CN101063824A - Exposure apparatus and exposure method - Google Patents
Exposure apparatus and exposure method Download PDFInfo
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- CN101063824A CN101063824A CNA2007100868917A CN200710086891A CN101063824A CN 101063824 A CN101063824 A CN 101063824A CN A2007100868917 A CNA2007100868917 A CN A2007100868917A CN 200710086891 A CN200710086891 A CN 200710086891A CN 101063824 A CN101063824 A CN 101063824A
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- substrate
- exposure
- loading stage
- substrate loading
- mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The invention provides a exposure device and method for effectively supplying substrates for two substrate loading platform and reducing tact time for manufacturing exposure transferring substrates. The exposure device PE comprises mask loading platform(10), two substrate loading platform(11,12) which can move relative to the mask loading platform(10), prealigning unit(14), two substrate loading machine(15,16) oppositely arranged relative to the prealigning unit(14). When one substrate loading platform(11) moves from waiting position WP1 to exposure position EP, exposes and transfers mask figure on substrate W, the other substrate loading platform(12) moves from exposure position EP to waiting position WP2, and then discharges the exposed and transferred substrate W; after prealigned, the substrate W is carried to another substrate loading platform(12) and then to the prealigning unit(14) by substrate loading machine(16).
Description
Technical field
The present invention relates to exposure device and exposure method, more specifically, the exposure device and the exposure method that use when relating to large-sized panel display devices such as making semiconductor, panel of LCD or plasma display.
Background technology
As existing exposure device, making the approaching state of mask and substrate, by mask irradiation pattern exposure light, transfer mask pattern (for example, with reference to patent documentation 1 and 2) thus exposes on substrate.
In the patent documentation 1 exposure device of record comprise 2 frameworks disposing mask, with 2 frameworks be mounted with accordingly respectively substrate 2 substrate loading stages, with 2 substrate loading stages, 2 aligning guides of corresponding configuration respectively, and knownly under the state of assembling each framework and substrate loading stage, make them to the alternately mobile and loading stage travel mechanism of the transfer printing that exposes of exposure position.Thus, loading stage travel mechanism aims at simultaneously by 2 substrate loading stages and exposes, and can shorten the productive temp time.
And, the exposure device of patent documentation 2 record comprises a plurality of substrate loading stages of loading each substrate, measures the 1st detection system of substrate loading stage position and measure the 2nd detection system of substrate loading stage position at observation position at exposure position, by a plurality of substrate loading stages alternately being aligned in the exposure position transfer printing that exposes.Thus, utilize 2 measuring systems, can not measure the position of substrate loading stage off and on, thereby accurately measure the position of loading attachment.
Open communique 63-87725 number of patent documentation 1 Jap.P.
No. the 3203719th, patent documentation 2 Japanese patent gazette
Therefore, in the exposure device of patent documentation 1 and 2 records, though by utilizing 2 substrate loading stages can shorten the productive temp time, no matter any, all do not put down in writing to 2 substrate loading stage carrying substrates, therefore further improved space is arranged.
Summary of the invention
The present invention will solve aforementioned technical problem exactly, and its purpose is, can be effectively shortens the exposure device and the exposure method of productive temp time of the substrate of the transfer printing that exposes to 2 substrate loading stage carrying substrates thereby provide.
Above-mentioned purpose of the present invention realizes by following structure and method.
(1) a kind of exposure device is characterized in that, comprising:
Be used to keep the mask loading stage of mask,
Can be at the 1st substrate loading stage that between exposure position below the mask loading stage and the 1st position of readiness, moves,
The 2nd substrate loading stage that can between exposure position and the 2nd position of readiness, move,
Shine the irradiation unit that pattern exposure is used up by aforementioned mask to the substrate that remains on the 1st and the 2nd substrate loading stage that moves to exposure position,
The prealignment unit, aligning supplies to the position of the substrate of the 1st and the 2nd substrate loading stage in advance,
The 1st substrate loader is configured in the side of prealignment unit, with board carrying to the prealignment unit, and board carrying to the 1 substrate loading stage that will utilize the prealignment unit to aim in advance, and
The 2nd substrate loader disposes with the 1st substrate loader opposed to each other with respect to the prealignment unit, and board carrying is arrived the prealignment unit, and board carrying to the 2 substrate loading stages that will utilize the prealignment unit to aim in advance.
