CN101085435B - Resin coating system - Google Patents
Resin coating system Download PDFInfo
- Publication number
- CN101085435B CN101085435B CN2006101281370A CN200610128137A CN101085435B CN 101085435 B CN101085435 B CN 101085435B CN 2006101281370 A CN2006101281370 A CN 2006101281370A CN 200610128137 A CN200610128137 A CN 200610128137A CN 101085435 B CN101085435 B CN 101085435B
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- China
- Prior art keywords
- circuit board
- resin
- mentioned
- conveyance
- treatment channel
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
Abstract
An object of the invention is to provide a resin applying system which can cope with high-mix low-volume production and mass production, and further easily reduce an installation area. The resin applying system (1) includes a resin applying device (4) for applying the resin to circuit boards (2A, 2B), and a resin hardening device (5) heating the resin applied on the circuit boards (2A, 2B) and hardening the resin and comprising a first processing channel (8A) and a second processing channel (8B). The operation side for operators performing the required operation is arranged at the front side and the back side. The resin hardening device (5) has: a first conveying channel (90A) which forms the first processing channel (8A), a second conveying channel (90B) which forms the second processing channel (8B), and a partition wall (92) for fully partitioning the first conveying channel (90A) and the second conveying channel (90B). The partition wall (92) is formed by two boards which are partitioned and spaced, and the height and the amplitude of the conveying direction of the partition wall (92) are equal to the height and the amplitude of the conveying direction of the first conveying channel (90A).
Description
Technical field
What the present invention relates to is that resin is coated on the circuit board, simultaneously, makes the resin coating system of the resin solidification (sclerosis) that is coated on the circuit board.
Background technology
Resin coating system known under the prior art has: the resin applying device that is coated with and is applied to sealing, is fixedly installed in the resin of semiconductor wafer on the banded circuit board of pliability etc.; Heat coated resin and make the resin solidification device of its curing; The resin applying device is provided the circuit board supplying device of circuit board; And the circuit board rolling device (for example, with reference to patent documentation 1) of the circuit board of taking out of from the resin solidification device of reeling.In addition; As known the having of resin solidification device that constitutes this resin coating system; To install short transverse and rotate, simultaneously, have on the both sides of side and back side in front as the rotating shaft direction; To the device front face side or the back side open the door (so-called kwan-yin door) resin solidification device (for example, with reference to patent documentation 2).
In the resin coating system that patent documentation 1 grade is put down in writing, usually, system's front face side becomes the fore side that the operator operates as required, and system's back side then becomes carries out each repairing of installing and the maintenance side of maintenance.In addition, this resin coating system operated by rotary motion is in the cleaning shop.
Patent documentation 1: day disclosure communique, spy open 2004-122753 number
Patent documentation 2: day disclosure communique, spy open 2002-240048 number
Summary of the invention
Relevant variedization of the parts forward development that waits with semiconductor of electronic device is installed on the circuit board in recent years.In addition, in recent years in industrial circle,, carrying out stock's reduction in order to reduce cost.Therefore, need improve year by year in the industrial circle Multi-varieties and Small-batch Production.And on the other hand, being accompanied by the increase of outputs such as LCD TV, the output of same parts is also increasing in recent years.In addition, for cutting down cost, the miniaturization that is provided with the cleaning shop etc. of resin coating system needs also to improve year by year.
Here, through arranging the resin coating system that a plurality of patent documentations 1 are put down in writing, needs that can corresponding Multi-varieties and Small-batch Production.In addition, also can realize the production in enormous quantities of same parts.Yet, just merely arrange the resin coating system that a plurality of patent documentations 1 are put down in writing, the area that is provided with of resin coating system is increased.Therefore, the needs of the cleaning shop miniaturization of resin coating system can not corresponding be set.
Therefore, it is a kind of that problem of the present invention is to provide, can corresponding Multi-varieties and Small-batch Production, and, can make the resin coating system that area reduces is set.
In order to solve above-mentioned problem; Resin coating system of the present invention is; To being carried out the system that resin applies and makes coated resin solidification to the second circuit board of equidirectional conveyance to the first circuit board of prescribed direction conveyance and with this first circuit board; It is characterized in that, by have heating be coated in the resin on the first circuit board and make its curing the first conveyance passage first treatment channel and have heating and be coated in the resin on the second circuit board and make the second conveyance passage of its curing and constitute with respect to second treatment channel that disposes symmetrically with first treatment channel with the interface of first treatment channel; Simultaneously; The fore side that the operator is carried out action required is arranged at front face side and back side, and has the partition wall that separates fully between the first conveyance passage and the second conveyance passage, and the two boards material that this partition wall is disposed by devices spaced apart constitutes; And the amplitude of the height of this partition wall and conveyance direction is identical with the amplitude of the height of the first conveyance passage and conveyance direction.
Resin coating system of the present invention is made up of two treatment channel of first treatment channel and second treatment channel.Therefore, compare, can make area is set reduces with the situation of resin coating system under merely arranging a plurality of prior aries.In addition, can on each treatment channel, carry out the coating and the curing of resin to the different circuits plate.Particularly, resin coating system of the present invention has, with the first conveyance passage that constitutes first treatment channel, with the isolated partition wall of the second conveyance passage that constitutes second treatment channel.Therefore, in this resin coating system, can on each conveyance passage, be used to make the temperature control of resin solidification.Thereby resin coating system of the present invention can corresponding Multi-varieties and Small-batch Production.
In addition; In order to solve above-mentioned problem; Resin coating system of the present invention is characterized in that, by first treatment channel to being carried out the resin coating and make coated resin solidification by the first circuit board to the prescribed direction conveyance; With apply and make second treatment channel of coated resin solidification to constitute to carrying out resin to the second circuit board of equidirectional conveyance with first circuit board; Simultaneously, have resin is coated in the resin applying device on first circuit board and the second circuit board and makes the resin solidification device of the resin solidification that is coated on first circuit board and the second circuit board; First treatment channel and second treatment channel dispose with respect to the boundary face of first treatment channel and second treatment channel symmetrically; The fore side that the operator is carried out action required is arranged at front face side and back side; And; The resin solidification device has, constitute first treatment channel the first conveyance passage, constitute the second conveyance passage of second treatment channel and with the partition wall that separates fully between the first conveyance passage and the second conveyance passage, the two boards material that this partition wall is disposed by devices spaced apart constitutes; And the amplitude of the height of this partition wall and conveyance direction is identical with the amplitude of the height of the first conveyance passage and conveyance direction.
Resin coating system of the present invention is made up of two treatment channel of first treatment channel that disposes symmetrically with respect to boundary face and second treatment channel.That is to say that resin coating system of the present invention is made up of two treatment channel of first treatment channel that disposes back-to-back with respect to boundary face and second treatment channel.Therefore, compare, can make area is set reduces with the situation of resin coating system under merely arranging a plurality of prior aries.In addition, resin coating system of the present invention is made up of two treatment channel of first treatment channel and second treatment channel, has the isolated partition wall with the first conveyance passage and the second conveyance passage.Therefore, can corresponding Multi-varieties and Small-batch Production.
