CN101059617B - Liquid crystal display - Google Patents
Liquid crystal display Download PDFInfo
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- CN101059617B CN101059617B CN2006100666395A CN200610066639A CN101059617B CN 101059617 B CN101059617 B CN 101059617B CN 2006100666395 A CN2006100666395 A CN 2006100666395A CN 200610066639 A CN200610066639 A CN 200610066639A CN 101059617 B CN101059617 B CN 101059617B
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Abstract
The invention provides a liquid crystal display device, comprising a colorful filter baseboard and an array baseboard, one of which is made from polyimide, wherein the polyimide compound has the formula (1), while A and A' are different or same, containing annular aliphatic compound or aromatic compound, at least one of A and A' is annular aliphatic perssad, B and B' are different or same, containing annular aliphatic perssad or aromatic compound, x and y are 10-10000.
Description
Technical field
The present invention relates to a kind of LCD, the LCD of particularly a kind of polyimide (polyimide) substrate.
Background technology
Along with the arriving in message digit epoch, people are increasingly high to the dependency degree of electronic product, quickened the universalness of electronic product.For make the product light weight, slim, be easy to carry about with one, the substrate thickness of liquid crystal indicator certainly will reduce downwards, yet, thin glass substrate, on making and be not easy and yield not good, also might cause the inconvenience in the carrying.
For this reason; The dealer imports the plastic substrate of transparent soft, and (0.1～0.2mm) as new display pannel; But make it have characteristics such as slimming, lightweight, shock-resistant, difficult broken, easy to carry curved surface demonstration, coiling property and wearable property; And the importing of transparent soft plastic substrate material continuous rolling mode capable of using is produced, and greatly reduces production cost.
Yet; Use the transparent soft plastic substrate must face another problem as the baseplate material of display; Promptly be deposition of transparent conductive film on the soft plastic substrate (ITO), active thin film transistor (TFT) (thin film transistor, TFT) and the problem of back segment panel assembling.And PET (Polyethylene Terephthalate for example at present; Polyethylene terephthalate), PEN (polyethylene naphthalate; PEN), PC (polycarbonate; Polycarbonate) or m-COC (Metallocene Cyclic Olefin Copolymer; Metallocene cyclic olefine copolymer, the Zeonor that the Arton that makes like Japanese JSR Corp. or Japanese ZEON Co., Ltd. make) its glass temperature of optical grade plastic substrate material (Tg) all is lower than 200 ℃, unfavorable process operations.Even the Tg point of PES (Polyether sulphone, polyethersulfone) can reach 225 ℃, right its solvent resistance extreme difference, and have the generation of yellow and embrittlement phenomenon down in high temperature (about 200 ℃) operation, still be not suitable for as the flexible display baseplate material.And existing high temperature resistant and solvent-proof PI (Polyimide; Polyimide) though plastic substrate can meet process conditions, so its baseplate material is a dark brown, so only be suitable for reflective LCD (Liquid Crystal Display; LCD panel) panel uses, and is not suitable for penetration LCD panel.
In addition for the traditional PI baseplate material after extending, though have only 20ppm/ ℃ excellent specific property of low thermal coefficient of expansion (CTE), right excessive (Rth＞1000nm), therefore, and be not suitable for the use of LCD panel of its light sluggish (retardation).
In addition, plastic substrate is handling (operation) difficulty in the TFT processing procedure, needs to be fixed in earlier on the glass substrate by the resin viscose glue, in order to multiple tracks gold-tinted and the etch process of TFT, treats again it to be taken off assembling after processing procedure is accomplished.So in the process of taking off, often cause TFT element break and mucilage glue surface often to have cull can't remove clean problem fully.
Summary of the invention
In view of this, the present invention provides a kind of LCD, comprises a colored filter substrate and array basal plate, in this two substrates one of them is made up of polyimide at least, this polyimide compound has chemical formula (I):
Wherein, A and A ' are identical or different, comprise cyclic aliphatic group or aromatic group; Wherein one of them is a cyclic aliphatic group at least for A and A '; B and B ' are identical or different, comprise cyclic aliphatic group or aromatic group, and x and y are 10～10000.
