CN101093057B - Liquid raw material supply unit for vaporizer - Google Patents
Liquid raw material supply unit for vaporizer Download PDFInfo
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- CN101093057B CN101093057B CN2007101100990A CN200710110099A CN101093057B CN 101093057 B CN101093057 B CN 101093057B CN 2007101100990 A CN2007101100990 A CN 2007101100990A CN 200710110099 A CN200710110099 A CN 200710110099A CN 101093057 B CN101093057 B CN 101093057B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/003—Housing formed from a plurality of the same valve elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
- F16K31/06—Actuating devices; Operating means; Releasing devices electric; magnetic using a magnet, e.g. diaphragm valves, cutting off by means of a liquid
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
- F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
- F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31691—Inorganic layers composed of oxides or glassy oxides or oxide based glass with perovskite structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
- Y10T137/4245—Cleaning or steam sterilizing
- Y10T137/4259—With separate material addition
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/877—With flow control means for branched passages
- Y10T137/87885—Sectional block structure
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
A raw material liquid supplying unit is suitable for supplying raw material liquid for a vaporizer. The raw material liquid supplying unit comprises a collection pipe, inside which a flow path is provided; and a plurality of fluid control valve on the collection pipe, comprising a raw material liquid control valve, a cleaning liquid control valve, a purge gas control valve, and a first induction control valve which can be connected to the vaporizer for controlling the fluid supply from the flow path to the vaporizer, wherein the purge gas control valve, the cleaning liquid control valve, the raw material liquid control valve, and first induction control valve are disposed on the collection pipe orderly from upstream. The flow path is respectively connected with the valve ports of the control valves, the valve ports are communicated with the corresponding control valve ports, and the flow path is constructed in such a manner that the purge gas from the purge gas control valve is allowed to directly flow in the valve ports of the cleaning liquid control valve and the raw material liquid control valve below the purge gas control valve.
Description
Technical field
The present invention relates to a kind of being used for to the raw-material liquid raw material supply unit that is used for vaporizer of vaporizer supply fluid.
Background technique
In recent years, semiconductor memory system that utilizes capacitor such as DRAM (dynamic random access memory) and FeRAM (ferroelectric RAM) and the in-line memory LSI design that needed high integration.In response to such demand, must adopt high dielectric constant materials to be used for semi-conductive manufacturing.High dielectric material is adopted with liquid form usually.Therefore, in many cases, be in vaporizer with liquid raw material supply, liquid raw material is vaporized in this vaporizer, and this bog is fed to reactor.Therefore, this process need is used for the liquid raw material supply pipeline of this liquid raw material supply to vaporizer.
If liquid raw material remains in liquid raw material pipeline and the vaporizer, may cause to be deposited on the reaction product in pipeline and the vaporizer.Such deposition is easy to cause variety of issue; For example, they become particle and produce the source, cause lower productive rate, and they block control valve and pipeline pipeline, and perhaps they block the nozzle of vaporizer.For fear of these problems, after vaporizer supply fluid raw material, the liquid raw material supply pipeline will carry out cleaning process usually.In cleaning process, with cleaning solution (by liquid-liquid displacement) liquid raw material that remains in pipeline pipeline and the vaporizer is cleaned or washs, remove cleaning solution by purge gas (by liquid-gas displacement) from pipeline pipeline and vaporizer then.
One exemplary arrangement of aforesaid liquid raw material supply pipeline becomes as shown in Figure 6, wherein, liquid raw material pipeline 101 and 102 each all comprise and be used for raw-material valve of feed fluid and pipeline, cleaning solution pipeline 103 comprises valve and the pipeline that is used to supply with cleaning solution, liquid raw material pipeline 101 and 102 and cleaning solution pipeline 103 be connected on the main line 105, one end of this main line 105 is connected to vaporizer, and the other end is connected to purge gas pipeline 104.In this liquid raw material pipeline, liquid raw material supplies to the main line 105 from liquid raw material pipeline 101 or 102, and the liquid raw material that supplies to main line 105 is supplied in the vaporizer then.
Here,, cleaning solution is supplied to main line 105 from cleaning solution pipeline 103, thereby the pipeline of process and vaporizer clean together to liquid raw material and cleaning solution in order to clean.After utilizing cleaning solution to clean, purge gas is incorporated in the purge gas pipeline 104, thereby removes residual cleaning solution from the liquid raw material supply pipeline.
