CN1928978A - Driving circuit for liquid crystal display panel - Google Patents

Driving circuit for liquid crystal display panel Download PDF

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Publication number
CN1928978A
CN1928978A CN 200510099236 CN200510099236A CN1928978A CN 1928978 A CN1928978 A CN 1928978A CN 200510099236 CN200510099236 CN 200510099236 CN 200510099236 A CN200510099236 A CN 200510099236A CN 1928978 A CN1928978 A CN 1928978A
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CN
China
Prior art keywords
driving circuit
drive integrated
integrated circult
lead group
electric current
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Granted
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CN 200510099236
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Chinese (zh)
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CN100508009C (en
Inventor
吴铭仁
任坚志
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Gao Zhi invention fund eighty-second limited liability company
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Chunghwa Picture Tubes Ltd
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Priority to CNB2005100992366A priority Critical patent/CN100508009C/en
Publication of CN1928978A publication Critical patent/CN1928978A/en
Application granted granted Critical
Publication of CN100508009C publication Critical patent/CN100508009C/en
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Abstract

The LCD panel drive circuit includes a substrate with multiple driver IC chips, a current supply power, and a first wire group to paralleled connect the IC chips with power with same resistance value and then same input voltage. This invention can avoid uneven block color in the figure.

Description

The driving circuit of display panels
Technical field
The present invention relates to a kind of driving circuit of display panels, particularly relate to a kind of driving circuit that makes each drive integrated circult chip (driver IC chip, be called for short driving IC chip) obtain an identical input voltage.
Background technology
Liquid crystal display panel of thin film transistor mainly is the thin film transistor (TFT) that utilizes rectangular arrangement, cooperates electronic packages such as suitable electric capacity, switching pad to drive liquid crystal pixel, enriches beautiful figure with generation.Generally speaking, liquid crystal display panel of thin film transistor include one have upper substrate, the infrabasal plate of colorized optical filtering mirror (color filter) and be filled in this upper substrate and this infrabasal plate between liquid crystal material.The sweep trace (scan or gate line) and the signal line (data or signal line) that have many mutual vertical interlaceds on this infrabasal plate, and respectively this sweep trace is provided with at least one thin film transistor (TFT) with the confluce of this signal line respectively, is used as the switch module (switch device) of a pixel (pixel).
Please refer to Fig. 1, Fig. 1 is the structural representation of a display panels.As shown in Figure 1, a display panels 10 includes a substrate 12 and an X-axis tellite (X-printing wiring board) 14.In addition, display panels 10 also includes a plurality of bendable printed circuit board (PCB)s (flexible printing circuit board, FPC) 16, be used for being electrically connected X-axis tellite 14 and substrate 12, and on substrate 12 and side that bendable printed circuit board (PCB) 16 is connected, be provided with source drive IC chip 18, be electrically connected with bendable printed circuit board (PCB) 16.
Substrate 12 is provided with multi-strip scanning line S 1~S mAnd many signal line D 1~D n, and each sweep trace S 1~S mWith each signal line D 1~D nAll intersect vertically, to define a plurality of pixel (not shown)s that are arranged in the active area 19 that is used on substrate 12.In addition, substrate 12 also includes a terminal and is pressing district (outer lead bonding region, OLB) 20 and one gate driver circuit 22 is located at terminal and is being pressed and distinguish in 20, and gate driver circuit 22 then includes driving IC chip 22a and 22b, is used for exporting switch/addressing signal to each sweep trace S 1~S mAforesaid source drive IC chip 18 then is to be used for the image output data signals to each signal line D 1~D n Driving IC chip 18,22a and 22b utilize glass flip chip encapsulation (chip-on-glass, COG) technology directly are arranged on the surface of substrate 12.And also include many leads 24 in the driving circuit 22, and each driving IC chip 22a is electrically connected with series system with 22b, and each lead 24 directly being made in substrate 12 surfaces, this kind design is called WOA (wiring on array) design.
