CN101093411A - Self-cooling set for computer CPU - Google Patents

Self-cooling set for computer CPU Download PDF

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Publication number
CN101093411A
CN101093411A CN 200710069581 CN200710069581A CN101093411A CN 101093411 A CN101093411 A CN 101093411A CN 200710069581 CN200710069581 CN 200710069581 CN 200710069581 A CN200710069581 A CN 200710069581A CN 101093411 A CN101093411 A CN 101093411A
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CN
China
Prior art keywords
heat
liquid
exchange box
cpu
heat exchange
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200710069581
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Chinese (zh)
Inventor
杨继新
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to CN 200710069581 priority Critical patent/CN101093411A/en
Publication of CN101093411A publication Critical patent/CN101093411A/en
Pending legal-status Critical Current

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Abstract

A self-cooling device of computer CPU is prepared for using heat radiation plate as part of computer case, packing superconductive liquid in heat exchange box being contacted closely with CPU, transferring heat to superconductive liquid by said box when CPU is operated to release heat, evaporating said liquid to be gas state quickly by heat under vacuum condition, guiding gas state of said liquid into is radiated plate through guide tube, changing said liquid back to be liquid state after heat is radiated to the air by heat radiation plate and flowing changed-back liquid to heat exchange box again.

Description

A kind of self-cooling set for computer CPU
Technical field
The present invention relates to the computer hardware field, especially refer to a kind of device that computer CPU is cooled off voluntarily.
Background technology
CPU is the core work parts of computer, also is one of main heater element, and the product thermal value can reach about 100 watts, and CPU can operate as normal and itself temperature relation close, phenomenons such as flower screen, deadlock can appear usually if cpu temperature surpasses 65 degree.Common computer mostly is to take the fan radiating mode at present, can satisfy the operate as normal demand substantially, but has defectives such as power consumption and generation noise.
The utility model patent of existing one " CPU cooling unit " by name, its patent No. is 01240863.8, a kind of CPU cooling unit is disclosed, it has heat exchange box and refrigeration case, the stitch connection expansion connector of the dielectric extension plate of heat exchange box connects CPU and is suspended in the heat exchange box, the stitch of dielectric extension plate is connected with the CPU socket of computer main frame panel, a loop hose is connected cooling liquid outlet by ready-packaged joint with refrigeration case liquid coolant inlet, the cooling liquid outlet of refrigeration case directly is communicated with pump entry, and loop hose is communicated with formation closed circulation with outlet of circulating pump with the liquid coolant inlet of heat exchange box by ready-packaged joint.The structure more complicated though this novel cooling device cooling velocity is fast, and ebullator also will waste energy and make a noise, therefore not ideal enough.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of self-cooling set for computer CPU at above-mentioned prior art present situation, neither wastes energy under the prerequisite of cooling effect and does not make noise satisfying.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: 1, the critical piece of this cooling device comprises: heat exchange box (interior dress superconducting fluid), conduit, stopcock and heat radiator; 2, the native system device is a closed structure, and is an amount of and vacuumize by the stopcock superconducting fluid of packing into; 3, the heat exchange box is closely contacted with CPU and fixing, the superconducting fluid of the heat transferred inside when CPU is worked is utilized superconducting fluid low pressure evaporating principle to conduct heat to heat radiator and is dispersed in the air; 4, superconducting fluid is cooled to liquid at the heat radiator place and is back to the heat exchange box, begins next cool cycles.
As improvement, the heat exchange box selects for use profile to imitate the fan fin type, can not change computer main board structure, convenient fixing like this.
As improving, heat radiator like this can be so that compact overall structure be also saved cost to a certain extent as the part of cabinet again.
As further improvement, liquid coolant is selected superconducting fluid commonly used in the super heat-conductive pipe for use, under vacuum state, the vaporization of being heated, heat is passed to heat radiator rapidly, become liquid after the cooling and be back to the heat exchange box, have cold-starting, heat transfer characteristics such as (being more than 1000 times of common metal heat transfer rate) and one-way heat conduction rapidly.
Compared with prior art, the present invention utilizes superconducting fluid self-loopa principle to realize the automatic heat radiation of CPU, and with the part of heat radiator as cabinet, simple in structure, energy savings and eliminated noise is an energy-conserving and environment-protective technology, is worthy of popularization very much.
Description of drawings
Accompanying drawing is the structural representation and the fragmentary cross-sectional view of the embodiment of the invention;
Embodiment
Embodiment describes in further detail the present invention below in conjunction with accompanying drawing.As shown in drawings, the present invention is formed by heat radiator (1), conduit (2), heat exchange box (3), the airtight connection of stopcock (4), superconducting fluid (6) is housed in the heat exchange box (3) and closely contacts with computer CPU (5).Opening stopcock (4) adds superconducting fluid (6), closes stopcock (4) after inside is evacuated.
When CPU (5) work adstante febre, by heat exchange box (3) with heat transferred superconducting fluid (6), superconducting fluid is heated and is evaporated to gaseous state very soon, entered in the heat radiator (1) by conduit (2) under vacuum state, superconducting fluid (6) becomes liquid state after being dispersed into heat in the air by heat radiator (1), again be back in the heat exchange box (3) by conduit (2), begin next cool cycles.Thereby the work calories that guarantees CPU (5) in time distributes, keeps normal operating conditions.
In order to make compact conformation, to reduce cost, heat radiator (1) can be directly as the part of cabinet, and present embodiment is the computer housing loam cake, also can be used as side cover in the practical application and uses.
Superconducting fluid (6) is known super heat-conductive pipe common used material, can be distilled water, liquefied ammonia, also can be mixed with the potpourri of number of chemical reagent by a certain percentage.

