CN210982989U - Display device - Google Patents

Display device Download PDF

Info

Publication number
CN210982989U
CN210982989U CN201922112301.4U CN201922112301U CN210982989U CN 210982989 U CN210982989 U CN 210982989U CN 201922112301 U CN201922112301 U CN 201922112301U CN 210982989 U CN210982989 U CN 210982989U
Authority
CN
China
Prior art keywords
emitting diode
circuit board
micro light
window
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201922112301.4U
Other languages
Chinese (zh)
Inventor
李富琳
乔明胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Visual Technology Co Ltd
Original Assignee
Hisense Visual Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Visual Technology Co Ltd filed Critical Hisense Visual Technology Co Ltd
Priority to CN201922112301.4U priority Critical patent/CN210982989U/en
Application granted granted Critical
Publication of CN210982989U publication Critical patent/CN210982989U/en
Priority to PCT/CN2020/132198 priority patent/WO2021104445A1/en
Priority to US17/580,285 priority patent/US11822115B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The utility model discloses a display device, including backlight unit and display panel, backlight unit includes: the circuit board comprises a plurality of welding pads for welding the micro light-emitting diode; the reflecting coating covering the circuit board is provided with a windowing exposing the bonding pad, and the micro light-emitting diode is welded in the windowing. The size of the window is designed to be larger than that of the micro light-emitting diode, so that the micro light-emitting diode can be smoothly contacted and welded with the bonding pad in the window when being transferred to the upper part of the corresponding window. And because the circuit board usually has the problem of harmomegathus, so can design the size of windowing and increase the distance that will move when the circuit board takes place harmomegathus on the basis of miniature emitting diode's size, even like this the circuit board takes place harmomegathus, the position of windowing and pad takes place the skew, miniature emitting diode still can contact with windowing inner pad when shifting to the primary importance position, realizes the electric connection of miniature emitting diode electrode and the pad of circuit board.

Description

Display device
Technical Field
The utility model relates to a show technical field, especially relate to a display device.
Background
With the development of display technology, liquid crystal display technology is widely used in the display field. The lcd panel itself cannot emit light, and the backlight module is required to provide the required brightness for displaying. Due to the limitation of the characteristics of the liquid crystal panel, light leakage occurs to different degrees, and the improvement of the contrast ratio has a bottleneck. Therefore, a scheme for performing local dimming (local dimming) on the backlight module is provided, and backlights in different areas can be independently controlled, so that when the backlight brightness corresponding to a high-brightness part in a displayed image can be maximized, and the backlight brightness corresponding to a dark part in the image can be reduced, so that the displayed image can achieve better contrast.
The micro light Emitting Diode (Mini L light Emitting Diode, abbreviated as Mini L ED) as backlight has become a current hotspot in the liquid crystal display technology, and is different from the traditional liquid crystal display backlight scheme adopting the lateral entrance of a light guide plate, and a huge amount of Mini L ED is adopted as a backlight source, so that the backlight thinning can be realized, the more refined dynamic control can be realized, and the display effect is improved.
The Mini L ED needs to be welded on a circuit board in a die bonding mode to prepare a Mini L ED lamp panel, the circuit board is subjected to multiple production processes, transportation and the like, expansion and shrinkage phenomena can occur, and a pad on the circuit board can be prevented from deviating, and the Mini L ED is small in size, so that the Mini L ED cannot be accurately welded on the corresponding pad due to the deviation of the pad, and poor welding of the Mini L ED is caused.
SUMMERY OF THE UTILITY MODEL
The utility model provides a display device for solve the bad problem of miniature emitting diode welding.
The utility model provides a display device, include:
the backlight module is used for providing backlight;
the display panel is positioned on the light emitting side of the backlight module and used for displaying images;
the backlight module comprises a miniature light-emitting diode lamp panel as a backlight source;
the miniature LED lamp plate includes:
the circuit board has the functions of bearing and supporting and is used for providing power; the circuit board comprises a plurality of welding pads for welding the micro light-emitting diode;
the reflecting coating is covered on the circuit board; the reflective coating includes a plurality of windows exposing the pads;
the micro light-emitting diode is welded on the bonding pad in the window;
the size of the window is larger than that of the micro light-emitting diode, and the size of the window meets the requirement that the micro light-emitting diode is welded after the circuit board expands and contracts.
In a possible implementation manner, in the display device provided by the present invention, the circuit board and the micro light emitting diode are both rectangular;
the long side of the micro light-emitting diode is parallel to the short side of the circuit board.