In addition, in resin coating system of the present invention, first treatment channel and second treatment channel dispose with respect to the boundary face of first treatment channel and second treatment channel symmetrically.Therefore, for example, can dispose first treatment channel in the front face side of system, side disposes second treatment channel in the back.Thereby; Even arranging a plurality of resin coating systems, so that under the front face side of the system situation relative, in the time of need operating with the back side; The operator needs only one later, just can utilize two treatment channel of first treatment channel and second treatment channel to operate.In addition, on first treatment channel and second treatment channel, the conveyance direction of circuit board is identical.Thereby resin coating system of the present invention can improve operability.
And then in resin coating system of the present invention, the first conveyance passage and the second conveyance passage are separated by partition wall.Therefore, compare, can make the decreased number that is arranged on the door on the resin solidification device with the situation of resin coating system under merely arranging a plurality of prior aries.Thereby resin coating system of the present invention, thereby can cut down the simplification that the parts number of packages is sought to constitute.
In the present invention, be the vertical plane parallel with boundary face with the conveyance direction of first circuit board and second circuit board, first treatment channel and second treatment channel are face with respect to vertical plane and are configured to good symmetrically.If adopt this formation, owing to can make first treatment channel identical with the formation of second treatment channel, so the formation of resin coating system is oversimplified.
As above illustrated, the resin coating system that the present invention relates to can corresponding Multi-varieties and Small-batch Production, in addition, can make area is set reduces.
Description of drawings
Fig. 1 is a sketch map of representing that from the front resin coating system that example of the present invention relates to roughly constitutes.
Fig. 2 is the sketch map that roughly constitutes from top expression resin coating system shown in Figure 1.
Fig. 3 is the key diagram that the drive part of circuit board supplying device shown in Figure 1 constitutes.
Fig. 4 is the sketch map that roughly constitutes from top expression resin applying device shown in Figure 1.
Fig. 5 is the profile of the F-F section of presentation graphs 4.
Fig. 6 is the sketch map that roughly constitutes from top expression travel mechanism shown in Figure 4.
Fig. 7 is the sketch map that roughly constitutes from G-G direction indication y-axis shift actuation mechanism, X axle travel mechanism and the conveyance path of Fig. 4.
Fig. 8 is the key diagram that X axle travel mechanism shown in Figure 6 constitutes.
Fig. 9 is the amplification profile that amplifies the H-H section of presentation graphs 2.
Figure 10: (A) being the state diagram of arranging the resin coating system under a plurality of prior aries from top expression, (B) is the state diagram of arranging a plurality of resin coating systems shown in Figure 1 from top expression.
Symbol description
1 resin coating system
The 2A first circuit board
The 2B second circuit board
4 resin applying devices
5 resin solidification devices
8A first treatment channel
8B second treatment channel
The 90A first conveyance passage
The 90B second conveyance passage
92 partition walls
P vertical plane (boundary face)
The specific embodiment
Below, describe according to the accompanying drawing specific embodiments of the invention.
(the roughly formation of resin coating system)
Fig. 1 is the sketch map that roughly constitutes from the resin coating system 1 that positive (front) expression example of the present invention relates to.Fig. 2 is the sketch map that roughly constitutes from top expression resin coating system 1 shown in Figure 1.And, in Fig. 2 for ease, the circuit board 2 (2A, 2B) in the illustrated circuit board feedway 6.
The resin coating system 1 of this example is, is used for heat cured resin-sealed, the system that is fixedly installed in banded first circuit board 2A and the electronic devices such as semiconductor wafer on the second circuit board 2B (omitting diagram).As shown in Figure 2, in this resin coating system 1, at downside (the paper outside of Fig. 1) the conveyance first circuit board 2A of Fig. 2, at upside (paper of Fig. 1 is inboard) the conveyance second circuit board 2B of Fig. 2.That is to say, in the resin coating system 1 of this example, can be installed on the sealing, fixing and be installed on the sealing, fixing of the electronic device on the second circuit board 2B of the electronic device on the first circuit board 2A simultaneously.And, below, under the situation of summarizing expression first circuit board 2A and second circuit board 2B, be recited as " circuit board 2 ".
Like Fig. 1 and shown in Figure 2; Resin coating system 1 has: be coated with and be applied to being installed on electronic component encapsulation on the circuit board 2, the resin applying device 4 of fixing thermosetting resin really simultaneously; Heat coated resin and make the resin solidification device 5 of its curing; To resin applying device 4 circuit board supplying device 6 of circuit board 2 is provided, and the circuit board rolling device 7 of the circuit board 2 of taking out of from resin solidification device 5 of reeling.In addition, in resin coating system 1, press the order of circuit board supplying device 6, resin applying device 4, resin solidification device 5, circuit board rolling device 7, from the left side configuration successively to the right of Fig. 1.
And, because the left and right directions of Fig. 1 becomes the conveyance direction of circuit board 2 in the resin coating system 1, therefore, below the left and right directions of Fig. 1 is recited as " conveyance direction ".In addition, in resin coating system 1, owing to from the left side of Fig. 1 circuit board 2 is provided, the coiling circuit board 2 on the right side of Fig. 1, and therefore the left side with Fig. 1 is recited as " supply side ", the right side is recited as " winding side ".And then, the paper vertical direction of Fig. 1 is recited as " fore-and-aft direction " that intersects vertically with the conveyance direction, simultaneously, the paper outside is recited as " front face side ", the paper inboard is recited as " back side ".In addition, the above-below direction with Fig. 1 is recited as " above-below direction ".
As shown in Figure 2, the first treatment channel 8A and the second treatment channel 8B dispose with respect to the vertical plane P as boundary face between the first treatment channel 8A and the second treatment channel 8B symmetrically.In the resin coating system 1 of this example, have the first treatment channel 8A and the second treatment channel 8B of same formation, be face with respect to the vertical plane P parallel and dispose symmetrically with the conveyance direction of circuit board 2.Specifically, with respect to the locational vertical plane P of the approximate centre that on fore-and-aft direction, is formed at resin coating system 1, the first treatment channel 8A and the second treatment channel 8B are face and dispose symmetrically.And as shown in Figure 2, in this example, the amplitude of each fore-and-aft direction of circuit board supplying device 6, resin applying device 4, resin solidification device 5 and circuit board rolling device 7 about equally.But; Because resin applying device 4 as after have complicacy stating the 53A of travel mechanism, 53B; Therefore, the amplitude of the fore-and-aft direction of resin applying device 4 also is wider than the amplitude of the fore-and-aft direction of circuit board supplying device 6, resin solidification device 5 and circuit board rolling device 7 a little.In addition, the center of each fore-and-aft direction of circuit board supplying device 6, resin applying device 4, resin solidification device 5 and circuit board rolling device 7 is unanimous on the whole.