Polyimide material of the present invention, its mist degree, penetrability and yellow index, the glass temperature performance is good, is suitable as baseplate material and uses.In addition; The PI plastic substrate material of the present invention exploitation directly film forming on the existing glass substrate; Do not need fix as need see through the resin viscose glue in the past, it is through TFT multiple tracks gold-tinted, etch process, or after specific water bath processing, can take off easily; The problem that does not have residual viscose glue is obviously simplified the TFT processing procedure.
For let above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, hereinafter is special lifts preferred embodiment, and conjunction with figs., elaborates as follows:
Description of drawings
Fig. 1 is the diagrammatic cross-section that shows liquid crystal display device structure of the present invention.
Embodiment
The present invention provides a kind of LCD, comprises a colored filter substrate and array basal plate, in the two substrates one of them is made up of polyimide at least, this polyimide compound has chemical formula (I):
In the above-mentioned polyimide compound, more comprise being mixed with inorganic particle.Inorganic particle can be made up of silicate, silicon dioxide or titania.Diameter of particle is substantially between 10～400 nanometers, and is preferable between 10～100 nanometers.And the percentage by weight of powder in potpourri is preferable between 2～10wt% substantially between 1～20wt%.
The present invention utilizes the organic/inorganic nano BCD hybrid technology; In conjunction with the characteristics such as high rigidity, high-fire resistance, low thermal coefficient of expansion and high resistance to chemicals medicine property of inorganic nanometer powder, reach the dimensional stability, thermotolerance, chemical proofing and the pencil hardness that promote polyimide material.It is sluggish with the light that reduces the colorless polyimide baseplate material that the interpolation of this inorganic nanometer powder also can reach regulation and control, reaches to meet the required optical compensation effect of LCD panel.
In chemical formula (I), A and A ' can be identical or different cyclic aliphatic group or aromatic group, and cyclic aliphatic group for example does
Wherein X, Y and Z can comprise hydrogen, methyl, trifluoromethyl, hydroxyl, C
1-18Alkyl, bromine, chlorine or iodine.And aromatic group for example does
Wherein X and Y can be hydrogen, methyl, trifluoromethyl, hydroxyl, C
1-18Alkyl, bromine, chlorine or iodine, Z can be-O-,-CH
2-,-S-,-SO
2-,-C (CH
3)
2-,-Ar-O-Ar-,-Ar-CH
2-Ar-,-O-Ar-C (CH
3)
2-Ar-O-,-O-Ar-Ar-O-,-O-Ar-C (CF
3)
2-Ar-O-or-Ar-C (CH
3)
2-Ar-, wherein Ar is a phenyl ring.
B and B ' can be identical or different cyclic aliphatic group or aromatic group, and cyclic aliphatic group for example does
And aromatic group for example does
Wherein X and Y can be hydrogen, methyl, trifluoromethyl, hydroxyl, C
1-18Alkoxy, bromine, chlorine or iodine, Z can be-O-,-SO
2-,-CH
2-,-C (CH
3)
2-,-COO (CH
2)
2COO-,-C (CF
3)
2-,-Ar-O-Ar-,-O-Ar-O-,-Ar-CH
2-Ar-,-O-Ar-C (CH
3)
2-Ar-O-,-O-Ar-Ar-O-,-O-Ar-C (CF
3)
2-Ar-O-or-Ar-C (CH
3)
2-Ar-, wherein Ar is a phenyl ring.
The B and B 'can include?
and x and y may be from 10 to 10000.
Below enumerate out the particular instance of above-mentioned chemical formula (I) polyimide compound, comprising:
The x and the y of above-claimed cpd can be 10～10000.
Polyimide compound of the present invention can have chemical formula (II) in addition:
In the chemical formula (II), A can be cyclic aliphatic group, for example does
Wherein X, Y and Z can comprise hydrogen, methyl, trifluoromethyl, hydroxyl, C
1-18Alkyl, bromine, chlorine or iodine.
B can be aromatic group, for example does
Wherein X and Y can be hydrogen, methyl, trifluoromethyl, hydroxyl, C
1-18Alkoxy, bromine, chlorine or iodine, Z can be-O-,-SO
2-,-CH
2-,-C (CH
3)
2-,-COO (CH
2)
2COO-,-C (CF
3)
2-,-Ar-O-Ar-,-O-Ar-O-,-Ar-CH
2-Ar-,-O-Ar-C (CH
3)
2-Ar-O-,-O-Ar-Ar-O-,-O-Ar-C (CF
3)
2-Ar-O-or-Ar-C (CH
3)
2-Ar-, wherein Ar is a phenyl ring.B above may include?
and n can be from 10 to 10000.