(2) exposure method of the described exposure device of a kind of utilization (1) is characterized in that having:
Make the 1st substrate loading stage move to exposure position and at the 1st exposure process of the mask pattern that remains in the substrate exposure transfer mask on the 1st substrate loading stage from the 1st position of readiness,
To utilize the 1st carrying operation of board carrying to the 2 substrate loading stages that the prealignment unit aims in advance by the 2nd substrate loader,
Substrate is supplied with the prealignment unit and adjusts the 1st prealignment operation of the position of substrate by the 1st substrate loader,
Make the 2nd substrate loading stage move to exposure position and at the 2nd exposure process of the mask pattern that remains on the substrate exposure transfer mask on the 2nd substrate loading stage from the 2nd position of readiness,
By the 1st substrate loader will utilize board carrying that aforementioned prealignment unit aims in advance to the 2nd carrying operation of aforementioned the 1st substrate loading stage and
Substrate is supplied to the prealignment unit and adjusts the 2nd prealignment operation of the position of substrate by the 2nd substrate loader,
At least one operation and the 1st exposure process in the 1st carrying operation and the 1st prealignment operation carry out simultaneously, and,
At least one operation and the 2nd exposure process in the 2nd carrying operation and the 2nd prealignment operation carry out simultaneously.
(3) as the exposure method of (2) record, it is characterized in that, also comprise:
Be used to keep after the 1st substrate loading stage of the substrate after the 1st exposure process exposure transfer printing moves to the 1st position of readiness from exposure position, by the 1st substrate loader discharge the 1st of substrate discharge operation and
Be used to keep after the 2nd substrate loading stage of the substrate after the 2nd exposure process exposure transfer printing moves to the 2nd position of readiness from exposure position, discharging the 2nd of substrate by the 2nd substrate loader and discharge operation,
The 2nd discharges operation and the 1st exposure process carries out simultaneously, and the 1st discharges operation and the 2nd exposure process carries out simultaneously.
(4) as the exposure method of (2) or (3) record, it is characterized in that,
The 1st substrate loading stage moves to exposure position and the 2nd substrate loading stage from the 1st position of readiness and moves to the 2nd position of readiness from exposure position and carry out synchronously, and
The 2nd substrate loading stage moves to exposure position and the 1st substrate loading stage from the 2nd position of readiness and moves to the 1st position of readiness from exposure position and carry out synchronously.
According to exposure device of the present invention, because have mask loading stage, the 1st and the 2nd substrate loading stage that can relatively move with respect to the mask loading stage, prealignment unit 14, the 1st and the 2nd substrate loader of configuration with respect to the prealignment unit and opposed to each other, therefore the 1st and the 2nd substrate loading stage can shared prealignment unit, simplified the structure of exposure device, and can be, thereby can shorten productive temp time of exposure transfer substrate effectively to 2 substrate loading stage carrying substrate W.
And, according to exposure method of the present invention, since one of the 1st and the 2nd substrate loading stage move to exposure position from position of readiness and the exposure process of transfer printing that substrate exposed during, to the board carrying of prealignment supplies to the prealignment unit to the carrying operation of another substrate loading stage with substrate and adjusts at least one operation in the prealignment operation of position, therefore can obviously shorten the handling time of substrate, load carrying substrate to 2 substrates effectively, thereby can shorten the productive temp time of exposure transfer substrate.
In addition, because during above-mentioned exposure process, be used to keep the substrate loading stage of the substrate after exposure process exposure transfer printing after exposure position moves to position of readiness, carry out discharging the discharge operation of substrate by substrate loader, thereby can further shorten the handling time of substrate significantly, effectively to 2 substrate loading stage carrying substrates, thereby can shorten productive temp time of exposure transfer substrate.
And, because the 1st substrate loading stage moving between the 1st position of readiness and exposure position, and the 2nd substrate loading stage moving between the 2nd position of readiness and exposure position carried out synchronously, thereby can be, thereby can further shorten productive temp time of exposure transfer substrate effectively to 2 substrate loading stage carrying substrates.
Description of drawings
Fig. 1 is the vertical view that schematically illustrates the general structure of exposure device of the present invention.
Fig. 2 is the front view of the major part of exposure device.
Fig. 3 is the side view of substrate loading stage.
Fig. 4 is the side view of the substrate loader among Fig. 1.