When display panels 10 carries out a display operation, as shown in Figure 1, the driving voltage of one controlling signal 28 is from 14 outputs of X-axis tellite, and through after a bendable printed circuit board (PCB) 16 and the lead 24, import each driving IC chip 22a and 22b again, export switch/addressing signal to each sweep trace S by each driving IC chip 22a and 22b more at last 1~S mIn addition, as shown in Figure 2, driving IC chip 22a is to be electrically connected with the state of connecting with 22b, because lead 24 produces impedance R 1And R 5, driving IC chip 22a inside has resistance R 3, and each parts contact point produce impedance R 2, R 4, and R 6, therefore have sizable total resistance value.
Traditional wiring mode is that conductor width is relaxed to reduce resistance value as far as possible, and the mode with serial connection is electrically connected to last piece IC by first IC again.But the interface impedance that is subject to metal wire and ITO up to 200 Ω about, the cabling resistance difference between first IC and last piece IC still may be up to more than 500 Ω.Therefore, when the driving voltage of controlling signal 28 was imported each driving IC chip 22a and 22b, the input voltage that driving IC chip 22a and 22b accepted was also inequality, and then makes output voltage inconsistent.The voltage that first grid IC and last piece grid IC are subjected to may differ to the 0.3V, and make the briliancy of display frame of display panels 10 inequality, produce the bad phenomenon of block look inequality (band mura), reduce the display quality of display panels 10.Display frame 30 as shown in Figure 3 promptly produces the synoptic diagram of block look inequality.
See also Fig. 4, the known method that is used for suppressing this kind block look inequality is, the signal input adds a resistance 31 on tellite, make input signal generation concussion distortion to a certain degree earlier, the pressure reduction that its amplitude of vibration is produced greater than metal wiring impedance on the panel, the phenomenon of de-fuzzy block look inequality in this way.Yet this kind method can increase the power consumption of whole driving circuit.
Therefore, still need a kind of driving circuit of good display panels,, avoid block look inequality so that each driving IC chip obtains an identical input voltage.
Summary of the invention
The driving circuit that the purpose of this invention is to provide a kind of display panels is to solve the uneven problem of each IC input voltage block look inequality that causes.
Therefore, according to the driving circuit of liquid crystal display face of the present invention comprise that a substrate, a plurality of driving IC chip (driver IC chip) are located on the substrate, an electric current source of supply, and the first lead group.The first lead group has many conducting line segments so that each driving IC chip is electrically connected with the electric current source of supply with parallel way.The shape that each conducting line segment has is to make each thread guide path to each driving IC chip has equal resistance value from the electric current source of supply, so that each driving IC chip obtains an identical input voltage.
According to another aspect of the present invention, the driving circuit of display panels of the present invention comprises that a substrate, a plurality of drive integrated circult chip (driver IC chip) are located on the substrate, an electric current source of supply, and one first lead group, and this first lead group comprises a lead each drive integrated circult chip is electrically connected with the electric current source of supply with parallel way.
In the driving circuit of display panels of the present invention, a plurality of drive integrated circult chips are to dispose with parallel way with being electrically connected of electric current source of supply, can further set the shape of each conducting line segment, make each driving IC chip to the resistance difference of the thread guide path of electric current source of supply near zero, thereby can make respectively that this driving IC chip obtains an identical input voltage, problem with the display frame block look inequality that solves display panels, and therefore the power consumption of driving circuit can't increase, and can promote the display quality of display panels.
Description of drawings
Fig. 1 shows the structural representation of a known display panels.
Fig. 2 shows the synoptic diagram of the resistance that produces in the driving circuit of known display panels.
Fig. 3 shows the synoptic diagram of the block look inequality of known display panels.
Fig. 4 shows the means synoptic diagram of the block look inequality of known solution display panels.
Fig. 5 shows the synoptic diagram according to the driving circuit of display panels of the present invention.
Fig. 6 shows the synoptic diagram according to an embodiment of driving circuit of the present invention.
Fig. 7 shows the synoptic diagram according to the lead group structure of driving circuit of the present invention.
Fig. 8 is a form, and it shows conducting line segment A, B among the present invention, reaches an example of C combination.
Fig. 9 is a form, and it shows conducting line segment A, B among the present invention, reaches another example of C combination.