Below also enumerate the particular instance of above-mentioned chemical formula (II) polyimide compound, comprising:
Wherein n can be 10～10000.
Chemical formula (II) can be synthetic by following dual mode, and first kind of mode was divided into for two stages carries out, and at first, will for example be 4; 4 '-di-2-ethylhexylphosphine oxide (cyclohexylamine) (4,4 '-methylenebis (cyclohexylamine), diamine DACH) with for example be 2,2 '-two (3; 4-dicarboxyl phenyl) hexafluoropropane dianhydride (2,2 '-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride; Bisgallic acid anhydride monomer 6FDA) for example place for the N-N-methyl-2-2-pyrrolidone N-(N-methyl-2-pyrrolidone, NMP) or dimethyl acetamide (N, N-dimethylacetamide; DMAc) react in the polar solvent, with form polyamic acid (poly (amic acid), PAA); Afterwards, with about 300～400 ℃ high-temperature baking, carry out imidization (imidization) reaction; Make the polyamic acid dehydration closed-loop, and change into polyimide, be shown in the following figure.
The second way is a chemical method; With for example for the diamine of DACH and for example for the bisgallic acid anhydride monomer of 6FDA place for example be between-the phenol solvent of cresols (m-cresol) or phenol (phenol) reacts; And be warming up to reflux temperature, carrying out polyamic acid and imidization simultaneously, behind the dehydration closed-loop; Change into polyimide, be shown in the following figure.
Polyimide material of the present invention is because of there being the importing of annular aliphatic structure; Make its material character be different from general traditional polyimide; And the polyimide of being formed by an annular aliphatic diamine monomer and an aromatic series bisgallic acid anhydride monomer, owing to belong to non-full benzene ring structure, therefore; Except having high thermotolerance and light transmission, also have preferable processability and chemical proofing.
The physicochemical characteristic of this polyimide film, for example: mist degree (haze) is lower than 4%, and penetrability (transmittance) is greater than 70%; Yellow index (yellow index) is lower than 6.5, and between 250～350 degrees centigrade, thermal expansivity is substantially between 20～75ppm/ ℃ substantially for glass temperature; Pencil hardness is greater than 2H; Light hysteresis (retardation) is lower than 200 nanometers, and the thickness cardinal principle is preferable between 50～150 microns between 20～200 microns.
Then, see also Fig. 1, the formation of LCD of the present invention is described.LCD 10 includes array basal plate 11, a colored filter substrate 12, gap son (spacer) 13 and liquid crystal material 14.In array base palte 11 and the colored filter substrate 12 one of them is made up of polyimide at least.Colored filter substrate 12 is arranged at array base palte 11 opposites, and gap son 13 and liquid crystal material 14 are formed between aforementioned two substrates 11 and 12.
Below through several embodiment to illustrate further feature and advantage of the present invention.
Embodiment
Embodiment 1:6FDA-DACH's (PI-FD) is synthetic
At room temperature, use there-necked flask also to pass to nitrogen, the DACH diamine of 2.32g is dissolved among the DMAc of 41g; Treat again the 6FDA bisgallic acid acid anhydride of 5g to be added after DACH dissolves fully; After 6FDA dissolves fully, continue to stir 3 hours, and form thick polyamic acid solution.Then with the scraper film forming on glass substrate, through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the polyimide film material of high clear, colorless again.
Embodiment 2:6FDA-m-TB-HG-co-6FDA-IPDA's (PI-FTI) is synthetic
At room temperature, use there-necked flask also to pass to nitrogen, with the m-TB-HG of 1.64g (2,2 '-Dimethyl-4; 4 '-diamino biphenyl, 2,2 '-dimethyl-4; 4 '-benzidine) and IPDA (Isophorone diamine, the IPD) diamine of 0.56g dissolve among the DMAc of 41g, treat again the 6FDA bisgallic acid acid anhydride of 5g to be added after m-TB-HG and IPDA dissolve fully; After 6FDA dissolves fully, continue to stir 3 hours, and form thick polyamic acid solution.Then with the scraper film forming on glass substrate, through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the polyimide film material of high clear, colorless again.
