CN101075572B - Device clamp, wire bonding machine and method for providng fluid to bonding area of wire bonding machine - Google Patents

Device clamp, wire bonding machine and method for providng fluid to bonding area of wire bonding machine Download PDF

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Publication number
CN101075572B
CN101075572B CN200710126620XA CN200710126620A CN101075572B CN 101075572 B CN101075572 B CN 101075572B CN 200710126620X A CN200710126620X A CN 200710126620XA CN 200710126620 A CN200710126620 A CN 200710126620A CN 101075572 B CN101075572 B CN 101075572B
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opening
device clamp
clamp
entry port
fluid
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CN101075572A (en
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G·吉洛蒂
E·W·弗拉施
K·拉马
张信吉
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Kulicke and Soffa Investments Inc
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Kulicke and Soffa Investments Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01007—Nitrogen [N]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Abstract

A device clamp configureured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configureured to be positioned adjacent a bond site area of the wire bonding machine. The body portion includes a inlet port for receiving a fluid from a gas supply source. The body portion defines a fluid path from the inlet port to the at least one device aperture.

Description

Device clamp, bonding equipment and fluid is provided to the method in the solder joint district of bonding equipment
Patent application of the present invention requires priority that submit to, United States Patent (USP) provisional application No.60/747214 on May 15th, 2006, and its content is in conjunction with being hereby incorporated by reference.
Technical field
The present invention relates to the bonding wire of semiconductor device, and more particularly, relate to bonding equipment solder joint district protective gas is provided.
Background technology
In the manufacturing of various semiconductor device, often use bonding wire (wire bonding) technology, (for example, wafer is to the joint of substrate/lead frame with the parts in the interface unit; Wafer is to joint of wafer etc.).For example, often use wire rod junction surface (for example wire loop) so that it is gone up between the contact (for example, going between) of the substrate (for example, lead frame) that semiconductor crystal wafer is installed conductive interconnection is provided at the wafer weld pad of (1) semiconductor crystal wafer and (2).Representative traditional bonding wire operation relates to: (1) with first junction surface be engaged on the wafer first bonding station (for example, use ball bonding), (2) second bonding station of wire rod on lead frame extended, (3) with engaged at end to the second bonding station of the wire rod that extends, and (4) cut off wire rod.In this ball bonding, electronic flame extinguishes (being EFO) rod or analog is used usually, to form " soldered ball " (for example free air balls) in wire ends.
Usually, gold thread (being nonactive basically for oxygen) is used to bonding wire craft; Yet in some application-specific, more active metal (for example copper, silver, palladium, aluminium or the like) is used.These more active metals may react, and for example, exist under the situation of oxygen, and form oxide/oxidation at wire rod (and/or wire ends or afterbody), and this is unfavorable for bonding wire.
Consider so potential oxidation, some bonding wire systems comprise subsystem, are used for utilizing the EFO clavate to become the process of soldered ball to provide protective gas to wire ends.For example, integral body is incorporated in this US patent application publication No.6 as a reference, and 234,376 disclose a kind of such system.Regrettably, this protective gas subsystem can not protect whole wire rod (or whole process of bonding wire craft) not influenced by potential oxidation, and the wire rod of reactive metal becomes the problem of oxidation in the ring process still to exist.
Other measure that reduces oxidation during semiconductor device is handled comprises US patent application publication No.5265788 (name is called " bonding equipment with anti-oxidation device "); US patent application publication No.6866182 (name is called " apparatus and method for that prevents oxidation of electronic devices "); And US patent application publication No.7182793 (name is called " system that reduces oxidation of electronic devices ").Be sure of that these traditional systems use the anchor clamps that are connected with other device, to reduce the potentiality of oxidation; Yet these systems will be complicated and expensive as the additional parts that increase to the bonding wire system.
Therefore, expectation provides a kind of method and apparatus that reduces the oxidation in the bonding wire.
Summary of the invention
The illustrative examples according to the present invention provides a kind of device clamp of using with bonding equipment of being configured to.Described device clamp comprises body part, and it limits at least one device opening.Each device opening in described at least one device opening is configured to be positioned to the solder joint district (bond site area) of contiguous described bonding equipment.Described body part comprises entry port, and it is used for receiving the fluid from the gas supply source protective gas source of supply of gas pipeline etc. (for example, such as).Body part limits the fluid passage from entry port to described at least one device opening.
