CN101058132A - SnAgCuBi series leadless soldering tin alloy - Google Patents
SnAgCuBi series leadless soldering tin alloy Download PDFInfo
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- CN101058132A CN101058132A CN 200710041686 CN200710041686A CN101058132A CN 101058132 A CN101058132 A CN 101058132A CN 200710041686 CN200710041686 CN 200710041686 CN 200710041686 A CN200710041686 A CN 200710041686A CN 101058132 A CN101058132 A CN 101058132A
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Abstract
The SnAgCuBi lead free solder alloy features in the following weight composition, comprising 0. 1-3. 0% Ag, 0. 1-1. 0% Cu, 0. 1-3. 0% Bi, 0. 01-0. 1% Sb, 0. 01-0. 1% Ni, 0. 005-0. 05% La, 0. 005-0. 05% P, with the rest being Sn. The SnAgCuBi lead free solder alloy does not have any lead, being more environmental protective, with low fuse point, better moisture feature, with anti stretch, flexibility, expansion and creep resistance equal to the tinsel alloy. It is simple in process, low in energy consumption, with the solder alloy even, finer and improved in welding feasibility.
Description
Technical field
The present invention relates to the alloy field, specifically a kind of Pb-free solder alloy material.
Background technology
Along with the enforcement of two instructions of WEEE of European Union and RoHS and the appearance of domestic electronic product prevention and cure of pollution way, domestic electronics manufacturing and scolding tin manufacturing comprehensive unleaded will be more and more urgent, the exploitation Pb-free solder, imperative.Be the solderability of guaranteeing Pb-free solder and the reliability of postwelding, and to consider problems such as cost, research and development at present, use Pb-free solder and mainly face following problem: the fusing point of (1) Pb-free solder is low, be as far as possible near 183 ℃ of the fusing points of 63Sn37Pb alloy, roughly between 183 ℃-220 ℃.Should have less solid-liquid coexistence temperature range, it is relatively more reasonable to be controlled within 10 ℃, and the too wide solder joint cracking that then might take place of scope makes the too early damage of electronic product.(2) requirement is hot, electric property is suitable with conventional alloys, and wetability is good, and mechanical performances such as the tensile strength of solder joint, toughness, ductility and creep-resistant property are suitable with leypewter.(3) become and should reduce as much as possible, scolding tin hypotoxicity, even nontoxic can not be introduced the new composition that can pollute environment because of unleaded back.(4) require and existing equipment and technology compatibility, require Pb-free solder to be complementary with all kinds of scaling powders as far as possible.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, provide that a kind of fusing point is low, solid-liquid coexistence temperature range is narrow, wettability better, SnAgCuBi series lead-free soldering tin alloy that the solder joint mechanical performance is high, the cost of this scolding tin is relatively low and have a performance that can replace existing tin lead welding tin.
The present invention realizes by the following technical solutions:
SnAgCuBi series lead-free soldering tin alloy of the present invention, the percentage by weight of its constituent is: the La of Ni, the 0.005-0.05% of Sb, the 0.01-0.1% of Bi, the 0.01-0.1% of the Ag of 0.1-3.0%, the Cu of 0.1-1.0%, 0.1-3.0%, the P of 0.005-0.05%, and the Sn of surplus and unavoidable impurities.
Concretely, described a kind of SnAgCuBi series lead-free soldering tin alloy, it is characterized in that its composition is by weight percentage: 0.1% Ag, 0.7% Cu, 1.0% Bi, 0.01% Sb, 0.1% Ni, 0.01% La, 0.01% P, and the Sn of surplus.
Described a kind of SnAgCuBi series lead-free soldering tin alloy, it is characterized in that its composition is by weight percentage: 1.0% Ag, 0.5% Cu, 2.0% Bi, 0.05% Sb, 0.05% Ni, 0.01% La, 0.01% P, and the Sn of surplus.
Described a kind of SnAgCuBi series lead-free soldering tin alloy is characterized in that its composition is by weight percentage: 2.0% Ag, 0.1% Cu, 3.0% Bi, 0.1% Sb, 0.1% Ni, 0.01% La, 0.01% P, and the Sn of surplus.
Described a kind of SnAgCuBi series lead-free soldering tin alloy, it is characterized in that its composition is by weight percentage: 2.0% Ag, 0.5% Cu, 1.0% Bi, 0.05% Sb, 0.01% Ni, 0.01% La, 0.01% P, and the Sn of surplus.
Described a kind of SnAgCuBi series lead-free soldering tin alloy, it is characterized in that its composition is by weight percentage: 2.0% Ag, 0.5% Cu, 2.0% Bi, 0.05% Sb, 0.05% Ni, 0.01% La, 0.01% P, and the Sn of surplus.
