method |
| CN104128305A (en) * | 2014-07-31 | 2014-11-05 | 广东威创视讯科技股份有限公司 | Smearing process and device applied to LEDs |
| CN105702836A (en) * | 2016-04-26 | 2016-06-22 | 苏州瑞而美光电科技有限公司 | Silk screen packaging method for white light semiconductor lighting module |
| CN106129227A (en) * | 2016-09-26 | 2016-11-16 | 麦科勒（滁州）新材料科技有限公司 | A kind of fluorescent material that wraps up is in LED flip chip upper surface and the method on top layer, side |
| CN108212698A (en) * | 2018-03-12 | 2018-06-29 | 黄琴 | A kind of double-colored temperature LED light source point glue equipment of flexibility |
| CN111842015A (en) * | 2019-04-28 | 2020-10-30 | 江苏长电科技股份有限公司 | Printing apparatus and printing method |
| CN113488456A (en) * | 2021-06-25 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
| CN115055334A (en) * | 2022-06-01 | 2022-09-16 | 绍兴欧柏斯光电科技有限公司 | Intelligent glue spraying device applied to nixie tube and control method thereof |
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