CN101097985A - Package member and manufacturing method therefor - Google Patents
Package member and manufacturing method therefor Download PDFInfo
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- CN101097985A CN101097985A CNA2007101367304A CN200710136730A CN101097985A CN 101097985 A CN101097985 A CN 101097985A CN A2007101367304 A CNA2007101367304 A CN A2007101367304A CN 200710136730 A CN200710136730 A CN 200710136730A CN 101097985 A CN101097985 A CN 101097985A
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- adhesive force
- chip
- lens jacket
- layer
- manufacture method
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Abstract
The invention relates to a package element and a relative production, wherein the production comprises that first, arranging a chip on a substrate to be electrically connected, forming an adhesive force adjusting layer on the chip, while the adhesive force adjusting layer and the chip are provided with a first adhesive force between, forming a first lens layer on the adhesive force adjusting layer, while the adhesive force adjusting layer and the first lens layer are provided with a second adhesive force between. The adhesive force adjusting layer can change the surface state of chip, therefore, the interaction between the cohesive force and surface tension of the first lens layer, and the second adhesive force can support the shaping of the first lens layer.
Description
Technical field
The present invention relates to a kind of packaging part and manufacture method thereof, and be particularly related to a kind of packaging part and manufacture method thereof with lens jacket.
Background technology
Please refer to Figure 1A, it illustrates the schematic diagram of traditional packaging part.Packaging part 100 comprises reflector 101, chip 103 and packing colloid 105.Chip 103 is placed in the reflector 101.Packing colloid 105 pours in the reflector 101, to cover chip 103.
Packing colloid 105 is shaped according to the shape of reflector 101.After packing colloid 105 poured into reflector 101, reflector 101 can not break away from packing colloid 105 to reuse.Therefore, make the manufacturing cost of this kind packaging part 100 improve.
Please refer to Figure 1B, it illustrates the schematic diagram of the traditional packaging part of another kind.Compared to the packaging part 100 of Figure 1A, the packaging part 150 of Figure 1B also comprises convex colloid 155.Please refer to Fig. 1 C, it illustrates the schematic diagram of mould.The material of convex colloid 155 (shown in Figure 1B) pours at least one depression 161 of mould 160, and is solidified into convex colloid 155.Then, shown in Figure 1B, convex colloid 155 utilizes the mode of heating to be bonded on the surface 157 of packing colloid 105 again, to form packaging part 150.
Though convex colloid 155 can be in order to improving the optical characteristics of packaging part 150, yet the step of manufacturing of packaging part 150 is comparatively loaded down with trivial details, its step comprise Figure 1A packaging part 100 step and make the step of convex colloid 155.In addition, packaging part 150 needs mould 160 (shown in Fig. 1 C) as the mould that forms convex colloid 155 during fabrication.Therefore, improve the manufacturing cost of packaging part 150 more.
Summary of the invention
The invention provides a kind of packaging part and manufacture method thereof, it utilizes adhesive force to adjust the shape that layer is adjusted first lens jacket, so that light forms different optical field distribution by control behind first lens jacket.
According to a first aspect of the invention, propose a kind of manufacture method of packaging part, this manufacture method comprises: at first, first step is provided with chip on substrate, and chip is electrically connected with substrate.Then, second step forms adhesive force and adjusts layer on chip.Has first adhesive force between adhesive force adjustment layer and the chip.Then, third step forms first lens jacket and adjusts on the layer in adhesive force.Has second adhesive force between the adhesive force adjustment layer and first lens jacket.Because adhesive force adjustment layer is covered in chip and has changed surface state, makes the reciprocation of cohesive force, surface tension and second adhesive force of the material of the lens jacket of winning, and helps the shaping of first lens jacket.
Manufacturing method according to the invention, wherein after described third step, described manufacture method also comprises: form at least one second lens jacket on described first lens jacket.
Manufacturing method according to the invention, the mode of wherein in described second step, utilize that rotation is smeared, brushed, spraying, dipping or point being stained with form described adhesive force and adjust layer on described chip.
Manufacturing method according to the invention, wherein in described third step, the mode of utilizing point to be stained with is adjusted at described adhesive force and is formed described first lens jacket on the layer.
Manufacturing method according to the invention, wherein after described second step and before described third step, described manufacture method also comprises: the described adhesive force that hardens is adjusted layer.
Manufacturing method according to the invention, wherein said first step also comprise utilizes lead to be electrically connected described chip and described substrate.
Manufacturing method according to the invention, wherein said second step also comprises the described lead of cover part, and the described lead of another part is exposed outside described adhesive force is adjusted layer.
Manufacturing method according to the invention, wherein said third step also comprise the described lead that another part is exposed in covering.
