CN108469922A - A kind of array substrate and preparation method thereof, touch control display apparatus - Google Patents
A kind of array substrate and preparation method thereof, touch control display apparatus Download PDFInfo
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- CN108469922A CN108469922A CN201810266349.8A CN201810266349A CN108469922A CN 108469922 A CN108469922 A CN 108469922A CN 201810266349 A CN201810266349 A CN 201810266349A CN 108469922 A CN108469922 A CN 108469922A
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- induction
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- 239000000758 substrate Substances 0.000 title claims abstract description 80
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 230000006698 induction Effects 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 230000010354 integration Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 60
- 239000003990 capacitor Substances 0.000 description 6
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000002161 passivation Methods 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- YZZNJYQZJKSEER-UHFFFAOYSA-N gallium tin Chemical compound [Ga].[Sn] YZZNJYQZJKSEER-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 grid Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Abstract
A kind of array substrate of present invention offer and preparation method thereof, touch control display apparatus, belong to technical field of touch control, can solve the problem of that the touch chip of existing mutual capacitance type touch screen is respectively controlled with display chip and be unfavorable for over all Integration.Driving electrodes and induction electrode are arranged in array substrate in the array substrate of the present invention, driving electrodes and induction electrode are respectively by driving the chip near line, the line of induction and array substrate to connect, line, the line of induction is driven to may be contained at the position of array substrate in this way, the over all Integration of touch-control and display chip more conducively in array substrate.Further, in the display stage, driving electrodes are multiplexed with show electrode, and driving line is multiplexed with display signal line, is conducive to optimize technique.The array substrate of the present invention is suitable for various touch control display apparatus, is particularly suitable for the embedded touch display device of mutual capacitance.
Description
Technical field
The invention belongs to technical field of touch control, and in particular to a kind of array substrate and preparation method thereof, touch control display apparatus.
Background technology
The touch control electrode of the In-cell touch panel of mutual capacitance includes driving electrodes and induction electrode two arrays of electrodes, two arrays of electrodes
The place of intersection will form coupled capacitor, when finger touches capacitance plate, affect near touch point between two electrodes
Coupling, to change the size of the coupled capacitor between the two electrodes, the changed position of detection coupled capacitor, i.e.,
It can determine whether the coordinate position of touch point.
Inventor has found that at least there are the following problems in the prior art：The touch screen of mutual capacitance type is all to form driving electrodes
In in array substrate, induction electrode is set on color membrane substrates, needs to be arranged in array substrate and color membrane substrates respectively in this way
Touch chip is controlled with display chip, is unfavorable for over all Integration.
Invention content
The present invention is respectively controlled for the touch chip of the touch screen of existing mutual capacitance type with display chip, is unfavorable for
The problem of over all Integration, provides a kind of array substrate and preparation method thereof, touch control display apparatus.
Technical solution is used by solving present invention problem：
A kind of array substrate, including substrate, the substrate are equipped with multiple driving electrodes and multiple induction electrodes, Mei Gesuo
It states driving electrodes to connect with a driving line, each induction electrode is connect with a line of induction, the driving line and induction
Line is used to connect with chip.
Optionally, the driving line is used to be connected to same chip with the line of induction.
Optionally, the driving electrodes are multiplexed with show electrode；In the display stage, the chip is by driving line to drive
Moving electrode, which provides, shows signal；In the touch-control stage, the chip is by driving line to provide touching signals to driving electrodes.
Optionally, each driving electrodes are made of with driving line identical transparent conductive material, and same layer is arranged.
Optionally, it is described driving line thickness it is identical, and length it is longer driving line width it is smaller so that a plurality of driving
The resistance all same of line.
Optionally, the multiple driving electrodes and multiple induction electrodes intersect setting.
Optionally, the induction electrode compared to the driving electrodes closer to substrate be arranged, the induction electrode with
Between substrate be equipped with display element, between the induction electrode and display element be equipped with the first insulating layer, the driving electrodes with
Second insulating layer, the orthographic projection phase mutual respect on first insulating layer and second insulating layer to substrate are equipped between induction electrode
It closes.
