CN101060734A - Organic LED double panel module - Google Patents

Organic LED double panel module Download PDF

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Publication number
CN101060734A
CN101060734A CNA2006100758217A CN200610075821A CN101060734A CN 101060734 A CN101060734 A CN 101060734A CN A2006100758217 A CNA2006100758217 A CN A2006100758217A CN 200610075821 A CN200610075821 A CN 200610075821A CN 101060734 A CN101060734 A CN 101060734A
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China
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signal
panel
organic led
lead
shared
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CNA2006100758217A
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Chinese (zh)
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CN100461490C (en
Inventor
古琼景
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Richtek Technology Corp
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Richtek Technology Corp
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The OLED dual-plate module comprises: two plates, a shared encapsulation device with two wire areas connected with two plates respectively, and a control circuit generating drive signal according to external signal and driving two plates. Compared with prior art, this invention simplifies structure by eliminating an encapsulation device and a control chip, reduces product cost efficiently.

Description

Organic LED double panel module
Technical field
The present invention is relevant a kind of Organic Light Emitting Diode (Organic Light-Emitting Diode; OLED) panel is particularly about a kind of OLED double panel module.
Background technology
The OLED display can save weight, volume and the power consumption of backlight module owing to have the characteristic of self-lighting, therefore not only has than LCD (Liquid Crystal Display; LCD) thinner thickness, operating voltage more is reduced to 2 to 10 volts, the visual angle that adds OLED is wide, picture response speed fast (less than 10ms) and color representation are outstanding than LCD, more have flexible characteristic, make its range of application extremely wide, be applied on the display floater of hand-held electronic products such as mobile phone, personal digital assistant at present.
And hand-held devices such as present mobile phone or personal digital assistant dispose two display floaters mostly for some additional functions are provided.With clamshell phone, the subpanel in the outside does not launch mobile phone for the user just can see information such as time and caller ID, inboard main panel then is to launch mobile phone the user, during operations such as dialling or search for data, and images such as display text, pattern.For example during the object beyond the camera function that uses mobile phone is taken self, can determine whether camera lens is aimed at, and when the user wants oneself is taken, can determine the direction of camera lens by the subpanel in the outside by the main panel of inboard.These additional functions become the basic function of consumption electronic products gradually, and double panel module also becomes the basic outfit of these products thereupon.
Yet therefore known OLED double panel module needs higher cost and bigger mechanism size with each self-driven panel of two control chips.As shown in Figure 1, in known OLED double panel module, main panel module 105 comprises main panel 10, packaging system 12 and control chip 14, subpanel module 205 comprises subpanel 20, packaging system 22 and control chip 24, main panel module 105 and subpanel module 205 are attached to the two sides of printed circuit board (PCB) 30 respectively, are combined into an OLED double panel module.The front of the OLED double panel module of Fig. 2 A displayed map 1, it is main panel module 105, the wire area 120 welding main panels 10 of packaging system 12, wire area 122 is welded on the printed circuit board (PCB) 30, control chip 14 is welded on the central authorities of packaging system 12, control chip 14 transmits signal by lead-in wire 16 with main panel 10 and printed circuit board (PCB) 30.The back side of the OLED double panel module of Fig. 2 B displayed map 1, it is subpanel module 205, the wire area 220 welding subpanels 20 of packaging system 22, wire area 222 is welded on the printed circuit board (PCB) 30, control chip 24 is welded on the central authorities of packaging system 22, and control chip 24 26 transmits signals with subpanel 20 and printed circuit board (PCB) 30 through going between.The signal outer from module is connected on the printed circuit board (PCB) 30, pass to main panel module 105 and subpanel module 205 by wire area 122 and 222, the signal transmission between main panel module 105 and the subpanel module 205 is also by the circuit on the printed circuit board (PCB) 30.The thickness of this OLED double panel module is the thickness sum total of main panel 10, subpanel 20 and printed circuit board (PCB) 30, and its area then is the sum total of main panel 10 and packaging system 12.