The reference numeral explanation
10: display panels
12: substrate
14:X axle tellite
16: bendable printed circuit board (PCB)
18: source drive IC chip
19: active area
20: terminal is being pressed and is being distinguished
22: gate driver circuit
22a, 22b: driving IC chip
24: lead
28: controlling signal
30: display frame
31: resistance
32: driving circuit
33: thin film transistor base plate
34,36: gate driving IC chip
35: active area
37: terminal is being pressed and is being distinguished
38,39a, 39b: conducting line segment
40: the lead group
42: the electric current source of supply
43: display panels
44: tellite
46: bendable printed circuit board (PCB)
48: source drive IC chip
50: the lead group
A, B, C: conducting line segment
D 1~D n: signal line
A, B, C: conducting line segment
D 1~D n: signal line
S 1~S m: sweep trace
Embodiment
As shown in Figure 5, driving circuit 32 according to display panels of the present invention, comprise that a thin film transistor base plate 33, two driving IC chip 34 and 36 are located on the thin film transistor base plate 33, an electric current source of supply 42, and lead group 40, be used in parallel driving IC chip 34 and 36 being connected to electric current source of supply 42.
Lead group 40 is made of many conducting line segments, and there is no particular restriction for the shape of each conducting line segment, as long as can be in the layout of on the substrate, and meets required resistance value, makes each driving IC chip in parallel obtain rough identical voltage input value and get final product.As shown in Figure 5, lead group 40 is to be made of a main line 38 and two branch line 39a and 39b.One end of main line 38 is connected with electric current source of supply 42, and branch line 39a then is connected with driving IC chip 34 other end of main line 38 respectively with 39b with 36.Though call this conducting line segment with main line and branch line, but the shape of each conducting line segment or length, width, there is no principal and subordinate's branch, mainly be with parallel way each driving IC chip 34 to be connected with electric current source of supply 42 respectively with 36 with the scale size of thickness.Therefore, the shape of each conducting line segment or length, width, many variations are arranged with the big I of thickness, but the result should make the thread guide path that connects electric current source of supply 42 and driving IC chip 34 and be connected the thread guide path of electric current source of supply 42 with driving IC chip 36 and have the rough resistance value that equates, that is, should be rough identical from connecting electric current source of supply 42 to the pressure drop of each driving IC chip 34 and 36, so that each driving IC chip can obtain a roughly the same input voltage.
The material of lead group is a conductive material, for example metal, alloy or tin indium oxide (indiumtin oxide, ITO).In addition, metal or alloy can be aluminium, chromium, molybdenum or aluminium neodymium alloy (aluminum-neodymium, AlNd) or the like.
See also Fig. 6, show that the driving circuit according to display panels 43 of the present invention is applied to the situation of display panels.Display panels 43 includes a substrate 33 and a tellite 44.Can be provided with multi-strip scanning line (scanning line) S on the substrate 33 in addition 1, S 2... to S m, with many signal line (signal line) D 1, D 2... to D nM and n are respectively positive integer.To define a plurality of pixel (not shown)s that are arranged in the active area 35 that is used on substrate 33.Substrate 33 also include a terminal pressing distinguish 37 and one gate driving IC chip 34 and 36 and lead group 40 and 50 be located at terminal and pressing and distinguish in 37.In addition, display panels 43 also includes a plurality of bendable printed circuit board (PCB)s 46, be used for being electrically connected tellite 44 and substrate 33, and pressing at the side terminal that substrate 33 is connected with bendable printed circuit board (PCB) 46 and to distinguish on 37, be provided with source drive IC chip 48, be electrically connected with bendable printed circuit board (PCB) 46.The electric current source of supply outputs current to driving IC chip from tellite 44 via a bendable printed circuit board (PCB) 46.
The lead group can be made simultaneously with the sweep trace on the substrate, and have same material with sweep trace, or make simultaneously with the signal line on this thin film transistor base plate, and have same material with signal line, or make simultaneously, and has same material with pixel electrode with the pixel electrode on the thin film transistor base plate.Preferable situation is, during as the lead of gate driving IC chip, then makes simultaneously with sweep trace, can have same material with sweep trace, and it is convenient to make, and can have littler resistance value.