Figure 7 illustrates another example of liquid raw material supply pipeline, this liquid raw material supply line arrangement becomes to make each comprise that all the integral valve X1 to X4 of a plurality of valves interconnects by pipeline.In this liquid raw material supply unit, superheated steam (for example, He gas or another inert gas) be supplied among the valve V2 of integral valve X1, enter into liquid raw material case 121 by the valve V1 of integral valve X1 and the valve V4 of integral valve X2 then, thus to will be successively valve V1 by integral valve X2 and integral valve X3 and the X4 liquid raw material that is fed to vaporizer pressurize.
Here, in order to clean, when the valve V1 to integral valve X1 supplied with cleaning solution, cleaning solution flowed in integral valve X3 via the valve V3 of integral valve X2.Cleaning solution sequentially flows in the valve V2 of the valve V2 of integral valve X3 and integral valve X4 then.By this process, the passage that liquid raw material has been passed through cleans.After utilizing cleaning solution to clean, will be incorporated among the valve V3 of whole X1 as purge gas such as the inert gas of Ar gas, thereby from passage, remove residual cleaning solution.
Yet, more than two kinds of liquid raw material supply pipelines constitute by a plurality of valves and Duo Gen pipeline basically.Disadvantageously, this structure needs big installing space, and this will hinder miniaturization and high integration.
In last liquid raw material pipeline, cleaning solution is being supplied to when being used to clean in the main line 105, liquid residue or remaining zone (dead band) are tending towards occurring in liquid raw material supply pipeline 101 or 102.On the other hand, when purge gas being supplied in the main line 105, liquid residue or remaining zone (dead band) occur in respectively easily in liquid raw material supply pipeline 101 or 102 and cleaning solution supply line 103 in.Like this, the replacement rate (or replaceability) of residue or residual liquid (liquid-liquid displacement speed and liquid-gas displacement speed) is relatively poor, the remaining liq time swap that this need grow, thus cause long clean time.This also causes prolong the cycle time of semiconductor-fabricating device, thereby reduces manufacturing efficiency.And, liquid-gas displacement speed extreme difference, thus residual cleaning solution can not be replaced by purge gas fully after cleaning.
On the other hand, in the one liquid raw material pipeline of back, can shorten and clean the required time (can improve the replacement rate of remaining liq).Yet the integral valve X1 to X4 that uses in pipeline has very complicated flow duct respectively.
Summary of the invention
Make the present invention at above situation, the object of the present invention is to provide a kind of liquid raw material supply unit that is miniaturization and integrated design with simple channel structure, this liquid raw material supply unit can reduce liquid residue or remaining zone, thereby improves the replacement rate of remaining liq.
Other purpose of the present invention and advantage will partly be set forth in the following description, and partly will be clear from described description, perhaps can recognize by enforcement of the present invention.Can realize and obtain objects and advantages of the present invention by means and the combination of in claims, specifically noting.
To achieve these goals, the invention provides a kind of liquid raw material supply unit that is used for vaporizer, this liquid raw material supply unit is suitable for being used for raw-material these vaporizer supply fluid raw material of gasifying liquid, and this unit comprises: collector, and this collector is formed with flow channel in inside; With a plurality of control valves for fluids, described a plurality of control valves for fluids are installed on the described collector, and wherein said a plurality of control valves for fluids comprise: liquid raw material control valve, this liquid raw material control valve are used for control to described flow channel supply fluid raw material; Cleaning solution control valve, this cleaning solution control valve are used for control to described flow channel supply cleaning solution; Purge gas control valve, this purge gas control valve are used for described flow channel supplying purging gas; With the first introducing control valve, this first introducing control valve can be connected on the vaporizer, be used to control fluid supply from described flow channel to described vaporizer, the purge gas control valve, the cleaning solution control valve, the liquid raw material control valve, with first introduce control valve and be installed on the collector in this order from the upstream side of collector, wherein said flow channel is connected respectively on the valve port of described a plurality of control valves, the valve open communication of these valve ports and corresponding control valve, and described flow channel is configured to allow the purge gas from the supply of purge gas control valve comes directly to flow the valve port of described cleaning solution control valve that is arranged at purge gas control valve downstream and described liquid raw material control valve.
Description of drawings
In conjunction with in this manual and the accompanying drawing that constitutes this specification part show embodiments of the invention, and and specification played the effect that purpose of the present invention, advantage and principle are described together.
In the accompanying drawings,
Fig. 1 is the part sectioned view that shows the schematic structure of the liquid raw material supply unit in the preferred embodiment;
Fig. 2 is for showing the plotted curve in the test result of liquid-liquid (salt solution-pure water) replacement rate under the situation of the first liquid raw material supply valve (pipeline) supply salt solution;
Fig. 3 is for showing the plotted curve in the test result of liquid-liquid (salt solution-pure water) replacement rate under the situation of the second liquid raw material supply valve (pipeline) supply salt solution;
Fig. 4 is the sectional drawing that shows the schematic configuration of the liquid raw material supply unit in the comparative example;
Fig. 5 is the part sectioned view that shows the schematic configuration of the liquid raw material supply unit in another example;
Fig. 6 is the schematic representation of the structure overview of prior art liquid raw material supply pipeline; And
Fig. 7 is the schematic representation of the structure overview of another prior art liquid raw material supply pipeline.