In order to meet light, thin, short, the little trend of consumption electronic products trends, the while is also in order to reduce cost, a kind of low cost and have the OLED double panel module of less mechanism size, what people expected just.
Summary of the invention
Main purpose of the present invention is to propose the OLED double panel module that a kind of cost is low, mechanism size is little.
According to the present invention, a kind of OLED double panel module comprises a packaging system of sharing, engage two panels respectively with two wire areas, and a control circuit, produce the lead-in wire of a plurality of drive signals on described packaging system according to a plurality of external signals and drive described two panels respectively or simultaneously.
Organic LED double panel module of the present invention comprises: one first panel; One second panel; One packaging system of sharing has first wire area and second wire area and engages described first and second panel respectively; And a control circuit, produce a plurality of drive signals according to a plurality of external signals, drive described first and second panel respectively or simultaneously via described shared packaging system transmission.
OLED double panel module of the present invention does not use printed circuit board (PCB), has lacked one group of packaging system than known OLED double panel module yet, more can reduce by a control chip, so the thickness and the less area that have lower cost, approach.
Description of drawings
Fig. 1 is the end view of known OLED double panel module;
Fig. 2 A, Fig. 2 B are the positive and negative schematic diagrames of the OLED double panel module of Fig. 1;
Fig. 3 is the expanded view of OLED double panel module of the present invention;
Fig. 4 is the end view of module behind the packaging system reflexed of Fig. 3;
Fig. 5 A, Fig. 5 B are the positive and negative schematic diagrames of the module of Fig. 4;
Fig. 6 is the embodiment of the packaging system of Fig. 3;
Fig. 7 is the embodiment of the control chip of Fig. 3;
Fig. 8 is another embodiment of the control chip of Fig. 3;
The signal that the control chip of Fig. 9 displayed map 7 produces when main panel and subpanel are all opened;
The control chip of Figure 10 displayed map 7 is opened at main panel, the signal that produces when subpanel is closed;
The control chip of Figure 11 displayed map 7 is closed at main panel, the signal that produces when subpanel is opened; And
The signal that the control chip of Figure 12 displayed map 7 produces when main panel and subpanel are all closed.
The primary clustering symbol description:
10 main panels, 105 main panel modules
12 packaging systems, 120 wire areas
122 wire areas, 14 control chips
16 lead-in wires, 20 subpanels
205 subpanel modules, 22 packaging systems
220 wire areas, 222 wire areas
24 control chips, 26 lead-in wires
30 printed circuit board (PCB)s, 40 main panels
42 packaging systems, 420 wire areas
44 control chips, 442 instruction interfaces
443 memories, 444 longitudinal scanning line time schedule controllers
445 main panel horizontal scan line time schedule controllers
446 subpanel horizontal scan line time schedule controllers
447 control chips, 448 connecting lines
45 control chip packaging areas
450 connecting lines, 46 main panels lead-in wire
48 subpanels, 50 subpanels that go between
520 wire areas, 55 connectors
550 connectors, 555 wire areas that go between
Embodiment