Embodiment 3:6FDA-m-TB-HG-co-6FDA-DACH's (PI-FTD) is synthetic
At room temperature; Use there-necked flask and pass to nitrogen; The m-TB-HG of 1.63g and the DACH diamine of 0.70g are dissolved among the DMAc of 42g, treat again the 6FDA bisgallic acid acid anhydride of 5g to be added after m-TB-HG and DACH dissolve fully, after 6FDA dissolves fully; Continue to stir 3 hours, and form thick polyamic acid solution.Then with the scraper film forming on glass substrate, through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the polyimide film material of high clear, colorless again.
Embodiment 4:6FDA-m-DACH-co-DSDA-DACH's (PI-FDD) is synthetic
At room temperature, use there-necked flask also to pass to nitrogen, the DACH diamine of 3.12g dissolved among the DMAc of 46g, treat DACH dissolve fully after again with the 6FDA of 3g and the DSDA (3 of 3g; 3 ', 4,4 '-diphenylsulfonetetracarboxylic dianhydride, 3; 3 ', 4,4 '-diphenylsulfone acid's dianhydride) adding of bisgallic acid acid anhydride; After 6FDA and DSDA dissolve fully, continue to stir 3 hours, and form thick polyamic acid solution.Then with the scraper film forming on glass substrate, through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the polyimide film material of high clear, colorless again.
Embodiment 5:ODPA-BAPPm-co-ODPA-IPDA's (PI-OBI) is synthetic
At room temperature, use there-necked flask and pass to nitrogen, with the BAPPm (2 of 4.53g; 2 '-bis [4-(4-aminophenoxy) phenyl] propane, 2,2 '-two [4-(4-amino-benzene oxygen) phenyl] propane) and the IPDA diamine of 0.81g dissolve among the DMAc of 59g; Treat BAPPm and IPDA dissolve fully after again with the ODPA of 5g (3,3 ' 4,4 '-tetracarboxylic diphenyl ether dianhydride; 3,3 ' 4,4 '-tetracarboxylic acid diphenyl ether dianhydride) adding of bisgallic acid acid anhydride; After ODPA dissolves fully, continue to stir 3 hours, and form thick polyamic acid solution.Then with the scraper film forming on glass substrate, through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the polyimide film material of high clear, colorless again.
Embodiment 6:B1317-BAPPm-co-B1317-DACH's (PI-BD) is synthetic
At room temperature; Use there-necked flask and pass to nitrogen; The BAPPm of 16.2g and the DACH diamine of 8.3g are dissolved among the DMAc of 250g, treat again the B1317 bisgallic acid acid anhydride of 20g to be added after BAPPm and DACH dissolve fully, after B1317 dissolves fully; Continue to stir 3 hours, and form thick polyamic acid solution.Then with the scraper film forming on glass substrate, through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the polyimide film material of high clear, colorless again.
The preparation of embodiment 7:PI-BD/ silicate inorganic powder composition
The silicate (silicate) of 50g is sneaked in the DMAc organic solvent of 900g, be dispersed into particle diameter between between 80～150 nanometers through grinding the dispersion machine grinding at a high speed down, form transparent clarified solution in 60 ℃.The above-mentioned transparent clarified solution that contains silicate is got in the PI-BD polyamic acid solution that 1.44g is added into 50g; After evenly puddling 4 hours at a high speed, form thick PI-BD polyamic acid/inorganic silicate in 25 ℃ and blend together solution; Then with the scraper film forming on glass substrate; Through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the PI-BD polyimide/inorganic silicate compositions of the high clear, colorless of weight ratio (99/1) again.
The preparation of embodiment 8:PI-BD/ silicate inorganic powder composition
The silicate (silicate) of 50g is sneaked in the DMAc organic solvent of 900g, be dispersed into particle diameter between between 80～150 nanometers through grinding the dispersion machine grinding at a high speed down, form transparent clarified solution in 60 ℃.The above-mentioned transparent clarified solution that contains silicate is got in the PI-BD polyamic acid solution that 4.41g is added into 50g; After evenly puddling 4 hours at a high speed, form thick PI-BD polyamic acid/inorganic silicate in 25 ℃ and blend together solution; Then with the scraper film forming on glass substrate; Through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the PI-BD polyimide/inorganic silicate compositions of the high clear, colorless of weight ratio (97/3) again.