In a possible implementation manner, in the display device provided by the present invention, the window of the reflective coating is rectangular;
the long edge of the window is parallel to the long edge of the micro light-emitting diode.
In a possible implementation manner, the present invention provides an above display device, wherein the dimension of the long side of the circuit board, the dimension of the short side of the window and the dimension of the short side of the micro light emitting diode satisfy the following relationships:
Figure BDA0002296841260000021
where Py denotes a length of a short side of the window, Cy denotes a length of a short side of the micro light emitting diode, and L y denotes a length of a long side of the circuit board.
In a possible implementation manner, in the above display device provided by the present invention, the size of the long side of the micro light emitting diode and the size of the long side of the window satisfy the following relationship:
Cx<Px≤Cx+d;
wherein Cx denotes a length of a long side of the micro light emitting diode, Px denotes a length of a long side of the window, and d denotes a length of an electrode of the micro light emitting diode in a direction parallel to the long side of the micro light emitting diode.
In a possible implementation manner, the utility model provides an among the above-mentioned display device, backlight unit includes a plurality of miniature emitting diode lamp plates, and the circuit board of each miniature emitting diode lamp plate is along being on a parallel with the direction of the minor face of circuit board is arranged.
In one possible implementation manner, in the display device provided by the present invention, the size of the micro light emitting diode is 50 μm to 300 μm.
In a possible implementation manner, in the display device provided by the present invention, the length of the circuit board is 200mm to 800mm, and the width of the circuit board is 100mm to 500 mm.
In a possible implementation manner, in the above display device provided by the present invention, the backlight module further includes:
and the protective layer is covered on the surfaces of the reflective coating and the side of the micro light-emitting diode, which is far away from the circuit board.
In a possible implementation manner, in the above display device provided by the present invention, the backlight module further includes:
the transparent substrate is positioned on one side of the protective layer, which is far away from the circuit board;
the diffusion plate is positioned on one side of the transparent substrate, which is far away from the protective layer;
and the optical membrane is positioned on one side of the diffusion plate, which is far away from the transparent substrate.
The utility model discloses beneficial effect as follows:
the utility model provides a display device, include: the backlight module is used for providing backlight; the display panel is positioned on the light emitting side of the backlight module and used for displaying images; the backlight module includes: the miniature light-emitting diode lamp panel is used as a backlight source; the miniature LED lamp plate includes: the circuit board has the functions of bearing and supporting and is used for providing power; the circuit board comprises a plurality of welding pads for welding the micro light-emitting diodes; the reflecting coating is covered on the circuit board; the reflective coating includes a plurality of fenestrations that expose the pads; the micro light-emitting diode is welded on the bonding pad in the window; the size of the window is larger than that of the micro light-emitting diode, and the size of the window meets the requirement of welding the micro light-emitting diode after the circuit board expands and contracts. The size of the window is designed to be larger than that of the micro light-emitting diode, so that the micro light-emitting diode can be smoothly contacted and welded with the bonding pad in the window when being transferred to the upper part of the corresponding window. And because the circuit board usually has the problem of harmomegathus, so can design the size of windowing and increase the distance that will move when the circuit board takes place harmomegathus on the basis of miniature emitting diode's size, even like this the circuit board takes place harmomegathus, the position of windowing and pad takes place the skew, miniature emitting diode still can contact with windowing inner pad when shifting to the primary importance position, realizes the electric connection of miniature emitting diode electrode and the pad of circuit board.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional structure diagram of a display device according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure view of a Mini L ED lamp panel provided in an embodiment of the present invention;
fig. 3 is a schematic top view of a Mini L ED lamp panel according to an embodiment of the present invention;
fig. 4 is a schematic top view of the window and the micro light emitting diode provided in the embodiment of the present invention;
fig. 5 is a schematic diagram of a side view relationship between the window and the micro light emitting diode provided by the embodiment of the present invention;
fig. 6 is a schematic top view of a plurality of Mini L ED lamp panels according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of a backlight module according to an embodiment of the present invention.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described with reference to the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words for expressing the position and direction described in the present invention are all the explanations given by taking the drawings as examples, but can be changed according to the needs, and the changes are all included in the protection scope of the present invention. The drawings of the present invention are only for illustrating the relative positional relationship and do not represent true proportions.
Fig. 1 is a schematic structural diagram of a display device provided by an embodiment of the present invention, as shown in fig. 1, an embodiment of the present invention provides a display device including:
a backlight module 100 for providing backlight; the backlight module 100 can uniformly emit light in the whole light emitting surface, and is used for providing light with sufficient brightness and uniform distribution for the display panel, so that the display panel can normally display images.