Another illustrative examples according to the present invention provides a kind of bonding equipment.Bonding equipment comprises workbench, and it is used to support the device of being processed by bonding equipment.Bonding equipment also comprises device clamp, and it is configured to clamping device to be processed.Device clamp limits at least one device opening.Each device opening in described at least one device opening is configured to be positioned to the solder joint district of contiguous described bonding equipment.Described device clamp comprises entry port, and it is used to receive the fluid (for example, protective gas) from gas supply source.Described device clamp limits the fluid passage from entry port to described at least one device opening.
Another illustrative examples according to the present invention, providing a kind of provides fluid (for example, protective gas) to the method in the solder joint district of bonding equipment.This method may further comprise the steps: (1) provides device clamp, it is configured to clamping semiconductor device to be processed, described device clamp limits at least one device opening, and each device opening in described at least one device opening is configured to be positioned to the solder joint district of contiguous described bonding equipment; (2) will flow into from the fluid of gas supply source in the entry port of described device clamp; And (3) described fluid is passed through by the fluid passage that described device clamp limited, so that described fluid flow to described at least one device opening from the entry port of described device clamp is mobile.
Description of drawings
When reading,, can better understand the present invention by detailed description hereinafter referring to accompanying drawing.Should emphasize that according to common practise, the different feature in the accompanying drawing is not proportional.On the contrary, for clarity sake, the size of different features is at random enlarged or is dwindled.Accompanying drawing comprises following each figure:
Fig. 1 is illustrative examples according to the present invention, be used for the top plan view of the device clamp of bonding wire system;
Fig. 2 A is the vertical view of device clamp among Fig. 1;
Fig. 2 B is the side sectional view along device clamp line 2B-2B, Fig. 1 of Fig. 2 A;
Fig. 3 A is the detailed view of other schematic part of the part of Fig. 2 B and bonding wire craft;
Fig. 3 B is the part of device clamp of Fig. 2 A and the vertical view of semiconductor device;
Fig. 4 A is another illustrative examples according to the present invention, be used for the vertical view of the device clamp of bonding wire system;
Fig. 4 B is the side sectional view along the device clamp line 4B-4B of Fig. 4 A, Fig. 4 A;
Fig. 5 A is another illustrative examples according to the present invention, be used for the vertical view of the device clamp of bonding wire system;
Fig. 5 B is the side sectional view along the device clamp line 5B-5B of Fig. 5 A, Fig. 5 A;
Fig. 6 is the cutaway view of a part of the device clamp of 6-6 along the line, Fig. 5 A;
Fig. 7 be according to the present invention's one illustrative examples, with the similar cutaway view of other parts of the part of another anchor clamps and bonding wire system shown in Fig. 5 A.
Embodiment
US patent application publication No.5205463, No.6062462 and No.6156990, and U.S. Patent Application Publication document No.20040152292 and U.S. Patent Application Publication document No.11/380233, all relate to wire soldering technology, they are in full in conjunction with being hereby incorporated by reference.
According to specific illustrative examples of the present invention, fluid (for example protective gas, such as the gas that includes nitrogen, argon gas) (wherein, described gas can comprise, also can not comprise such as reducing gass such as hydrogen) is provided near the solder joint district of bonding equipment.For example, in the bonding wire operation, the described fluid of constant supply may be provided in the solder joint district, thereby makes, in described bonding wire operation, the trend of wire rod oxidation reduces.Depend on employed fluid (and temperature), can also reduce the oxide/oxidation on the wire rod Already in, be similar to the effect that in the process that forms free air balls, applies reducing gas.
For example, in the bonding wire operation, after finishing wire loop (and before forming next free air balls), the wire rod afterbody (for example, the wire ends that hangs out by capillary end) may be subjected to oxygen or analog effect, thereby cause oxide to be formed on the wire rod afterbody.This oxide may be unfavorable for the line weldering, even the wire rod afterbody is formed free air balls subsequently.The present invention proposes a kind of such situation, the protective gas of (in some representative embodiment) constant supply promptly is provided in the solder joint district, thereby make, before forming next free air balls, protection wire rod afterbody is not oxidized.The present invention also helped in various other stages of wire cycle, when for example (1) forms second junction surface in the solder joint district, (2) when formed free air balls is reduced to the solder joint district, or the like, the protection wire rod (and/or wire ends) not oxidated.