Like Fig. 1 and shown in Figure 2, circuit board supplying device 6 has: first circuit board wire spool 10A that is reeled with the first circuit board 2A and the banded liner 9 overlapping states that are provided on the resin applying device 4 and the second circuit board wire spool 10B that is reeled with the second circuit board 2B and the liner 9 overlapping states that are provided on the resin applying device 4.In addition; Circuit board rolling device 7 has: first circuit board take-up reel 11A that is reeled with the first circuit board 2A that takes out of from resin solidification device 5 and liner 9 overlapping states and the second circuit board take-up reel 11B that is reeled with the second circuit board 2B that takes out of from resin solidification device 5 and liner 9 overlapping states.And as shown in Figure 1, the first circuit board 2A that is wound on the first circuit board wire spool 10A is connected with first circuit board 2A on being wound on first circuit board take-up reel 11A.Likewise, the second circuit board 2B that is wound on the second circuit board wire spool 10B also is connected with second circuit board 2B on being wound on second circuit board take-up reel 11B.That is to say that the resin coating system 1 of this example becomes so-called continuous coil type (reel to reel) resin coating system.And; Below under the situation of summarizing expression first circuit board wire spool 10A and second circuit board wire spool 10B; Be recited as circuit board wire spool 10, under the situation of summarizing expression first circuit board take-up reel 11A and second circuit board take-up reel 11B, be recited as circuit board take-up reel 11.
Circuit board 2 is, as COF (the Chip On Film or Chip On Flexible Circuit Board) band of pliability resin circuit board, or the circuit board of TAB (Tape Automa ted Bonding) band etc.In addition, on the circuit board 2 that provides from circuit board supplying device 6, electronic device is installed in advance.In the resin coating system 1 of this example, as circuit board 2, used thickness is for example 20 μ m～125 μ m, and amplitude is the various circuit boards 2 of 35mm～200mm for example.In addition, liner 9 is to be used to protect the circuit board 2 that is wound on the circuit board wire spool 10, or is wound on the parts of the circuit board 2 on the circuit board take-up reel 11, becomes band shape with thin resin-shaped.
(formation of circuit board supplying device and circuit board rolling device)
Fig. 3 is the key diagram that the drive part of circuit board supplying device 6 shown in Figure 1 constitutes.And Fig. 3 is from the drive part of the E-E direction indication circuit board supplying device 6 of Fig. 2.
Shown in Fig. 1～3, circuit board supplying device 6 is made up of the second circuit board supply unit 21B that first circuit board supply unit 21A that constitutes the first treatment channel 8A that is configured in front face side and formation are configured in the second treatment channel 8B of back side.That is to say in circuit board supplying device 6, to have the first circuit board supply unit 21A and the second circuit board supply unit 21B of same formation, P disposes symmetrically with respect to vertical plane.And, on the front of circuit board supplying device 6 and the two sides of back, door to be opened/closed (omitting diagram) is installed.
First circuit board supply unit 21A; Except that above-mentioned first circuit board wire spool 10A; Also have: the liner take-up reel 12A of the liner 9 that coiling separates with first circuit board 2A, circuit board guiding roller 13A and the guiding parts 14A of guiding first circuit board 2A, the liner guiding roller 15A of guiding liner 9; The circuit board wire spool motor 16A that first circuit board wire spool 10A rotation is driven, and the liner take-up reel motor 17A that liner take-up reel 12A rotation is driven.Circuit board guiding roller 13A and liner guiding roller 15A are the driven rollers with driving means.
Shown in Fig. 3 waited, each formation of the first circuit board wire spool 10A that is configured in front face side and liner take-up reel 12A etc. was installed on the installing plate 19A on the framework 18 that is fixed in circuit board supplying device 6.The amplitude of the height of installing plate 19A and conveyance direction, roughly the same with the amplitude of the inside height of framework 18 or conveyance direction.In addition, installing plate 19A is configured in, as the front face side of the vertical plane P of the fore-and-aft direction center of circuit board supplying device 6.
As shown in Figure 3, circuit board wire spool motor 16A and liner take-up reel motor 17A are fixed on the installing plate 19A through omitting illustrated installation bracket, so that output shaft is towards the top.In addition; As shown in Figure 3; First circuit board wire spool 10A and circuit board wire spool motor 16A are through the bevel gear 23A on the rotating shaft that is fixed on first circuit board wire spool 10A, are connected with bevel gear 24A on the output shaft that is fixed on circuit board wire spool motor 16A.Likewise, liner take-up reel 12A and liner take-up reel motor 17A are through the bevel gear 25A on the rotating shaft that is fixed on liner take-up reel 12A, are connected with bevel gear 26A on the output shaft that is fixed on liner take-up reel motor 17A.
The part of bevel gear 23A and bevel gear 24A engagement is provided with covers 27A.In addition, the part of bevel gear 25A and bevel gear 26A engagement is provided with and covers 28A.
As stated, second circuit board supply unit 21B is to constitute with respect to vertical plane P balanced configuration through the formation identical with first circuit board supply unit 21A.Therefore, omit the detailed description of second circuit board supply unit 21B.And, in Fig. 2 and Fig. 3,, give the symbol that replaces giving " A " part in the symbol that first circuit board supply unit 21A constitutes with " B " to the formation of the second circuit board supply unit 21B corresponding with the formation of above-mentioned first circuit board supply unit 21A.
Like Fig. 2 and shown in Figure 3, at the installing plate 19A of the front face side that is disposed at vertical plane P, and be configured between the installing plate 19B of back side of vertical plane P, be formed with the receiving space 20 of accommodating circuit board wire spool motor 16A, 16B etc.That is to say, as shown in Figure 3, circuit board wire spool motor 16A, 16B, the drive division of liner take- up reel motor 17A, 17B and bevel gear 23A～26B etc. is configured in the receiving space 20.In addition, remove each formation of these circuit board supplying device 6,, be configured in the inside of framework 18 in the front face side of installing plate 19A or the back side of installing plate 19B.
As shown in Figure 1, in first circuit board supply unit 21A,, sagging to downside between circuit board guiding roller 13A and guiding parts 14A by the first circuit board 2A that first circuit board wire spool 10A provides.Sagging for the time being first circuit board 2A between circuit board guiding roller 13A and guiding parts 14A, 14A is drawn towards the downstream through guiding parts, is provided to resin applying device 4.In addition, the liner 9 that separates with first circuit board 2A is wound on the liner take-up reel 12A by liner guiding roller 15A guiding.Likewise in second circuit board supply unit 21B, second circuit board 2B is provided to resin applying device 4, and the liner 9 that separates with second circuit board 2B is wound on the liner take-up reel 12B.