The display panel 200 is located on the light emitting side of the backlight module 100 for displaying images. The display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the transmittance and color of light incident to the pixel unit from the backlight module 100, so that the light transmitted by all the pixel units forms a displayed image.
The embodiment of the utility model provides an above-mentioned display device can be display devices such as liquid crystal display, LCD TV, also can be for mobile terminal such as cell-phone, panel computer, intelligent album adopt backlight unit to provide backlight among the display device, modulate by the light of display panel to backlight unit outgoing, realize image display the utility model provides a backlight unit can adopt Mini L ED lamp plate as the light source, and Mini L ED's size is littleer for traditional L ED, adopts huge Mini L ED as the backlight, can realize more refined dynamic control, promotes LCD display's dynamic contrast.
The embodiment of the utility model provides an above-mentioned backlight module 100 includes miniature emitting diode lamp plate (Mini L ED lamp plate), as the backlight.
Fig. 2 is a schematic cross-sectional structure view of a Mini L ED lamp panel provided in an embodiment of the present invention, as shown in fig. 2, the Mini L ED lamp panel includes a circuit board 11, a reflective coating 12 and a micro led 13;
the circuit board 11 has a bearing and supporting function, and is used for providing power. In the embodiment of the present invention, the circuit board 11 is used for providing a driving electrical signal for the micro light emitting diode 13. The micro light emitting diode 13 and the circuit board 11 are separately manufactured, the surface of the circuit board 11 includes a plurality of bonding pads p for welding the micro light emitting diode, after the micro light emitting diode 12 is manufactured, the micro light emitting diode 13 is transferred to the upper side of the bonding pad of the circuit board 11, and the micro light emitting diode 13 is welded on the circuit board 11 through processes such as reflow soldering, so that the micro light emitting diode 13 can be driven to emit light by controlling an input signal of the circuit board 11.
In a specific implementation, the Circuit Board 11 may be a Printed Circuit Board (PCB), where the PCB includes an electronic Circuit and an insulating layer, and the insulating layer exposes a pad of the electronic Circuit, which is soldered to the micro light emitting diode 12, and covers the rest of the electronic Circuit.
Alternatively, the circuit board 11 may be an array substrate formed by fabricating a thin film transistor driving circuit on a substrate, the surface of the array substrate may have a connection electrode (i.e., the pad in the window) connected to the thin film transistor driving circuit, and the electrodes of the micro light emitting diodes 12 may be soldered to the connection electrodes in a one-to-one correspondence manner. The substrate or the substrate base plate of the above circuit board 11 may be made of a flexible material to form a flexible display device.
In the embodiment of the present invention, the circuit board 11 is plate-shaped, and the whole is rectangular or square. The length of the circuit board 11 is 200mm-800mm, and the width is 100mm-500 mm. According to the size of the display device, the backlight module may include a plurality of circuit boards 11, and the circuit boards 11 are connected to each other in a splicing manner to provide backlight. In order to avoid the optical problem caused by the splicing of the circuit boards 11, the splicing seams between the adjacent circuit boards 11 are as small as possible, and even seamless splicing is realized.
And a reflective coating 12 covering the circuit board 11. The reflective coating 12 may be a protective layer located above the circuit board 11, and when a material having a reflective property is coated on the surface of the circuit board 11, the protective layer has a reflective function at the same time, and can reflect light incident toward one side of the circuit board 11, thereby improving the utilization efficiency of the light. In the embodiment of the present invention, the reflective coating 12 may be made of white oil or the like.
Fig. 3 is a schematic view of a top view structure of a Mini L ED lamp panel provided by an embodiment of the present invention, as shown in fig. 3, after the circuit board is wired, a layer of reflective coating 12 is coated on the surface thereof, and the position of a pad p for welding the micro light emitting diode is exposed through etching and other processes, so as to form a window 121 as shown in fig. 3, after the window 121 is formed, the micro light emitting diode 13 is welded on the pad p corresponding to the circuit board, so that the micro light emitting diode 13 is welded on the circuit board 11.
And a micro light emitting diode 13 soldered on the pad p in the window 121. The micro light emitting diode 13 is different from a general light emitting diode, and is specifically referred to as a micro light emitting diode chip. Since the micro led 13 has a small size, the light emitting chip is advantageous to control dynamic light emission to a smaller partition, which is advantageous to improve the contrast of a picture. In the embodiment of the present invention, the micro light emitting diode 13 can be a monochromatic micro light emitting diode with a size of 50 μm to 300 μm.