Embodiment
Now with reference to accompanying drawing, provide the detailed description of preferred embodiment that is used for the liquid raw material supply unit of vaporizer according to the present invention.The structure of the liquid raw material supply unit of present embodiment is described with reference to Fig. 1.Fig. 1 is the part sectioned view of schematic structure that shows the liquid raw material supply unit of present embodiment.
As shown in Figure 1, the introducing valve 70 that liquid raw material supply unit 10 comprises purge gas supply valve 30, cleaning solution supply valve 40, the first liquid raw material supply valve 50, the second liquid raw material supply valve 60 and can be connected to liquid-discharging tube is (hereinafter referred to as " discharge opeing introducing valve ", it introduces valve corresponding to of the present invention second), these valves are fixedly mounted on the upper surface of collector 20 in line, and these collector 20 inside are formed with flow channel.And the introducing valve 80 (hereinafter referred to as " vaporizer introducing valve ", it introduces valve corresponding to of the present invention first) that can connect vaporizer is connected to the left side of collector 20.Particularly, purge gas supply valve 30, cleaning solution supply valve 40, the first liquid raw material supply valve 50, the second liquid raw material supply valve 60, discharge opeing introducing valve 70 and vaporizer introducing valve 80 begin to arrange according to the upstream side of this order from collector 20.Valve 70 is introduced in purge gas supply valve 30, cleaning solution supply valve 40, the first liquid raw material supply valve 50, the second liquid raw material supply valve 60, discharge opeing and vaporizer introducing valve 80 interconnects by the flow channel 21 that is formed in the collector 20.Flow channel 21 comprises V- arrangement passage 23,24,25 and 26 and communication passage 27.Vaporizer introducing valve 80 is connected to vaporizer by the flow channel 22 of collector 20.
Liquid raw material supply unit 10 be configured to carry out with first liquid raw material and second liquid raw material supply to vaporizer, after supplying first and second liquid raw materials with cleaning solution cleaning unit 10 and vaporizer and after cleaning, remove remaining cleaning solution or other material by purge gas.Comprise that the valve 30,40,50,60,70 that is installed on the collector 20 and 80 liquid raw material supply unit 10 can realize miniaturization and high integration.Therefore, liquid raw material supply unit 10 can be installed near vaporizer.
Purge gas supply valve 30 is configured to control the flow channel 21 supplying purging gases (being nitrogen in the present embodiment) to collector 20.In purge gas supply valve 30, valve chamber 31 is connected to the purge gas supply source by unshowned valve chamber mouth, and by valve opening 32 be connected to the flow channel 21 of collector 20 at the valve port 33 of installation surface (lower surface) upper shed.
Cleaning solution supply valve 40 is configured to control the flow channel 21 supply cleaning solutions (being THF in the present embodiment) to collector 20.In cleaning solution supply valve 40, valve chamber 41 is connected to the cleaning solution supply source by unshowned valve chamber mouth, and by valve opening 42 be connected to the flow channel 21 of collector 20 at the valve port 43 of installation surface (lower surface) upper shed.
The first liquid raw material supply valve 50 is configured to control flow channel 21 supplies first liquid raw material (being strontium in the present embodiment) to collector 20.In the first liquid raw material supply valve 50, valve chamber 51 is connected to the first liquid raw material supply source by unshowned valve chamber mouth, and by valve opening 52 be connected to the flow channel 21 of collector 20 at the valve port 53 of installation surface (lower surface) upper shed.
The second liquid raw material supply valve 60 is configured to control flow channel 21 supplies second liquid raw material (being titanium in the present embodiment) to collector 20.In the second liquid raw material supply valve 60, valve chamber 61 is connected to the second liquid raw material supply source by unshowned valve chamber mouth, and by valve opening 62 be connected to the flow channel 21 of collector 20 at the valve port 63 of installation surface (lower surface) upper shed.
Discharge opeing introducing valve 70 is configured to control the fluid of the flow channel 21 that will flow through collector 20 and introduces the liquid-discharging tube that is used for discharging from liquid raw material supply unit 10 fluids.In valve 70 was introduced in discharge opeing, valve chamber 71 was connected to liquid-discharging tube by unshowned valve chamber mouth, and by valve opening 72 be connected to the flow channel 21 of collector 20 at the valve port 73 of installation surface (lower surface) upper shed.