The present invention also provides a kind of preparation methods of above-mentioned array substrate, including form driving electrodes and driving on substrate
The step of the step of line, formation induction electrode and the line of induction.
Optionally, first insulating layer is used with second insulating layer and is formed with a patterning processes.
The present invention also provides a kind of touch control display apparatus, including above-mentioned array substrate.
Driving electrodes and induction electrode are arranged in array substrate in the array substrate of the present invention, driving electrodes and sense
It answers electrode respectively by driving line, the line of induction and chip to connect, drives line, the line of induction to may be contained within close to array substrate in this way
At position, the over all Integration of touch-control and display chip more conducively in array substrate.Further, in display stage, driving electrodes
It is multiplexed with show electrode, driving line is multiplexed with display signal line, is conducive to optimize technique.The array substrate of the present invention is suitable for various
Touch control display apparatus is particularly suitable for the embedded touch display device of mutual capacitance.
Description of the drawings
Fig. 1 is the structural schematic diagram of the array substrate of the embodiment of the present invention 1；
Fig. 2 is the schematic top plan view of the array base-plate structure of the embodiment of the present invention 2；
Fig. 3 is the schematic cross-section of the array base-plate structure of the embodiment of the present invention 2；
Wherein, reference numeral is：10, substrate；1, driving electrodes；11, line is driven；2, induction electrode；21, the line of induction；3、
Chip；41, light shield layer；42, buffer layer；43, active layer；44, gate insulating layer；45, grid；46, interlayer dielectric layer；47, it leaks
Pole；48, passivation layer；49, pixel electrode；51, the first insulating layer；52, second insulating layer.
Specific implementation mode
To make those skilled in the art more fully understand technical scheme of the present invention, below in conjunction with the accompanying drawings and specific embodiment party
Present invention is further described in detail for formula.
Embodiment 1：
The present embodiment provides a kind of array substrates, as shown in Figure 1, including substrate, the substrate is equipped with multiple drivings electricity
Pole 1 and multiple induction electrodes 2, each driving electrodes 1 are connect with a driving line 11, each induction electrode 2 and one
The line of induction 21 connects, and the driving line 11 and the line of induction 21 are used to connect with chip 3.
Driving electrodes 1 and induction electrode 2 are arranged in array substrate in the present embodiment, driving electrodes 1 and induced electricity
Pole 2 connect with driving line 11, the line of induction 21 respectively, since driving electrodes 1 and induction electrode 2 are apart from relatively close, drive line 11,
The line of induction 21 can be connected in the chip (not shown) on array substrate periphery, in this way set driving line 11, the line of induction 21
It is disposed adjacent at the position of array substrate, the over all Integration of touch-control and display chip more conducively in array substrate.The battle array of the present invention
Row substrate is suitable for various touch control display apparatus.
Embodiment 2：
The present embodiment provides a kind of array substrates, as shown in Fig. 2, including substrate, the substrate is equipped with multiple drivings electricity
Pole 1 and multiple induction electrodes 2, each driving electrodes 1 are connect with a driving line 11, each induction electrode 2 and one
The line of induction 21 connects, and the driving line 11 and the line of induction 21 are used to connect with same chip 3.
It is shown in the corresponding attached drawing of the present embodiment 2：It drives one end of line 11 to connect driving electrodes 1, drives the another of line 11
One end connects chip 3, and the other end of one end connection electrode of the line of induction 21, the line of induction 21 connects chip 3, wherein array substrate
On be also provided with display element and display signal line, drive line 11, the line of induction 21 and display signal line that can connect in this way
On to the same chip 3 of display and touch-control over all Integration, specifically, chip 3 may be disposed at the position at the edge of array substrate,
It can be tied to by flexible circuit board at the other positions on array substrate periphery.
In one embodiment, the multiple driving electrodes 1 and multiple induction electrodes 2 intersect setting.