The micro-leds 13 usually include two electrodes, which need to be soldered to two adjacent pads p on the circuit board 11, and the micro-leds 13 can be moved above their corresponding pads by mechanical transfer before soldering. The mechanical arm for transferring the micro light emitting diode 12 transfers the micro light emitting diode 13 to a corresponding position above the circuit board 11 according to a nominal value of the opening window on the circuit board 11, however, after the circuit board 11 is processed through various process steps, transportation and the like, the expansion and shrinkage of the substrate of the circuit board 11 are easy to occur, the opening window on the reflective coating shifts along with the expansion and shrinkage of the circuit board, and the micro light emitting diode 13 still moves according to the opening window position on the standard circuit board, and because the size of the micro light emitting diode 13 is in the micrometer scale, the small shift of the opening window on the circuit board 11 causes the problem that the micro light emitting diode 13 cannot be aligned with the bonding pad in the opening window, thereby causing poor welding of the micro light emitting diode.
In order to overcome the above problem, in the embodiment of the present invention, as shown in fig. 2 and fig. 3, the size of the window 121 on the reflective coating 12 can be properly enlarged, so that the size of the window 121 is larger than the size of the micro light emitting diode 13, and the size of the window 121 meets the requirement of welding the micro light emitting diode after the expansion and contraction of the circuit board 11.
In specific implementation, the size of the open window 121 may be designed to be larger than that of the micro light emitting diode 13, so that when the micro light emitting diode is transferred to the upper side of the corresponding open window 121, the micro light emitting diode can be smoothly contacted and soldered with the pad p in the open window 121. Because the circuit board 11 usually has the problem of expansion and shrinkage, the size of the window 121 can be designed to increase the moving distance of the circuit board 11 when the expansion and shrinkage occur on the basis of the size of the micro light-emitting diode 13, so that even if the expansion and shrinkage occur on the circuit board 11 and the positions of the window and the bonding pad shift, the micro light-emitting diode can still contact with the bonding pad p in the window when the micro light-emitting diode shifts to the original position, and the electric connection between the electrode of the micro light-emitting diode and the bonding pad of the circuit board is realized.
In the manufacturing process, considering the difficulty of the process and the shape requirement of the product, as shown in fig. 3, the circuit board 11 and the micro light emitting diode 13 are usually designed into regular rectangles.
The circuit board is welded with the miniature light-emitting diode to form the miniature light-emitting diode lamp panel, and the display equipment used at present is generally rectangular in shape no matter a computer display screen, a television or a mobile phone, so that the driving circuit board of the miniature light-emitting diode lamp panel used as a backlight source can also be made into a rectangular shape.
The micro light emitting diode is not formed individually but is cut after an epitaxial layer and other structures are grown on the substrate, and the cutting precision directly affects the precision of the micro light emitting diode.
The expansion and contraction of the circuit board are influenced by the adopted materials, and the proportion of the expansion and contraction is generally
Figure BDA0002296841260000081
And the degree of expansion and contraction is positively correlated with the length in that direction. Taking a circuit board with a length direction of 400mm and a width direction of 200mm as an example, the circuit board 11 may have a shrinkage in the length direction of 80 μm to 200 μm and a shrinkage in the width direction of 40 μm to 100 μm. That is, the amount of offset of the opening window of the circuit board 11 in the length direction of the circuit board will be larger than that in the width direction.
In order to ensure the welding yield of the micro light-emitting diode, the long side of the micro light-emitting diode 13 is arranged to be parallel to the short side of the circuit board 11. The expansion and contraction amount of the circuit board 11 in the direction of the long edge is large, the windowing has a large offset in the direction of the long edge of the circuit board, and the influence of the offset of the windowing on the short edge of the micro light-emitting diode 13 is relatively small compared with the long edge, because the short edge of the micro light-emitting diode can be positioned in the windowing even if the windowing deviates by a large distance, the contact between the electrode of the micro light-emitting diode and the bonding pad in the windowing can not be influenced, and the problem of poor welding of the micro light-emitting diode can be solved.
As shown in fig. 3, the window 121 of the reflective coating 12 may be correspondingly rectangular in shape in order to accommodate the shape of the micro-leds 13. And the long side of the window 121 is disposed parallel to the long side of the micro light emitting diode 13.