Fig. 3 is one embodiment of the present of invention, the main panel 40 of OLED double panel module and subpanel 50 use a packaging system 42 of sharing, its typical embodiment is the macromolecule winding with many strip metal lead-in wires, utilizes the automatic joining technique of coil type (Tape Automated Bonding; TAB) wire area 420 is welded to main panel 40, wire area 520 is welded to subpanel 50, and wire area 555 is welded to connector 55.Control chip 44 is welded on the central authorities of packaging system 42.Connector 55 uses bendable soft board, hot pressed paper or printed circuit board (PCB) as substrate usually, and the connector lead-in wire 550 on circuit on it and the packaging system 42 carries out the signal transmission for the outer device of control chip 44 and module.Control chip 44 produces a plurality of drive signals according to the external signal of sending here outside module, be delivered to main panel 40 and subpanel 50 via lead-in wire 46 and 48, to drive main panel 40 and subpanel 50 at the same time or separately.
Fig. 4 is the end view of embodiment behind packaging system 42 reflexeds of Fig. 3, and subpanel 50 and packaging system 42 all are attached to the back side of main panel 40.Fig. 5 A and Fig. 5 B are the positive and negative schematic diagrames of the module of Fig. 4.In the present embodiment, the thickness of OLED double panel module is the thickness that main panel 40 adds subpanel 50, area is about the size of main panel 40, compare with known OLED double panel module, present embodiment does not use printed circuit board (PCB), but allow two panels 40 and 50 back-to-back attachings, more lacked one group of packaging system and a control chip, so have lower cost, thinner thickness and littler area than known OLED double panel module.
The embodiment of the packaging system 42 of Fig. 6 displayed map 3, for having the macromolecule winding of many strip metal lead-in wires, its material is generally polyimides (polyimide; PI), be a kind of material of similar photographic negative.The default main panel 40 that will connect of present embodiment is 160 * 128 oled panel, subpanel 50 is 96 * 96 oled panel, so the lead-in wire on the packaging system 42 is divided into main panel longitudinal scanning line lead-in wire S1 to S160, main panel horizontal scan line lead-in wire C1 to C128, subpanel longitudinal scanning line lead-in wire D33 to D128, subpanel horizontal scan line lead-in wire C ' 1 to C ' 96 and connector lead-in wire IO1 to IOn, one end of these lead-in wires all is connected to control chip packaging area 45, and the other end then is connected respectively to wire area 420,520 and 555.For keeping the even of panel picture, present embodiment is divided into two groups of C1 to C64 and C65 to C128 with main panel horizontal scan line lead-in wire, be configured in respectively outside the both sides of main panel longitudinal scanning line lead-in wire S1 to S160, subpanel horizontal scan line lead-in wire also is divided into C ' 1 to C ' 48 and 49 to C ' 96 liang of groups of C ', is configured in respectively outside the both sides of subpanel longitudinal scanning line lead-in wire D33 to D128.In the present embodiment, other has connecting line 450 across control chip packaging area 45, connect the longitudinal scanning line lead-in wire S33 to S128 of main panel 40 and the longitudinal scanning line lead-in wire D33 to D128 of subpanel 50, shown in the partial enlarged drawing on Fig. 6 right side, so the longitudinal scanning signal S33 to S128 of main panel 40 and subpanel 50 shared.Because the longitudinal scanning line of subpanel 50 lead-in wire D33 to D128 is the longitudinal scanning signal of sharing from longitudinal scanning line lead-in wire S33 to the S128 reception of main panel 40, so longitudinal scanning line lead-in wire D33 to D128 also can not weld control chip 44.
Fig. 7 is the embodiment of the control chip 44 of Fig. 3, and a plurality of connection pads are arranged on the control chip 44, for convenience of description, the lead-in wire designate that connects with each connection pad it.External signal is by connection pad IO1 to IOn input control chip 44, instruction interface 442 is according to external signal, send first and second initial order at the same time or separately and give main panel horizontal scan line time schedule controller 445 and subpanel horizontal scan line time schedule controller 446, and image data is stored into memory 443.Main panel horizontal scan line time schedule controller 445 and subpanel horizontal scan line time schedule controller 446 are according to first and second initial order, produce a plurality of first and second horizontal scan signals that use for main panel 40 and subpanel 50 respectively to connection pad C1 to C128 and C ' 1 to C ' 