Like Fig. 1 and shown in Figure 2, circuit board rolling device 7, the second circuit board coiling 22B of portion that is configured in the second treatment channel 8B of back side by first circuit board coiling 22A of portion that constitutes the first treatment channel 8A that is configured in front face side and formation constitutes.That is to say that in circuit board rolling device 7, first circuit board coiling 22A of portion and the second circuit board coiling 22B of portion with same formation dispose with respect to vertical plane P symmetrically.And, on the front and two sides at the back of circuit board rolling device 7, door to be opened/closed (omitting diagram) is installed.
The first circuit board coiling 22A of portion; Except that above-mentioned first circuit board take-up reel 11A; Also have: the liner wire spool 30A with the overlapping liner 9 of first circuit board 2A is provided; The circuit board take-up reel motor (omitting diagram) that first circuit board take-up reel 11A rotation is driven; The liner wire spool motor (omitting diagram) that liner wire spool 30A rotation is driven, will from be formed on the resin solidification device 5 after state first take out of first circuit board 2A that mouthful 98A takes out of to device inner introduce first introduce roller 31A, will from after state second take out of first circuit board 2A that mouthful 99A takes out of to device inner introduce second introduce roller 32A; The first guiding parts 33A that will guide downwards through the first circuit board 2A that the first introducing roller 31A introduces; The second guiding parts 34A that will guide downwards through the first circuit board 2A that the second introducing roller 32A introduces, the circuit board guiding roller 35A of guiding first circuit board 2A conveyance, and the liner guiding roller 36A of guiding liner 9 conveyances.
First introduces roller 31A and second introduces roller 32A, be to rotate the driving roller that drives through omitting illustrated motor, and circuit board guiding roller 35A and liner guiding roller 36A is the driven roller with driving means.First introduces roller 31A and second introduces roller 32A, for after the conveyance roller 46A, the 47A that state synchronous, repeat only to rotate the cycle that just stops certain hour behind the predetermined distance.That is to say that in the first treatment channel 8A, introduce roller 31A or second through first and introduce roller 32A, with conveyance roller 46A, 47A, first circuit board 2A is discontinuously by conveyance.
Shown in Fig. 2 waited, each formation of the first circuit board take-up reel 11A that is configured in front face side and liner wire spool 30A etc. was installed on the installing plate 39A on the framework 38 that is fixed in circuit board rolling device 7.The height of this installing plate 39A and the amplitude of conveyance direction are identical substantially with the amplitude of the inside height of framework 38 or conveyance direction.In addition, installing plate 39A is configured in the front face side as the vertical plane P of the fore-and-aft direction center of circuit board rolling device 7.
21A is identical with the first circuit board supply unit, and in the first circuit board coiling 22A of portion, circuit board take-up reel motor and liner wire spool motor are fixed on the installing plate 39A through installation bracket, so that output shaft is towards the top.In addition; 21A is identical with the first circuit board supply unit; First circuit board take-up reel 11A and circuit board take-up reel motor are connected through the bevel gear (omit and illustrate) on being fixed on bevel gear on the first circuit board take-up reel 11A rotating shaft (omitting diagram) and being fixed on circuit board take-up reel motor output shaft.And then; 21A is identical with the first circuit board supply unit; Liner wire spool 30A and liner wire spool motor are connected through the bevel gear (omit and illustrate) on being fixed on bevel gear on the liner wire spool 30A rotating shaft (omitting diagram) and being fixed on liner wire spool motor output shaft.
In addition, as shown in Figure 2 being fixed in the bevel gear on the first circuit board take-up reel 11A rotating shaft and being fixed on the part of the bevel gear engagement on the circuit board take-up reel motor output shaft, be provided with and cover 42A.Likewise, being fixed in the bevel gear on the liner wire spool 30A rotating shaft and being fixed on the part of the bevel gear engagement on the liner wire spool motor output shaft, also be provided with lid (omitting diagram).And, as shown in Figure 2, also be provided with on the drive division of the first introducing roller 31A and cover 43A, also be provided with lid (omitting diagram) on the drive division of the second introducing roller 32A etc.
As stated, the second circuit board coiling 22B of portion is to constitute with respect to vertical plane P balanced configuration through the formation identical with the first circuit board coiling 22A of portion.Therefore, omit the detailed description of the second circuit board coiling 22B of portion.And, in Fig. 2, in the formation to the second circuit board coiling 22B of portion corresponding, give the symbol that replaces giving " A " part in the symbol that the first circuit board coiling 22A of portion constitutes with " B " with the formation of the above-mentioned first circuit board coiling 22A of portion.
Identical with circuit board supplying device 6, in circuit board rolling device 7, at the installing plate 39A of the front face side that is disposed at vertical plane P and be disposed between the installing plate 39B of back side of vertical plane P, be formed with the receiving space 40 that is equivalent to receiving space 20.That is to say, circuit board take-up reel motor, the drive division of liner wire spool motor and bevel gear etc. and first and second are introduced the drive division of roller 31A, 31B, 32A, are configured in the receiving space 40.In addition, except each of the circuit board rolling device 7 of these formations constitutes,, be configured in the inside of framework 38 in the front face side of installing plate 39A or the back side of installing plate 39B.
As shown in Figure 1; In the first circuit board coiling 22A of portion; Take out of the back from resin solidification device 5 and introduce the roller 31A or the second introducing roller 32A introducing through first; And be wound in the first circuit board 2A before the first circuit board take-up reel 11A, sagging to downside between the first guiding parts 33A or the second guiding parts 34A and circuit board guiding roller 35A.In addition, liner 9 is provided on the first circuit board take-up reel 11A from liner wire spool 30A by liner guiding roller 35A guiding.Between the first guiding parts 33A or the second guiding parts 34A and circuit board guiding roller 35A,, be wound on the first circuit board take-up reel 11A with liner 9 to the sagging first circuit board 2A of downside.Identical ground, in the second circuit board coiling 22B of portion, second circuit board 2B also is wound on the second circuit board take-up reel 11B with liner 9.And the circuit board rolling device 7 of this example has, and detects the sagging sensor of circuit board (omitting diagram) of first circuit board 2A hang and second circuit board 2B hang respectively.
(formation of resin applying device)
Fig. 4 is the sketch map that roughly constitutes from top expression resin applying device 4 shown in Figure 1.Fig. 5 is the profile of the F-F section of presentation graphs 4.Fig. 6 is the sketch map that roughly constitutes from the top expression 53A of travel mechanism shown in Figure 4.Fig. 7 is the sketch map that roughly constitutes from G-G direction indication y-axis shift actuation mechanism 64A～67A, the X axle 69A of travel mechanism, 71A and the conveyance path 48A of Fig. 4.Fig. 8 is the X axle 70A of travel mechanism shown in Figure 6, the key diagram that 71A constitutes.And, the part of an illustrated circuit board 2 in Fig. 4.In addition, in Fig. 5～8, omitted the diagram of circuit board 2.