The preparation of embodiment 9:PI-BD/ silicate inorganic powder composition
The silicate (silicate) of 50g is sneaked in the DMAc organic solvent of 900g, be dispersed into particle diameter between between 80～150 nanometers through grinding the dispersion machine grinding at a high speed down, form transparent clarified solution in 60 ℃.The above-mentioned transparent clarified solution that contains silicate is got in the PI-BD polyamic acid solution that 7.50g is added into 50g; After evenly puddling 4 hours at a high speed, form thick PI-BD polyamic acid/inorganic silicate in 25 ℃ and blend together solution; Then with the scraper film forming on glass substrate; Through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the PI-BD polyimide/inorganic silicate compositions of the high clear, colorless of weight ratio (95/5) again.
The preparation of embodiment 10:PI-BD/ silicate inorganic powder composition
The silicate (silicate) of 50g is sneaked in the DMAc organic solvent of 900g, be dispersed into particle diameter between between 80～150 nanometers through grinding the dispersion machine grinding at a high speed down, form transparent clarified solution in 60 ℃.The above-mentioned transparent clarified solution that contains silicate is got in the PI-BD polyamic acid solution that 15.84g is added into 50g; After evenly puddling 4 hours at a high speed, form thick PI-BD polyamic acid/inorganic silicate in 25 ℃ and blend together solution; Then with the scraper film forming on glass substrate; Through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the PI-BD polyimide/inorganic silicate compositions of the high clear, colorless of weight ratio (90/10) again.
The preparation of embodiment 11:PI-BD/ silicate inorganic powder composition
The silicate (silicate) of 50g is sneaked in the DMAc organic solvent of 900g, be dispersed into particle diameter between between 80～150 nanometers through grinding the dispersion machine grinding at a high speed down, form transparent clarified solution in 60 ℃.The above-mentioned transparent clarified solution that contains silicate is got in the PI-BD polyamic acid solution that 35.64g is added into 50g; After evenly puddling 4 hours at a high speed, form thick PI-BD polyamic acid/inorganic silicate in 25 ℃ and blend together solution; Then with the scraper film forming on glass substrate; Through being heated to after 100 ℃, 200 ℃ and 300 ℃ baking in each 1 hour carries out imidization, form the PI-BD polyimide/inorganic silicate compositions of the high clear, colorless of weight ratio (80/20) again.
Below be comparison polyimide film of the present invention (comprising PI-FD, PI-FTI, PI-FTD, PI-FDD and PI-OBI) and current material such as PES, Kapton (Kapton; E.I.Du Pont Company makes) and Ube (Kapton; The emerging product manufactured of space portion); Difference on thickness, mist degree, penetrability, yellow index, glass temperature and thermal expansivity, as shown in table 1.
Table 1
| Polyimide material of the present invention | Thickness (micron) | Mist degree (%) | Penetrability (%) | The yellow index | Glass temperature (degree centigrade) | Thermal expansivity (ppm/ ℃) |
| PI-FD | 59 | 0.24 | 90.3 | 6.33 | 326 | 68 |
| PI-FTI | 69 | 1.96 | 89.4 | 3.59 | 336 | 71 |
| PI-FTD | 79 | 1.74 | 90.0 | 3.98 | 307 | 75 |
| PI-FDD | 60 | 1.74 | 90.7 | 2.78 | 301 | 61 |
| PI-OBI | 52 | 2.91 | 89.0 | 6.37 | 285 | 73 |
| Current material | ? | ? | ? | ? | ? | ? |
| PES | 200 | 0.30 | 89.0 | 0.97 | 225 | 58 |
| Kapton | 25 | 0.72 | 73.6 | 82.34 | 318 | 16 |
| Ube | 51 | 2.49 | 32.1 | 66.46 | 332 | 23 |
Can find out by table 1; Existing PES material is compared with polyimide material of the present invention, though its mist degree, penetrability and yellow indexed performance are pretty good, glass temperature is too low; Therefore; And be not suitable for the baseplate material use, and the yellow index of Kapton and Ube material is obviously higher and penetrability is not good yet, also is not suitable for the selection as baseplate material then.