Vaporizer is introduced valve 80 and is configured to control the fluid that flows through the flow channel 21 of collector 20 to the vaporizer supply.In vaporizer is introduced valve 80, be connected to the flow channel 21 of collector 20 at installation surface (right surface) upper shed and the valve port 83 that is communicated with valve opening 82, and the valve chamber mouth 84 that is communicated with valve chamber 81 is connected to flow channel 22.
Here, purge gas supply valve 30, cleaning solution supply valve 40, the first liquid raw material supply valve 50, the second liquid raw material supply valve 60 and discharge opeing introducing valve 70 interconnect by the flow channel 21 of collector 20.More specifically, adjacent valve be purge gas supply valve 30 with cleaning solution supply valve 40, cleaning solution supply valve 40 and the first liquid raw material supply valve 50, the first liquid raw material supply valve 50 and the second liquid raw material supply valve 60 and the second liquid raw material supply valve 60 and discharge opeing introduce valve 70 respectively the V-arrangement passage by correspondence 23,24,25 be connected with 26.
More specifically, the inlet 23a to 26a of V-arrangement passage 23 to 26 and outlet 23b to 26b form the upper surface open at collector 20 as follows, and this mode promptly is communicated with the valve port 33,43,53,63 and 73 of valve 30,40,50,60 and 70 respectively.In other words, the inlet 23a of V-arrangement passage 23 is connected to the valve port 33 of purge gas supply valve 30, and outlet 23b is connected to the valve port 43 of cleaning solution supply valve 40.The inlet 24a of V-arrangement passage 24 is connected to the valve port 43 of cleaning solution supply valve 40, and outlet 24b is connected to the valve port 53 of the first liquid raw material supply valve 50.And the inlet 25a of V-arrangement passage 25 is connected to the valve port 53 of the first liquid raw material supply valve 50, and outlet 25b is connected to the valve port 63 of the second liquid raw material supply valve 60.The inlet 26a of V-arrangement passage 26 is connected to the valve port 63 of the second liquid raw material supply valve 60, and outlet 26b is connected to the valve port 73 that valve 70 is introduced in discharge opeing.
As mentioned above, the outlet 23b of V-arrangement passage 23 and the inlet 24a of V-arrangement passage 24 form the opening at the same position place, thereby are connected on the valve port 43 of cleaning solution supply valve 40.In other words, V- arrangement passage 23 and 24 is located at outlet 23b (or inlet 24a), promptly interconnects in the connector portions office with respect to valve port 43.And the outlet 24b of V-arrangement passage 24 and the inlet 25a of V-arrangement passage 25 form the opening at the same position place, thereby are connected to the valve port 53 of the first liquid raw material supply valve 50.In other words, V- arrangement passage 24 and 25 is located at outlet 24b (or inlet 25a), promptly interconnects in the connector portions office with respect to valve port 53.The outlet 25b of V-arrangement passage 25 and the inlet 26a of V-arrangement passage 26 form the opening at the same position place, thereby are connected to the valve port 63 of the second liquid raw material supply valve 60.In other words, V- arrangement passage 25 and 26 is located at outlet 25b (or inlet 26a), promptly interconnects in the connector portions office with respect to valve port 63.
The valve port 73 of valve 70 is introduced in discharge opeing and the valve port 83 of vaporizer introducing valve 80 connects by communication passage 27.By above structure, by discharge opeing being introduced the control that valve 70 and vaporizer are introduced valve 80, the fluid of each the valve supply from the first liquid raw material supply valve 50, the second liquid raw material supply valve 60, cleaning solution supply valve 40 and purge gas supply valve 30 can be fed to vaporizer or be discharged to liquid-discharging tube.
The operation of aforesaid liquid raw material supply unit 10 below will be described.Will when supply first liquid raw material, vaporizer open the first liquid raw material supply valve 50 and vaporizer and introduce valve 80, and close other valve 30,40,60 and 70.Like this, first liquid raw material of supplying with from the first liquid raw material supply valve 50 is allowed to by flow channel 21, that is, and and V- arrangement passage 25 and 26 and communication passage 27, and introduce in the valve 80 at vaporizer and to flow.Place this moment the vaporizer introducing valve 80 of open mode to allow to be fed to vaporizer by flow channel 22 at first liquid raw materials that valve 80 flows.
Will when supply second liquid raw material, vaporizer open the second liquid raw material supply valve 60 and vaporizer and introduce valve 80, and close other valve 30,40,50 and 70.Like this, it is V-arrangement passage 26 and communication passage 27 that second liquid raw material of supplying with from the second liquid raw material supply valve 60 is allowed to by flow channel 21, and introduces in the valve 80 at vaporizer and to flow.Place this moment the vaporizer introducing valve 80 of open mode to allow to be fed to vaporizer by flow channel 22 at second liquid raw materials that valve 80 flows.
In order to clean, to open cleaning solution supply valve 40 and vaporizer and introduce valve 80, and close other valve 30,50,60 and 70.Like this, the cleaning solution of supplying with from cleaning solution supply valve 40 is allowed to by V- arrangement passage 24,25,26 and communication passage 27, and introduces in the valve 80 mobile at vaporizer.Place this moment the vaporizer introducing valve 80 of open mode to allow to be fed to vaporizer by flow channel 22 at the cleaning solutions that valve 80 flows.Like this, just cleaning solution is fed to passage, valve and the vaporizer that first or second liquid raw material has passed through, cleaning liquid raw material supply unit 10 and vaporizer thus.
In the time will supplying cleaning solution, valve port 53,63 and 73 can be changed into liquid and retains district (dead band), but compares with traditional situation, and corresponding volume is minimum.The cleaning solution that supplies to V-arrangement passage 24 from cleaning solution supply valve 40 flows in the valve port 53 of the first liquid raw material supply valve 50, flows in V-arrangement passage 25 then.The cleaning solution that flows in V-arrangement passage 25 flows in the valve port 63 of the second liquid raw material supply valve 60, flows in V-arrangement passage 26 then.The cleaning solution that flows in V-arrangement passage 26 flows in the valve port 73 of discharge opeing introducing valve 70, flows in communication passage 27 then.By with upper type, allow described cleaning solution directly mobile in may becoming the valve port 53,63 and 73 that liquid retains the zone.Therefore, cleaning solution sequentially collides with the residual liquid of staying in valve port 53,63 and 73, thereby residual liquid is extruded valve port 53,63 and 73 gradually, perhaps dissolves residual liquid.This makes can replace residual liquid by cleaning solution effectively.Like this, can improve liquid-liquid displacement speed.Therefore, first or second liquid raw material that remains in the flow channel of liquid raw material supply unit 10 can be cleaned the solution displacement fully than conventional situation in the short time.
Fig. 2 and Fig. 3 show the test result of the replacement rate of the liquid raw material supply unit 10 of present embodiment and traditional liquid raw material supply pipeline shown in Figure 6.Fig. 2 is for showing the plotted curve in the test result of liquid-liquid (salt solution-pure water) replacement rate under the situation of the first liquid raw material supply valve (pipeline) supply salt solution.Fig. 3 is for showing the plotted curve in the test result of liquid-liquid (salt solution-pure water) replacement rate under the situation of the second liquid raw material supply valve (pipeline) supply salt solution.
In test, salt solution (0.5%) rather than liquid raw material are injected in the fluid passage, supply pure water with the speed of 2mL/min then.Then, the water storage 10mL that will discharge from the feeding unit 10 that can be connected with vaporizer and traditional supply line by corresponding supply port, and the specific conductance of the water stored measured.To the specific conductance of every kind of measurement of pure water and salt solution, calculate salinity based on formerly from measured Conductivity Meters.In test, between described two kinds of situations, compare salinity, being diluted to salinity up to salt solution is 1.0ppm or following.
As can know among Fig. 2 and Fig. 3 see, make salinity be reduced to always the required time swap of the displacement of 1.0ppm aspect in the comparison carried out between the traditional liquid raw material supply pipeline to liquid raw material supply unit 10 and Fig. 6, the liquid raw material supply unit 10 of present embodiment (solid line in the plotted curve) demonstrates the replacement rate that has and is better than traditional liquid raw material supply pipeline (dotted line in the plotted curve).Particularly, as shown in Figure 2, under the situation of the first liquid raw material supply pipeline (valve) supply salt solution, be reduced to the required time swap of 1.0ppm up to salinity and in liquid raw material supply unit 10, be about 90 minutes, and in traditional liquid raw material supply pipeline up to about 220 minutes.Under the situation of the second liquid raw material supply pipeline (valve) supply salt solution, up to salinity be reduced to the required time swap of 1.0ppm in liquid raw material supply unit 10 for about 70 minutes, and in traditional liquid raw material supply pipeline up to about 170 minutes.
Above result shows, the liquid raw material supply unit 10 of present embodiment can greatly shorten the required clean time of cleaning liquid raw material supply unit 10, thereby shortened the cycle time of semiconductor-fabricating device, improved throughput like this.Also can reduce the consumption of cleaning solution, to reduce cost.