The size of the window 121 is theoretically equal to that of the micro light emitting diode 13, so that the electrode of the micro light emitting diode 13 is connected to the pad p in the window 121, and considering the problems of expansion and contraction of the circuit board 11, errors generated in the transfer process and the like, the size of the window 121 can be set to be correspondingly enlarged based on the size of the micro light emitting diode 13, and even if the problems occur, the micro light emitting diode 13 can be ensured to be set in the window 121. The sizes of the micro light-emitting diode 13 and the windowing 121 are in the micron order, the long edge of the windowing 121 is parallel to the long edge of the micro light-emitting diode 13, the short edge of the windowing 121 is parallel to the short edge of the micro light-emitting diode 13, the size of the windowing 121 can adapt to the shape of the micro light-emitting diode, the waste of occupied space cannot be caused, and more micro light-emitting diodes can be arranged on the circuit board.
Fig. 4 is a schematic diagram illustrating a top view relationship between the window and the micro light emitting diode provided in the embodiment of the present invention, and fig. 2 and 3 show a dimensional relationship among the circuit board 11, the window 121, and the micro light emitting diode 13, as shown in fig. 2, a length of a long side of the circuit board 11 is L y, a length of a short side of the circuit board is L x, a length of a long side of the window 121 is Px, a length of a short side of the window 121 is Py, as shown in fig. 3, a length of a long side of the micro light emitting diode 13 is Cx, and a length of a short side of the micro light emitting diode 13 is Cy.
Considering the problem of the skew of windowing that causes because the harmomegathus of circuit board, in the embodiment of the utility model provides an, the size of the long limit size of circuit board 11, the minor face of windowing 121 and the size of the minor face of miniature emitting diode 13 can satisfy following relation:
Figure BDA0002296841260000091
where Py denotes the length of the short side of the window, Cy denotes the length of the short side of the micro light emitting diode, and L y denotes the length of the long side of the circuit board.
Expansion and contraction amount of the circuit board 11 in the long side direction and the long side directionThe length of the board is dependent on the expansion and contraction degree of the board 11, which is different from the material of the board, if the expansion and contraction ratio of the board material is
Figure BDA0002296841260000092
The amount of displacement of the window 121 on the circuit board in the long side direction of the circuit board can be reached
Figure BDA0002296841260000093
If the micro light emitting diode 13 is to be positioned in the corresponding window 121 after being shifted according to the predetermined position and to be contacted with the pad in the window 121, the length of the short side of the window 121 should be increased by the shift amount in the long side direction of the circuit board 11 based on the length of the short side of the micro light emitting diode 13, so that the short side dimension of the micro light emitting diode 13 and the short side dimension of the window 121 are set to satisfy the above relationship, and it can be ensured that the corresponding micro light emitting diode 13 can still be shifted into the window 121 when the window 121 is shifted.
The size of the long side of the micro light emitting diode 13 and the size of the long side of the window 121 may satisfy the following relationship:
Cx<Px≤Cx+d;
where Cx denotes a length of a long side of the micro light emitting diode, Px denotes a length of a long side of the window, and d denotes a length of an electrode of the micro light emitting diode in a direction parallel to the long side of the micro light emitting diode.
Miniature emitting diode 13 includes two electrodes, respectively with two pad p mutual welding in the window 121 that corresponds, fig. 5 does the utility model provides a window and miniature emitting diode's that windows looks sideways at the relation sketch map, as shown in fig. 5, there is certain clearance between two pad p in the window 121, this is because also there is the clearance between two electrodes of miniature emitting diode 13, and this clearance occupies about the third on long limit along the length of miniature emitting diode 13 long limit direction, so when making circuit board 11, consequently the clearance between two pads of connecting same miniature emitting diode suits with the clearance between two electrodes of miniature emitting diode. However, the windows 121 of the circuit board are also shifted along the short side direction of the circuit board 11, so that the dimensions of the micro-leds 13 and the windows 121 in the long side direction need to be considered, and in case that the windows 121 are shifted, two electrodes of the micro-leds 13 can be connected to two pads p in the corresponding windows 121.
In the embodiment of the present invention, the length Px of the long side of the window 121 is greater than the length Cx of the long side of the micro light emitting diode 13. In addition, the length d of the electrode of the micro light emitting diode 13 along the long side direction of the micro light emitting diode is about one third of the long side of the micro light emitting diode, and the length d of the electrode can already satisfy the offset of the window 121, so that the length Px of the long side of the window 121 can be set to satisfy Cx < Px ≦ Cx + d.
In specific application, the size of the micro light-emitting diode lamp plate is not too large, so that the micro light-emitting diode needs to be transferred to a circuit board after being manufactured and then welded, the yield of the micro light-emitting diode lamp plate depends on the yield of the micro light-emitting diode on the lamp plate, and the larger the lamp plate is, the lower the production yield is.