Manufacturing method according to the invention, wherein said first lens jacket is essentially hemisphere.
Manufacturing method according to the invention, wherein said chip are light-emitting diode chip for backlight unit.
Manufacturing method according to the invention, wherein said substrate are printed circuit board (PCB).
Manufacturing method according to the invention, wherein said first lens jacket and described adhesive force adjustment layer are essentially identical or different material.
According to a second aspect of the invention, a kind of packaging part is proposed.Packaging part comprises substrate, chip, adhesive force adjustment layer and first lens jacket.Chip is arranged on the substrate, and chip is electrically connected with substrate.Adhesive force adjustment layer is arranged on the chip and the cover part substrate.Has first adhesive force between adhesive force adjustment layer and the chip.First lens jacket is arranged at adhesive force and adjusts on the layer.Has second adhesive force between the adhesive force adjustment layer and first lens jacket.The change of the surface state of chip helps the shaping of first lens jacket.
According to packaging part of the present invention, also comprise: at least one second lens jacket, described second lens jacket is arranged on described first lens jacket.
According to packaging part of the present invention, wherein said chip is electrically connected described substrate with lead, and the described lead of part is exposed to described adhesive force and adjusts outside the layer, and described first lens jacket also covers the described lead that exposes.
According to packaging part of the present invention, wherein said substrate is a printed circuit board (PCB).
According to packaging part of the present invention, wherein said chip is a light-emitting diode chip for backlight unit.
According to packaging part of the present invention, wherein said first lens jacket is essentially hemisphere.
According to packaging part of the present invention, the material of wherein said adhesive force adjustment layer is Teflon, epoxy resin or silica gel.
According to packaging part of the present invention, the material of wherein said first lens jacket is epoxy resin or silica gel.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Figure 1A illustrates the schematic diagram of traditional packaging part.
Figure 1B illustrates the schematic diagram of the traditional packaging part of another kind.
Fig. 1 C illustrates the schematic diagram of mould.
Fig. 2 illustrates the flow chart according to the manufacture method of the packaging part of first embodiment of the invention.
Fig. 3 A～Fig. 3 C illustrates the schematic flow sheet of the manufacture method of Fig. 2.
Fig. 4 illustrates the irradiant schematic diagram of chip of Fig. 3 C.
Fig. 5 illustrates the schematic diagram according to the packaging part of second embodiment of the invention.
Wherein, description of reference numerals is as follows:
100,150,200,300: packaging part
101: reflector 103: chip
105: packing colloid 155: the convex colloid
157: surface 160: mould
161: depression 210: substrate
215: lead 220: chip
230: adhesive force is adjusted 240: the first lens jacket of layer
Lens jacket 400 in 340: the second: light
410: optical field distribution
Embodiment
First embodiment
Please be simultaneously with reference to Fig. 2 and Fig. 3 A～Fig. 3 C, Fig. 2 illustrates the flow chart according to the manufacture method of the packaging part of first embodiment of the invention, and Fig. 3 A～Fig. 3 C illustrates the schematic flow sheet of the manufacture method of Fig. 2.
At first, shown in Fig. 2 and Fig. 3 A, in step 301, chip 220 is set on substrate 210.Chip 220 for example is to utilize at least one lead 215 to be electrically connected with substrate 210.
Then, shown in Fig. 2 and Fig. 3 B, in step 303, form adhesive force and adjust layer 230 on chip 220.Has first adhesive force between adhesive force adjustment layer 230 and the chip 220.
Then, shown in Fig. 3 C, form first lens jacket 240 and adjust on the layer 230, to form packaging part 200 at adhesive force.Wherein, has second adhesive force between the adhesive force adjustment layer 230 and first lens jacket 240.Because adhesive force adjustment layer 230 covers on the chip 220 and has changed surface state, makes the reciprocation of cohesive force, surface tension and second adhesive force of the material of the lens jacket 240 of winning, and helps the shaping of first lens jacket 240.
Adhesive force is two kinds of van der Waals' forces between the material.That is to say, when adhesive force more hour, the van der Waals' force between two kinds of materials is more little, when adhesive force was big more, the van der Waals' force between two kinds of materials was big more.In the present embodiment, because adhesive force adjustment layer 230 covers on the chip 220 and has changed surface state, make the second adhesive force reciprocation of cohesive force, surface tension and the adhesive force adjustment interlayer of the material of the lens jacket 240 of winning, compared to first adhesive force, help the shaping of first lens jacket 240.