Fig. 1 shows and is configured to the device clamp 100 that uses with the bonding equipment (not shown).Can understand as those skilled in the art, device clamp 100 can be arranged on treat bonding wire semiconductor device (for example, be installed in the semiconductor crystal wafer on the substrate) top, thereby (for example can use the bonding wire instrument, capillary (capillary)), finish the bonding wire operation with the device opening 102 defined in device clamp 100.For example, bonding equipment is included in the workbench (for example, composition surface) of settling semiconductor device (for example, be installed on substrate/lead frame semiconductor crystal wafer) in the bonding wire operation.Device clamp 100 is used in the process of bonding wire operation with respect to workbench that semiconductor device clamping (fixing) is in place.As conventionally known to one of skill in the art, heat block or other heating element can be provided as the part (being positioned at the composition surface of device clamp 100 belows) of workbench, think that the bonding wire operation provides the heating of expectation.
Schematically device clamp 100 comprises body part (wherein said body part is the agent structure of device clamp 100), it defines 10 (promptly, ten) device opening 102, they are restricted to 5 row (every row limits two openings 102 being separated by cross member 102a).Certainly, in any structure within the scope of the invention, can limit the opening of any amount in the device clamp.Anchor clamps 100 comprise near the uper side surface 100a (downside surface of anchor clamps 100 not shown in Figure 1 is usually located at the heat block and/or workbench of bonding equipment) on the top side that is positioned at anchor clamps 100.Anchor clamps 100 also comprise two fluid connectors 104, and they are configured to be connected to two fluid connectors 104 of the fluid provider gas supply source of gas transmission line or gas pipeline (for example, such as).Enter the passage of the gas delivery of connector 104, arrive and 102 outlets 106 corresponding, place, solder joint district of each opening by anchor clamps 100 inside.
Referring now to Fig. 2 A,, the vertical view of anchor clamps 100 is provided, and has removed connector 104, so that entry port 104a (that is opening/mouth 104a) to be shown.In this illustrative examples, entry port 104a is positioned on the top surface of anchor clamps 100, thereby easily helps to realize being connected to entry port 104a (for example, gas feedthroughs/source being connected to the entry port connector).In addition, by (just away from the entry port 104a of device opening 102, in the illustrative examples shown in Fig. 2 A, entry port 104a is arranged on every side of anchor clamps 100, be positioned at and comprise in the portion of outside installing hole 108/110, device clamp " ladder "), the connection from gas supply source to entry port 104a will not hinder bonding wire operation and relevant parts.
Fig. 2 A also shows hole 108/110 (for example, installation/location hole 108/110) (shown in Fig. 2 B, compare with being lower than bigger central portions end difference, anchor clamps 100, hole 108/110 is limited on each outside staircase areas of device clamp 100).Entry port 104a is the opening that gas enters the place, entrance in the anchor clamps 100.Enter the solder joint district (wherein, when device clamp on bonding equipment in place, solder joint district vicinity by zone that each device opening limited, so that finish bonding wire operation) of gas along delivery pathways to correspondence of anchor clamps 100 by means of entry port 104a.According to the present invention, there are a plurality of potential passages, they can be arranged between one or more device opening of one or more entry port of (1) device clamp and (2) device clamp.
Referring to the example among Fig. 2 A, the counterpart from each entry port 104a to the device opening 102 that is limited by device clamp 100 is provided with gas flow once more.More particularly, each entry port from two entry port 104a to five device opening 102 that limited by device clamp 100 are provided with corresponding gas stream through passage.Shown in Fig. 2 A, the gas that enters left side entry port 104a is carried along path 110a, arrives path 110b then.From path 110b, define five relatively short paths (being 110c1,110c2,110c3,110c4 and 110c5), so that each in gas stream to the five left side device opening 102.Each path 110c1,110c2,110c3,110c4 and 110c5 stop (for example, referring to Fig. 2 B and 3A) at 106 places of outlet separately at device opening 102 places of correspondence.Equally, the gas that enters right side entry port 104a is carried along path 120a, arrives path 120b then.From path 120b, limit five relatively short paths (being 120c1,120c2,120c3,120c4 and 120c5), so that each in gas stream to the five right side device opening 102.Each path 120c1,120c2,120c3,120c4 and 120c5 stop at 106 places of outlet separately at device opening 102 places of correspondence.
Thereby, between each entry port 104a and corresponding device opening 102, define the passage of the body part inside of device clamp 100.By in entire device anchor clamps 100, the gas source that enters from the entry port 104a complete channels to the corresponding welding spots district is provided, thereby the fluid passage of clear qualification is provided, wherein said fluid can desirably flow to other zone.And further, because passage is positioned at the inside of device clamp, so can save fluid (and fluid pressure).