Fig. 6 is the utility model provides a structural schematic that overlooks of a plurality of Mini L ED lamp plates, as shown in fig. 6, the utility model provides a backlight module includes a plurality of miniature emitting diode lamp plates, and the circuit board 11 of each miniature emitting diode lamp plate is along being on a parallel with the direction of the minor face of circuit board is arranged.
In practical implementation, the conventional display screen size is 16:9, and the range of the Mini L ED die bonding equipment and the size of the display are not spliced by square lamp panels, so that the circuit board 11 can be designed to be rectangular, and the ratio of the long side to the short side is close to 2: 1. when the size of the circuit board 11 is smaller than the size of the required illumination range, the number of the circuit boards 11 arranged along the direction of the short side of the circuit board 11 can be increased.
In the above-mentioned display device that the embodiment of the present invention provides, as shown in fig. 2, the above-mentioned Mini L ED that the embodiment of the present invention provides still includes:
and the protective layer 14 covers the surfaces of the reflective coating 12 and the micro light-emitting diode 13 on the side away from the circuit board 11.
The protective layer 14 serves to encapsulate the micro-leds 13, thereby effectively preventing the micro-leds from falling off and moisture. The material used for the protective layer 14 includes silicon gel, epoxy resin or other colloid material with high transmittance. In practical applications, the micro light emitting diodes 13 may be formed on the surface by spraying or spot coating. In the backlight module shown in fig. 2, the protective layer 14 is manufactured by a full-surface spraying method, and the production efficiency of the full-surface spraying manufacturing method is higher. In practical application, a mode of dispensing a colloid material above the micro light emitting diode 13 and packaging the micro light emitting diode 13 can be adopted, the colloid material can be saved by the dispensing packaging mode, the glue coating amount can be flexibly controlled, and the applicability is stronger.
Fig. 7 is a schematic view of a cross-sectional structure of a backlight module provided in an embodiment of the present invention, as shown in fig. 7, an embodiment of the present invention provides an above-mentioned backlight module further including: a transparent substrate 15, a diffuser plate 16 and an optical film 17.
A transparent substrate 15 on the side of the protective layer 14 facing away from the circuit board 11. And a transparent substrate 15 for supporting the diffusion plate 16 and allowing light from the micro light emitting diodes 13 to pass therethrough. The material of the transparent substrate 15 may be selected from polymethyl methacrylate, polycarbonate, or the like. The transparent substrate 15 acts as a support structure for the diffuser plate 16, allowing the light emitted by the micro-leds 13 to be sufficiently mixed before reaching the diffuser plate 16. In the embodiment of the present invention, the thickness of the transparent substrate 15 satisfies the light mixing distance of the micro light emitting diode 13, and the backlight effect is ensured. In a specific implementation, the thickness of the transparent substrate 15 is not greater than 10 mm.
And the diffusion plate 16 is positioned on the side of the transparent substrate 15, which faces away from the protective layer 14. The diffusion plate 16 is usually provided with a scattering particle material, and after the light enters the diffusion plate 16, the scattering particle material continuously refracts and reflects the light, so as to scatter the light, and further realize the function of light uniformization. The material of the diffuser plate is generally at least one selected from the group consisting of polymethyl methacrylate (PMMA), Polycarbonate (PC), polystyrene-based material (PS), and polypropylene (PP), but not limited thereto.
And an optical film 17 positioned on a side of the diffuser plate 16 facing away from the transparent substrate 15. The optical film set 17 may include one or more of a prism sheet, a quantum dot film, a reflective polarizer, etc., and the purpose of adding these films to the backlight module is to adapt the backlight module to various practical applications. For example, the prism sheet may change the exit angle of light, thereby changing the viewable angle of the display device. The quantum dot film can provide quantum dot luminescence with higher monochromaticity, and is applied to quantum dot televisions to improve the display color gamut of the televisions. The reflective polarizer can improve the utilization rate of light, and simultaneously, the emergent light has polarization property, thereby omitting the use of the polarizer under the liquid crystal display panel.
