JPH0348435A - Mounting structure of flip chip element - Google Patents

Mounting structure of flip chip element

Info

Publication number
JPH0348435A
JPH0348435A JP1182613A JP18261389A JPH0348435A JP H0348435 A JPH0348435 A JP H0348435A JP 1182613 A JP1182613 A JP 1182613A JP 18261389 A JP18261389 A JP 18261389A JP H0348435 A JPH0348435 A JP H0348435A
Authority
JP
Japan
Prior art keywords
flip chip
bumps
chip element
circuit pattern
thermal stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1182613A
Inventor
Junichi Kanazawa
Koichi Murakoshi
Original Assignee
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Ind Co Ltd filed Critical Oki Electric Ind Co Ltd
Priority to JP1182613A priority Critical patent/JPH0348435A/en
Publication of JPH0348435A publication Critical patent/JPH0348435A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Abstract

PURPOSE: To erect the title mounting structure capable of accurately making alignment of an element within a short time while acquiring such merits as the reduction of manufacturing cost, the enhancement of reliability upon the mounting of flip chip element, etc., by a method wherein a sheet type thermal stress relaxing member making bump regulating holes having the thermal resistance and the electrical insulating properties is arranged on a circuit pattern on an insulating substrate.
CONSTITUTION: Within the title mounting structure of a flip chip element 7 to be electrically connected by welding bumps 10 provided on the flip chip element 7 into a circuit pattern 9 formed on an insulating substrate 6, a sheet type thermal stress relaxing member 8 having thermal resistance and electrical insulating properties is arranged on the circuit pattern 9 on the insulating substrate 6 while bump regulating holes 11 to avoid the outflow of the bumps 10 fused with the guide of the said bumps 10 are made in the thermal stress relaxing member 8. For example, tapered bump regulating holes 11 are made in the patterns corresponding to the bumps 10 on the said thermal stress relaxing member 8 while register marks 12 are made on the four corners to be aligned with respective corner parts of the flip chip element 7 so that the said element 7 may be aligned with the circuit pattern 9.
COPYRIGHT: (C)1991,JPO&Japio
JP1182613A 1989-07-17 1989-07-17 Mounting structure of flip chip element Pending JPH0348435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1182613A JPH0348435A (en) 1989-07-17 1989-07-17 Mounting structure of flip chip element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1182613A JPH0348435A (en) 1989-07-17 1989-07-17 Mounting structure of flip chip element

Publications (1)

Publication Number Publication Date
JPH0348435A true JPH0348435A (en) 1991-03-01

Family

ID=16121352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1182613A Pending JPH0348435A (en) 1989-07-17 1989-07-17 Mounting structure of flip chip element

Country Status (1)

Country Link
JP (1) JPH0348435A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250835A (en) * 1995-03-10 1996-09-27 Nec Corp Method for mounting lsi package having metallic bump
US5683942A (en) * 1994-05-25 1997-11-04 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
US5883438A (en) * 1995-09-22 1999-03-16 Lg Semicon Co., Ltd. Interconnection structure for attaching a semiconductor to substrate
EP0827191A3 (en) * 1996-08-20 1999-12-29 Nec Corporation Semiconductor device mounting structure
EP0917195A4 (en) * 1997-01-17 2000-03-22 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
US6124634A (en) * 1996-03-07 2000-09-26 Micron Technology, Inc. Micromachined chip scale package
JP2002313840A (en) * 2001-04-17 2002-10-25 Matsushita Electric Ind Co Ltd Semiconductor element board mounting and its manufacturing method
JP2009016399A (en) * 2007-06-29 2009-01-22 Toshiba Corp Printed circuit board, method of mounting electronic component, and electronic apparatus

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5683942A (en) * 1994-05-25 1997-11-04 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
US5905303A (en) * 1994-05-25 1999-05-18 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
JPH08250835A (en) * 1995-03-10 1996-09-27 Nec Corp Method for mounting lsi package having metallic bump
US5883438A (en) * 1995-09-22 1999-03-16 Lg Semicon Co., Ltd. Interconnection structure for attaching a semiconductor to substrate
US6207548B1 (en) * 1996-03-07 2001-03-27 Micron Technology, Inc. Method for fabricating a micromachined chip scale package
US6358833B1 (en) 1996-03-07 2002-03-19 Micron Technology, Inc. Method of fabricating a micromachined chip scale package
US6124634A (en) * 1996-03-07 2000-09-26 Micron Technology, Inc. Micromachined chip scale package
US6407451B2 (en) 1996-03-07 2002-06-18 Micron Technology, Inc. Micromachined chip scale package
EP0827191A3 (en) * 1996-08-20 1999-12-29 Nec Corporation Semiconductor device mounting structure
US6323542B1 (en) 1997-01-17 2001-11-27 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
EP0917195A4 (en) * 1997-01-17 2000-03-22 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
US7755205B2 (en) 1997-01-17 2010-07-13 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
US6518651B2 (en) 1997-01-17 2003-02-11 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
US7235881B2 (en) 1997-01-17 2007-06-26 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
US7307351B2 (en) 1997-01-17 2007-12-11 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
US7485973B2 (en) 1997-01-17 2009-02-03 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
US7888177B2 (en) 1997-01-17 2011-02-15 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
US8399999B2 (en) 1997-01-17 2013-03-19 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
JP2002313840A (en) * 2001-04-17 2002-10-25 Matsushita Electric Ind Co Ltd Semiconductor element board mounting and its manufacturing method
JP2009016399A (en) * 2007-06-29 2009-01-22 Toshiba Corp Printed circuit board, method of mounting electronic component, and electronic apparatus

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