A schematic passage of (shown in Fig. 2 A) begins at entry port 104a from left side entry port 104a to top left side device opening 102, extend along path 110a, upwards go to path 110b (shown in Fig. 2 A " on ", yes comparatively speaking), along path 110c1 (" right side " shown in Fig. 2 A of turning right, yes comparatively speaking), and in the termination of outlet 106 places at top left side device opening 102 places.
Fig. 2 B shows the side sectional view of device clamp 100.This view shows cross member 102a (equally as shown in Figure 1) and outlet 106.As shown in the figure, lead to the outlet 106 in corresponding solder joint district, extend along the axis x that can be described as the wire rod junction surface; Yet such statement only is relative expression.Fig. 2 B also shows the lip 112 that comprises other structure hole 108/110 (as installation/location hole), device clamp 100 and device clamp.The details of Fig. 2 B " Fig. 3 A " is referring to Fig. 3 A.
Fig. 3 A clearly show that outlet 106 and path 110b, 110c1,120b and 120c1.Fig. 3 A also shows the various schematic part in the bonding wire craft, comprising: capillary 300, substrate 306 (for example, lead frame 306) and be mounted to the semiconductor crystal wafer 302 of substrate 306.In the bonding wire operating process, the lip 112 and the substrate 306 of device clamp keep in touch.As conventionally known to one of skill in the art, the wire rod that engages in the capillary 300 is used to form the wire loop that extends between two junctions (for example, the contact/lead-in wire of wafer weld pad on the semiconductor crystal wafer 302 and substrate 306).Also as conventionally known to one of skill in the art, device clamp 100 is used for the composition surface (for example, workbench) of substrate 306 (it is equipped with semiconductor crystal wafer 302) clamping (fixing) to bonding equipment.In addition, the workbench of bonding equipment may further include heating element (for example, heat block).
Fig. 3 B shows the vertical view of a part of the device clamp 100 of two openings 102.In addition, show semiconductor crystal wafer 302, a part of substrate 306 and wire loop 304 (they provide the conductive interconnection between semiconductor crystal wafer 302 and the substrate 306) by left side device opening 102.
Referring now to Fig. 4 A,, provide the vertical view of another schematic device clamp 400, and connector (for example, with connector 104 similar connectors shown in Figure 1) is removed, so that entry port 404a (hole/opening 404a just) to be shown.Entry port 404a is the opening that gas enters the inlet point place of anchor clamps 400.The gas that enters anchor clamps 400 via entry port 404a is transported to corresponding welding spots district (wherein when device clamp was in place on bonding equipment, solder joint district vicinity was by the zone that each device opening limited, so that finish the bonding wire operation) along passage.
Counterpart from each entry port 404a to the device opening 402 that is limited by device clamp 400 is provided with gas channel.More particularly, each entry port from two entry port 404a is provided with gas channel to five device opening 402 that limited by device clamp 400.Shown in Fig. 4 A, the gas that enters left side entry port 404a is carried along path 410a, arrives each path 410b1,410b2,410b3,410b4 and 410b5 then.Each path 410b1,410b2,410b3,410b4 and 410b5 stop (for example, seeing Fig. 4 B) at corresponding outlet 406 places at device opening 402 places of correspondence.Equally, the gas that enters right side entry port 404a is carried along path 420a, arrives each path 420b1,420b2,420b3,420b4 and 420b5 then.Each path 420b1,420b2,420b3,420b4 and 420b5 stop at corresponding outlet 406 places at device opening 402 places of correspondence.
Thereby, between each entry port 404a and corresponding device opening 402, limit the passage of the body part inside of device clamp 400.A schematic passage (shown in Fig. 4 A) of left side device opening 402 begins at entry port 404a from left side entry port 404a to the top side, extend along path 410a, along path 410b1 (" right side " shown in Fig. 4 A of turning right, certainly just comparatively speaking stop), at outlet 406 places at top left side device opening 402 places.
Fig. 4 B shows the side sectional view of device clamp 400.This view shows cross member 402a, outlet 406, a part of path 410a, path 410b1, a part of path 420a and path 420b1.The outlet 406 of leading to corresponding solder joint district is extended along the x axis that can be described as the wire rod junction surface as shown in the figure; Yet such statement only is relative expression.Fig. 4 A to 4B also illustrates hole 408/410 (for example, installation/location hole 408/410), and Fig. 4 B shows the lip 412 of device clamp.