The embodiment of the utility model provides a display device, include: the backlight module is used for providing backlight; the display panel is positioned on the light emitting side of the backlight module and used for displaying images; the backlight module includes: the miniature light-emitting diode lamp panel is used as a backlight source; the miniature LED lamp plate includes: the circuit board has the functions of bearing and supporting and is used for providing power; the circuit board comprises a plurality of welding pads for welding the micro light-emitting diodes; the reflecting coating is covered on the circuit board; the reflective coating includes a plurality of fenestrations that expose the pads; the micro light-emitting diode is welded on the bonding pad in the window; the size of the window is larger than that of the micro light-emitting diode, and the size of the window meets the requirement of welding the micro light-emitting diode after the circuit board expands and contracts. The size of the window is designed to be larger than that of the micro light-emitting diode, so that the micro light-emitting diode can be smoothly contacted and welded with the bonding pad in the window when being transferred to the upper part of the corresponding window. And because the circuit board usually has the problem of harmomegathus, so can design the size of windowing and increase the distance that will move when the circuit board takes place harmomegathus on the basis of miniature emitting diode's size, even like this the circuit board takes place harmomegathus, the position of windowing and pad takes place the skew, miniature emitting diode still can contact with windowing inner pad when shifting to the primary importance position, realizes the electric connection of miniature emitting diode electrode and the pad of circuit board.
While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. A display device, comprising:
the backlight module is used for providing backlight;
the display panel is positioned on the light emitting side of the backlight module and used for displaying images;
the backlight module comprises a miniature light-emitting diode lamp panel as a backlight source;
the miniature LED lamp plate includes:
the circuit board has the functions of bearing and supporting and is used for providing power; the circuit board comprises a plurality of welding pads for welding the micro light-emitting diode;
the reflecting coating is covered on the circuit board; the reflective coating includes a plurality of windows exposing the pads;
the micro light-emitting diode is welded on the bonding pad in the window;
the size of the window is larger than that of the micro light-emitting diode, and the size of the window meets the requirement that the micro light-emitting diode is welded after the circuit board expands and contracts.
2. The display device of claim 1, wherein the circuit board and the micro light emitting diodes are both rectangular;
the long side of the micro light-emitting diode is parallel to the short side of the circuit board.
3. The display device of claim 2, wherein the fenestrations of the reflective coating are rectangular;
the long edge of the window is parallel to the long edge of the micro light-emitting diode.
4. The display device according to claim 3, wherein a size of a long side of the circuit board, a size of a short side of the window, and a size of a short side of the micro light emitting diode satisfy the following relationship:
Figure FDA0002296841250000011
where Py denotes a length of a short side of the window, Cy denotes a length of a short side of the micro light emitting diode, and L y denotes a length of a long side of the circuit board.
5. The display device of claim 3, wherein the dimension of the long side of the micro light emitting diode and the dimension of the long side of the window satisfy the following relationship:
Cx<Px≤Cx+d;
wherein Cx denotes a length of a long side of the micro light emitting diode, Px denotes a length of a long side of the window, and d denotes a length of an electrode of the micro light emitting diode in a direction parallel to the long side of the micro light emitting diode.
6. The display device of claim 2, wherein the backlight module comprises a plurality of micro led panels, and the circuit boards of the micro led panels are arranged in a direction parallel to short sides of the circuit boards.
7. The display device according to any one of claims 1 to 6, wherein the micro light emitting diode has a size of 50 μm to 300 μm.
8. The display device according to any one of claims 1 to 6, wherein the length of the circuit board is 200mm to 800mm, and the width of the circuit board is 100mm to 500 mm.
9. The display device according to any one of claims 1 to 6, wherein the backlight module further comprises:
and the protective layer is covered on the surfaces of the reflective coating and the side of the micro light-emitting diode, which is far away from the circuit board.
10. The display device of claim 9, wherein the backlight module further comprises:
the transparent substrate is positioned on one side of the protective layer, which is far away from the circuit board;
the diffusion plate is positioned on one side of the transparent substrate, which is far away from the protective layer;
and the optical membrane is positioned on one side of the diffusion plate, which is far away from the transparent substrate.