Fig. 5 is transported to the substrate loading stage with the 2nd plate base when being illustrated in exposure the 1st plate base, and the 3rd plate base is transported to the key diagram of the state of prealignment unit.
Fig. 6 is the 1st plate base of discharging the transfer printing that exposed when being illustrated in exposure the 2nd plate base, and the 3rd plate base is transported to the substrate loading stage, and the 4th plate base is transported to the key diagram of the state of prealignment unit.
Fig. 7 is the curve map of expression substrate loading stage and the position of substrate loader when exposure actions.
Embodiment
Below describe an embodiment of exposure device of the present invention and exposure method with reference to the accompanying drawings in detail.
Fig. 1 is the vertical view that schematically illustrates the general structure of exposure device of the present invention, and Fig. 2 is the front view of the major part of exposure device, and Fig. 3 is the side view of substrate loading stage, and Fig. 4 is the side view of the substrate loader among Fig. 1.As Figure 1-3, exposure device PE comprises mask loading stage the 10, the 1st substrate loading stage the 11, the 2nd substrate loading stage 12, irradiation unit 13, prealignment unit the 14, the 1st substrate loader the 15, the 2nd substrate loader 16, mask shovel loader 17 and mask aligner 18, and is contained in respectively on the base station 21.
As shown in Figures 2 and 3, the upper surface of the 1st and the 2nd substrate loading stage 11,12 has substrate maintaining part 31a, the 31b that keeps as being exposed the substrate W of material respectively.And, be respectively equipped with substrate loading stage travel mechanism 32,32 below the 1st and the 2nd substrate loading stage 11,12, substrate loading stage travel mechanism 32,32 has Y-axis worktable 33, Y-axis connecting gear 34, X-axis worktable 35, X-axis connecting gear 36 and Z to tilt adjusting mechanism 37.Each substrate loading stage travel mechanism 32,32 transmits driving the 1st and the 2nd substrate loading stage 11,12 with respect to loading stage base 23 at directions X and Y direction, make the 1st and the 2nd substrate loading stage 11,12 in Z-direction fine motion and inclination, so that the gap between trim mask M and the substrate W simultaneously.
Particularly, Y-axis connecting gear 34 has straight line guiding piece 38 and Y-axis transmission driving mechanism 39 between loading stage base 23 and Y-axis worktable 33.Article 2, on loading stage base 23, the slide block 41 that is installed in Y-axis worktable 33 lower surfaces passes through rolling body (not shown) crossbearer on guide rail to guide rail 40 along the Y direction configured in parallel.Thus, can support 2 Y- axis loading stages 33,33 movably along 2 guide rails 40 and along Y direction.
And corresponding with the 1st and the 2nd substrate loading stage 11,12, the ballscrew shaft 43 that is driven by motor 42 rotations is separately positioned on the loading stage base 23, and the ball-screw nut 44 that is installed in Y-axis worktable 33 lower surfaces respectively screws togather with ballscrew shaft 43.
And as shown in Figure 3, X-axis connecting gear 36 also has straight line guiding piece 45 between Y-axis worktable 33 and X-axis worktable 35 and X-axis transmits driving mechanism 46.Article 2, on Y-axis worktable 33, the slide block 48 that is installed in X-axis worktable 35 lower surfaces is by the setting of rolling body (not shown) crossbearer along the X-direction configured in parallel for guide rail 47.And the ballscrew shaft 50 that is driven by motor 49 rotations is arranged on the Y-axis worktable 33, and the ball-screw nut 51 that is installed in X-axis worktable 35 lower surfaces screws togather with ballscrew shaft 50.
On the other hand, Z has the movable Wedge mechanism that is combined to form by motor, ball-screw and wedge to-tilt adjusting mechanism 37, motor 52 rotations that are arranged on X-axis worktable 35 upper surfaces drive ballscrew shaft 53, simultaneously ball-screw nut 54 is assembled on the wedge shape moving body, the inclined-plane of the wedge 55 on the inclined-plane of this wedge and the outstanding lower surface that is arranged on substrate loading stage 11,12 matches.
And when rotation drove this ballscrew shaft 53, ball-screw nut 54 was in the horizontal fine motion of X-direction, and this horizontal fine motion moves through the inclined-plane of the wedge shape moving body of having assembled and is transformed into the campaign of fine motion up and down of degree of precision.This movable Wedge mechanism is provided with 2 at X-direction one end, at the other end 1 (not shown) is set, and is provided with 3 altogether, respectively they is carried out drive control.
Thus, Y-axis connecting gear 34, for the substrate W on substrate maintaining part 31a, the 31b that will remain on each substrate loading stage 11,12 is set to respectively on the exposure position EP that is configured in mask loading stage 10 belows, the 1st substrate loading stage 11 is moved in Y direction along guide rail 40 between the 1st position of readiness WP1 and exposure position EP, the 2nd substrate loading stage 12 is moved in Y direction along guide rail 40 between the 2nd position of readiness WP2 and exposure position EP.And X-axis connecting gear 36 and Y-axis connecting gear 34 move the 1st and the 2nd substrate loading stage 11,12, so that the substrate maintaining part 31a, the 31b that are positioned at exposure position EP are moved in X, the stepping of Y direction with respect to mask M.
In addition, though Y-axis transmits driving mechanism 39, X-axis transmits driving mechanism 46 and movable Wedge mechanism combines motor and ball-screw apparatus, also can constitute by linear motor with stator and rotor.
And, as shown in Figure 1-Figure 3, on the 1st and the 2nd substrate loading stage 11,12, directions X sidepiece and Y direction sidepiece at each substrate maintaining part 31a, 31b are equipped with excellent mirror (barmirror) 61,62 separately, and, be provided with 3 laser interferometers 63,64,65 in a side of the X-direction of the both sides of the Y direction of loading stage base 23 and loading stage base.Thus, the laser radiation of laser interferometer 63,64,65 is on excellent mirror 61,62, by accepting by excellent mirror 61,62 laser light reflected, Laser Measurement and by the interference between excellent mirror 61,62 laser light reflected, thus detect the position of the 1st and the 2nd loading stage 11,12.
As shown in Figure 2, lighting device 13 is configured in the top of the opening 25a of mask maintaining part 25, for example has light source for ultraviolet ray irradiation, concave mirror, optical integrator, level crossing, spherical mirror and exposure control such as high-pressure mercury-vapor lamp with shutter etc.Lighting device 13 is used up pattern exposure by mask and is radiated on the substrate W, and substrate W remains on substrate maintaining part 31a, the 31b of the 1st and the 2nd substrate loading stage 11,12 that moves to exposure position.Thus, the exposure of the mask pattern of mask M is transferred on the substrate W.
To supply to from the substrate W of substrate box 70A, the 70B carrying in the outside that is arranged on base station 21 before the 1st substrate loading stage 11 or the 2nd substrate loading stage 12, prealignment unit 14 carries out prealignment, make that substrate W is the position of regulation with respect to the position of mask M, in the drawings, prealignment unit 14 is configured in the front side of mask loading stage 10.Prealignment unit 14 has not shown X-axis connecting gear, Y-axis connecting gear and rotating mechanism, and the position of regulation is adjusted in the position that will be positioned in the substrate W on the prealignment unit 14.
The 1st substrate loader 15 is configured in the right side of the prealignment unit 14 among Fig. 1, its maintenance will supply to the substrate W of the 2nd substrate loading stage 12 and be transported to prealignment unit 14, and carries the substrate W of prealignment from prealignment unit 14 to the 1st substrate loading stage 11.
The 2nd substrate loader 16, dispose opposed to each other with the 1st substrate loader 15 with respect to prealignment unit 14, promptly, the left side of configuration prealignment unit 14 in the drawings, its maintenance will supply to the substrate W of the 1st substrate loading stage 11 and be transported to prealignment unit 14, and carries the substrate W of prealignment from prealignment unit 14 to the 2nd substrate loading stage 12.
As shown in Figure 4, the 1st and the 2nd substrate loader the 15, the 16th, charging manipulator, it can be provided with a plurality of trucking departments 82,83 with freely swinging on the column 81 that is fixed on the base station 21.A plurality of trucking departments 82,83 move up and down along column 81 by elevating mechanism (not shown), and servo motor is set respectively simultaneously, independently of each other above-mentioned trucking department is driven.Each trucking department 82,83 has the substrate-placing platform 87 of the 1st and the 2nd arm 84,85 and the first arm 84 front ends, and a plurality of bar-like members 86 are arranged on the substrate-placing platform abreast.And, move by control servo motor separately, make substrate-placing platform 87 liftings, rotation and mobile, thus the substrate W on the carrying substrate mounting table 87.
Particularly, the substrate W mounting that the 1st substrate loader 15 will be accommodated among the substrate box 70A is carried to substrate-placing platform 87 and to prealignment unit 14, the substrate W mounting of prealignment is transported to the 1st substrate loading stage 11 to substrate-placing platform 87 and from prealignment unit 14, will be positioned at substrate W mounting after the exposure transfer printing on the 1st substrate loading stage 11 of the 1st position of readiness WP1 again to substrate-placing platform 87 and be transported to substrate box 70A.
The substrate W mounting that the 2nd substrate loader 16 will be accommodated among the substrate box 70B is carried to substrate-placing platform 87 and to prealignment unit 14, the substrate W mounting of prealignment is transported to the 2nd substrate loading stage 12 to substrate-placing platform 87 and from prealignment unit 14, will be positioned at substrate W mounting after the exposure transfer printing on the 2nd substrate loading stage 12 of the 2nd position of readiness WP2 again to substrate-placing platform 87 and be transported to substrate box 70B.
And mask shovel loader 17 and mask aligner 18 dispose with the 1st substrate loader 15 opposed to each other with respect to the 1st substrate loading stage 11.Mask shovel loader 17 has and the roughly the same structure of the 1st and the 2nd substrate loader 15,16 shown in Figure 4, moves into mask M from the mask cassette 91 that is arranged on base station 21 outsides, will utilize the mask M of mask aligner 18 prealignments to supply to mask loading stage 10.And, about supplying with mask M to mask loading stage 10, though also can directly supply with mask M from mask aligner 18 by mask shovel loader 17 to mask loading stage 10, but also can by mask shovel loader 17 to 11 carryings of the 1st substrate loading stage once supply with to mask loading stage 10 by the 1st substrate loading stage 11 then from mask aligner 18.And the trucking department of mask shovel loader 17 can equally with substrate loader 15,16 have a plurality of, also can be one.
Describe the exposure method of exposure device PE of the present invention in detail below with reference to Fig. 5 to Fig. 7.And, for convenience of description, description be, the 1st substrate loading stage 11 keeps substrate W, the substrate W of first prealignment mounting on prealignment unit 14.
As shown in Figure 5, by making 34 actions of Y-axis connecting gear, make the 1st substrate loading stage 11 (figure represents with the single-point line) that keeps the 1st plate base W and be arranged in the 1st position of readiness WP1 to move to exposure position EP (arrow A).And, after using not shown gap camera adjustment mask M and the gap between the substrate W, use up by mask M from the pattern exposure of the 1st time of lighting device 13 irradiation and to be radiated on the substrate W, thereby the mask pattern P exposure that is formed on the mask M is transferred on the substrate W.Further, 11 steppings of the 1st substrate loading stage are moved, utilize excellent mirror 61,62 and laser interferometer 63,64,65 to aim at adjustment, simultaneously, behind the adjusting play, utilize the pattern exposure of the 2nd irradiation to use up mask pattern P exposure is transferred on the substrate W, after, similarly carry out the stepping exposure.(the 1st exposure process)
In addition, when after the adjustment of gap, carry out mask M and substrate W on time, also can replace use excellent mirror 61,62 and laser interferometer 63,64,65 with align cameras.At this moment, even when the exposure transfer printing of the 1st irradiation, after the gap is adjusted, also can aim at this align cameras.
During carrying out above-mentioned exposure transfer printing, by the 2nd substrate loader 16 mounting the 2nd plate base W on prealignment unit 14 after the arrow B direction carrying prealignment, and hold it in (the 1st carrying operation) on the 2nd substrate loading stage 12 that is positioned at the 2nd position of readiness WP2.Further, the 1st substrate loader 15 accepts to be accommodated in the 3rd plate base W among the substrate box 70A, supplies to prealignment unit 14 along the carrying of arrow C direction, and the position of substrate W is adjusted to the position (the 1st prealignment operation) of regulation.
As shown in Figure 6, after the exposure transfer printing of finishing the 1st plate base W, the 1st substrate loading stage 11 moves to the 1st position of readiness EP1 from exposure position EP, the 1st substrate loader 15 is accepted substrate W from the 1st substrate loading stage 11, and, substrate W is discharged to (the 1st discharges operation) among the substrate box 70A along direction of arrow carrying.