Like Fig. 2 and shown in Figure 4, resin applying device 4, the second resin coating 45B of portion that is configured in the second treatment channel 8B of back side by first resin coating 45A of portion that constitutes the first treatment channel 8A that is configured in front face side and formation constitutes.That is to say in resin applying device 4, to have the first resin coating 45A of portion and the second resin coating 45B of portion of same formation, P disposes symmetrically with respect to vertical plane.In addition, the first resin coating 45A of portion and the second resin coating 45B of portion, as shown in Figure 1, be configured on the top 44a of case shape resettlement section 44, this case shape receptacle contains the control device (omitting diagram) of the control circuit board of resin applying device 4 etc.And, on the front of resin applying device 4 and the two sides of back, door to be opened/closed (omitting diagram) is installed.
Shown in Fig. 4 waits; The first resin coating 45A of portion has: conveyance roller 46A, the 47A of the first circuit board 2A that conveyance provides from first circuit board supply unit 21A; The conveyance path 48A of conveyance first circuit board 2A; For four resins as the resin applying mechanism that are configured in applying heat cured resin on the part that electronic device is installed of first circuit board 2A above the conveyance path 48A apply a 49A, 50A, 51A, 52A, and make resin apply the 53A of travel mechanism that a 49A～52A moves.In addition, the first resin coating 45A of portion has, with the top 44a configured in parallel of resettlement section 44, carry and be equipped with carrying of conveyance path 48A and put plate 54A.Putting plate 54A this year is fixed in the above on the 44a through omitting illustrated installation bracket.
In this example, conveyance roller 46A is configured in supply side, and conveyance roller 47A is configured in winding side.Conveyance roller 46A, 47A are with same circumferential speed rotation, so that on first circuit board 2A between conveyance roller 46A, the 47A, do not produce sagging.In addition, conveyance roller 46A, 47A, for first introduce roller 31A or second to introduce roller 32A synchronous, repeat only to rotate the pulsation that just stops certain hour behind the predetermined distance.Thereafter, the state so that first circuit board 2A stops to apply 49A～52A application of resin on first circuit board 2A through resin.That is to say that in the first resin coating 45A of portion, the first circuit board 2A that provides from first circuit board supply unit 21A is applied thermosetting resin, thereafter, first circuit board 2A takes out of to resin solidification device 5.
And, the drive division of the motor of driving conveyance roller 46A, 47A etc., shown in Fig. 4 waited, tegmentum 55A, 55A covered.In addition, as stated, in this example, introduce roller 31A or second through first and introduce roller 32A, carry out the discontinuity conveyance of the first circuit board 2A on the first treatment channel 8A with conveyance roller 46A, 47A.That is to say, behind formation resin solidification device 5, state among the first conveyance passage 90A, also introduce roller 31A or second and introduce roller 32A, carry out the conveyance of first circuit board 2A with conveyance roller 46A, 47A through first.
Resin applies a 49A～52A, shown in Fig. 4 waits, the arranged in order of pressing 49A～52A to winding side from supply side, and on the conveyance direction adjacency.Resin applies a 49A～52A, has the spray nozzle part that is formed at leading section (bottom of Fig. 5), by this spray nozzle part, part above the first circuit board 2A, that electronic device is installed is applied thermosetting resin.And the number that is configured in the resin coating 49A～52A on the first resin coating 45A of portion is not limited to four, also can have the resin coating head below three or three, more than five or five to be configured on the first resin coating 45A of portion.
Shown in Fig. 4 waits; The 53A of travel mechanism has: make resin apply the Z axle 60A of travel mechanism, 61A, 62A, 63A that a 49A～52A moves up at upper and lower respectively; Make resin apply a 49A～52A respectively, make resin apply the X axle 68A of travel mechanism, 69A, 70A, 71A that a 49A～52A moves to the conveyance direction with the Z axle 60A～63A of travel mechanism and y-axis shift actuation mechanism 64A～67A respectively with the Z axle 60A～63A of the travel mechanism y-axis shift actuation mechanism 64A, 65A, 66A, the 67A that move of direction forwards, backwards.
Like Fig. 5 and shown in Figure 6, the Z axle 60A～63A of travel mechanism has respectively, makes to be fixed with the feed screw (omitting diagram) that lever 73A that resin applies a 49A～52A moves to above-below direction on the side of front and to make this feed screw rotation drive electric motor 74A.Be fixed with the feed nut (omitting diagram) that screws togather with feed screw on the back side of lever 73A.Feed screw is housed in accommodating in the case 75A of formation case shape.In addition, motor 74A is fixed on the upper surface of accommodating case 75A.
Shown in Fig. 5 waits; Y-axis shift actuation mechanism 64A～67A has respectively: be fixed with the analog bracket 76A that accommodates case 75A; Carry and to put and the fixing fixed head 77A of analog bracket 76A; Make analog bracket 76A and the fixed head 77A feed screw 78A that moves of direction forwards, backwards, make feed screw 78A rotation drive electric motor 79A, and the feed nut 80A that screws togather with feed screw 78A.Feed screw 78A is housed in and accommodates in the case 81A, and motor 79A is fixed on the back side of accommodating case 81A.And, in Fig. 6, omitted the diagram of feed screw 78A.
As shown in Figure 5, the front face side of fixed head 77A is configured in carries the below of putting plate 54A.Feed nut 80A be fixed on fixed head 77A front face side below.Feed screw 78A and accommodate case 81A carry put plate 54A below, be configured on fore-and-aft direction, cross conveyance path 48A.That is to say that the part of y-axis shift actuation mechanism 64A～67A is configured in the below of conveyance path 48A.
Shown in Fig. 6 waits, accommodate case 81A above be formed with the peristome 811A of feed nut 80A through usefulness.In addition, the inside of accommodating case 81A is equipped with, and is used for feed nut 80A is guided into the guide rail (omitting diagram) of fore-and-aft direction.
In addition, shown in Fig. 5 waited, the X axle 68A～71A of travel mechanism had respectively: make the feed screw 83A that accommodates case 81A and move to the conveyance direction, the feed nut 85A that makes feed screw 83A rotation drive electric motor 84A and screw togather with feed screw 83A.Feed screw 83A is housed in and accommodates in the case 86A, and motor 84A is as shown in Figure 6, is fixed on the conveyance direction outboard end of accommodating case 86A.And, in Fig. 4 and Fig. 6, omitted the diagram of feed screw 83A.
In addition, the X axle 68A～71A of travel mechanism has respectively, is used for accommodating two guide block 87A, the 87A that case 81A guides the conveyance direction into.And then, as the common formation of four X axle 68A～71A of travel mechanism, be provided with two guide rail 88A, the 88A of guide block 87A, 87A combination.