CN201922112301.4U 2019-11-29 2019-11-29 Display device Active CN210982989U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201922112301.4U CN210982989U (en) 2019-11-29 2019-11-29 Display device
PCT/CN2020/132198 WO2021104445A1 (en) 2019-11-29 2020-11-27 Display device
US17/580,285 US11822115B2 (en) 2019-11-29 2022-01-20 Display apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922112301.4U CN210982989U (en) 2019-11-29 2019-11-29 Display device

Publications (1)

Publication Number Publication Date
CN210982989U true CN210982989U (en) 2020-07-10

Family

ID=71421361

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922112301.4U Active CN210982989U (en) 2019-11-29 2019-11-29 Display device

Country Status (1)

Country Link
CN (1) CN210982989U (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112241088A (en) * 2020-10-15 2021-01-19 Tcl华星光电技术有限公司 Miniature light-emitting diode lamp panel, backlight module and preparation method thereof
CN112291923A (en) * 2020-10-30 2021-01-29 芜湖聚飞光电科技有限公司 Circuit board, lamp panel, backlight module and display device
CN112467018A (en) * 2020-10-20 2021-03-09 深圳市隆利科技股份有限公司 Mini-LED/micro-LED surface light source and manufacturing method thereof
WO2021104445A1 (en) * 2019-11-29 2021-06-03 海信视像科技股份有限公司 Display device
WO2021248970A1 (en) * 2020-06-10 2021-12-16 海信视像科技股份有限公司 Display apparatus
CN114063343A (en) * 2020-07-31 2022-02-18 海信视像科技股份有限公司 Display device
CN114428421A (en) * 2020-10-29 2022-05-03 海信视像科技股份有限公司 Display device
WO2022213559A1 (en) * 2021-04-09 2022-10-13 海信视像科技股份有限公司 Display device
US11703716B2 (en) 2020-04-28 2023-07-18 Hisense Visual Technology Co., Ltd. Display apparatus
US11796859B2 (en) 2020-03-25 2023-10-24 Hisense Visual Technology Co., Ltd. Display apparatus with micro light emitting diode light board
US11822183B2 (en) 2020-03-25 2023-11-21 Hisense Visual Technology Co., Ltd. Display apparatus
US11908986B2 (en) 2020-12-30 2024-02-20 Hubei Yangtze Industrial Innovation Center of Advanced Display Co., Ltd. Display panel and manufacturing method thereof and display device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11822115B2 (en) 2019-11-29 2023-11-21 Hisense Visual Technology Co., Ltd. Display apparatus
WO2021104445A1 (en) * 2019-11-29 2021-06-03 海信视像科技股份有限公司 Display device
US11796859B2 (en) 2020-03-25 2023-10-24 Hisense Visual Technology Co., Ltd. Display apparatus with micro light emitting diode light board
US11822183B2 (en) 2020-03-25 2023-11-21 Hisense Visual Technology Co., Ltd. Display apparatus
US11703716B2 (en) 2020-04-28 2023-07-18 Hisense Visual Technology Co., Ltd. Display apparatus
WO2021248970A1 (en) * 2020-06-10 2021-12-16 海信视像科技股份有限公司 Display apparatus
CN114063343A (en) * 2020-07-31 2022-02-18 海信视像科技股份有限公司 Display device
CN112241088A (en) * 2020-10-15 2021-01-19 Tcl华星光电技术有限公司 Miniature light-emitting diode lamp panel, backlight module and preparation method thereof
CN112241088B (en) * 2020-10-15 2021-09-03 Tcl华星光电技术有限公司 Miniature light-emitting diode lamp panel, backlight module and preparation method thereof
CN112467018A (en) * 2020-10-20 2021-03-09 深圳市隆利科技股份有限公司 Mini-LED/micro-LED surface light source and manufacturing method thereof
CN114428421A (en) * 2020-10-29 2022-05-03 海信视像科技股份有限公司 Display device
CN112291923A (en) * 2020-10-30 2021-01-29 芜湖聚飞光电科技有限公司 Circuit board, lamp panel, backlight module and display device
US11908986B2 (en) 2020-12-30 2024-02-20 Hubei Yangtze Industrial Innovation Center of Advanced Display Co., Ltd. Display panel and manufacturing method thereof and display device
WO2022213559A1 (en) * 2021-04-09 2022-10-13 海信视像科技股份有限公司 Display device

Similar Documents

Publication Publication Date Title
CN210982989U (en) Display device
CN111399280B (en) Display device
CN210982990U (en) Display device
CN211979375U (en) Display device
CN101183193B (en) Electro-optical device, illumination device, electronic apparatus
CN210982988U (en) Display device
CN112882282A (en) Display device
US11822115B2 (en) Display apparatus
CN211786492U (en) Display device
CN113777826B (en) Display device
CN213399142U (en) Display device
CN214098031U (en) Display device
CN112882280A (en) Display device
CN113093434A (en) Display device
CN113777825B (en) Display device
US11703716B2 (en) Display apparatus
CN113568220A (en) Display device
CN112882281A (en) Display device
CN214098032U (en) Display device
CN113820886B (en) Display device
CN114063343A (en) Display device
CN216718865U (en) Display device
CN113721383B (en) Display device
CN115407549A (en) Display device
CN115933246B (en) Display device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant