CN101071149A - Electronic component aligning bias detecting method and its detecting device - Google Patents
Electronic component aligning bias detecting method and its detecting device Download PDFInfo
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- CN101071149A CN101071149A CN 200710128657 CN200710128657A CN101071149A CN 101071149 A CN101071149 A CN 101071149A CN 200710128657 CN200710128657 CN 200710128657 CN 200710128657 A CN200710128657 A CN 200710128657A CN 101071149 A CN101071149 A CN 101071149A
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Abstract
This invention discloses an electronic component on the detection method of migration and detection devices to detect electronic components attached to the object's state-migration, attached to target areas with attached electronic components. Detection methods include: the first will be attached at the wire connected to the conductive zone external markings; second wire connected to the electronic components; components will be connected to the signal output and the first conductor in a second wire; provide voltage signal the first and second wire to wire in a separate, and will be attached to electronic components attached area. When the bit offset, electronic components and electrical conductivity markers have short circuit, the voltage signal to the output signal transmission components, so that the output signal components issued such a warning signal. This invention can be simple and accurate detection of the electronic components of the offset state.
Description
Technical field
The present invention is particularly to a kind of electronic component contraposition bias detecting method and pick-up unit thereof relevant for a kind of detection method and pick-up unit thereof.
Background technology
LCD is to drive by chip for driving (drive IC).The part chip for driving is the process for pressing by High Temperature High Pressure, presses to exactly on the correspondence position of glass substrate.Before pressing, have the action of aligning, by on the chip with substrate on mutual corresponding mechanism, behind aligning, promptly carry out pressing.Yet in the pressing process, have machinery or artificial error unavoidably, thereby cause the situation of misalignment skew.Therefore, when each pressing, still must artificially observe the skew situation.
At glass flip chip encapsulation (chip-on-glass; COG) in the technology, the skew condition detection appraisal procedure of present glass substrate and chip pressing is to utilize microscope direct observing to lay respectively at relative position between the alignment mark on chip and the relative glass substrate.Alignment mark on the chip has fixing and relative size and shape between the two with alignment mark on the substrate.Yet, owing to be not the state of complete driving fit between two alignment marks, therefore when skew takes place, only can be offset situation by "ball-park" estimate, can't know the amount of skew more clearly.When board carries out timing, can only adjust in rough mode, so often need correction repeatedly, can obtain result more accurately.
Another kind of mode is the contact pad (pad) that is applied to glass substrate and the pressing of chip lug (bump) detects; During detection, utilize side direction light source irradiation glass substrate, and have different brightness, judge the side-play amount of glass substrate and chip pressing with this by reflected light from pressing district and non-pressing district.The method only is still and proofreaies and correct with the side-play amount of guestimate, and utilizes catoptrical brightness to judge that side-play amount must come assessment result via the process that converts, so detection method is also comparatively complicated.
Summary of the invention
For solving above problem, the invention provides a kind of electronic component contraposition bias detecting method and pick-up unit thereof, to solve the complicated or inaccurate problem of the disclosed detection method of prior art.
For achieving the above object, the present invention discloses a kind of electronic component contraposition bias detecting method, and the offset state when being pasted to the attaching object in order to the detected electrons element wherein attaches object and has adhesion zone, in order to attach electronic component.This detection method comprises: first lead is connected to the conduction mark that is positioned at the adhesion zone periphery; Second lead is connected to electronic component; The signal output element is connected in first lead and second lead one; Provide voltage signal in first lead and second lead another; And electronic component is pasted to adhesion zone.When the contraposition skew took place, electronic component produced short circuit with the conduction mark, and voltage signal transfers to the signal output element, makes the signal output element send alarm signal.
According to the present invention, the signal output element can be connected to first lead, and voltage signal is offered second lead; Or the signal output element is connected to second lead, and voltage signal is offered first lead.
According to the present invention, before electronic component and attaching object are fitted, can attach mutually with electronic component by this anisotropic conducting membrance again prior to attaching anisotropic conducting membrance (ACF) on the conformable region that attaches object.
When electronic component was integrated circuit (IC), voltage signal integrated circuit thus provided, or was connected to first or second lead by another integrated circuit or with outside tool, so that required voltage signal to be provided.
If electronic component is integrated circuit, then this electronic component is that projection (bump) by integrated circuit is pasted to the adhesion zone that attaches object, a non-functional projection (dummy bump) that is connected to this integrated circuit in first or second lead.In this, attach object and can be glass substrate, the conduction mark then can be by being formed such as indium tin oxide conductive materials such as (ITO) on the glass substrate.
When electronic component is flexible circuit board (FPC), then be pasted to the adhesion zone that attaches object by the connection pads on the flexible circuit board (pad), a lead in two leads then is connected to connection pads.In this, attach object and can be printed circuit board (PCB) (PCBA), the conduction mark then can be by being formed such as conductive materials such as copper on the printed circuit board (PCB).According to the present invention, when detecting when the contraposition skew takes place, also can be according to the position calculation side-play amount of electronic component with the conduction mark, and then adjust electronic component and the relative position that attaches object according to this side-play amount.
Aforesaid detection method, wherein this electronic component is an integrated circuit, this attaching object is the glass substrate of display panels.
Aforesaid detection method, wherein providing the step of this voltage signal to comprise by this integrated circuit provides this voltage signal to this second lead.
Aforesaid detection method, wherein this second lead is the non-functional projection that is connected to this integrated circuit.
Aforesaid detection method, wherein this voltage signal is to offer this second lead by this non-functional projection.
Aforesaid detection method, wherein providing the step of this voltage signal to comprise by outside tool provides this voltage signal to this second lead.
Aforesaid detection method, wherein this electronic component is a flexible circuit board, this attaching object is a printed circuit board (PCB).
Aforesaid detection method, wherein this second lead is the connection pads that is connected to this flexible circuit board.
Aforesaid detection method, wherein this voltage signal is to offer this second lead by this connection pads.
Aforesaid detection method, wherein providing the step of this voltage signal to comprise by outside tool provides this voltage signal to this second lead.
Aforesaid detection method wherein also comprises the position calculation side-play amount according to this electronic component and this conduction mark.
Aforesaid detection method wherein also comprises the relative position of adjusting this electronic component and this attaching object according to this side-play amount.
Electronic component contraposition offset detecting device disclosed in this invention, offset state when being pasted to the attaching object in order to the detected electrons element, attach object and have adhesion zone in order to attach electronic component, pick-up unit comprises: conduction mark, first lead and second lead.
The conduction mark is arranged at the periphery of adhesion zone.First lead connects the conduction mark.Second lead then connects electronic component, to receive voltage signal.When electronic component was pasted to adhesion zone, if the contraposition skew takes place, electronic component can produce short circuit with the conduction mark, and the voltage signal that second lead is received transfers to the conduction mark.At this, the conduction mark can be around the periphery that is arranged at adhesion zone.
According to the present invention, first lead also can be connected to the signal output element, with when the contraposition skew takes place, sends alarm signal via the actuating of voltage signal.
Moreover, also the signal output element can be connected to second lead, and voltage signal is offered first lead.
In addition, between electronic component and attaching object, can attach mutually by anisotropic conducting membrance.
When electronic component was integrated circuit, voltage signal integrated circuit thus provided, or was connected to first or second lead by another integrated circuit or outside tool, so that required voltage signal to be provided.
Aforesaid pick-up unit, wherein this conduction Marking ring is around in the periphery of this adhesion zone.
Aforesaid pick-up unit, wherein also comprise: the signal output element, connect this first lead, this signal output element comprises the caution unit, when this electronic component was pasted to this adhesion zone and the contraposition skew takes place, this voltage signal made this caution unit send alarm signal.
Aforesaid pick-up unit, wherein this caution unit is pilot lamp or hummer.
Aforesaid pick-up unit wherein also comprises: outside tool connects this second lead, in order to provide this voltage signal to this second lead.
Aforesaid pick-up unit, wherein this electronic component is an integrated circuit.
Aforesaid pick-up unit, wherein this second lead is connected with the non-functional projection of this integrated circuit.
Aforesaid pick-up unit, wherein this voltage signal is to be provided to this second lead by this integrated circuit.
Aforesaid pick-up unit, wherein this electronic component is a flexible circuit board.
Aforesaid pick-up unit, wherein this second lead links to each other with the contact pad of this flexible circuit board.
Aforesaid pick-up unit wherein also comprises: outside tool connects this second lead, in order to provide this voltage signal to this second lead.
Aforesaid pick-up unit wherein also comprises: detection module, in order to detect the position of this electronic component and this conduction mark; And computing module, be electrically connected this detection module, in order to position calculation departure according to this electronic component and this conduction mark.The present invention can be simply and is detected the offset state of electronic component exactly.
About feature of the present invention and running, now be described in detail as follows with the preferred embodiment conjunction with figs..
Description of drawings
Fig. 1 is the electronic component contraposition offset detecting device synoptic diagram according to the embodiment of the invention;
Fig. 2 is electronic component contraposition offset detecting device synoptic diagram according to another embodiment of the present invention;
Fig. 3 is the electronic component contraposition offset detecting device synoptic diagram according to further embodiment of this invention;
Fig. 4 is the electronic component contraposition offset detecting device synoptic diagram according to further embodiment of this invention;
Fig. 5 is the electronic component contraposition offset detecting device synoptic diagram according to further embodiment of this invention;
Fig. 6 is the electronic component contraposition bias detecting method process flow diagram according to the embodiment of the invention;
Fig. 7 is electronic component contraposition bias detecting method process flow diagram according to another embodiment of the present invention;
Fig. 8 is the electronic component contraposition bias detecting method process flow diagram according to further embodiment of this invention; And
Fig. 9 is the electronic component contraposition bias detecting method process flow diagram according to further embodiment of this invention.
Embodiment
Below be described with reference to the accompanying drawings content of the present invention with specific embodiment.
Fig. 1 and Fig. 2 are electronic component contraposition offset detecting device according to an embodiment of the invention, are pasted to offset state when attaching object 100 in order to detected electrons element 130.Attach object 100 and have adhesion zone 102, in order to attach electronic component 130.At this, for clearly expression, electronic component 130 applying positions only are shown among the figure, other position is then omitted not shown.
The contraposition offset detecting device comprises: conduction mark 110, first lead 120 and second lead 132.
With reference to Fig. 3, first lead 120 also can be connected to signal output element 140.When electronic component 130 is pasted to adhesion zone 102 and the contraposition skew takes place, electronic component 130 can produce short circuit and conducting with conduction mark 110, the voltage signal Vs that second lead 132 is received can transfer to conduction mark 110 via electronic component 130, and then makes signal output element 140 send alarm signal.Signal output element 140 comprises caution unit 142, sends alarm signal by caution unit 142.In an embodiment, caution unit 142 can be pilot lamp, and voltage signal Vs can make signal output element 140 send light by caution unit 142.In another embodiment, caution unit 142 can be hummer, and voltage signal Vs can make signal output element 140 sound by caution unit 142.As is known to the person skilled in the art, caution unit 142 also can be the assembly that other has warning function.Thus, can be simply and detect the offset state of electronic component exactly.
For instance, when being pasted to integrated circuit (IC) on the glass substrate, electronic component 130 can be integrated circuit, promptly can be glass substrate and attach object 100, and 110 of marks of conduction can be by being formed such as indium tin oxide conductive materials such as (ITO) on the glass substrate.At this, the projection (bump) of integrated circuit is pasted to the adhesion zone of glass substrate, second lead 132 is connected directly to the non-functional projection of integrated circuit.At this, voltage signal Vs can be provided by integrated circuit itself.In addition, also the other end of second lead 132 can be connected to another integrated circuit or outside tool, to provide voltage signal Vs to second lead 132.
In another embodiment, be that flexible circuit board (FPC) is pasted on the printed circuit board (PCB) (PCBA), this electronic component 130 is a flexible circuit board, is printed circuit board (PCB) and attach object 100, and 110 of marks of conduction can be by being formed such as conductive materials such as copper on the printed circuit board (PCB).At this, the connection pads (pad) of flexible circuit board is pasted to the adhesion zone of printed circuit board (PCB), therefore second lead 132 will be connected to connection pads.First lead 120 utilizes existing circuit on the printed circuit board (PCB).At this, voltage signal Vs can be connected to integrated circuit or outside tool via the other end with second lead 132, to provide voltage signal Vs to second lead 132.
In addition, between electronic component 130 and attaching object 100, can pass through anisotropic conducting membrance (ACF) and attaching mutually.
As Fig. 1, Fig. 2 and shown in Figure 4, also can receive voltage signal Vs, and second lead 132 is connected to signal output element 140 by first lead 120.When electronic component 130 is pasted to adhesion zone 102 generation contraposition skews, electronic component 130 can produce short circuit with conduction mark 110, thereby the voltage signal Vs that first lead 120 is received can transfer to electronic component 130 via conduction mark 110, and then makes signal output element 140 send alarm signal by caution unit 142 via second lead 132.
With reference to Fig. 5, can extract the image of electronic component 130 and conduction mark 110 by detection module 150, to detect the position of electronic component 130 and conduction mark 110, again by computing module 160 according to detection module 150 detect the position calculation amount of deviating X, Y, and send board to carry out the correction of electronic component 130 and the relative position that attaches object 100.
With reference to Fig. 6, it is electronic component contraposition bias detecting method according to an embodiment of the invention, is pasted to offset state when attaching object in order to the detected electrons element.Wherein attach object and have adhesion zone, in order to attach electronic component.
At first, first lead is connected to the conduction mark, and this conduction mark is to be positioned at adhesion zone periphery (step 210a).At this, the conduction mark can be around the periphery that is arranged at adhesion zone.
And, second lead is connected to electronic component (step 210b).
Again the signal output element is connected first lead (step 220).
Then, voltage signal is offered second lead (step 230).
So, can learn electronic component and attach whether contraposition skew (step 242) has taken place when object is fitted (step 240) by the signal output element.In other words, as if the contraposition skew taking place when (the contraposition skew exceeds set side-play amount when being electronic component and the attaching of attaching object), because electronic component produces short circuit with the conduction mark, thereby voltage signal transferred to signal output element (step 250), and then make the signal output element send alarm signal (step 252).If contraposition skew (that is, the contraposition skew did not exceed set side-play amount or do not have skew when electronic component attached with the attaching object) does not take place, then the signal output element can not send alarm signal (step 260).Thus, can be simply and detect the contraposition skew of electronic component exactly.
For instance, in the time of being pasted on the glass substrate with integrated circuit (IC), this electronic component can be integrated circuit, is glass substrate and attach object, and the conduction mark then can be by being formed such as indium tin oxide on the glass substrate.When attaching, the projection of integrated circuit is pasted to the adhesion zone of glass substrate, second lead can be connected directly to the non-functional projection (dummy bump) of integrated circuit.In this, voltage signal can be provided by integrated circuit itself.Also the other end of second lead can be connected to another integrated circuit or outside tool, to provide voltage signal to second lead.
In another embodiment, in the time of flexible circuit board (FPC) being pasted on the printed circuit board (PCB) (PCBA), this electronic component is a flexible circuit board, is printed circuit board (PCB) and attach object, and the conduction mark then can be formed by the conductive material such as copper on the printed circuit board (PCB).When attaching, the connection pads (PAD) of flexible circuit board is pasted to the adhesion zone of printed circuit board (PCB), therefore second lead will be connected to connection pads.First lead can directly utilize the circuit on the printed circuit board (PCB).At this, voltage signal can be connected to integrated circuit or outside tool via the other end with second lead, to provide voltage signal to second lead.
In the above-described embodiments, before electronic component and attaching object are fitted, can attach (step 240) mutually by this anisotropic conducting membrance and electronic component again, as shown in Figure 7 prior to attaching anisotropic conducting membrance (step 235) on the conformable region that attaches object.
Referring again to Fig. 8, also can provide the signal output element to connect second lead (step 222), and voltage signal is offered first lead (step 232).
When electronic component is fitted (step 240) with the attaching object, as if the contraposition skew taking place when (the contraposition skew exceeds set side-play amount when being electronic component and the attaching of attaching object), because electronic component produces short circuit with the conduction mark, thereby voltage signal will be in regular turn transfer to signal output element (step 250) via first lead, conduction mark, electronic component and second lead, and then make the signal output element send alarm signal (step 252).
Refer again to Fig. 9, when the contraposition skew takes place, can adjust electronic component and the relative position (step 280) that attaches object according to the side-play amount that calculates again according to the position calculation side-play amount (step 270) of electronic component with the conduction mark.
Though the present invention with above preferred embodiment openly as above, so it is not in order to restriction the present invention.Those skilled in the art without departing from the spirit and scope of the present invention, when doing a little change and modification.Therefore, scope of patent protection of the present invention must be looked the scope that this instructions appending claims defined and is as the criterion.
Claims (31)
1. electronic component contraposition bias detecting method, offset state when being pasted to the attaching object in order to the detected electrons element, this attaching object has adhesion zone in order to attaching this electronic component, and the outer periphery of this adhesion zone is equipped with the conduction mark, and this detection method comprises:
Connect first lead and conduct electricity mark to this;
Connect second lead to this electronic component;
Connect the signal output element to this first lead;
Provide voltage signal to this second lead; And
This electronic component is pasted to this adhesion zone, wherein when this electronic component and this adhesion zone generation contraposition skew, this electronic component and this conduction mark produce short circuit, and this voltage signal is transferred to this signal output element and makes this signal output element send alarm signal.
2. detection method according to claim 1, wherein this electronic component is an integrated circuit, this attaching object is the glass substrate of display panels.
3. detection method according to claim 2 wherein provides the step of this voltage signal to comprise:
Provide this voltage signal to this second lead by this integrated circuit.
4. detection method according to claim 3, wherein this second lead is the non-functional projection that is connected to this integrated circuit.
5. detection method according to claim 4, wherein this voltage signal is to offer this second lead by this non-functional projection.
6. detection method according to claim 3 wherein provides the step of this voltage signal to comprise:
Provide this voltage signal to this second lead by outside tool.
7. detection method according to claim 1, wherein this electronic component is a flexible circuit board, this attaching object is a printed circuit board (PCB).
8. detection method according to claim 7, wherein this second lead is the connection pads that is connected to this flexible circuit board.
9. detection method according to claim 8, wherein this voltage signal is to offer this second lead by this connection pads.
10. detection method according to claim 9 wherein provides the step of this voltage signal to comprise:
Provide this voltage signal to this second lead by outside tool.
11. detection method according to claim 1 also comprises:
Position calculation side-play amount according to this electronic component and this conduction mark.
12. detection method according to claim 11 also comprises:
Adjust the relative position of this electronic component and this attaching object according to this side-play amount.
13. electronic component contraposition bias detecting method, offset state when attaching object in order to the detected electrons element, this attaching object has adhesion zone in order to attaching this electronic component, and the outer periphery of this adhesion zone is equipped with the conduction mark, and this detection method comprises:
Connect first lead and conduct electricity mark to this;
Connect second lead to this electronic component;
Connect the signal output element to this second lead;
Provide voltage signal to this first lead; And
This electronic component is pasted to this adhesion zone, wherein when this electronic component and this adhesion zone generation contraposition skew, this electronic component and this conduction mark produce short circuit, and this voltage signal is transferred to this signal output element and makes this signal output element send alarm signal.
14. detection method according to claim 13, wherein this electronic component is an integrated circuit, and this attaching object is the glass substrate of display panels.
15. detection method according to claim 14, wherein this second lead is connected to the non-functional projection of this integrated circuit.
16. detection method according to claim 13, wherein this electronic component is a flexible circuit board, and this attaching object is a printed circuit board (PCB).
17. detection method according to claim 16, wherein this second lead is connected to the connection pads of this flexible circuit board.
18. detection method according to claim 13 also comprises:
Position calculation side-play amount according to this electronic component and this conduction mark.
19. detection method according to claim 18 also comprises:
Adjust the relative position of this electronic component and this attaching object according to this side-play amount.
