CN101098613A

CN101098613A - Radiating module device

Info

Publication number: CN101098613A
Application number: CNA2006101001469A
Authority: CN
Inventors: 施博仁; 林志宪
Original assignee: Giga Byte Technology Co Ltd
Current assignee: Giga Byte Technology Co Ltd
Priority date: 2006-06-30
Filing date: 2006-06-30
Publication date: 2008-01-02
Anticipated expiration: 2026-06-30
Also published as: CN101098613B

Abstract

A heat radiation module is provided with a thermal conductive plate fixed with at least one thermal conductive tube, wherein the thermal conductive tube is composed of at least one heat accept end and one condense terminal mounted on the thermal conductive plate, each condense end is through with a heat radiation fin group provided with a shaft post. The flange of the shaft post is integrally shaped with a plurality of heat radiation fins. The middle of the shaft post is axially through with a through hole, via which the condense end of the thermal conductive tube can pass to transmit heat. Therefore, the heat generated by heating elements can be first transmitted to the thermal conductive plate, to exchange heat with the thermal conductive tube on the thermal conductive plate, while the exchanged heat of the thermal conductive tube is leaded to the heat radiation fin group to be discharged.

Description

Radiating module device

Technical field

The present invention relates to a kind of radiating module device, particularly a kind of radiator that is applied on the electronic heating component (as CPU).

Background technology

Along with scientific and technological industry develops fast; computer is more and more faster on arithmetic speed; yet when the arithmetic speed of central processing unit is high more; the heat that is produced during its running is also more and more high; for this intensive heat effectively being distributed to the outer environment of main frame, can operate under permissive temperature to keep central processing unit, can on central processing unit, be provided with radiator usually; in order to assist the central processing unit heat radiation, to increase heat-sinking capability.

And the radiator earliest period be designed to an aluminium extruded type radiator, its aluminium extruded is formed with several pieces fin, and this aluminium extruded type radiator is directly installed on central processing unit or other pyrotoxin, by the aluminium extruded type radiator central processing unit or other pyrotoxin are dispelled the heat.Subsequently, then above the aluminium extruded type radiator, radiator fan is installed,, the heat of heat radiator body is taken away, to reduce the temperature of heat radiator body by the wind that this radiator fan produced in order to improve radiating efficiency.But it is not enough that above-mentioned radiator is still disliked on radiating efficiency, so below this aluminium extruded type radiator, locate to be provided with again heat-conducting plate or heat pipe, have working fluid and capillary structure in heat-conducting plate or the heat pipe, utilize this heat-conducting plate or heat pipe to dispel the heat to pyrotoxin fast.

Other has the thin sheet of metal utilized with the made stacking-type radiating fin of continuous punching out mode, though it reduces the spacing between each fin, and can link by the heat pipe serial connection, but because after each fin is arranged on the heat pipe, gapped unavoidably to each other, this gap just causes heat pipe to fail to contact with fin and makes heat pass area minimizing or waste, not as wearing heat pipe with the aluminium extruded type radiator, can more completely contact effectively with heat pipe.

Yet, traditional aluminium extruded type radiator is that its radiating fin is integrally formed on its pedestal that is heated, though can cooperate the radiator fan of side blown type or bottom blowing type to use, when desiring to blow on every side assemblies such as transistor of central processing unit, also only can adopt the radiator fan of bottom blowing type with radiator fan.At this moment,, and cause the cold air that blows from top to bottom to be stopped, thereby can't be smoothly be blowed transistor around the central processing unit etc. and locate by this pedestal promptly because of the pedestal that is heated of general aluminium extruded type radiator.

Summary of the invention

Main purpose of the present invention is to provide a kind of radiating module device, make on the condensation end of each heat pipe of radiating module device and all be equipped with independently radiating fin group, this radiating fin group can be to extrude as aluminium and forms, and can cooperate the bottom blowing type radiator fan to use.