Wherein, the touch control manner of the present embodiment is mutual capacitance type touch control manner, specifically, multiple driving electrodes 1 and multiple senses
It answers electrode 2 to intersect, will form coupled capacitor in the place of intersection, when finger is touched, touch point will be influenced
Coupling between neighbouring two electrodes detects coupled capacitor to change the size of the coupled capacitor between the two electrodes
Changed position, you can judge the coordinate position of touch point.
In IPS, FFS mode, usually public electrode and pixel electrode may be contained in array substrate, along with induction
Electrode 2 and driving electrodes 1 are equivalent to four layers of electrode, in order to advanced optimize product, a kind of preferred implementation as the present embodiment
Scheme, the driving electrodes 1 are multiplexed with show electrode；In the display stage, the chip 3 is by driving line 11 to driving electrodes 1
It provides and shows signal；In the touch-control stage, the chip 3 is by driving line 11 to provide touching signals to driving electrodes 1.
That is, by the way of by driving electrodes 1 and public electrode time-sharing multiplex, it can reduce by one layer of electricity in this way
Pole；The public electrode wire being connect with public electrode and driving 11 time-sharing multiplex of line are also corresponded to simultaneously.It is understood that driving
Electrode 1 is usually made of transparent conductive material, and driving line 11 can be made of metal material, when driving line 11 is by metal material
When composition, driving line 11 can be connect by via with driving electrodes 1.
It is shown in the corresponding attached drawing of the present embodiment 3, includes display element on substrate：Light shield layer 41, buffer layer 42 are active
Layer 43, gate insulating layer 44, grid 45, interlayer dielectric layer 46, drain electrode 47, passivation layer 48, pixel electrode 49.Wherein, driving electricity
Pole 1 and public electrode time-sharing multiplex, and by driving line 11 to be connected to the ends IC, induction electrode 2 is connected to IC by the line of induction 21
End.It should be noted that the ends IC are the chip 3 of touch-control and display over all Integration.
As a kind of preferred embodiment of the present embodiment, the induction electrode 2 compared to the driving electrodes 1 closer to
Substrate is arranged, and the first insulating layer 51, the driving electrodes 1 and induction electrode 2 are equipped between the induction electrode 2 and display element
Between be equipped with second insulating layer 52.Orthographic projection on first insulating layer 51 and second insulating layer 52 to substrate overlaps.
Wherein, the benefit that the orthographic projection on the first insulating layer 51 and second insulating layer 52 to substrate overlaps is first
Insulating layer 51 can be formed with second insulating layer 52 by a patterning processes.
As a kind of optional embodiment in the present embodiment, each driving electrodes 1 are with driving line 11 by identical
Bright conductive material is constituted, and same layer is arranged.
Show that driving electrodes 1 are formed with driving 11 same layer of line in the present embodiment attached drawing 2, Fig. 3, specifically, it can be by
The transparent conductive materials such as ITO are constituted, wherein at the position for the frame that driving line 11 is set to viewing area periphery, that is, utilize electrode
The ITO on layer periphery forms driving line 11, the part ITO of the frame region etched away will be needed to remain originally, forms driving
On the one hand line 11 can save material, on the other hand can also avoid forming via in driving electrodes 1.
It is understood that longer driving line 11 is needed apart from the driving electrodes 1 of chip 3 farther out, when using ITO conducts
When driving line 11, since ITO is big compared to the resistance of metal, apart from the driving electrodes 1 of chip 3 farther out with apart from chip 3 compared with
Close driving electrodes 1 are compared, it is possible that signal delay.
As a kind of optional embodiment in the present embodiment, the thickness of the driving line 11 of the same layer setting is identical, and one
As ITO electrode thickness range beAnd length it is longer 11 width of driving line it is smaller so that a plurality of driving line 11
Resistance all same.Can ensure in this way the driving line 11 of same layer setting resistance is identical, pressure drop all same.