Claims (4)

1, a kind of self-cooling set for computer CPU is formed by heat radiator (1), conduit (2), heat exchange box (3), the airtight connection of stopcock (4), it is characterized in that the part of heat radiator (1) as computer housing, and superconducting fluid (6) is housed in the heat exchange box (3).
2, heat exchange box according to claim 1 (3) is characterized in that external form imitates the fan heat radiator, can closely contact with computer CPU under the prerequisite that does not change the computer main board structure, convenient fixing.
3, according to the described superconducting fluid of claim 1 (6), it is characterized in that being known super heat-conductive pipe working medium commonly used, can select distilled water, liquefied ammonia for use also can be the potpourri of the chemical reagent prepared by a certain percentage.
4, self-cooling set according to claim 1 is characterized in that duty is system's airtight vacuum state.
CN 200710069581 2007-07-16 2007-07-16 Self-cooling set for computer CPU Pending CN101093411A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200710069581 CN101093411A (en) 2007-07-16 2007-07-16 Self-cooling set for computer CPU

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200710069581 CN101093411A (en) 2007-07-16 2007-07-16 Self-cooling set for computer CPU

Publications (1)

Publication Number Publication Date
CN101093411A true CN101093411A (en) 2007-12-26

Family

ID=38991696

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200710069581 Pending CN101093411A (en) 2007-07-16 2007-07-16 Self-cooling set for computer CPU

Country Status (1)

Country Link
CN (1) CN101093411A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101600324B (en) * 2009-07-06 2013-05-15 武汉大学 Surface heat-radiating device of electronic equipment
CN104035534A (en) * 2014-06-16 2014-09-10 上海戎和实业有限公司 CPU (central processing unit) vacuum heat dissipation system
CN107193353A (en) * 2017-06-19 2017-09-22 张莲莲 A kind of heat-radiating chassis for computer of high heat dispersion

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101600324B (en) * 2009-07-06 2013-05-15 武汉大学 Surface heat-radiating device of electronic equipment
CN104035534A (en) * 2014-06-16 2014-09-10 上海戎和实业有限公司 CPU (central processing unit) vacuum heat dissipation system
CN104035534B (en) * 2014-06-16 2017-04-19 上海戎和实业有限公司 CPU (central processing unit) vacuum heat dissipation system
CN107193353A (en) * 2017-06-19 2017-09-22 张莲莲 A kind of heat-radiating chassis for computer of high heat dispersion
CN107193353B (en) * 2017-06-19 2020-10-20 烟台三新新能源科技有限公司 Computer heat dissipation machine case with high heat dissipation performance

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C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20071226