Referring now to Fig. 5 A,, provide the vertical view of another schematic device clamp 500, and connector (for example, the connector of connector 104 as shown in Figure 1) is removed, so that entry port 504a (hole/opening 504a just) to be shown.Entry port 504a is the opening that gas enters the inlet point place in the device clamp 500.The gas that enters anchor clamps 500 via entry port 504a is delivered to corresponding welding spots district (wherein when device clamp was in place on bonding equipment, solder joint district vicinity was by the zone that each device opening limited, so that finish the bonding wire operation) along passage.
Part from each entry port 504a to the device opening 502 that is limited by device clamp 500 is provided with gas channel.More particularly, to five device opening 502 that limited by device clamp 500, be provided with gas channel from each entry port of two entry port 504a.Shown in Fig. 5 A, the gas that enters left side entry port 504a is carried along path 510a, arrives each path 510b1,510b2,510b3,510b4 and 510b5 then.From these paths (for example, path 510b1,510b2,510b3,510b4 and 510b5) in each path begin, gas delivery is to path 510c1,510c2,510c3,510c4 and 510c5 (these paths, just 510c1,510c2,510c3,510c4 and 510c5, except 510c1, in Fig. 5 A, do not mark; Yet path 510c2 and 510c3 mark in Fig. 6 and illustrate) a middle corresponding short path.Each path 510c1,510c2,510c3,510c4 and 510c5 stop (for example, seeing Fig. 5 B) at corresponding outlet 506 places at device opening 502 places of correspondence.
Equally, the gas that enters right side entry port 504a is carried along path 520a, arrives each path 520b1,520b2,520b3,520b4 and 520b5 then.Each path from these paths (being path 520b1,520b2,520b3,520b4 and 520b5), gas delivery be a corresponding short path to path 520c1,520c2,520c3,520c4 and the 520c5.Each path 520c1,520c2,520c3,520c4 and 520c5 stop (for example, seeing Fig. 5 B) at corresponding outlet 506 places at device opening 502 places of correspondence.
Thereby, between each entry port 504a and corresponding device opening 502, limit the passage of the body part inside of device clamp 500.Schematic passage (shown in Fig. 5 A) from left side entry port 504a to top left side device opening 502 begins at entry port 504a, extend along path 510a, turn right to path 510b1 (" right side " shown in Fig. 5 A, certainly just comparatively speaking), change (the D score shown in Fig. 5 A downwards along path 510c1, certainly just comparatively speaking), and end at outlet 506 places at top left side device opening 502 places.
Fig. 5 B shows the side sectional view of device clamp 500.This view shows cross member 502a and outlet 506.The outlet 506 of leading to corresponding solder joint district is extended along the y axis that can be described as the wire rod junction surface as shown in the figure; Yet such statement only is relative expression.Fig. 5 B also shows connector 504 (being similar to connector shown in Figure 1 104).Fig. 5 A to 5B also shows hole 508/510 (for example, installation/location hole 508/510), and Fig. 5 B shows the lip 512 of device clamp.
Fig. 6 is along the cutaway views line 6-6 among Fig. 5 A, anchor clamps 500.The cutaway view of Fig. 6 revolves with respect to the side sectional view of Fig. 5 B and turn 90 degrees.Fig. 6 shows outlet 506, path 510c2 and 510c3 and a part of path 510b2 and 510b3.Also show schematic capillary 300.
Fig. 7 be the part of device clamp 700 view (with the view of anchor clamps among Fig. 6 500 like), wherein, similar with Fig. 5 A to 5B and anchor clamps 500 shown in Figure 6, schematically anchor clamps 700 define the passage that is used for gas.The wire loop 754 that Fig. 7 also shows substrate 752 (for example, lead frame 752), semiconductor crystal wafer 750 and is provided with between substrate 752 and semiconductor crystal wafer 750.Wire loop 754 usefulness capillaries 756 form.Clear as those skilled in the art institute, electronic flame extinguishes rod 760 and be used for forming free air balls 712 on the end of the wire rod that extends through capillary 756.Gas pipeline 758 can be used to provide gas, to reduce possible oxidation in free air balls 712 forming processes.Also show a part of workbench 762 (in the bonding wire process, substrate 752 seatings thereon) of bonding equipment.The parts of these schematic bonding equipments (capillary, electronic flame extinguish rod, gas pipeline, workbench) only use the square form structure of the installation on the bonding equipment (rather than with) to illustrate in Fig. 7, and are actually schematically, only are used for illustration purpose.Those skilled in the art know that the details of various bonding equipment platform.