That is, in the present embodiment by design different driving line 11 width so that same layer setting driving line 11
Resistance is identical.It is understood that the size of each structure sheaf, thickness etc. shown in attached drawing are only to illustrate.It is each to tie in technique realization
The projected area of structure layer on substrate may be the same or different, and required each structure sheaf can be realized by etching technics
Projected area；Meanwhile structure shown in attached drawing does not limit the geometry of each structure sheaf yet, such as can be square shown in the drawings
Shape can also be that trapezoidal or other etchings are formed by shape, can equally be realized by etching.
Embodiment 3：
The present embodiment provides a kind of preparation methods of array substrate, including following preparation process：
S01, light shield layer is formed on substrate, buffer layer, active layer, gate insulating layer, grid, interlayer dielectric layer, source electrode,
The display elements such as drain electrode.
S02, the first insulating layer is formed on the substrate for completing above-mentioned steps；First insulating layer can select oxide, nitrogen
Compound or nitrogen oxides are formed, and can be single, double or multi-layer structure.Specific first insulating layer can by SiNx,
The materials such as SiOx or Si (ON) x are formed.
S03, induction electrode and the line of induction are formed on the substrate for completing above-mentioned steps；Induction electrode and the line of induction can be with oxygen
Change the transparent conductive materials such as indium gallium zinc (IGZO), indium zinc oxide (IZO), tin indium oxide (ITO) or indium gallium tin (InGaSnO)
At least one of formed.
S04, second insulating layer is formed on the substrate for completing above-mentioned steps；The material of second insulating layer can select oxidation
Object, nitride or nitrogen oxides, second insulating layer can be single layer structures, can also be to be constituted using silicon nitride and silica
Double-layer structure.
Optionally, first insulating layer is used with second insulating layer and is formed with a patterning processes.
S05, driving electrodes and driving line are formed on the substrate for completing above-mentioned steps；It is splashed specifically, magnetic control may be used
It penetrates, thermal evaporation or other film build method deposition thickness areTransparency conducting layer, transparency conducting layer can be
ITO, IZO or AZO material.
S06, passivation layer is formed on the substrate for completing above-mentioned steps；Passivation layer is single layer structure or the lamination of multiple sublayers
Structure can be used Si oxide, silicon nitride, hafnium oxide or aluminum oxide and be formed.
S07, pixel electrode is formed on the substrate for completing above-mentioned steps；Pixel electrode using indium gallium zinc, indium oxide,
At least one of zinc oxide, indium zinc oxide, tin indium oxide, indium gallium tin or indium tin zinc oxide material is formed.Wherein, pixel
Electrode is electrically connected by the via of passivation layer, second insulating layer, the first insulating layer with drain electrode.
Embodiment 4：
Present embodiments provide a kind of touch control display apparatus comprising any one of the above array substrate.The touch-control is aobvious
Showing device can be：Liquid crystal display panel, Electronic Paper, mobile phone, tablet computer, television set, display, laptop, number
Any product or component with display function such as photo frame, navigator.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of array substrate, including substrate, which is characterized in that the substrate is equipped with multiple driving electrodes and multiple induced electricities
Pole, each driving electrodes are connect with a driving line, and each induction electrode is connect with a line of induction, the driving
Line and the line of induction are used to connect with chip.
2. array substrate according to claim 1, which is characterized in that the driving line is same for being connected to the line of induction
Chip.
3. array substrate according to claim 1, which is characterized in that the driving electrodes are multiplexed with show electrode；Aobvious
Show that stage, the chip show signal by driving line to be provided to driving electrodes；In the touch-control stage, the chip is by driving line
Touching signals are provided to driving electrodes.
4. array substrate according to claim 1, which is characterized in that each driving electrodes are with driving line by identical
Bright conductive material is constituted, and same layer is arranged.
5. array substrate according to claim 4, which is characterized in that the thickness of the driving line is identical, and length is longer
Driving line width it is smaller so that it is a plurality of driving line resistance all same.