Described a kind of SnAgCuBi series lead-free soldering tin alloy, it is characterized in that its composition is by weight percentage: 3.0% Ag, 0.5% Cu, 0.1% Bi, 0.01% Sb, 0.01% Ni, 0.01% La, 0.01% P, and the Sn of surplus.
Described a kind of SnAgCuBi series lead-free soldering tin alloy, it is characterized in that its composition is by weight percentage: 3.0% Ag, 1.0% Cu, 0.1% Bi, 0.01% Sb, 0.01% Ni, 0.01% La, 0.01% P, and the Sn of surplus.
Pb-free solder of the present invention is based on Sn, adds the wettability that Ag can increase scolding tin, improves the weld strength of scolding tin and the percentage elongation of solder joint.Because the used mother metal of welding in most cases is the Cu substrate, therefore adding Cu has the effect that improves weld strength, improves wettability.Add Bi and can improve the wettability of scolding tin, and can reduce the fusing point of scolding tin.Because Bi is a fragile material, add the decline that Bi can cause the scolding tin percentage elongation afterwards, therefore in scolding tin, add Sb or La, Sb or La can be dispersed in and stop growing up of crystal grain in the scolding tin, improve the mechanical property of scolding tin, in addition the interpolation of the La surface wettability that also helps the enhancing of scolding tin creep properties and improve soldering alloy.Add Ni among the present invention and can restrain growing up of postwelding solder joint metal compound layer, improve the fatigue resistance of solder joint.Owing to contain a large amount of Sn in the scolding tin, can increase the generation of metal oxide in addition, therefore add P and can suppress Sn combines generation with oxygen metal oxide, improve the operability of weld job, improve welding quality.
The preparation method of Pb-free solder among the present invention is characterized in that adopting following preparation process:
(1) preparation intermediate alloy
Frequently dispose graphite crucible in the induction melting furnace in a vacuum, raw material are put into graphite crucible in proportion, close body of heater, vacuumize, and heating in medium frequency metal to proper temperature is incubated, and is cast into corresponding alloy pig at last.
A, in a vacuum frequently in the induction melting furnace weight percent with 70: 30 prepare the Sn-Ag alloy, be warming up to 1100 ℃ and be incubated 30 minutes, the sn-ag alloy ingot is cast in the cooling of coming out of the stove.
B, in a vacuum frequently in the induction melting furnace weight percent with 70: 30 prepare the Sn-Cu alloy, be warming up to 1200 ℃ and be incubated 30 minutes, the gun-metal ingot is cast in the cooling of coming out of the stove.
C, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the Sn-Bi alloy, be warming up to 500 ℃ and be incubated 30 minutes, the sn-bi alloy ingot is cast in the cooling of coming out of the stove.
D, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the Sn-Sb alloy, be warming up to 800 ℃ and be incubated 30 minutes, the tin pewter ingot is cast in the cooling of coming out of the stove.
E, in a vacuum frequently in the induction melting furnace weight percent with 95: 05 prepare the Sn-Ni alloy, be warming up to 1600 ℃ and be incubated 30 minutes, the tin-nickel alloy ingot is cast in the cooling of coming out of the stove.
F, in a vacuum frequently in the induction melting furnace weight percent with 99: 01 prepare the Sn-La alloy, be warming up to 1000 ℃ and be incubated 30 minutes, tin lanthanum alloy ingot is cast in the cooling of coming out of the stove.
G, in a vacuum frequently in the induction melting furnace weight percent with 99: 01 prepare the Sn-P alloy, be warming up to 500 ℃ and be incubated 30 minutes, tin phosphorus alloy ingot is cast in the cooling of coming out of the stove.
(2) a, b, c, d, e, f item intermediate alloy are added not enough tin amount and carry out weight proportion, alloy material was added in the graphite crucible of medium frequency induction melting furnace heat temperature raising to 500 ℃ insulation 30 minutes according to the soldering alloy ratio.
(3) soldering alloy of melting is cooled to 350 ℃ and add tin phosphorus alloies the g item that meets proportioning from 500 ℃, stirs, coming out of the stove, cooling is cast into the soldering alloy rod on the tin bar machine.
The melting of scolding tin of the present invention and intermediate alloy is adopted in the medium frequency induction melting furnace and is carried out.Medium frequency induction melting furnace adopts the Medium frequency induction current flow heats, and therefore the melting for metal has the high advantage of the efficiency of heating surface; Smelting metal material in intermediate frequency furnace, because the existence of Medium frequency induction electric current has the effect of magnetic agitation to metal liquid, so the product composition of being produced is even; The body of heater of medium frequency induction melting furnace adopts the recirculated cooling water cooling in addition, so its cooling effectiveness is higher; Carry out in the metal alloy compositions employing vacuum medium frequency induction melting furnace for the melting of needs higher temperature, can guarantee the influence that material is at high temperature not oxidated, the fusion process loss is lower, the even free from admixture of alloying component etc.Characteristics such as in addition, melting is all adopted in the high purity graphite crucible and carried out, and in induction furnace, graphite crucible has efficiency of heating surface height, and impurity is few, the alloy purity of institute's melting is higher.