Below more relatively the present invention be mixed with the PI-BD polyimide film (silicate weight ratio be respectively 1,3,5,10 and 20wt%) and current material such as PES, Kapton and Ube of inorganic silicate powder; Difference on thickness, mist degree, penetrability, yellow index, glass temperature, thermal expansivity, pencil hardness and light hysteresis, as shown in table 2.
Table 2
| Material of the present invention | Thickness (micron) | Mist degree (%) | Penetrability (%) | The yellow index | Glass temperature (degree centigrade) | Thermal expansion coefficients (ppm/ ℃) | Pencil hardness | Light hysteresis (nm) |
| PI-BD/1wt％ | 50 | ?0.66 | 89.0 | 2.04 | 321 | 70 | 2H | 207 |
| PI-BD/3wt％ | 53 | ?0.83 | 88.3 | 2.52 | 330 | 63 | 3H | 173 |
| PI-BD/5wt％ | 47 | ?1.95 | 88.5 | 3.83 | 335 | 51 | 3H | 159 |
| PI-BD/10wt％ | 41 | ?3.23 | 87.8 | 4.57 | 325 | 42 | 4H | 148 |
| PI-BD/20wt％ | 44 | ?3.68 | 87.0 | 5.60 | 318 | 36 | 4H | 124 |
| Current material | ? | ? | ? | ? | ? | ? | ? | ? |
| PES | 200 | ?0.30 | 89.0 | 0.97 | 225 | 58 | H | 25 |
| Kapton | 25 | ?0.72 | 73.6 | 82.34 | 318 | 16 | H | 6923 |
| Ube | 51 | ?2.49 | 32.1 | 66.46 | 332 | 23 | H | ＞9999 |
In addition; The PI plastic substrate material of the present invention exploitation directly film forming on the existing glass substrate; Do not need fix as need see through the resin viscose glue in the past, it is through TFT multiple tracks gold-tinted, etch process, or after specific water bath processing, can take off easily; The problem that does not have residual viscose glue is obviously simplified the TFT processing procedure.Polyimide substrate material of the present invention can be applicable to comprise soft LCD (liquid crystal display; LCD), PDP (Plasma Display Panel; Plasma display panel), FED (FieldEmission Display; Electroluminescent display), SED (Surface-conduction Electron-emitter Display; Surface-conduction-electron emission display), among E-ink (electric ink) or E-Paper flexible displays such as (electronic papers) and the OLED (Organic Light Emitting Display, OLED).
The above is merely preferred embodiment of the present invention; So it is not in order to limit scope of the present invention; Any personnel that are familiar with this technology; Do not breaking away from the spirit and scope of the present invention, can do further improvement and variation on this basis, so the scope that claims were defined that protection scope of the present invention is worked as with the application is as the criterion.
The simple declaration of symbol is following in the accompanying drawing:
10: LCD
11: array base palte
12: colored filter substrate
13: gap
14: liquid crystal material
Claims (31)
1. LCD comprises:
One colored filter substrate; And
Array basal plate, in this two substrates one of them is made up of polyimide at least, this polyimide compound has chemical formula (I):
Wherein,
When A and A ' were cyclic aliphatic group, B and B ' were aromatic group, and one of them is a cyclic aliphatic group as A and A ', and when another was aromatic group, B and B ' were cyclic aliphatic group or are aromatic group; And
X and y are 10～10000.
2. LCD according to claim 1 is characterized in that, also comprises inorganic particle, is mixed in this polyimide compound.
3. LCD according to claim 2 is characterized in that this inorganic particle comprises silicate, silicon dioxide or titania.
4. LCD according to claim 2 is characterized in that the particle diameter of this inorganic particle is between 10～400 nanometers.
5. LCD according to claim 2 is characterized in that the particle diameter of this inorganic particle is between 10～100 nanometers.
6. LCD according to claim 2 is characterized in that the percentage by weight of this inorganic particle is between 1～20wt%.
7. LCD according to claim 2 is characterized in that the percentage by weight of this inorganic particle is between 2～10wt%.