6. array substrate according to claim 1, which is characterized in that the multiple driving electrodes and multiple induction electrode phases
It is mutually arranged in a crossed manner.
7. array substrate according to claim 1, which is characterized in that the induction electrode is more compared to the driving electrodes
It is arranged close to substrate, display element is equipped between the induction electrode and substrate, is set between the induction electrode and display element
There is the first insulating layer, second insulating layer is equipped between the driving electrodes and induction electrode, first insulating layer and second is absolutely
Orthographic projection in edge layer to substrate overlaps.
8. a kind of preparation method of array substrate, which is characterized in that the array substrate is claim 1-7 any one of them
Array substrate forms induction electrode and the line of induction the method includes forming driving electrodes and driving line on substrate
The step of.
9. the preparation method of array substrate according to claim 8, which is characterized in that the array substrate is claim
Array substrate described in 7, first insulating layer are used with second insulating layer and are formed with a patterning processes.
10. a kind of touch control display apparatus, which is characterized in that including claim 1-7 any one of them array substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810266349.8A CN108469922B (en) | 2018-03-28 | 2018-03-28 | Array substrate, preparation method thereof and touch display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810266349.8A CN108469922B (en) | 2018-03-28 | 2018-03-28 | Array substrate, preparation method thereof and touch display device |
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| Publication Number | Publication Date |
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| CN108469922A true CN108469922A (en) | 2018-08-31 |
| CN108469922B CN108469922B (en) | 2021-11-19 |
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| CN201810266349.8A Expired - Fee Related CN108469922B (en) | 2018-03-28 | 2018-03-28 | Array substrate, preparation method thereof and touch display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111090359A (en) * | 2019-12-03 | 2020-05-01 | 武汉华星光电半导体显示技术有限公司 | Touch substrate, display panel and display device thereof |
| WO2021217819A1 (en) * | 2020-04-28 | 2021-11-04 | 武汉华星光电半导体显示技术有限公司 | Touch control display apparatus |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1928978A (en) * | 2005-09-07 | 2007-03-14 | 中华映管股份有限公司 | Driving circuit for liquid crystal display panel |
| US20080048994A1 (en) * | 2006-08-25 | 2008-02-28 | Samsung Electronics Co., Ltd. | Liquid crystal display device having touch panel function and method for detecting a touch position |
| CN102315166A (en) * | 2010-07-07 | 2012-01-11 | 乐金显示有限公司 | Thin film transistor base plate and manufacturing approach thereof with low-resistance bus structure |
| CN103677410A (en) * | 2013-12-02 | 2014-03-26 | 合肥京东方光电科技有限公司 | Touch base plate, touch screen and display device |
| CN103699284A (en) * | 2013-12-27 | 2014-04-02 | 京东方科技集团股份有限公司 | Capacitive built-in touch screen, production method thereof and display device |
| CN104750347A (en) * | 2015-04-17 | 2015-07-01 | 合肥京东方光电科技有限公司 | Capacitive touch screen, production technology for same and touch display panel |
| CN204557432U (en) * | 2015-04-17 | 2015-08-12 | 宸鸿科技(厦门)有限公司 | Contact panel |
| CN104866153A (en) * | 2015-05-29 | 2015-08-26 | 武汉华星光电技术有限公司 | Self-capacitive embedded touch screen, preparation method therefor, and liquid crystal display |
| CN105138184A (en) * | 2015-09-25 | 2015-12-09 | 深圳市华星光电技术有限公司 | Embedded touch liquid crystal panel and array substrate thereof |