See also Fig. 6 again, in the foundation driving circuit of display panels of the present invention, the lead group can have many groups, for example comprises two groups of lead groups 40 and 50.Lead group 40 describes in detail in aforementioned.Lead group 50 in like manner is provided with lead group 40, also constituted by many conducting line segments, and it is independently of one another between the lead group 40, can be identical or inequality, must each driving IC chip 34 be connected with electric current source of supply 42 with 36 with parallel way, and should make connect electric current source of supply 42 to the pressure drop of driving IC chip 34 with to be connected electric current source of supply 42 rough equal to the pressure drop of driving IC chip 36, therefore, the shape of each conducting line segment, length, width, also many variations can be arranged with the size of thickness.In specific embodiment shown in Figure 6, lead group 40 can be set to transmit the conducting electric current, lead group 50 is set to transmit close current.
The resistance of known lead is directly proportional with the length of lead itself, and the sectional area of lead is inversely proportional to therewith, therefore, can utilize simulation calculation and obtains the resistance value of lead.So, in the present invention, for a predetermined resistance value, the shape of each conducting line segment in the lead group, for example: length, width and thickness, many kind combinations can be arranged, all can realize required.See also Fig. 7, it shows the embodiment according to lead group in the driving circuit of display panels of the present invention.The lead group by conducting line segment A, B, and C constituted.The end of conducting line segment B is connected with conducting line segment A, and the other end is connected with driving IC chip 34.The end of conducting line segment C is connected with conducting line segment A, and the other end is connected with driving IC chip 36.Form among Fig. 8 and Fig. 9 show respectively conducting line segment A, B, and may the making up of length and width, thickness and the material thereof of C in two examples.The combination of the lead group that it is as shown in the table can be fit to as transmission film transistor turns voltage (V Gg) and close voltage (V Ee) lead.
In addition, above-described driving circuit is to be used for exporting switch/addressing signal to each sweep trace, yet the present invention is not limited to this, the present invention also can be applicable to the image output data signals to the driving circuit of each signal line, and this should be those skilled in the art and knows.
Signal input on tellite compared to known technology adds a resistance, makes input signal generation concussion distortion to a certain degree, to solve the method for block look inequality, in the present invention, need not add resistance, does not therefore increase power consumption.The present invention makes the resistance between each driving IC chip and the electric current source of supply almost equal, therefore, the suffered voltage of each driving IC chip is indifference almost, and can make each driving IC chip obtain an identical input voltage, with the block look uneven of avoiding display frame problem, and then promote display quality.
The above only is preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.

Claims (34)

1. the driving circuit of a display panels comprises:
One substrate;
A plurality of drive integrated circult chips are located on this substrate;
One electric current source of supply; And
One first lead group, it has many conducting line segments, and this drive integrated circult chip is electrically connected with this electric current source of supply with parallel way to incite somebody to action respectively, the shape that has of this conducting line segment respectively wherein, make each have equal resistance value, so that respectively this drive integrated circult chip obtains an identical input voltage from this electric current source of supply to the thread guide path of this drive integrated circult chip respectively.
2. driving circuit as claimed in claim 1, wherein this first lead group comprises a metal level, alloy-layer or indium tin oxide layer.
3. driving circuit as claimed in claim 1, wherein this first lead group comprises one first main line and many first branch lines, wherein, this first main line is connected with this electric current source of supply, and respectively this first branch line is connected this first main line respectively with this drive integrated circult chip respectively.
4. driving circuit as claimed in claim 1 wherein also is provided with multi-strip scanning line and many signal line on this substrate.
5. driving circuit as claimed in claim 4, wherein said drive integrated circult chip are used for exporting extremely respectively this sweep trace of one switch/addressing signal.
6. driving circuit as claimed in claim 4, wherein said drive integrated circult chip are used for exporting extremely respectively this signal line of an image data signal.
7. driving circuit as claimed in claim 4, wherein this first lead group has the material identical with sweep trace.
8. driving circuit as claimed in claim 4, wherein this first lead group has the material identical with signal line.