Utilizing as mentioned above after cleaning solution finishes cleaning, open purge gas supply valve 30 and discharge opeing and introduce valve 70, and close other valve 40,50,60 and 80.Like this, stop to begin simultaneously from purge gas supply valve 30 supplying purging gases from cleaning solution supply valve 40 supply cleaning solutions.Introducing valve 70 from the purge gas of purge gas supply valve 30 supplies via discharge opeing discharges from liquid raw material supply unit 10.Supplying purging gas is intended to remove residual liquid fully from liquid raw material supply unit 10 like this, thereby prevents possible corrosion or other disadvantage.In some instances, close discharge opeing and introduce valve 70 and open vaporizer introducing valve 80, thereby to vaporizer supplying purging gas.
Similarly, will supplying purging gas the time, valve port 43,53 and 63 can be changed into liquid and retains district (dead band), but compares with traditional situation, and corresponding volume is minimum.The purge gas that supplies in the V-arrangement passage 23 from purge gas supply valve 30 flows in the valve port 43 of cleaning solution supply valve 40, flows in V-arrangement passage 24 then.The purge gas that is incorporated in the V-arrangement passage 24 flows in the valve port 53 of the first liquid raw material supply valve 50, flows in V-arrangement passage 25 then.The purge gas that flows in V-arrangement passage 25 flows in the valve port 63 of the second liquid raw material supply valve 60 then, flows in V-arrangement passage 26 then.The purge gas that flows in V-arrangement passage 26 flows in the valve port 73 of discharge opeing introducing valve 70 then, introduces valve 70 by discharge opeing, is discharged to the outside then.
By with upper type, allow described purge gas directly mobile in may becoming the valve port 43,53 and 63 that liquid retains the zone.Therefore, purge gas sequentially collides with the residual liquid of staying in valve port 43,53 and 63, thereby residual liquid is extruded valve port 43,53 and 63 gradually.Even have under the bigger capillary situation at residual liquid, it also can be replaced fully by purge gas.Therefore, can improve liquid-gas displacement speed.This makes can remove residual cleaning solution fully from liquid raw material supply unit 10.
Here, by the residual liquid situation in each valve port in valve port 43,53,63 and 73, check the liquid raw material supply unit 10 that is provided with the collector of making by acrylic acid 20 of present embodiment.As the target that compares with liquid raw material supply unit 10, by the residual liquid situation in each valve port in the valve port 43,53,63 and 73, check the liquid raw material supply unit of the collector 20a that utilizes the flow channel structure that is provided with as shown in Figure 4 similarly.It should be noted that collector 20a is formed with:, replace the flow channel 21 of collector 20 along the primary flow channel 21a of the straight extension of longitudinal direction of collector 20a; And subaisle 35,45,55,65 and 75, described subaisle 35,45,55,65 and 75 is connected to corresponding valve 30,40,50,60 and 70 valve port 33,43,53,63 and 73 with primary flow channel 21a.
To apparent in view the showing of the displacement performance (speed) of utilizing purge gas, the displacement performance of liquid raw material supply unit 10 is better than liquid raw material supply unit shown in Figure 4 between liquid raw material supply unit 10 and liquid raw material supply unit shown in Figure 4.Find that particularly in liquid raw material supply unit 10, when to the flow channel 21 supplying purging gases of collector 20, liquid is replaced by purge gas fully, and can not remain in the valve port 43,53,63 and 73 that may become the dead band.Find on the contrary, in the liquid raw material supply unit shown in Fig. 4, when to the flow channel 21a of collector 20a supplying purging gas, liquid residue the valve port 43,53,63 that may become the dead band and 73 and subaisle 35,45,55,65 and 75 in.Like this, liquid raw material can not be replaced by purge gas fully.
In the liquid raw material supply unit 10 of aforesaid present embodiment, purge gas supply valve 30, cleaning solution supply valve 40, the first liquid raw material supply valve 50, the second liquid raw material supply valve 60 and discharge opeing introduce valve 70 according to this order from the upstream side of collector 20 begin in line, one is installed on the upper surface of collector 20, and vaporizer is introduced the left side that valve 80 is also connected to collector 20.Like this, can realize miniaturization and high integration.The valve port 33,43,53,63 that the adjacent valve in the valve 70 is introduced in purge gas supply valve 30, cleaning solution supply valve 40, the first liquid raw material supply valve 50, the second liquid raw material supply valve 60 and discharge opeing is connected with 26 with 73 V- arrangement passages 23,24,25 by correspondence.Therefore, the liquid residue zone can be reduced to be at most only valve port 43,53,63 and 73.Under the situation of these valve ports 43,53,63 and 73, can sequentially extrude residual liquid gradually with the residual liquid collision at liquid residue by displacement fluid (cleaning liquid or purge gas) from supplied upstream.This makes can be by the replacement rate of cleaning solution or purge gas raising residual liquid.
Under the situation that does not depart from spirit of the present invention or fundamental characteristics, can realize the present invention with other concrete form.For example, the foregoing description illustrates the first liquid raw material supply valve 50 and the second liquid raw material supply valve 60 all is installed in the liquid raw material supply unit 10 that is used to supply two kinds of liquid raw materials on the collector 20.As a kind of possibility, can arrange the liquid raw material of a unit as shown in Figure 5 with the supply single kind, wherein the first liquid raw material supply valve 50 is installed on the collector 20, and the passage obturator 66 alternative second liquid raw material supply valves 60 are installed on the collector 20.
Although illustrated and described currently preferred embodiment of the present invention, it should be understood that the disclosure is for illustrative purposes, and under the situation that is not departing from the scope of the present invention that the present invention sets forth by claims, can make multiple change and modification.
Claims (7)
1. liquid raw material supply unit that is used for vaporizer, this liquid raw material supply unit is suitable for being used for raw-material these vaporizer supply fluid raw material of gasifying liquid, and this unit comprises:
Collector, this collector is formed with flow channel in inside; With
A plurality of control valves for fluids, described a plurality of control valves for fluids are installed on the described collector,
Wherein said a plurality of control valve for fluids comprises:
Liquid raw material control valve, this liquid raw material control valve are used for control to described flow channel supply fluid raw material;
Cleaning solution control valve, this cleaning solution control valve are used for control to described flow channel supply cleaning solution;
Purge gas control valve, this purge gas control valve are used for control to described flow channel supplying purging gas; With
First introduces control valve, and this first introducing control valve is connected on the vaporizer, is used to control the fluid supply from described flow channel to described vaporizer,
Purge gas control valve, cleaning solution control valve, liquid raw material control valve and
The first introducing control valve is installed on the collector in this order from the upstream side of collector,
Wherein said flow channel is connected respectively on the valve port of described a plurality of control valves, the valve open communication of these valve ports and corresponding control valve, and
Described flow channel is configured to allow the purge gas from the supply of purge gas control valve comes directly to flow the valve port of described cleaning solution control valve that is arranged at purge gas control valve downstream and described liquid raw material control valve.
2. the liquid raw material supply unit that is used for vaporizer according to claim 1, wherein said flow channel forms V-arrangement, this V-arrangement has opening end, these opening ends are used for connecting the adjacent valve of described purge gas control valve, described cleaning solution control valve and described liquid raw material control valve, thereby described flow channel is connected on each valve port in each open end as the joint part between adjacent V-arrangement passage.
3. the liquid raw material supply unit that is used for vaporizer according to claim 1, wherein said a plurality of control valve for fluids comprises that also being connected to second on the liquid-discharging tube introduces control valve, this second is introduced control valve and is used to control fluid supply from described flow channel to described liquid-discharging tube, and described second introduces valve and be installed on the described collector being positioned at described liquid raw material control valve downstream and being positioned at described first position of introducing the control valve upstream.
4. the liquid raw material supply unit that is used for vaporizer according to claim 1, wherein said purge gas control valve, described cleaning solution control valve and described liquid raw material control valve are installed on the upper surface of described collector in line.
5. the liquid raw material supply unit that is used for vaporizer according to claim 1, wherein said liquid raw material comprise at least a in strontium and the titanium.
6. the liquid raw material supply unit that is used for vaporizer according to claim 2, the described joint part between the wherein said V-arrangement passage is in the upper surface upper shed of described collector.