Anchor clamps 700 shown in Fig. 7 define outlet 706 (similar with the outlet 506 among Fig. 6), path 710c2 and 710c3 (similar with path 510c2 and 510c3 among Fig. 6) and a part of path 710b2 and 710b3 (similar with path 510b2 and 510b3 among Fig. 6).As shown in Figure 7, gas 714 flow to corresponding solder joint district by opening 706, to reduce the possibility of oxidation in the solder joint district.
The gas that flow to the solder joint district can be known as " protective gas ", and it will prevent the potential oxidation of wire rod (and/or wire ends) in the bonding wire operation.For example, to semiconductor device (for example, wafer 750), protective gas (for example, gas 714) reduces the potential oxidation in the solder joint district because free air balls (for example, the free air balls 712 among Fig. 7) engages (for example, first engages).Oxidation potentiality in the minimizing solder joint district can be applied to the different other parts in the bonding wire circulation, for example, in the process of taking out (pay out) wire rod, in second process that engages, in the process that free air balls forms, medium in the process that becomes ring processing.
Protective gas (for example, gas 714) can be the Continuous Flow of the protective gas in the whole bonding wire operating process by anchor clamps to the stream in solder joint district.Alternatively, stream can be set controlled stream (for example, utilizing and the integrated controller Be Controlled of bonding equipment) in the process of the time period that most possibly has potential oxidation for example.
Show schematic circulation road at the accompanying drawing that this provided, so that protective gas is caused the solder joint district by clamp structure; Yet the present invention is not limited to this.The present invention has considered the various circulation road by clamp structure, so that protective gas is provided to the solder joint district.
According to the present invention, can make specific anchor clamps, so that be defined for the passage of air-flow.Alternatively, can use traditional anchor clamps, and passage can drilled system or be limited to wherein in other mode.
When wire rod that the present invention is used to be formed by reactive metal (for example copper, aluminium or the like), the expectation protective gas is inactive for metal, and can be reproducibility.For example, protective gas can be effective inert gas, for example nitrogen or argon gas.Reducing gas (for example hydrogen) can be added, with react with any oxygen that exists (for example, schematically gas is 95% nitrogen and 5% hydrogen); Yet gas protection system of the present invention can be used to the deaeration from the solder joint district, and need not have hydrogen in protective gas.This is another advantage of the present invention, because use a large amount of high inflammable hydrogen to have all difficulties.
Thereby, compare with the legacy system of the oxidation that is used to reduce place, solder joint district, the invention provides simple durable structure, optional feature is (and low-down fringe cost and corresponding complexity very low) also seldom.
Technology disclosed in this invention can also be used to nonactive joint wire rod, for example gold thread.For example, protective gas can be used to provide the clean air barrier in the solder joint district, forms the required ecotopia of gold thread ring thereby provide.
Although be primarily aimed at protective gas for example nitrogen and argon gas (have or do not have form for example hydrogen of gas) the present invention has been described, the present invention is not limited thereto.Only however with unfavorable reaction takes place as the metal that engages wire rod, any gas can be used.
Although specific embodiment shows and has described the present invention here, can not think the present invention be confined to shown in details.On the contrary, in the scope that claim contained, and under the premise of not departing from the present invention, can make various modifications to these details.

Claims (18)

1. one kind is configured to the device clamp that uses with bonding equipment, and described device clamp comprises:
Body part, it limits a plurality of device opening, and each opening in described a plurality of device opening is configured to the solder joint district of contiguous bonding equipment,
Described body part comprises the entry port on the uper side surface that is positioned at described body part, it is used to receive the fluid from gas supply source, described body part limits the fluid passage from described entry port to described a plurality of device opening, limits in the body part of fluid passage at described device clamp between each opening in described entry port and described a plurality of device opening.
2. device clamp as claimed in claim 1 is characterized in that described body part comprises a plurality of entry ports, so that limit the fluid passage between each described entry port and corresponding a plurality of device opening.
3. device clamp as claimed in claim 1 is characterized in that, described body part comprises two entry ports, so that limit the fluid passage between each described entry port and corresponding a plurality of device opening.