Moreover, in the present embodiment, chip 220 for example be light-emitting diode (Light Emitting Diode, LED), and substrate 210 for example be printed circuit board (PCB) (Printed Circuit Board, PCB).Please refer to Fig. 4, it illustrates the irradiant schematic diagram of chip of Fig. 3 C.When chip 220 was luminous, light 400 was adjusted layer 230 and first lens jacket 240 by adhesive force respectively.Because adhesive force adjustment layer 230 can be adjusted the shape of first lens jacket 240, therefore may command forms different optical field distribution 410 after light 400 is by first lens jacket 240.Preferably, in the present embodiment, first lens jacket 240 can see through suitably and adjust, and becomes hemisphere.
Shown in Fig. 3 B, when adhesive force was adjusted layer 230 covering chip 220, it is comparatively smooth that adhesive force is adjusted layer 230.So, adhesive force is adjusted the only lead 215 of cover part of layer 230, and 215 in the lead of another part is exposed to adhesive force and adjusts outside the layer 230.Shown in Fig. 3 C, when first lens jacket 240 is covered in adhesive force when adjusting layer 230, first lens jacket 240 comparatively protrudes.So, though but adhesive force is adjusted the only lead 215 of cover part of layer 230, and 215 in the lead of another part is exposed to adhesive force and adjusts outside the layer 230, and first lens jacket 240 can cover the lead that exposes.
In addition, shown in Fig. 3 C, the adhesive force of present embodiment is adjusted layer 230 except covering chip 220, and adhesive force is adjusted also cover part substrate 210 of layer 230.Yet adhesive force adjustment layer 230 also can cover whole substrates 210.This part is looked process requirements.Adhesive force adjustment layer 230 can rotate smear, brush, mode that spraying, dipping or point are stained with is formed on chip 220 and the substrate 210.In the present embodiment, first lens jacket 240 mode of being stained with point is formed at adhesive force and adjusts on the layer 230.
The material of adhesive force adjustment layer 230 for example is Teflon (Teflon), epoxy resin (epoxy) or silica gel (silicon), and the material of first lens jacket 240 then for example is epoxy resin or silica gel.The material of the material of first lens jacket 240 and adhesive force adjustment layer 230 can be identical materials, or can be different material.In the present embodiment, the adhesive force adjustment layer 230 and first lens jacket 240 are selected identical materials for use, for example are epoxy resin.That is to say that first adhesive force is formed with epoxy resin (adhesive force is adjusted layer 230) by chip 220 or printed circuit board (PCB) (substrate 210), second adhesive force is formed with epoxy resin (first lens jacket 240) by epoxy resin (adhesive force is adjusted layer 230).According to experimental result, because the change of substrate 210 and the surface state of chip 220, after the cohesive force, surface tension that makes the material of the lens jacket 240 of winning and the second adhesive force reciprocation of adhesive force adjustment interlayer, help the shaping of first lens jacket 240.
In the present embodiment, shown in Fig. 2 and Fig. 3 C, between step 303 and step 305, manufacture method preferably also comprises the step of sclerosis adhesive force adjustment layer 230.This step is hardened to not flow regime in order to make adhesive force adjustment layer 230, adjusts on the layer 230 so that first lens jacket 240 firmly is formed at adhesive force.Wherein, the mode of sclerosis for example is to utilize heating or with ultraviolet ray (UV Light) irradiation, so that adhesive force is adjusted layer 230 sclerosis.
Second embodiment
Please refer to Fig. 5, it illustrates the schematic diagram according to the packaging part of second embodiment of the invention.Packaging part 200 differences of the packaging part 300 of present embodiment and first embodiment are that a plurality of second lens jackets 340 are formed on first lens jacket 240, further adjust the shape of second lens jacket 340.
Disclosed packaging part of the above embodiment of the present invention and manufacture method thereof, it utilizes adhesive force to adjust the shape that layer is adjusted first lens jacket so that light by first lens jacket after in fact may command form different optical field distribution.Moreover the adhesive force adjustment layer and first lens jacket fully cover lead, with guardwire.In addition, the packaging part of present embodiment and manufacture method thereof can reduce the volume of manufacturing cost and reduction packaging part.
In sum, though the present invention with preferred embodiment openly as above, so it is not in order to limit the present invention.Those skilled in the art, without departing from the spirit and scope of the present invention, when doing various variations and modification.Therefore, protection scope of the present invention is as the criterion when looking accompanying Claim.
Claims (20)
1. the manufacture method of a packaging part comprises:
First step is provided with chip on substrate, and described chip is electrically connected with described substrate;
Second step forms adhesive force and adjusts layer on described chip, has first adhesive force between described adhesive force adjustment layer and the described chip; And
Third step forms first lens jacket and adjusts on the layer at described adhesive force, has second adhesive force between described adhesive force adjustment layer and described first lens jacket.