In order to achieve the above object, the invention provides a kind of radiating module device, dispel the heat, comprise that one forms in order to be attached at the heat-conducting plate on the above-mentioned electronic heating component, at least one heat pipe and a radiating fin group in order to help electronic heating component; Each heat pipe is fixedly arranged on the heat-conducting plate, and constituted by the heating end and the upwardly extending condensation end that are fixed on the heat-conducting plate, the radiating fin group then is arranged on the condensation end of heat pipe, so that condensation end has separately radiating fin group as the usefulness of heat exchange; Wherein, the radiating fin group has a jack-post, and the jack-post outer rim all is formed with several radiating fins, and place and axially be penetrated with a perforation along it in the middle of the jack-post, penetrates for the condensation end of heat pipe and makes heat and pass and link.

Radiating module device of the present invention not only can increase the chance that the condensation end of each heat pipe contacts with outside air, more can dispel the heat at the transistor around the electronic heating component, so as to radiating efficiency and the applicable situation thereof that significantly promotes this radiating module device.

Description of drawings

Fig. 1 is the three-dimensional exploded view of radiating module device of the present invention;

Fig. 2 is the three-dimensional combination figure of radiating module device of the present invention;

Fig. 3 is the plan view from above of radiating module device of the present invention;

Fig. 4 is the A-A cross-section cutaway view of Fig. 3; And

Fig. 5 is the three-dimensional exploded view of another embodiment of the present invention.

Embodiment

The present invention is a kind of radiating module device, please refer to shown in Figure 1ly, and this radiating module device 10 is in order to be applied in as on central processing unit (CPU) 20 electronic heating components such as grade; Wherein, radiating module device 10 has a heat-conducting plate 1, and heat-conducting plate 1 is provided with containing groove 11, for setting more than one heat pipe 2 is set, heat pipe 2 is made of the heating end 21 and the upwardly extending condensation end 22 that are installed on the heat-conducting plate 1, can be " L " font or " U " font.Erect in the present embodiment and be provided with two groups of heat pipes 2 that are the U font, each group heat pipe 2 includes the heating end 21 and the two vertical condensation ends 22 of a level, so heating end 21 and four vertical condensation ends 22 of having two curved arc shapes in the present embodiment, the heating end 21 of level then is fixed in the containing groove 11 of heat-conducting plate 1.

Among the present invention, on each condensation end 22 of heat pipe 2, be equipped with a radiating fin group 3 respectively, make each condensation end 22 have separately radiating fin group 3 as the usefulness of heat exchange; Wherein, respectively this radiating fin group 3 has a jack-post 31, and be formed with several pieces radiating fins 32 that to arrange radially in jack-post 31 outer rims separately, and the place also is penetrated with a perforation 33 vertically in the middle of the jack-post 31, for the condensation end 22 that wears heat pipe 2, and then make condensation end 22 and each radiating fin group 3 do the binding of heat biography.In the present embodiment, further integrally formed and form a radiating fin 30 jointly by several group radiating fin groups 3, this radiating fin 30 further has a supporter 301 that is branch-like, this supporter 301 is each end of branch-like and connects a described radiating fin group 3 respectively, this radiating fin group 3 is arranged in the form of a ring and outside this supporter 301, and it is one fan-shaped that each radiating fin group 3 is respectively, so that this radiating fin 30 constitutes a circle by this fan-shaped radiating fin group 3.

Please refer to shown in Fig. 2,3, when the present invention assembles, the heating end 21 of two groups of heat pipes 2 is installed in the containing groove 11 of heat-conducting plate 1 respectively, then this radiating fin 30 is set on two groups of heat pipes 2; When wearing, the condensation end 22 of heat pipe 2 is promptly aimed in the perforation 33 of each radiating fin group 3 of radiating fin 30, and radiating fin 30 is fastened on two groups of heat pipes 2, and this can roughly finish the assembling of a radiating module device 10.