4. device clamp as claimed in claim 3, it is characterized in that, described body part limits ten device opening, and each entry port in described two entry ports is configured to by means of providing five device opening to described ten device opening by fluid passage that described device clamp limited with fluid.
5. device clamp as claimed in claim 1 is characterized in that, described device clamp comprises: downside surface, it is configured to the workbench of contiguous bonding equipment, and described uper side surface is opposite with described downside surface.
6. device clamp as claimed in claim 5 is characterized in that, described device clamp comprises a plurality of entry ports in the uper side surface that is limited to described device clamp.
7. device clamp as claimed in claim 6 is characterized in that, fluid passage each entry port from described a plurality of entry ports extends to corresponding a plurality of device opening.
8. bonding equipment, it comprises:
Workbench, it is used for supporting by the mach device of described bonding wire; And
Device clamp, it is configured to anchor clamps device to be processed, described device clamp limits a plurality of device opening, each device opening in described a plurality of device opening is configured to the solder joint district of contiguous described bonding equipment, described device clamp comprises the entry port on the uper side surface that is positioned at described device clamp, it is used to receive the fluid from gas supply source, described device clamp limits the fluid passage from described entry port to described a plurality of device opening, limits in the body part of fluid passage at described device clamp between each opening in described entry port and described a plurality of device opening.
9. bonding equipment as claimed in claim 8 is characterized in that described workbench comprises the heating element that device to be processed is heated.
10. bonding equipment as claimed in claim 8 is characterized in that, described device clamp comprises a plurality of described entry ports, so that limit the fluid passage between each described entry port and corresponding a plurality of device opening.
11. bonding equipment as claimed in claim 8 is characterized in that, described device clamp comprises two entry ports, so that limit the fluid passage between each described entry port and corresponding a plurality of device opening.
12. bonding equipment as claimed in claim 11, it is characterized in that, described device clamp limits ten device opening, and each entry port in described two entry ports is configured to by means of providing five device opening to described ten device opening by fluid passage that described device clamp limited with fluid.
13. bonding equipment as claimed in claim 8 is characterized in that, described device clamp comprises: downside surface, it is configured to the workbench of contiguous bonding equipment, and described uper side surface is opposite with described downside surface.
14. bonding equipment as claimed in claim 13 is characterized in that, described device clamp comprises a plurality of entry ports in the uper side surface that is limited to described device clamp.
15. bonding equipment as claimed in claim 14 is characterized in that, fluid passage each entry port from described a plurality of entry ports extends to corresponding a plurality of device opening.
16. one kind provides fluid to the method in the solder joint district of bonding equipment, said method comprising the steps of:
(1) provides device clamp, it is configured to clamping semiconductor device to be processed, described device clamp limits a plurality of device opening, each device opening in described a plurality of device opening is configured to the solder joint district of contiguous described bonding equipment, described device clamp comprises the entry port on the uper side surface that is positioned at described device clamp, it is used to receive the fluid from gas supply source, described device clamp limits the fluid passage from described entry port to described a plurality of device opening, limits in the body part of fluid passage at described device clamp between each opening in described entry port and described a plurality of device opening;
(2) will flow to the entry port of described device clamp from the fluid of gas supply source; And
(3) described fluid is passed through by the fluid passage that described device clamp limited, so that described fluid flow to described a plurality of device opening from the entry port of described device clamp is mobile.
17. method as claimed in claim 16 is characterized in that, step (2) comprises described fluid is flowed in a plurality of entry ports of described device clamp; And step (3) comprises a part that described fluid each entry port from described a plurality of entry ports is flow to the correspondence of described a plurality of device opening.
18. method as claimed in claim 16 is characterized in that, described fluid comprises reducing gas.
CN200710126620XA 2006-05-15 2007-05-15 Device clamp, wire bonding machine and method for providng fluid to bonding area of wire bonding machine Active CN101075572B (en)

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CN102130228B (en) * 2010-12-23 2012-07-25 陕西科技大学 LED bonding wire heating mold
CN102581532B (en) * 2011-11-30 2014-04-30 歌尔声学股份有限公司 Weld line pressure plate

Citations (1)

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Publication number Priority date Publication date Assignee Title
US6062459A (en) * 1998-04-29 2000-05-16 Advanced Micro Devices, Inc. Wire bond clamp

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6062459A (en) * 1998-04-29 2000-05-16 Advanced Micro Devices, Inc. Wire bond clamp

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