7. the liquid raw material supply unit that is used for vaporizer according to claim 3, wherein purge gas control valve, cleaning solution control valve, liquid raw material control valve and discharge opeing introducing control valve are installed on the upper surface of described collector in line.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006174323 | 2006-06-23 | ||
| JP2006174323A JP4256884B2 (en) | 2006-06-23 | 2006-06-23 | Raw material liquid supply unit to vaporizer |
| JP2006-174323 | 2006-06-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101093057A CN101093057A (en) | 2007-12-26 |
| CN101093057B true CN101093057B (en) | 2011-08-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101100990A Expired - Fee Related CN101093057B (en) | 2006-06-23 | 2007-06-22 | Liquid raw material supply unit for vaporizer |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7343926B2 (en) |
| JP (1) | JP4256884B2 (en) |
| KR (1) | KR100878575B1 (en) |
| CN (1) | CN101093057B (en) |
| TW (1) | TWI346384B (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK2089649T3 (en) * | 2006-11-02 | 2011-05-09 | Flowcon Int As | Adjustable controller insert |
| US8794267B2 (en) * | 2007-12-27 | 2014-08-05 | Lam Research Corporation | Gas transport delay resolution for short etch recipes |
| JP5046423B2 (en) * | 2008-05-30 | 2012-10-10 | 東京エレクトロン株式会社 | Raw material supply unit |
| KR100936881B1 (en) | 2008-11-26 | 2010-01-14 | 삼성모바일디스플레이주식회사 | Organic light emitting display and method of manufacturing the same |
| JP5234695B2 (en) * | 2009-11-12 | 2013-07-10 | Ｃｋｄ株式会社 | Liquid accumulation unit |
| JP5573666B2 (en) * | 2010-12-28 | 2014-08-20 | 東京エレクトロン株式会社 | Raw material supply apparatus and film forming apparatus |
| JP5837869B2 (en) * | 2012-12-06 | 2015-12-24 | 株式会社フジキン | Raw material vaporizer |
| US9335768B2 (en) * | 2013-09-12 | 2016-05-10 | Lam Research Corporation | Cluster mass flow devices and multi-line mass flow devices incorporating the same |
| JP6404706B2 (en) * | 2014-12-22 | 2018-10-10 | 東京エレクトロン株式会社 | Metal decontamination method and metal decontamination apparatus |
| KR102250139B1 (en) | 2018-01-23 | 2021-05-10 | (주)티티에스 | Apparatus and method for vaporizing liquid material |
| WO2020214616A1 (en) * | 2019-04-15 | 2020-10-22 | Lam Research Corporation | Modular-component system for gas delivery |
| KR102216526B1 (en) * | 2019-06-10 | 2021-02-17 | (주)티티에스 | Valve assembly |
| KR20230094191A (en) | 2020-11-04 | 2023-06-27 | 스웨이지락 캄파니 | Valves with integrated orifice restriction |
| US11796077B2 (en) | 2020-11-06 | 2023-10-24 | Swagelok Company | Valve cavity cap arrangements |
| CA3230051A1 (en) * | 2021-09-27 | 2023-03-30 | Mogas Industries, Inc. | Severe service redundant pathway system and method |
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| US5819782A (en) * | 1996-01-05 | 1998-10-13 | Ckd Corporation | Gas supply unit |
| US6209571B1 (en) * | 1997-05-13 | 2001-04-03 | Ckd Corporation | Process gas supply unit |
| US6314986B1 (en) * | 1997-11-14 | 2001-11-13 | Air Products And Chemicals, Inc. | Gas control device and method of supplying gas |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100556162B1 (en) * | 1998-07-08 | 2006-03-07 | 셀레리티 인크. | Manifold system of removable components for distribution of fluids |
| US6199580B1 (en) * | 1998-10-13 | 2001-03-13 | James M Morris | Valve manifold box and method of making same |
| JP2000271471A (en) * | 1999-03-24 | 2000-10-03 | Nippon M K S Kk | Liquid source supplying system and its washing method and vaporizer |
| DE10114439B4 (en) * | 2000-04-07 | 2005-12-15 | Smc K.K. | Solenoidventilverteiler |
| JP4331464B2 (en) | 2002-12-02 | 2009-09-16 | 株式会社渡辺商行 | Raw material solution supply system to vaporizer and cleaning method |
-
2006
- 2006-06-23 JP JP2006174323A patent/JP4256884B2/en not_active Expired - Fee Related
-
2007
- 2007-06-14 US US11/812,051 patent/US7343926B2/en active Active
- 2007-06-15 TW TW096121714A patent/TWI346384B/en not_active IP Right Cessation
- 2007-06-21 KR KR1020070061053A patent/KR100878575B1/en active IP Right Grant
- 2007-06-22 CN CN2007101100990A patent/CN101093057B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5819782A (en) * | 1996-01-05 | 1998-10-13 | Ckd Corporation | Gas supply unit |
| US6209571B1 (en) * | 1997-05-13 | 2001-04-03 | Ckd Corporation | Process gas supply unit |
| US6314986B1 (en) * | 1997-11-14 | 2001-11-13 | Air Products And Chemicals, Inc. | Gas control device and method of supplying gas |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100878575B1 (en) | 2009-01-15 |
| CN101093057A (en) | 2007-12-26 |
| TWI346384B (en) | 2011-08-01 |
| KR20070122146A (en) | 2007-12-28 |
| JP4256884B2 (en) | 2009-04-22 |
| US20070295405A1 (en) | 2007-12-27 |
| TW200810087A (en) | 2008-02-16 |
| US7343926B2 (en) | 2008-03-18 |
| JP2008004837A (en) | 2008-01-10 |
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