Please refer to shown in Figure 4ly, during use, radiating module device 10 is installed on the central processing unit 20 of motherboard 100, make heat-conducting plate 1 be attached to the end face place of central processing unit 20.So the heat that is produced when central processing unit 20 runnings can conduct on the heat-conducting plate 1 earlier, again with heat-conducting plate 1 on the heating end 21 of each heat pipe 2 carry out heat exchange, heat after each heat pipe 2 heat exchange then guides to radiating fin group 3 places by condensation end 22 more separately, discharge again at last in outside, and make central processing unit 20 reach the effect of heat radiation.Simultaneously, this radiating fin group 3 can be directed to below place by the top with cold air, so applicable to the bottom blowing type radiator fan, located so that the cold air that radiator fan blew out can blow smoothly to central processing unit transistor on every side etc.

Please refer to shown in Figure 5ly, it is the another embodiment of the present invention schematic diagram.Several radiating fin groups 3 ' that it is worn on the condensation end 22 of this heat pipe 2, be setting separated from one another and be not connected, and each radiating fin group 3 ' also has a jack-post 31 ', be formed with several pieces radiating fins 32 ' of arranging radially in each jack-post 31 ' outer rim, and locate in the middle of the jack-post 31 ' and axially be penetrated with one to bore a hole 33 ' along it.In the present embodiment, because of being provided with two groups of heat pipes 2 that are the U font, each group heat pipe 2 includes the heating end 21 and the two vertical condensation ends 22 of a level, so also be provided with four groups of radiating fin groups 3 ', can on four condensation ends 22 of two groups of heat pipes 2, be equipped with a radiating fin group 3 ' respectively.

Via after the said structure explanation as can be known, because radiating module device 10 of the present invention all is equipped with independently radiating fin group 3,3 ' on the condensation end 22 of each heat pipe 2, the chance that makes the condensation end 22 of each heat pipe 2 contact with outside air increases, so can increase the area of dissipation and the radiating rate of entire heat dissipation modular device 10, thereby significantly promote the radiating efficiency of this radiating module device 10.

Below preferred embodiment of the present invention is specified, but the present invention is not limited to described embodiment, those of ordinary skill in the art also can make all modification that is equal to or replacement under the prerequisite of spirit of the present invention, modification that these are equal to or replacement all are included in the application's claim institute restricted portion.

Claims

1, a kind of radiating module device dispels the heat in order to help electronic heating component, it is characterized in that this radiating module device comprises:

One heat-conducting plate is in order to be attached on the described electronic heating component;

One heat pipe is fixedly arranged on this heat-conducting plate, and this heat pipe is made of the heating end and the upwardly extending condensation end that are fixed on this heat-conducting plate; And

One radiating fin group is arranged in respectively on the condensation end of this heat pipe, so that condensation end has separately radiating fin group as the usefulness of heat exchange;

Wherein, this radiating fin group has a jack-post, and this jack-post outer rim all is formed with several radiating fins, and place and axially be penetrated with a perforation along it in the middle of this jack-post, penetrates for the condensation end of this heat pipe and makes heat and pass and link.

2, radiating module device as claimed in claim 1 is characterized in that: this heat-conducting plate is provided with containing groove, fixes for the heating end of this heat pipe.

3, radiating module device as claimed in claim 1 is characterized in that: this heat pipe is the U font.

4, radiating module device as claimed in claim 1 is characterized in that: this heat pipe is the L font.

5, radiating module device as claimed in claim 1, it is characterized in that: this radiating fin group is made up of several, and it is further integrally formed and form a radiating fin jointly, and this radiating fin further has a supporter that is branch-like, be each end of branch-like at this supporter and connect a described radiating fin group respectively, this radiating fin group is arranged and in the form of a ring outside this supporter.

6, radiating module device as claimed in claim 5 is characterized in that: this radiating fin group is one fan-shaped respectively, so that make this radiating fin constitute a circle by this radiating fin group.

7, radiating module device as claimed in claim 1 is characterized in that: this radiating fin is arranged radially.