20. an electronic component contraposition offset detecting device, the offset state when being pasted to the attaching object in order to the detected electrons element, this attaching object has adhesion zone in order to attach this electronic component, and this pick-up unit comprises:
The conduction mark is positioned at the periphery of this adhesion zone;
First lead connects this conduction mark; And
Second lead connects this electronic component, and in order to the reception voltage signal, thereby when this electronic component was pasted to this adhesion zone and the contraposition skew takes place, this electronic component and this conduction mark produced short circuit and make this voltage signal transfer to this conduction mark.
21. pick-up unit according to claim 20, wherein this conduction Marking ring is around in the periphery of this adhesion zone.
22. pick-up unit according to claim 21 also comprises:
The signal output element connects this first lead, and this signal output element comprises the caution unit, and wherein when this electronic component was pasted to this adhesion zone and the contraposition skew takes place, this voltage signal made this caution unit send alarm signal.
23. pick-up unit according to claim 22, wherein this caution unit is pilot lamp or hummer.
24. pick-up unit according to claim 22 also comprises:
Outside tool connects this second lead, in order to provide this voltage signal to this second lead.
25. pick-up unit according to claim 20, wherein this electronic component is an integrated circuit.
26. pick-up unit according to claim 25, wherein this second lead is connected with the non-functional projection of this integrated circuit.
27. pick-up unit according to claim 26, wherein this voltage signal is to be provided to this second lead by this integrated circuit.
28. pick-up unit according to claim 20, wherein this electronic component is a flexible circuit board.
29. pick-up unit according to claim 28, wherein this second lead links to each other with the contact pad of this flexible circuit board.
30. pick-up unit according to claim 20 also comprises:
Outside tool connects this second lead, in order to provide this voltage signal to this second lead.
31. pick-up unit according to claim 20 also comprises:
Detection module is in order to detect the position of this electronic component and this conduction mark; And
Computing module is electrically connected this detection module, in order to the position calculation departure according to this electronic component and this conduction mark.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101286576A CN100547418C (en) | 2007-07-09 | 2007-07-09 | Electronic component contraposition bias detecting method and pick-up unit thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101286576A CN100547418C (en) | 2007-07-09 | 2007-07-09 | Electronic component contraposition bias detecting method and pick-up unit thereof |
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| Publication Number | Publication Date |
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| CN101071149A true CN101071149A (en) | 2007-11-14 |
| CN100547418C CN100547418C (en) | 2009-10-07 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103454570A (en) * | 2012-05-29 | 2013-12-18 | 纬创资通股份有限公司 | Circuit layout short circuit detecting method and device |
| CN113237414A (en) * | 2021-05-07 | 2021-08-10 | 厦门天马微电子有限公司 | Display module, electronic equipment and alignment precision detection method |
| CN113470561A (en) * | 2021-06-30 | 2021-10-01 | Tcl华星光电技术有限公司 | Display driving device, display screen and short circuit prevention method |
-
2007
- 2007-07-09 CN CNB2007101286576A patent/CN100547418C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103454570A (en) * | 2012-05-29 | 2013-12-18 | 纬创资通股份有限公司 | Circuit layout short circuit detecting method and device |
| CN103454570B (en) * | 2012-05-29 | 2016-05-18 | 纬创资通股份有限公司 | The method for detecting short circuit of circuit layout and the short-circuit detecting device of circuit layout |
| CN113237414A (en) * | 2021-05-07 | 2021-08-10 | 厦门天马微电子有限公司 | Display module, electronic equipment and alignment precision detection method |
| CN113237414B (en) * | 2021-05-07 | 2023-02-28 | 厦门天马微电子有限公司 | Display module, electronic equipment and alignment precision detection method |
| CN113470561A (en) * | 2021-06-30 | 2021-10-01 | Tcl华星光电技术有限公司 | Display driving device, display screen and short circuit prevention method |
| CN113470561B (en) * | 2021-06-30 | 2023-11-28 | Tcl华星光电技术有限公司 | Display driving device, display screen and short circuit prevention method |
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| Publication number | Publication date |
|---|---|
| CN100547418C (en) | 2009-10-07 |
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