2. manufacture method as claimed in claim 1, wherein after described third step, described manufacture method also comprises:
On described first lens jacket, form at least one second lens jacket.
3. manufacture method as claimed in claim 1, the mode of wherein in described second step, utilize that rotation is smeared, brushed, spraying, dipping or point being stained with form described adhesive force and adjust layer on described chip.
4. manufacture method as claimed in claim 1, wherein in described third step, the mode of utilizing point to be stained with is adjusted at described adhesive force and is formed described first lens jacket on the layer.
5. manufacture method as claimed in claim 1, wherein after described second step and before described third step, described manufacture method also comprises:
The described adhesive force that hardens is adjusted layer.
6. manufacture method as claimed in claim 1, wherein said first step also comprise utilizes lead to be electrically connected described chip and described substrate.
7. manufacture method as claimed in claim 6, wherein said second step also comprises the described lead of cover part, and the described lead of another part is exposed outside described adhesive force is adjusted layer.
8. manufacture method as claimed in claim 7, wherein said third step also comprise the described lead that another part is exposed in covering.
9. manufacture method as claimed in claim 1, wherein said first lens jacket is essentially hemisphere.
10. manufacture method as claimed in claim 1, wherein said chip are light-emitting diode chip for backlight unit.
11. manufacture method as claimed in claim 1, wherein said substrate are printed circuit board (PCB).
12. manufacture method as claimed in claim 1, wherein said first lens jacket and described adhesive force adjustment layer are essentially identical or different material.
13. a packaging part comprises:
Substrate;
Chip is arranged on the described substrate, and described chip is electrically connected with described substrate;
Adhesive force is adjusted layer, is arranged on the described chip and the described substrate in cover part, has first adhesive force between described adhesive force adjustment layer and the described chip; And
First lens jacket is arranged on described adhesive force and adjusts on the layer, has second adhesive force between described adhesive force adjustment layer and described first lens jacket.
14. packaging part as claimed in claim 13 also comprises:
At least one second lens jacket, described second lens are stacked to be located on described first lens jacket.
15. packaging part as claimed in claim 13, wherein said chip is electrically connected described substrate with lead, and the described lead of part is exposed to described adhesive force and adjusts outside the layer, and described first lens jacket also covers the described lead that exposes.
16. packaging part as claimed in claim 13, wherein said substrate are printed circuit board (PCB).
17. packaging part as claimed in claim 13, wherein said chip are light-emitting diode chip for backlight unit.
18. packaging part as claimed in claim 13, wherein said first lens jacket is essentially hemisphere.
19. packaging part as claimed in claim 13, the material of wherein said adhesive force adjustment layer is Teflon, epoxy resin or silica gel.
20. packaging part as claimed in claim 13, the material of wherein said first lens jacket are epoxy resin or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101367304A CN100521268C (en) | 2007-07-25 | 2007-07-25 | Package member and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101367304A CN100521268C (en) | 2007-07-25 | 2007-07-25 | Package member and manufacturing method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101097985A true CN101097985A (en) | 2008-01-02 |
| CN100521268C CN100521268C (en) | 2009-07-29 |
Family
ID=39011608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101367304A Expired - Fee Related CN100521268C (en) | 2007-07-25 | 2007-07-25 | Package member and manufacturing method therefor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100521268C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8012777B2 (en) | 2009-04-09 | 2011-09-06 | Lextar Electronics Corp. | Packaging process of light emitting diode |
| CN103165763A (en) * | 2011-12-14 | 2013-06-19 | 展晶科技(深圳)有限公司 | Manufacture method of light emitting diode (LED) |
| CN114023828A (en) * | 2021-09-26 | 2022-02-08 | 佛山市顺德区蚬华多媒体制品有限公司 | Sensor and manufacturing method thereof |
-
2007
- 2007-07-25 CN CNB2007101367304A patent/CN100521268C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8012777B2 (en) | 2009-04-09 | 2011-09-06 | Lextar Electronics Corp. | Packaging process of light emitting diode |
| CN103165763A (en) * | 2011-12-14 | 2013-06-19 | 展晶科技(深圳)有限公司 | Manufacture method of light emitting diode (LED) |
| CN103165763B (en) * | 2011-12-14 | 2015-07-08 | 赛恩倍吉科技顾问（深圳）有限公司 | Manufacture method of light emitting diode (LED) |
| CN114023828A (en) * | 2021-09-26 | 2022-02-08 | 佛山市顺德区蚬华多媒体制品有限公司 | Sensor and manufacturing method thereof |
| CN114023828B (en) * | 2021-09-26 | 2023-08-01 | 佛山市顺德区蚬华多媒体制品有限公司 | Sensor and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100521268C (en) | 2009-07-29 |
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