8. LCD according to claim 1 is characterized in that, A and A ' comprising:
9. LCD according to claim 1 is characterized in that, A and A ' comprising:
10. LCD according to claim 1 is characterized in that, B and B ' comprising:
11. LCD according to claim 1 is characterized in that, B and B ' comprising:
Wherein, X and Y are hydrogen, methyl, trifluoromethyl, hydroxyl, C
1-18Alkoxy, bromine, chlorine or iodine, Z is-O-,-SO
2-,-CH
2-,-C (CH
3)
2-,-CO O (CH
2)
2COO-,-C (CF
3)
2-,-Ar-O-Ar-,-O-Ar-O-,-Ar-CH
2-Ar-,-O-Ar-C (CH
3)
2-Ar-O-,-O-Ar-Ar-O-,-O-Ar-C (CF
3)
2-Ar-O-or-Ar-C (CH
3)
2-Ar-, wherein Ar is a phenyl ring.
12. LCD according to claim 1 is characterized in that, B and B ' comprising:
13. LCD according to claim 1 is characterized in that, this polyimide compound comprises:
Wherein x and y are 10～10000.
14. LCD according to claim 1 is characterized in that, this polyimide compound comprises:
Wherein x and y are 10～10000.
15. LCD according to claim 1 is characterized in that, this polyimide compound comprises:
Wherein x and y are 10～10000.
16. LCD according to claim 1 is characterized in that, this polyimide compound comprises:
Wherein x and y are 10～10000.
17. LCD according to claim 1 is characterized in that, this polyimide compound comprises:
Wherein x and y are 10～10000.
18. LCD according to claim 1 is characterized in that, this polyimide compound has chemical formula (II):
Wherein,
A is a cyclic aliphatic group, comprises
Wherein X, Y and Z are hydrogen, methyl, trifluoromethyl, hydroxyl, C
1-18Alkyl, bromine, chlorine or iodine;
B is an aromatic group, comprises
Wherein X and Y are hydrogen, methyl, trifluoromethyl, hydroxyl, C
1 -18Alkoxy, bromine, chlorine or iodine, Z is-O-,-SO
2-,-CH
2-,-C (CH
3)
2-,-COO (CH
2)
2COO-,-C (CF
3)
2-,-Ar-O-Ar-,-O-Ar-O-,-Ar-CH
2-Ar-,-O-Ar-C (CH
3)
2-Ar-O-,-O-Ar-Ar-O-,-O-Ar-C (CF
3)
2-Ar-O-or-Ar-C (CH
3)
2-Ar-, wherein Ar is a phenyl ring, and
N is 10～10000.
19. LCD according to claim 18 is characterized in that, B comprises:
20. LCD according to claim 18 is characterized in that, this polyimide compound comprises:
Wherein n is 10～10000.
21. LCD according to claim 1 also comprises gap, is formed between this colored filter substrate and this array base palte.
22. LCD according to claim 1 also comprises a liquid crystal material, is formed between this colored filter substrate and this array base palte.
23. LCD according to claim 1 is characterized in that, the mist degree of this polyimide film is lower than 4%.
24. LCD according to claim 1 is characterized in that, the penetrability of this polyimide film is greater than 70%.
25. LCD according to claim 1 is characterized in that, the yellow index of this polyimide film is lower than 6.5.
26. LCD according to claim 1 is characterized in that, the glass temperature of this polyimide film is between 250～350 degrees centigrade.
27. LCD according to claim 1 is characterized in that, the thermal expansivity of this polyimide film is between 20～75ppm/ ℃.
28. LCD according to claim 2 is characterized in that, the pencil hardness of this polyimide film is greater than 2H.
29. LCD according to claim 2 is characterized in that, the light hysteresis of this polyimide film is lower than 200 nanometers.
30. LCD according to claim 1 is characterized in that, the thickness of this polyimide film is between 20～200 microns.
31. LCD according to claim 1 is characterized in that, the thickness of this polyimide film is between 50～150 microns.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1180175A (en) * | 1996-09-27 | 1998-04-29 | 东丽株式会社 | Liquid crystal display apparatus |
| JP2004331951A (en) * | 2003-04-18 | 2004-11-25 | Nitto Denko Corp | New polyimide |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1180175A (en) * | 1996-09-27 | 1998-04-29 | 东丽株式会社 | Liquid crystal display apparatus |
| JP2004331951A (en) * | 2003-04-18 | 2004-11-25 | Nitto Denko Corp | New polyimide |
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