9. driving circuit as claimed in claim 1, further comprise one second lead group, it has many conducting line segments, and this drive integrated circult chip is electrically connected with this electric current source of supply with parallel way to incite somebody to action respectively, the shape that has of this conducting line segment respectively wherein, make each have equal resistance value, so that respectively this drive integrated circult chip obtains an identical input voltage from this electric current source of supply to the thread guide path of this drive integrated circult chip respectively.
10. driving circuit as claimed in claim 9, wherein this first lead group is to carry thin film transistor (TFT) conducting electric current, and this second conduction group is to carry the thin film transistor (TFT) close current.
11. driving circuit as claimed in claim 9, wherein this second lead group comprises a metal level, alloy-layer or indium tin oxide layer.
12. driving circuit as claimed in claim 9, wherein this second lead group comprises one second main line and many second branch lines, wherein, this second main line is connected with this electric current source of supply, and respectively this second branch line is connected this second main line respectively with this drive integrated circult chip respectively.
13. driving circuit as claimed in claim 9 wherein also is provided with multi-strip scanning line and many signal line on this substrate.
14. driving circuit as claimed in claim 13, wherein said drive integrated circult chip are used for exporting extremely respectively this sweep trace of one switch/addressing signal.
15. driving circuit as claimed in claim 13, wherein said drive integrated circult chip are used for exporting extremely respectively this signal line of an image data signal.
16. driving circuit as claimed in claim 13, wherein this second lead group has the material identical with sweep trace.
17. driving circuit as claimed in claim 13, wherein this second lead group has the material identical with signal line.
18. the driving circuit of a display panels comprises:
One substrate;
A plurality of drive integrated circult chips are located on this substrate;
One electric current source of supply; And
One first lead group, this first lead group comprise a lead will be respectively this drive integrated circult chip be electrically connected with this electric current source of supply with parallel way.
19. driving circuit as claimed in claim 18, the conducting line segment that is electrically connected with this drive integrated circult chip respectively of this lead wherein, the shape that this conducting line segment has, make each have equal resistance value, so that respectively this drive integrated circult chip obtains an identical input voltage from this electric current source of supply to the conducting line segment of this drive integrated circult chip respectively.
20. driving circuit as claimed in claim 18, wherein this first lead group comprises a metal level, alloy-layer or indium tin oxide layer.
21. driving circuit as claimed in claim 18 wherein also is provided with multi-strip scanning line and many signal line on this substrate.
22. driving circuit as claimed in claim 21, wherein said drive integrated circult chip are used for exporting extremely respectively this sweep trace of one switch/addressing signal.
23. driving circuit as claimed in claim 21, wherein said drive integrated circult chip are used for exporting extremely respectively this signal line of an image data signal.
24. driving circuit as claimed in claim 21, wherein this first lead group has the material identical with sweep trace.
25. driving circuit as claimed in claim 21, wherein this first lead group has the material identical with signal line.
26. driving circuit as claimed in claim 18 further comprises one second lead group, this second lead group comprise a lead will be respectively this drive integrated circult chip be electrically connected with this electric current source of supply with parallel way.
27. driving circuit as claimed in claim 26, the conducting line segment that is electrically connected with this drive integrated circult chip respectively of this lead of comprising of this second lead group wherein, the shape that this conducting line segment has, make in the second lead group each have equal resistance value, so that respectively this drive integrated circult chip obtains an identical input voltage from this electric current source of supply to the conducting line segment of this drive integrated circult chip respectively.
28. driving circuit as claimed in claim 26, wherein this first lead group is to carry thin film transistor (TFT) conducting electric current, and this second conduction group is to carry the thin film transistor (TFT) close current.
29. driving circuit as claimed in claim 26, wherein this second lead group comprises a metal level, alloy-layer or indium tin oxide layer.
30. driving circuit as claimed in claim 26 wherein also is provided with multi-strip scanning line and many signal line on this substrate.
31. driving circuit as claimed in claim 30, wherein said drive integrated circult chip are used for exporting extremely respectively this sweep trace of one switch/addressing signal.
32. driving circuit as claimed in claim 30, wherein said drive integrated circult chip are used for exporting extremely respectively this signal line of an image data signal.
33. driving circuit as claimed in claim 30, wherein this second lead group has the material identical with sweep trace.
34. driving circuit as claimed in claim 30, wherein this second lead group has the material identical with signal line.