In this example,, carry out resin and apply a 52A moving to the conveyance direction through being configured in the X axle 70A of travel mechanism of winding side and back side.That is to say, shown in Fig. 8 waits,, be fixed with the feed nut 85A that screws togather with the feed screw 83A that constitutes the X axle 70A of travel mechanism constituting the accommodating below the case 81A of y-axis shift actuation mechanism 67A.In addition, through being configured in the X axle 71A of travel mechanism of winding side and front face side, carrying out resin and apply a 51A moving to the conveyance direction.That is to say, shown in Fig. 8 waits,, be fixed with the feed nut 85A that screws togather with the feed screw 83A that constitutes the X axle 71A of travel mechanism constituting the accommodating below the case 81A of y-axis shift actuation mechanism 66A.
Likewise; Because through being configured in the X axle 68A of travel mechanism of supply side and back side; Carry out resin and apply a 49A moving to the conveyance direction; Therefore, constituting the accommodating below the case 81A of y-axis shift actuation mechanism 64A, be fixed with the feed nut 85A that screws togather with the feed screw 83A that constitutes the X axle 68A of travel mechanism.In addition; Because through being configured in the X axle 69A of travel mechanism of supply side and front face side; Carry out resin and apply a 50A moving to the conveyance direction; Therefore, constituting the accommodating below the case 81A of y-axis shift actuation mechanism 65A, be fixed with the feed nut 85A that screws togather with the feed screw 83A that constitutes the X axle 69A of travel mechanism.
Article two, guide rail 88A, 88A on fore-and-aft direction, to have the state of predetermined distance, are fixed on the top 44a of resettlement section 44.Guide block 87A, 87A be fixed on accommodate case 81A below, combine with guide rail 88A, 88A respectively.In addition, accommodating case 86A is fixed in the above on the 44a.On accommodate case 86A, shown in Fig. 6 waits, be formed with the peristome 861A of feed nut 85A through usefulness.
As shown in Figure 4, the X axle 68A～71A of travel mechanism is configured in and carries the below of putting plate 54A.That is to say that the X axle 68A～71A of travel mechanism is configured in the below of conveyance path 48A.
As stated, the second resin coating 45B of portion constitutes with respect to vertical plane P balanced configuration through the formation identical with the first resin coating 45A of portion.Therefore, omitted the detailed description of the second resin coating 45B of portion.And, in Fig. 2 and Fig. 4,, give the symbol that replaces giving " A " part in the symbol that the first resin coating 45A of portion constitutes with " B " to the formation of the second resin coating 45B of portion corresponding with the formation of the above-mentioned first resin coating 45A of portion.
(formation of resin solidification device)
Fig. 9 is the amplification profile that amplifies the H-H section of presentation graphs 2.
Below, according to Fig. 1, Fig. 2 and Fig. 9 the formation of resin solidification device 5 is described.
In addition, the first conveyance passage 90A and the second conveyance passage 90B, as shown in Figure 1, be configured in case shape resettlement section 91 above, this case shape resettlement section contains the control device (omitting diagram) of the control circuit board of resin solidification device 5 etc.And then as shown in Figure 2, resin solidification device 5 has, and separates the partition wall 92 between the first conveyance passage 90A and the second conveyance passage 90B.
The first conveyance passage 90A has, the first conveyance path LA1 of conveyance first circuit board 2A, the second conveyance path LA2, and these three conveyance paths of the 3rd conveyance path LA3.In addition; The first conveyance passage 90A has: separate the dividing plate 93A between first～the 3rd conveyance path LA1～LA3 respectively; 93A; When being changeed, the table turning in of first circuit board 2A makes the first upset roller 94A and the second upset roller 95A of the conveyance direction upset of first circuit board 2A; Heating is coated in the resin on the first circuit board 2A and makes its heating arrangements 96A that solidifies usefulness, and is arranged on the circuit board guide rail 97A that first～the 3rd conveyance path LA1～LA3 is last, the two ends of first circuit board 2A are guided into the conveyance direction.And, in Fig. 1, omitted the diagram of circuit board guide rail 97A.In addition, in Fig. 2, for ease, only illustrate a part (part of supply side) that is configured in the circuit board guide rail 97A on the first conveyance path LA1, be configured in the circuit board guide rail 97A and the second upset roller 95A on the 3rd conveyance path LA3.
First～the 3rd conveyance path LA1～LA3 in the first conveyance passage 90A, disposes from the order of downside by first～the 3rd conveyance path LA1～LA3 successively.In the first conveyance passage 90A, the first circuit board 2A from the first resin coating 45A of portion takes out of at first passes through the first conveyance path LA1 and conveyance from supply side to winding side, thereafter, utilizes the first upset cylinder 94A upset.The first circuit board 2A that is reversed to supply side conveyance through the second conveyance path LA2, thereafter, utilizes the second upset cylinder 95A to overturn once more from winding side.The first circuit board 2A that is reversed passes through the 3rd conveyance path LA3 and conveyance from supply side to winding side, and takes out of a mouthful 98A from first and take out of.
In addition, according to the kind of first circuit board 2A, to the first circuit board 2A of winding side, intactly take out of a mouthful 99A and take out of from second through the first conveyance path LA1 conveyance from supply side.That is to say, in the resin solidification device 5 of this example, can use the conveyance of the first circuit board 2A of first～the 3rd conveyance path LA1～LA3, and only use the conversion between the conveyance of first circuit board 2A of the first conveyance path LA1.
Circuit board guide rail 97A is with the parts of conveyance direction as the elongate block of length direction, in first～the 3rd conveyance path LA1～LA3, to be configured on the position corresponding with first circuit board 2A two end portions.
As stated, the second conveyance passage 90B is to constitute with respect to vertical plane P balanced configuration through the formation identical with the first conveyance passage 90A.Therefore, omitted the detailed description of the second conveyance passage 90B.And, in Fig. 2,, give the symbol that replaces giving " A " part in the symbol that the first conveyance passage 90A constitutes with " B " to the formation of the second conveyance passage 90B corresponding with the formation of the above-mentioned first conveyance passage 90A.
As shown in Figure 9, the partition wall 92 of this example is made up of two light sheet 92a, 92b.That is to say on fore-and-aft direction, to have prescribed direction through two boards material 92a, 92b and dispose at interval, constitute partition wall 92. Sheet material 92a, 92b for example are stainless sheet steel.
In addition, in this example, between sheet material 92a, 92b, be formed with space 92c.As shown in Figure 9, can not dispose any parts on the 92c of space and form air layer, also can dispose heat-insulating material.In addition, also can utilize the pipe arrangement that space 92c stipulates and the coiling of distribution.And then, also can utilize space 92c as air flow circuit at sheet material 92a, the last peristome that forms regulation of 92b.