96, memory 443 is generally random-access memory (ram), longitudinal scanning line time schedule controller 444 is according to the image data in the memory 443, and the longitudinal scanning signal that produces main panel 40 is connected to connection pad S1 to S160.With reference to Fig. 6, though the longitudinal scanning signal of sharing of present embodiment is by packaging system 42, be connected to subpanel longitudinal scanning line lead-in wire D33 to D128 from main panel longitudinal scanning line lead-in wire S33 to S128 through connecting line 450, but for keeping the encapsulation acceptance rate and the evenness of OLED double panel module, a plurality of connection pad D33 to D128 that supply longitudinal scanning lines lead-in wire D33 to the D128 connection of subpanel 50 still are set on the control chip 44, these connection pads are empty connection pad (dummy pad), do not link to each other with circuit in the control chip 44.
Fig. 8 is another embodiment of control circuit of the present invention, circuit in the control chip 447 is identical with the control chip of Fig. 7 44, therefore do not show among the figure, also have a plurality of connecting lines 448 in addition and connect connection pad S33 to S128 and connection pad D33 to D128, therefore the longitudinal scanning signal S33 to S128 of main panel 40 is delivered to connection pad D33 to D128 via connecting line 448, shares with subpanel 50.Use this control chip 447, needn't have connecting line 450 on the packaging system 42 and connect the longitudinal scanning line lead-in wire S33 to S128 of main panel 40 and the longitudinal scanning line lead-in wire D33 to D128 of subpanel 50, but the longitudinal scanning line lead-in wire D33 to D128 of the necessary auxiliary connection panel 50 of the connection pad D33 to D128 on the control chip 447, the longitudinal scanning signal S33 to S128 that shares passes to connection pad D33 to D128 from connection pad S33 to S128 in control chip 447, pass to subpanel 50 through longitudinal scanning line lead-in wire D33 to D128 again.
In different embodiment, control circuit also can separately be produced on two or more chips.
The signal that the control chip 44 of Fig. 9 displayed map 7 sends when driving main panel 40 and subpanel 50 simultaneously, for convenience of description, with each signal of lead-in wire numbering designate.When main panel 40 and subpanel 50 are all opened, the main panel longitudinal scanning signal S1 to S160 that control chip 44 produces is the control signal of show image, subpanel longitudinal scanning signal D33 to D128 shares main panel longitudinal scanning signal S33 to S128, so be identical signal, main panel horizontal scan signal C1 to C128 and subpanel horizontal scan signal C ' 1 to C ' 96 are continuous sweep signal, constantly scan main panel 40 and subpanel 50 in regular turn, and on main panel 40 and subpanel 50, show identical image simultaneously.
The signal that the control chip 44 of Figure 10 displayed map 7 is opened, produced when subpanel 50 is closed at main panel 40, main panel longitudinal scanning signal S1 to S160 is the control signal of show image, subpanel longitudinal scanning signal D33 to D128 is identical with main panel longitudinal scanning signal S33 to S128, main panel horizontal scan signal C1 to C128 constantly scans main panel 40 in regular turn, 1 to C ' 96 of subpanel horizontal scan signal C ' maintains high level, promptly close subpanel 50, and show image on main panel 40 only.
The signal that the control chip 44 of Figure 11 displayed map 7 is closed at main panel 40, subpanel 50 produces when opening, main panel longitudinal scanning signal S1 to S160 still is the control signal of show image, subpanel longitudinal scanning signal D33 to D128 is identical with main panel longitudinal scanning signal S33 to S128, main panel horizontal scan signal C1 to C128 maintains high level, promptly close main panel 40, subpanel horizontal scan signal C ' 1 to C ' 96 scans subpanel in regular turn, and show image on subpanel 50 only.
The signal that Figure 12 produces when main panel 40 and subpanel 50 are all closed for the control chip 44 of Fig. 7, longitudinal scanning signal S1 to S160 and D33 to D128 are in zero level, and horizontal scan signal C1 to C128 and C ' 1 to C ' 96 maintain high level.
The above only is explanation the present invention, but not in order to limit protection scope of the present invention.