CNB2005100992366A 2005-09-07 2005-09-07 Driving circuit for liquid crystal display panel Active CN100508009C (en)

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Cited By (10)

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CN102314011A (en) * 2011-09-06 2012-01-11 深圳市华星光电技术有限公司 Liquid crystal display (LCD) driving circuit, data driving chip, liquid crystal panel and liquid crystal display device
CN102682693A (en) * 2012-06-05 2012-09-19 深圳市华星光电技术有限公司 Display panel and driving method thereof
CN102682694A (en) * 2012-06-05 2012-09-19 深圳市华星光电技术有限公司 Display panel, panel display device and driving method of panel display device
CN105304046A (en) * 2015-11-19 2016-02-03 深圳市华星光电技术有限公司 Liquid crystal display device and liquid crystal display
CN106128400A (en) * 2016-08-31 2016-11-16 深圳市华星光电技术有限公司 The gate driver circuit of liquid crystal panel
US9507229B2 (en) 2014-07-22 2016-11-29 Shenzhen China Star Optoelectronics Technology Co., Ltd. Display device
CN107491217A (en) * 2017-08-30 2017-12-19 厦门天马微电子有限公司 A kind of display panel and display device
CN108469922A (en) * 2018-03-28 2018-08-31 京东方科技集团股份有限公司 A kind of array substrate and preparation method thereof, touch control display apparatus
CN109461399A (en) * 2018-12-14 2019-03-12 惠科股份有限公司 Display panel
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US5467210A (en) * 1993-02-16 1995-11-14 Casio Computer Co., Ltd. Arrangement of bonding IC chip to liquid crystal display device
JP2001202065A (en) * 2000-01-21 2001-07-27 Matsushita Electric Ind Co Ltd Liquid crystal display device
JP4059750B2 (en) * 2002-10-28 2008-03-12 シャープ株式会社 Electronic module and manufacturing method thereof
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CN102314011A (en) * 2011-09-06 2012-01-11 深圳市华星光电技术有限公司 Liquid crystal display (LCD) driving circuit, data driving chip, liquid crystal panel and liquid crystal display device
CN102682693A (en) * 2012-06-05 2012-09-19 深圳市华星光电技术有限公司 Display panel and driving method thereof
CN102682694A (en) * 2012-06-05 2012-09-19 深圳市华星光电技术有限公司 Display panel, panel display device and driving method of panel display device
WO2013181860A1 (en) * 2012-06-05 2013-12-12 深圳市华星光电技术有限公司 Display panel, flat-panel display device and driving method thereof
WO2013181861A1 (en) * 2012-06-05 2013-12-12 深圳市华星光电技术有限公司 Display panel and driving method of flat-panel display device
CN102682694B (en) * 2012-06-05 2016-03-30 深圳市华星光电技术有限公司 Display panel, panel display apparatus and driving method thereof
CN102682693B (en) * 2012-06-05 2016-03-30 深圳市华星光电技术有限公司 Display panel and driving method thereof
US9507229B2 (en) 2014-07-22 2016-11-29 Shenzhen China Star Optoelectronics Technology Co., Ltd. Display device
CN105304046A (en) * 2015-11-19 2016-02-03 深圳市华星光电技术有限公司 Liquid crystal display device and liquid crystal display
CN106128400A (en) * 2016-08-31 2016-11-16 深圳市华星光电技术有限公司 The gate driver circuit of liquid crystal panel
CN107491217A (en) * 2017-08-30 2017-12-19 厦门天马微电子有限公司 A kind of display panel and display device
CN107491217B (en) * 2017-08-30 2020-11-13 厦门天马微电子有限公司 Display panel and display device
WO2019161656A1 (en) * 2018-02-26 2019-08-29 惠科股份有限公司 Display device
US11088176B2 (en) 2018-02-26 2021-08-10 HKC Corporation Limited Display device
CN108469922A (en) * 2018-03-28 2018-08-31 京东方科技集团股份有限公司 A kind of array substrate and preparation method thereof, touch control display apparatus
CN109461399A (en) * 2018-12-14 2019-03-12 惠科股份有限公司 Display panel

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