In the resin solidification device 5 of this example, can on each passage of the first conveyance passage 90A and the second conveyance passage 90B, carry out indivedual temperature control.That is to say; According to the temperature that is arranged on temperature sensor (omitting diagram) the control first conveyance passage 90A on the first conveyance passage 90A, according to the temperature that is arranged on temperature sensor (omitting diagram) the control second conveyance passage 90B on the second conveyance passage 90B.
And as long as can on each conveyance passage of the first conveyance passage 90A and the second conveyance passage 90B, carry out definite temperature control individually, then the first conveyance passage 90A and the second conveyance passage 90B just there is no need fully to separate through partition wall 92.That is to say that as long as can on each conveyance passage of the first conveyance passage 90A and the second conveyance passage 90B, carry out definite temperature control, then the first conveyance passage 90A also can be communicated with the second conveyance passage 90B on a part.
(the main effect of this form)
As above illustrated, in the resin coating system 1 of this example, the first treatment channel 8A and the second treatment channel 8B dispose with respect to vertical plane P symmetrically.That is to say, in this example, lean against with respect to vertical plane P and to dispose the first treatment channel 8A and the second treatment channel 8B privately.Therefore; Even suppose the fore-and-aft direction amplitude of the first treatment channel 8A and the second treatment channel 8B, identical with the fore-and-aft direction amplitude of resin coating system 101 under the prior art, shown in Figure 10 (A); Compare with the situation of resin coating system 101 under merely arranging a plurality of prior aries; Shown in Figure 10 (B), in the resin coating system 1 of this example, also can make the area minimizing is set.For example, in the resin coating system 1 of this example, compare with the situation of resin coating system 101 under merely arranging a plurality of prior aries, maximum can reduce the area that is provided with about 30%.
In addition, because the resin coating system 1 of this example is made up of the first treatment channel 8A and the second treatment channel 8B, therefore can come treatment circuit plate 2 with the front face side and the two sides of back side.Thereby; For example shown in Figure 10 (B),, make the front face side of resin coating system 1 relative with the back side even arranging a plurality of resin coating systems 1; Each treatment channel 8A; Under the situation that the last operator of needs of 8B operates, the operator needs only one later, just also can be at two enterprising line operates of treatment channel of the first treatment channel 8A and the second treatment channel 8B.In addition, in the first treatment channel 8A and the second treatment channel 8B, the conveyance direction of circuit board 2 is identical.That is to say, supply side, the winding side of the circuit board 2 among the first treatment channel 8A, consistent with supply side, the winding side of circuit board 2 among the second treatment channel 8B.Consequently, in the resin coating system 1 of this example, can improve operations of operators property.
In addition, the resin coating system 1 of this example is made up of two treatment channel of the first treatment channel 8A and the second treatment channel 8B.Therefore, even under first circuit board 2A and second circuit board 2B condition of different, also can on each treatment channel, carry out the coating and the curing of resin to different circuits plate 2.Particularly, in the resin coating system 1 of this example, resin solidification device 5 has, and separates the partition wall 92 between the first conveyance passage 90A and the second conveyance passage 90B.Therefore, in resin solidification device 5, can on each conveyance passage, be used to make the temperature control of resin solidification.Thereby, in resin coating system 1, can corresponding Multi-varieties and Small-batch Production.
And, in the resin coating system 1 of this example, handle same circuit board 2 (just, the same circuit board 2 of same electronic device being installed) through utilizing the first treatment channel 8A and the second treatment channel 8B, also can correspondingly produce in enormous quantities.
, utilizing the first treatment channel 8A and the second treatment channel 8B to handle under the situation of same circuit board 2 here, also can between the first conveyance passage 90A and the second conveyance passage 90B, partition wall 92 be set.Yet, do not have partition wall 92 at resin solidification device 5, only be formed with in the resin solidification device 5 under the situation in a space, its space broadens.Therefore, owing to the reasons such as air flow homogenising that are difficult to make resin solidification device 5 inside, the temperature control in the resin solidification device 5 becomes difficult.Particularly, the internal temperature of the resin solidification device as the resin solidification device 5 of this example generally is set at 150 ℃～200 ℃, and on the other hand, must be with resin solidification device temperature inside Deviation Control below for example ± 5 ℃.Therefore, the temperature control in the resin solidification device 5 becomes difficult more.
In the resin solidification device 5 of this example; Owing between the first conveyance passage 90A and the second conveyance passage 90B, be provided with partition wall 92; Therefore, can make each narrow space in the space and the space that the second conveyance passage 90B disposes of first conveyance passage 90A configuration.Thereby, become easy in the temperature control of the first conveyance passage 90A and the second conveyance passage 90B.That is to say, in the resin coating system 1 of the resin solidification device 5 that uses this example,, can correspondingly produce in enormous quantities through simple temperature control.
And then in this example, the first conveyance passage 90A and the second conveyance passage 90B are spaced through partition wall 92.Therefore, shown in Figure 10 (A), compare, can make the decreased number that is arranged on the door on the resin solidification device 5 with the situation of resin coating system 101 under merely arranging a plurality of prior aries.Thereby, in the resin coating system 1 of this example, formation is oversimplified thereby can cut down the parts number of packages.
In this example, partition wall 92 is configured on the approximate centre position of resin solidification device 5 fore-and-aft directions.Therefore, in resin solidification device 5, the space of first conveyance passage 90A configuration size, with the space size of second conveyance passage 90B configuration about equally.Thereby, in the first conveyance passage 90A and the second conveyance passage 90B,, just can carry out same temperature control as long as use same control constant.That is to say, there is no need that the control constant of the last design temperature control of 90B usefulness is oversimplified in the temperature control of resin solidification device 5 at each conveyance passage 90A.
In this example, have the first treatment channel 8A and the second treatment channel 8B of same formation, dispose symmetrically with respect to vertical plane P face.Therefore, in resin applying device 4, circuit board supplying device 6 and circuit board rolling device 7,, also can carry out same control as long as use same control constant.That is to say that there is no need to manage throughout passage 8A, the last setting control of 8B constant, the control of resin coating system 1 is oversimplified.In addition, because the first treatment channel 8A is identical with the formation of the second treatment channel 8B, therefore, even the resin coating system 1 that is made up of two treatment channel 8A, 8B also can make to constitute simplification.
(other examples)
Though above-mentioned example is the present invention's example of suitable example, is not limited thereto, and in the scope that does not change main idea of the present invention, various distortion can be arranged.For example, in above-mentioned example, partition wall 92 is configured on the approximate centre position of resin solidification device 5 fore-and-aft directions, and still, partition wall 92 can be configured in the front face side of the approximate centre position of resin solidification device 5 fore-and-aft directions, also can be configured in the back side.
In addition, in above-mentioned example, partition wall 92 is made up of two light sheet 92a, 92b, but also can constitute partition wall 92 by a heavy-gauge sheeting.
And then; In above-mentioned example, the first treatment channel 8A and the second treatment channel 8B dispose with respect to vertical plane P face symmetrically, still; The first treatment channel 8A and the second treatment channel 8B are configured to respect to vertical plane P, are symmetry during from top observation.That is to say, the formation of the first treatment channel 8A and second being formed in differing heights on of treatment channel 8B corresponding with this formation are disposed.In addition, the first treatment channel 8A is not limited to the vertical plane P parallel with the conveyance direction of circuit board 2 with the boundary face of the second treatment channel 8B.And then the first treatment channel 8A and the second treatment channel 8B also can be with respect to boundary faces and asymmetric configuration.
In addition, in above-mentioned example, first circuit board 2A and second circuit board 2B conveyance on same direction, but the conveyance direction of the conveyance direction of first circuit board 2A and second circuit board 2B also can be opposite.That is to say; For example, also can in first treatment channel, press the order of first circuit board supply unit 21A, the first resin coating 45A of portion, the first conveyance passage 90A, the first circuit board coiling 22A of portion; Dispose to the right from the left side of Fig. 1; In second treatment channel, press the order of second circuit board supply unit 21B, the second resin coating 45B of portion, the second conveyance passage 90B, the second circuit board coiling 22B of portion, dispose to the left from the right side of Fig. 1.In this case; Between the first conveyance passage 90A and the first circuit board coiling 22A of portion; Be provided with the illusory space of the configuration space that is equivalent to the second resin coating 45B of portion; Between the second conveyance passage 90B and the second circuit board coiling 22B of portion, be provided with the illusory space of the configuration space that is equivalent to the first resin coating 45A of portion.
And; The resin coating system 1 of above-mentioned example; Two treatment channel by the first treatment channel 8A and the second treatment channel 8B constitute, but also can be only constitute resin coating system by any side's of the first treatment channel 8A or the second treatment channel 8B a treatment channel.
Claims (3)
1. a resin coating system is carried out the system that resin applies and makes coated resin solidification to being reached by the first circuit board to the prescribed direction conveyance with this first circuit board to the second circuit board of equidirectional conveyance, it is characterized in that,
By having first treatment channel that heating is coated in the resin on the above-mentioned first circuit board and makes the first conveyance passage of its curing; And have heating and be coated in the resin on the above-mentioned second circuit board and make the second conveyance passage of its curing and constitute with respect to second treatment channel that disposes symmetrically with above-mentioned first treatment channel with the boundary face of above-mentioned first treatment channel; Simultaneously
The fore side that the operator is carried out action required is arranged at front face side and back side, and,
Has the partition wall that separates fully between above-mentioned first conveyance passage and the above-mentioned second conveyance passage; The two boards material that this partition wall is disposed by devices spaced apart constitutes; And the amplitude of the height of this partition wall and conveyance direction is identical with the amplitude of the height of the above-mentioned first conveyance passage and conveyance direction.
2. a resin coating system is characterized in that,
By first treatment channel to being carried out the resin coating and make coated resin solidification by first circuit board to the prescribed direction conveyance; With apply and make second treatment channel of coated resin solidification to constitute to carrying out resin to the second circuit board of equidirectional conveyance with above-mentioned first circuit board; Simultaneously
Have resin is coated in the resin applying device on above-mentioned first circuit board and the above-mentioned second circuit board and makes the resin solidification device that is coated in the resin solidification on above-mentioned first circuit board and the above-mentioned second circuit board;
Above-mentioned first treatment channel and above-mentioned second treatment channel dispose with respect to the boundary face of above-mentioned first treatment channel and above-mentioned second treatment channel symmetrically;
The fore side that the operator is carried out action required is arranged at front face side and back side, and,
Above-mentioned resin solidification device has: the first conveyance passage that constitutes above-mentioned first treatment channel; Constitute the second conveyance passage of above-mentioned second treatment channel; And with the partition wall that separates fully between above-mentioned first conveyance passage and the above-mentioned second conveyance passage; The two boards material that this partition wall is disposed by devices spaced apart constitutes, and the amplitude of the height of this partition wall and conveyance direction is identical with the amplitude of the height of the above-mentioned first conveyance passage and conveyance direction.
3. resin coating system as claimed in claim 2 is characterized in that, above-mentioned boundary face is the vertical plane parallel with the conveyance direction of above-mentioned first circuit board and above-mentioned second circuit board; Above-mentioned first treatment channel and above-mentioned second treatment channel are face with respect to above-mentioned vertical plane and dispose symmetrically.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006157411 | 2006-06-06 | ||
| JP2006-157411 | 2006-06-06 | ||
| JP2006157411 | 2006-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101085435A CN101085435A (en) | 2007-12-12 |
| CN101085435B true CN101085435B (en) | 2012-08-22 |
Family
ID=38936708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101281370A Expired - Fee Related CN101085435B (en) | 2006-06-06 | 2006-09-05 | Resin coating system |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20070116704A (en) |
| CN (1) | CN101085435B (en) |
| TW (1) | TW200746946A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1281754A (en) * | 1999-07-21 | 2001-01-31 | 关西涂料株式会社 | Coating method and device for flate-plate coated material |
| JP2001319864A (en) * | 2000-05-10 | 2001-11-16 | Tokyo Electron Ltd | Coating/developing system |
| CN2546463Y (en) * | 2002-03-19 | 2003-04-23 | 中华全国供销合作总社郑州棉麻工程技术设计研究所 | Roller embossing machine |
| CN1482657A (en) * | 2002-08-08 | 2004-03-17 | 爱立发株式会社 | Resin solidifying system |
| WO2005102542A1 (en) * | 2004-03-26 | 2005-11-03 | 3M Innovative Properties Company | Coating process and apparatus |
-
2006
- 2006-08-07 KR KR1020060074254A patent/KR20070116704A/en not_active Application Discontinuation
- 2006-09-05 CN CN2006101281370A patent/CN101085435B/en not_active Expired - Fee Related
- 2006-09-07 TW TW095132999A patent/TW200746946A/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1281754A (en) * | 1999-07-21 | 2001-01-31 | 关西涂料株式会社 | Coating method and device for flate-plate coated material |
| JP2001319864A (en) * | 2000-05-10 | 2001-11-16 | Tokyo Electron Ltd | Coating/developing system |
| CN2546463Y (en) * | 2002-03-19 | 2003-04-23 | 中华全国供销合作总社郑州棉麻工程技术设计研究所 | Roller embossing machine |
| CN1482657A (en) * | 2002-08-08 | 2004-03-17 | 爱立发株式会社 | Resin solidifying system |
| WO2005102542A1 (en) * | 2004-03-26 | 2005-11-03 | 3M Innovative Properties Company | Coating process and apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200746946A (en) | 2007-12-16 |
| CN101085435A (en) | 2007-12-12 |
| TWI372000B (en) | 2012-09-01 |
| KR20070116704A (en) | 2007-12-11 |
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