| CN105467644A (en) * | 2015-12-07 | 2016-04-06 | 武汉华星光电技术有限公司 | In Cell touch control display panel |
| CN105717690A (en) * | 2016-04-27 | 2016-06-29 | 武汉华星光电技术有限公司 | Embedded touch screen, preparation method thereof and liquid crystal display |
| CN106168865A (en) * | 2016-06-28 | 2016-11-30 | 京东方科技集团股份有限公司 | In-cell touch panel and preparation method thereof, display device |
| CN106910750A (en) * | 2017-04-24 | 2017-06-30 | 京东方科技集团股份有限公司 | A kind of preparation method of array base palte, display panel and array base palte |
| CN107238985A (en) * | 2017-08-09 | 2017-10-10 | 黄永兰 | A kind of liquid crystal display |
| CN107589576A (en) * | 2017-09-30 | 2018-01-16 | 武汉华星光电技术有限公司 | Array base palte and preparation method thereof, touch-control display panel |
-
2018
- 2018-03-28 CN CN201810266349.8A patent/CN108469922B/en not_active Expired - Fee Related
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1928978A (en) * | 2005-09-07 | 2007-03-14 | 中华映管股份有限公司 | Driving circuit for liquid crystal display panel |
| US20080048994A1 (en) * | 2006-08-25 | 2008-02-28 | Samsung Electronics Co., Ltd. | Liquid crystal display device having touch panel function and method for detecting a touch position |
| CN102315166A (en) * | 2010-07-07 | 2012-01-11 | 乐金显示有限公司 | Thin film transistor base plate and manufacturing approach thereof with low-resistance bus structure |
| CN103677410A (en) * | 2013-12-02 | 2014-03-26 | 合肥京东方光电科技有限公司 | Touch base plate, touch screen and display device |
| CN103699284A (en) * | 2013-12-27 | 2014-04-02 | 京东方科技集团股份有限公司 | Capacitive built-in touch screen, production method thereof and display device |
| CN104750347A (en) * | 2015-04-17 | 2015-07-01 | 合肥京东方光电科技有限公司 | Capacitive touch screen, production technology for same and touch display panel |
| CN204557432U (en) * | 2015-04-17 | 2015-08-12 | 宸鸿科技(厦门)有限公司 | Contact panel |
| CN104866153A (en) * | 2015-05-29 | 2015-08-26 | 武汉华星光电技术有限公司 | Self-capacitive embedded touch screen, preparation method therefor, and liquid crystal display |
| CN105138184A (en) * | 2015-09-25 | 2015-12-09 | 深圳市华星光电技术有限公司 | Embedded touch liquid crystal panel and array substrate thereof |
| CN105467644A (en) * | 2015-12-07 | 2016-04-06 | 武汉华星光电技术有限公司 | In Cell touch control display panel |
| CN105717690A (en) * | 2016-04-27 | 2016-06-29 | 武汉华星光电技术有限公司 | Embedded touch screen, preparation method thereof and liquid crystal display |
| CN106168865A (en) * | 2016-06-28 | 2016-11-30 | 京东方科技集团股份有限公司 | In-cell touch panel and preparation method thereof, display device |
| CN106910750A (en) * | 2017-04-24 | 2017-06-30 | 京东方科技集团股份有限公司 | A kind of preparation method of array base palte, display panel and array base palte |
| CN107238985A (en) * | 2017-08-09 | 2017-10-10 | 黄永兰 | A kind of liquid crystal display |
| CN107589576A (en) * | 2017-09-30 | 2018-01-16 | 武汉华星光电技术有限公司 | Array base palte and preparation method thereof, touch-control display panel |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111090359A (en) * | 2019-12-03 | 2020-05-01 | 武汉华星光电半导体显示技术有限公司 | Touch substrate, display panel and display device thereof |
| WO2021109267A1 (en) * | 2019-12-03 | 2021-06-10 | 武汉华星光电半导体显示技术有限公司 | Touch substrate, display panel and display device thereof |
| CN111090359B (en) * | 2019-12-03 | 2022-04-05 | 武汉华星光电半导体显示技术有限公司 | Touch substrate, display panel and display device thereof |
| WO2021217819A1 (en) * | 2020-04-28 | 2021-11-04 | 武汉华星光电半导体显示技术有限公司 | Touch control display apparatus |
| US11520422B2 (en) | 2020-04-28 | 2022-12-06 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Touch display device |
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| CN108469922B (en) | 2021-11-19 |
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