Claims (12)

1. organic LED double panel module is characterized in that comprising:
One first panel;
One second panel;
One packaging system of sharing has first wire area and second wire area and engages described first and second panel respectively; And
One control circuit produces a plurality of drive signals according to a plurality of external signals, drives described first and second panel respectively or simultaneously via described shared packaging system transmission.
2. organic LED double panel module as claimed in claim 1 is characterized in that, described shared packaging system is to be soldered to described first and second panel with the automatic joining technique of coil type.
3. organic LED double panel module as claimed in claim 1 is characterized in that, the back side that described shared packaging system and described second panel are attached to described first panel.
4. organic LED double panel module as claimed in claim 1 is characterized in that, comprises that also a connector engages described shared packaging system, to transmit described external signal to described control circuit.
5. organic LED double panel module as claimed in claim 4 is characterized in that described connector comprises the substrate of bendable soft board, hot pressed paper or printed circuit board (PCB).
6. organic LED double panel module as claimed in claim 1 is characterized in that, described drive signal comprises the signal that described first and second panel of a plurality of confessions is shared.
7. organic LED double panel module as claimed in claim 6 is characterized in that, described shared packaging system comprises:
Many first lead-in wires connect described control circuit and described first panel, to transmit a plurality of first signals in the described drive signal;
Many second lead-in wires connect described control circuit and described second panel, to transmit a plurality of secondary signals in the described drive signal;
Many articles the 3rd lead-in wires are connected to described second panel; And
Many connecting lines, each bar connecting line connect described first lead-in wire one of them with described the 3rd lead-in wire one of them, go between to the described the 3rd to transmit the described shared signal of at least a portion.
8. organic LED double panel module as claimed in claim 7 is characterized in that, described control circuit comprises:
One memory;
One instruction interface determines one first initial order and one second initial order according to described external signal, and deposits an image data in described memory;
One longitudinal scanning time schedule controller produces a plurality of longitudinal scanning signals according to the image data in the described memory, and described first signal comprises described longitudinal scanning signal, and described longitudinal scanning signal comprises described shared signal;
One first transversal scanning time schedule controller produces a plurality of first horizontal scan signals according to described first initial order, and described first signal comprises described first horizontal scan signal; And
One second transversal scanning time schedule controller produces a plurality of second horizontal scan signals according to described second initial order, and described secondary signal comprises described second horizontal scan signal.
9. organic LED double panel module as claimed in claim 8 is characterized in that, described longitudinal scanning signal also comprises the signal that described first and second panel of a plurality of non-confessions is shared.
10. organic LED double panel module as claimed in claim 6 is characterized in that, described shared packaging system comprises:
Many first lead-in wires connect described control circuit and described first panel, to transmit a plurality of first signals in the described drive signal; And
Many second lead-in wires connect described control circuit and described second panel, to transmit a plurality of secondary signals in the described drive signal;
Wherein said first and second signal respectively comprises described shared signal.
11. organic LED double panel module as claimed in claim 10 is characterized in that, described control circuit comprises:
One memory;
One instruction interface determines one first initial order and one second initial order according to described external signal, and deposits an image data in described memory;
One longitudinal scanning time schedule controller produces a plurality of longitudinal scanning signals according to the image data in the described memory, and described first signal comprises described longitudinal scanning signal, and described longitudinal scanning signal comprises described shared signal;
One first transversal scanning time schedule controller produces a plurality of first horizontal scan signals according to described first initial order, and described first signal comprises described first horizontal scan signal;
One second transversal scanning time schedule controller produces a plurality of second horizontal scan signals according to described second initial order, and described secondary signal comprises described second horizontal scan signal;
A plurality of first connection pads connect described first signal for described first lead-in wire;
A plurality of second connection pads connect described secondary signal for described second lead-in wire; And
Many connecting lines, each bar connecting line connect described first connection pad one of them and described second connection pad one of them, to transmit the described shared signal of at least a portion to described second connection pad.
12. organic LED double panel module as claimed in claim 11 is characterized in that, described longitudinal scanning signal also comprises the signal that described first and second panel of a plurality of non-confessions is shared.
CNB2006100758217A 2006-04-18 2006-04-18 Organic LED double panel module Expired - Fee Related CN100461490C (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CNB2006100758217A CN100461490C (en) 2006-04-18 2006-04-18 Organic LED double panel module

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CN101060734A true CN101060734A (en) 2007-10-24
CN100461490C CN100461490C (en) 2009-02-11

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799050A (en) * 2016-09-07 2018-03-13 三星显示有限公司 Display device
WO2018152948A1 (en) * 2017-02-27 2018-08-30 武汉华星光电技术有限公司 Oled display module and manufacturing method thereof
US10468470B2 (en) 2017-02-27 2019-11-05 Wuhan China Star Optoelectronics Technology Co., Ltd OLED display module and method of forming the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123868A (en) * 1984-11-21 1986-06-11 キヤノン株式会社 Positioning securing method for panel substrate
CN1547063A (en) * 2003-12-04 2004-11-17 友达光电股份有限公司 Planar display

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799050A (en) * 2016-09-07 2018-03-13 三星显示有限公司 Display device
WO2018152948A1 (en) * 2017-02-27 2018-08-30 武汉华星光电技术有限公司 Oled display module and manufacturing method thereof
US10468470B2 (en) 2017-02-27 2019-11-05 Wuhan China Star Optoelectronics Technology Co., Ltd OLED display module and method of forming the same

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