And, when operation is discharged in beginning the above-mentioned the 1st, begin the exposure process of the 2nd plate base W.Promptly, when the 1st substrate loading stage 11 moves to the 1st position of readiness WP1 from exposure position EP, by making 34 actions of Y-axis connecting gear, make the 2nd substrate loading stage 12 (representing with the single-point line among the figure) that keeps the 2nd plate base W to move to exposure position EP (arrow E) from the 2nd position of readiness EP2.Then, same with the 1st exposure process, after using not shown gap sensor adjustment mask M and the gap between the substrate W, use up by mask M from the pattern exposure of the 1st time of lighting device 13 irradiation and to be radiated on the substrate W, thereby the mask pattern P exposure that will be formed on the mask M is transferred on the substrate W that remains on the 2nd substrate loading stage 12.Further, 12 steppings of the 2nd substrate loading stage are moved, utilize excellent mirror 61,62 and laser interferometer 63,64,65 to aim at adjustment, simultaneously behind the adjusting play, utilizing the pattern exposure of the 2nd irradiation to use up is transferred to mask pattern P exposure on the substrate W, after, similarly carry out the stepping exposure.(the 2nd exposure process)
And, during carrying out the 2nd exposure process, the 3rd plate base W of mounting on prealignment unit 14 after aiming in advance along arrow F direction carrying by the 1st substrate loader 15, and hold it in (the 2nd carrying operation) on the 1st substrate loading stage 11 that is positioned at the 1st position of readiness WP1.Further, the 2nd substrate loader 16 accepts to be accommodated in the 4th plate base W among the substrate box 70B, supplies to prealignment unit 14 along the carrying of arrow G direction, and the position of substrate W is adjusted to the position (the 2nd prealignment operation) of regulation.
And after the exposure transfer printing of finishing the 2nd plate base W, the 2nd substrate loading stage 12 moves to the 2nd position of readiness EP2 from exposure position EP, and the 2nd substrate loader 16 is accepted substrate W from the 2nd substrate loading stage 12, and is discharged among the substrate box 70B (the 2nd discharges operation).And, begin the 2nd discharge operation in and the 2nd substrate loading stage 12 synchronously the 1st substrate loading stage 11 is moved to exposure position EP from the 1st position of readiness EP1, carry out the 1st exposure process.Then, as mentioned above, during carrying out the 1st exposure process, carry out the 2nd and discharge operation, the 1st carrying operation, the 1st prealignment operation.
Fig. 7 represents the 1st and the 2nd substrate loading stage 11,12 and the 1st and the 2nd position of substrate loader 15,16 when exposure actions.
In the present embodiment, because the 1st and the 2nd substrate loader 15,16 has 2 trucking departments 82,83 respectively, therefore, for example can utilize one of them trucking department 82 that the substrate W on the 1st substrate loading stage 11 is discharged among the substrate box 70B, the substrate W that utilizes another one trucking department 83 to aim in advance is transported on the 1st substrate loading stage 11, discharges operation thereby can carry out the 1st carrying operation and the 2nd simultaneously.But, when each substrate loader 15,16 has only a trucking department, also can after the 2nd discharges operation, carry out the 1st carrying operation.
After, by carrying out same operation repeatedly, Yi Bian Yi Bian carry a plurality of substrates successively mask pattern P exposure is transferred on the substrate W.
Thereby, exposure device PE according to present embodiment, because have mask loading stage 10, the 1st and the 2nd substrate loading stage 11,12 that can relatively move with respect to mask loading stage 10, prealignment unit 14, the 1st and the 2nd substrate loader 15,16 of configuration with respect to prealignment unit 14 and opposed to each other, therefore the 1st and the 2nd substrate loading stage 11,12 can shared prealignment unit 14, simplified the structure of exposure device PE, and can shorten the productive temp time of exposure transfer substrate effectively to 2 substrate loading stages, 11,12 carrying substrate W.
And, according to exposure method of the present invention, owing to make the 1st and the 2nd substrate loading stage 11, a wherein side of 12 is from position of readiness WP1, WP2 moves to exposure position EP and during the exposure process of the transfer printing that exposes on the substrate W, make substrate loading stage 11, the opposing party in 12 moves to position of readiness WP1 from exposure position EP, WP2, afterwards, discharge the discharge operation of the substrate W of the transfer printing that exposes, the substrate W that aims in advance is transported to another substrate loading stage 11,12 carrying operation, will be from substrate box 70A, the substrate W that 70B supplies with supplies to prealignment unit 14 and adjusts the prealignment operation of position, so can obviously shorten the handling time of substrate W, effectively to 2 substrate loading stages 11,12 carrying substrates, thereby the productive temp time of shortening exposure transfer substrate.
And, because the 1st substrate loading stage 11 moves to exposure position EP and the 2nd substrate loading stage 12 from the 1st position of readiness EP1 and moves to the 2nd position of readiness EP2 from exposure position EP and carry out synchronously, and the 2nd substrate loading stage 12 moves to exposure position EP and the 1st substrate loading stage 11 from the 2nd position of readiness EP2 and moves to the 1st position of readiness EP1 from exposure position EP and carry out synchronously, so can be, thereby can further shorten productive temp time of exposure transfer substrate effectively to 2 substrate loading stages, 11,12 carrying substrates.
And, the invention is not restricted to aforementioned embodiments, can suitably be out of shape and improve.
Claims (4)
1. an exposure device is characterized in that, comprising:
Be used to keep the mask loading stage of mask;
Can be at the 1st substrate loading stage that between exposure position below this mask loading stage and the 1st position of readiness, moves;
The 2nd substrate loading stage that can between described exposure position and the 2nd position of readiness, move;
Irradiation unit, by described mask to the substrate irradiation pattern exposure light that remains on the described the 1st and the 2nd substrate loading stage that moves to described exposure position;
The prealignment unit is aimed at the position that supplies to the described substrate on the described the 1st and the 2nd substrate loading stage in advance;
The 1st substrate loader is configured in the side of described prealignment unit, to described prealignment unit, and will utilize described board carrying that described prealignment unit aims in advance to described the 1st substrate loading stage described board carrying; And
The 2nd substrate loader, dispose opposed to each other with described the 1st substrate loader with respect to described prealignment unit, described board carrying is arrived described prealignment unit, and the described board carrying that will utilize described prealignment unit to aim in advance arrives described the 2nd substrate loading stage.
2. exposure method that utilizes the described exposure device of claim 1 is characterized in that having:
Make described the 1st substrate loading stage move to described exposure position and at the 1st exposure process of the mask pattern that remains in the described mask of described substrate exposure transfer printing on described the 1st substrate loading stage from described the 1st position of readiness;
To utilize described board carrying that described prealignment unit aims in advance the 1st carrying operation to described the 2nd substrate loading stage by described the 2nd substrate loader;
Supply to described substrate on the described prealignment unit and adjust the 1st prealignment operation of the position of described substrate by described the 1st substrate loader;
Make described the 2nd substrate loading stage move to described exposure position and at the 2nd exposure process of the mask pattern that remains in the described mask of described substrate exposure transfer printing on described the 2nd substrate loading stage from the 2nd position of readiness;
To utilize described board carrying that described prealignment unit aims in advance the 2nd carrying operation to described the 1st substrate loading stage by described the 1st substrate loader; And
Supply to described substrate on the described prealignment unit and adjust the 2nd prealignment operation of the position of described substrate by described the 2nd substrate loader;
At least one operation and described the 1st exposure process in described the 1st carrying operation and described the 1st prealignment operation carry out simultaneously; And
At least one operation and described the 2nd exposure process in described the 2nd carrying operation and described the 2nd prealignment operation carry out simultaneously.
3. exposure method as claimed in claim 2 is characterized in that, also comprises:
After described the 1st substrate loading stage of the described substrate after described the 1st exposure process exposure transfer printing moves to described the 1st position of readiness from described exposure position, discharge the 1st of described substrate by described the 1st substrate loader and discharge operation being used to keep; With
After described the 2nd substrate loading stage of the described substrate after described the 2nd exposure process exposure transfer printing moves to described the 2nd position of readiness from described exposure position, discharge the 2nd of described substrate by described the 2nd substrate loader and discharge operation being used to keep;
The described the 2nd discharges operation and described the 1st exposure process carries out simultaneously, and the described the 1st discharges operation and described the 2nd exposure process carries out simultaneously.
4. as claim 2 or 3 described exposure methods, it is characterized in that,
Described the 1st substrate loading stage moves to described exposure position and described the 2nd substrate loading stage from described the 1st position of readiness and moves to described the 2nd position of readiness from described exposure position and carry out synchronously; And
Described the 2nd substrate loading stage moves to described exposure position and described the 1st substrate loading stage from described the 2nd position of readiness and moves to described the 1st position of readiness from described exposure position and carry out synchronously.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006119412 | 2006-04-24 | ||
| JP2006119412A JP2007294594A (en) | 2006-04-24 | 2006-04-24 | Exposure device and exposure method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101063824A true CN101063824A (en) | 2007-10-31 |
| CN100526996C CN100526996C (en) | 2009-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100868917A Active CN100526996C (en) | 2006-04-24 | 2007-04-02 | Exposure apparatus and exposure method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007294594A (en) |
| KR (1) | KR100839398B1 (en) |
| CN (1) | CN100526996C (en) |
| TW (1) | TW200745790A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102365591A (en) * | 2010-03-12 | 2012-02-29 | 松下电器产业株式会社 | Alignment method and flat panel display manufacture method |
| CN104238272A (en) * | 2013-06-18 | 2014-12-24 | 群创光电股份有限公司 | Exposure system and exposure method |
| US9588427B2 (en) | 2013-06-18 | 2017-03-07 | Innolux Corporation | Light exposure system comprising a plurality of moving stages and light exposure process |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4726814B2 (en) * | 2007-01-16 | 2011-07-20 | 株式会社日立ハイテクノロジーズ | Substrate positioning device and positioning method |
| KR101005582B1 (en) * | 2009-07-13 | 2011-01-05 | 한국기계연구원 | Alignment module for substrate and lithography apparatus having the alignment module |
| US8379186B2 (en) * | 2009-07-17 | 2013-02-19 | Nikon Corporation | Pattern formation apparatus, pattern formation method, and device manufacturing method |
| TWI398639B (en) * | 2010-01-08 | 2013-06-11 | Nat Univ Kaohsiung | The carrier of the package |
| JP5843161B2 (en) * | 2011-05-13 | 2016-01-13 | 株式会社ニコン | Exposure apparatus, flat panel display manufacturing method, and device manufacturing method |
| TWI596449B (en) * | 2016-05-30 | 2017-08-21 | 志聖工業股份有限公司 | Method for light exposing workpiece, exposure apparatus, and placement mechanism of exposure apparatus |
| CN112015054B (en) * | 2019-05-31 | 2021-10-01 | 上海微电子装备（集团）股份有限公司 | Transmission device, transmission method and photoetching machine |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3203719B2 (en) * | 1991-12-26 | 2001-08-27 | 株式会社ニコン | Exposure apparatus, device manufactured by the exposure apparatus, exposure method, and device manufacturing method using the exposure method |
| JP2001308003A (en) * | 2000-02-15 | 2001-11-02 | Nikon Corp | Exposure method and system, and method of device manufacturing |
| JP2002305140A (en) * | 2001-04-06 | 2002-10-18 | Nikon Corp | Aligner and substrate processing system |
| JP4458322B2 (en) * | 2003-01-14 | 2010-04-28 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
-
2006
- 2006-04-24 JP JP2006119412A patent/JP2007294594A/en active Pending
-
2007
- 2007-03-23 KR KR1020070028681A patent/KR100839398B1/en active IP Right Grant
- 2007-03-29 TW TW096111046A patent/TW200745790A/en unknown
- 2007-04-02 CN CNB2007100868917A patent/CN100526996C/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102365591A (en) * | 2010-03-12 | 2012-02-29 | 松下电器产业株式会社 | Alignment method and flat panel display manufacture method |
| CN104238272A (en) * | 2013-06-18 | 2014-12-24 | 群创光电股份有限公司 | Exposure system and exposure method |
| CN104238272B (en) * | 2013-06-18 | 2017-02-01 | 群创光电股份有限公司 | Exposure system and exposure method |
| US9588427B2 (en) | 2013-06-18 | 2017-03-07 | Innolux Corporation | Light exposure system comprising a plurality of moving stages and light exposure process |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100839398B1 (en) | 2008-06-20 |
| JP2007294594A (en) | 2007-11-08 |
| KR20070104827A (en) | 2007-10-29 |
| TWI338201B (en) | 2011-03-01 |
| TW200745790A (en) | 2007-12-16 |
| CN100526996C (en) | 2009-08-12 |
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