Compare with prior art, this SnAgCuBi series lead-free soldering tin alloy does not contain the composition of any lead, more environmental protection, and described Pb-free solder material melting point is low, heat, electric property is suitable with conventional alloys, and wetability is good, and mechanical performances such as the tensile strength of solder joint, toughness, ductility and creep-resistant property are suitable with leypewter.Simultaneously, soldering alloy preparation technology of the present invention is simple, and energy consumption is lower, can make prepared soldering alloy composition more evenly, refinement, improved the solderability of material.
Description of drawings
Fig. 1 is differential scanning calorimetric (DSC) curve of Pb-free solder alloy described in the embodiment 1 in temperature-rise period.
Fig. 2 is differential scanning calorimetric (DSC) curve of Pb-free solder alloy described in the embodiment 2 in temperature-rise period.
Fig. 3 is differential scanning calorimetric (DSC) curve of Pb-free solder alloy described in the embodiment 3 in temperature-rise period.
Fig. 4 is differential scanning calorimetric (DSC) curve of Pb-free solder alloy described in the embodiment 4 in temperature-rise period.
Fig. 5 is differential scanning calorimetric (DSC) curve of Pb-free solder alloy described in the embodiment 5 in temperature-rise period.
Fig. 6 is differential scanning calorimetric (DSC) curve of Pb-free solder alloy described in the embodiment 6 in temperature-rise period.
Fig. 7 is differential scanning calorimetric (DSC) curve of Pb-free solder alloy described in the embodiment 7 in temperature-rise period.
Fig. 8 is differential scanning calorimetric (DSC) curve of Pb-free solder alloy described in the comparative example in temperature-rise period.
The specific embodiment
The present invention will be described with the following Examples, but the present invention is not limited to these embodiment.
The percentage by weight of embodiment 1 this SnAgCuBi series lead-free soldering tin alloy consists of: Ag0.1%, Cu0.7%, Bi1.0%, Sb0.01%, Ni0.1%, La0.01%, P0.01%, all the other are Sn.
The preparation method of this Pb-free solder alloy is as follows: get each raw material by above-mentioned weight percent, prepare intermediate alloy earlier: dispose graphite crucible in the induction melting furnace frequently in a vacuum, raw material are put into graphite crucible in proportion, close body of heater, vacuumize, heating in medium frequency metal to proper temperature is incubated, and is cast into corresponding alloy pig at last.
A, in a vacuum frequently in the induction melting furnace weight percent with 70: 30 prepare the Sn-Ag alloy, be warming up to 1100 ℃ and be incubated 30 minutes, the sn-ag alloy ingot is cast in the cooling of coming out of the stove.
B, in a vacuum frequently in the induction melting furnace weight percent with 70: 30 prepare the Sn-Cu alloy, be warming up to 1200 ℃ and be incubated 30 minutes, the gun-metal ingot is cast in the cooling of coming out of the stove.
C, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the Sn-Bi alloy, be warming up to 400 ℃ and be incubated 30 minutes, the sn-bi alloy ingot is cast in the cooling of coming out of the stove.
D, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the Sn-Sb alloy, be warming up to 800 ℃ and be incubated 30 minutes, the tin pewter ingot is cast in the cooling of coming out of the stove.
E, in a vacuum frequently in the induction melting furnace weight percent with 95: 05 prepare the Sn-Ni alloy, be warming up to 1600 ℃ and be incubated 30 minutes, the tin-nickel alloy ingot is cast in the cooling of coming out of the stove.
F, in a vacuum frequently in the induction melting furnace weight percent with 99: 01 prepare the Sn-La alloy, be warming up to 1000 ℃ and be incubated 30 minutes, tin lanthanum alloy ingot is cast in the cooling of coming out of the stove.
G, in a vacuum frequently in the induction melting furnace weight percent with 99: 01 prepare the Sn-P alloy, be warming up to 500 ℃ and be incubated 30 minutes, tin phosphorus alloy ingot is cast in the cooling of coming out of the stove.
(2) a, b, c, d, e, f item intermediate alloy are added not enough tin amount and carry out weight proportion, alloy material was added in the graphite crucible of medium frequency induction melting furnace heat temperature raising to 500 ℃ insulation 30 minutes according to the soldering alloy ratio.
(3) soldering alloy of melting is cooled to 350 ℃ and add tin phosphorus alloies the g item that meets proportioning from 500 ℃, stirs, coming out of the stove, cooling is cast into the soldering alloy rod on the tin bar machine.
Adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this Pb-free solder alloy mensuration is seen accompanying drawing 1, its every Performance Detection data see the following form.
The percentage by weight of embodiment 2 these SnAgCuBi series lead-free soldering tin alloys consists of: Ag1.0%, Cu0.5%, Bi2.0%, Sb0.05%, Ni0.05%, La0.01%, P0.01%, and all the other are Sn, the preparation method is with embodiment 1.Adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this Pb-free solder alloy mensuration is seen accompanying drawing 2, its every Performance Detection data see the following form.
The percentage by weight of embodiment 3 these SnAgCuBi series lead-free soldering tin alloys consists of: Ag2.0%, Cu0.1%, Bi3.0%, Sb0.1%, Ni0.1%, La0.01%, P0.01%, all the other are Sn., the preparation method is with embodiment 1.Adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this Pb-free solder alloy mensuration is seen accompanying drawing 3, its every Performance Detection data see the following form.
The percentage by weight of embodiment 4 these SnAgCuBi series lead-free soldering tin alloys consists of: Ag2.0%, Cu0.5%, Bi1.0%, Sb0.05%, Ni0.01%, La0.01%, P0.01%, all the other are Sn.The preparation method is with embodiment 1.Adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this Pb-free solder alloy mensuration is seen accompanying drawing 4, its every Performance Detection data see the following form.
The percentage by weight of embodiment 5 these SnAgCuBi series lead-free soldering tin alloys consists of: Ag2.0%, Cu0.5%, Bi2.0%, Sb0.05%, Ni0.05%, La0.01%, P0.01%, and all the other are Sn, the preparation method is with embodiment 1.Adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this Pb-free solder alloy mensuration is seen accompanying drawing 5, its every Performance Detection data see the following form.
The percentage by weight of embodiment 6 these SnAgCuBi series lead-free soldering tin alloys consists of: Ag3.0%, Cu0.5%, Bi0.1%, Sb0.01%, Ni0.01%, La0.01%, P0.01%, all the other are Sn.The preparation method is with embodiment 1.Adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this Pb-free solder alloy mensuration is seen accompanying drawing 5, its every Performance Detection data see the following form.
The percentage by weight of embodiment 7 these SnAgCuBi series lead-free soldering tin alloys consists of: Ag3.0%, Cu1.0%, Bi0.1%, Sb0.01%, Ni0.01%, La0.01%, P0.01%, all the other are Sn.The preparation method is with embodiment 1.Adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this Pb-free solder alloy mensuration is seen accompanying drawing 5, its every Performance Detection data see the following form.
It consists of the described soldering alloy of comparative example: Ag3.0%, Cu0.5%, all the other are Sn.Earlier prepare Sn-Ag, Sn-Cu alloy by the method among the embodiment 1, method by embodiment 1 prepares this soldering alloy then, the Pb-free solder alloy of above example 1 to 7 manufacturing and the soldering alloy of comparative example are carried out every Performance Detection and contrast, and its fusing point, spreading ratio, percentage elongation, tensile strength are as shown in the table:
| Item differentiation | Composition (wt%) | Fusing point (℃) | Spreading ratio (%) | Percentage elongation (%) | Tensile strength (MPa) | ||||||||
| Sn | Ag | Cu | Bi | Sb | Ni | La | P | Solidus | Liquidus curve | ||||
| Example 1 | Surplus | 0.1 | 0.7 | 1.0 | 0.01 | 0.1 | 0.01 | 0.01 | 223.6 | 224.4 | 80.7 | 42.5 | 51.1 |
| Example 2 | Surplus | 1.0 | 0.5 | 2.0 | 0.05 | 0.05 | 0.01 | 0.01 | 212.8 | 224.1 | 82.1 | 25.7 | 75.1 |
| Example 3 | Surplus | 2.0 | 0.1 | 3.0 | 0.1 | 0.1 | 0.01 | 0.01 | 215.6 | 217.2 | 84.4 | 15.3 | 85.3 |
| Example 4 | Surplus | 2.0 | 0.5 | 1.0 | 0.05 | 0.01 | 0.01 | 0.01 | 219.8 | 224.5 | 81.7 | 27.5 | 74.5 |
| Example 5 | Surplus | 2.0 | 0.5 | 2.0 | 0.05 | 0.05 | 0.01 | 0.01 | 221.5 | 227.3 | 82.6 | 24.3 | 65.7 |
| Example 6 | Surplus | 3.0 | 0.5 | 0.1 | 0.01 | 0.01 | 0.01 | 0.01 | 218.7 | 224.9 | 81.2 | 29.4 | 57.9 |
| Example 7 | Surplus | 3.0 | 1.0 | 0.1 | 0.01 | 0.01 | 0.01 | 0.01 | 220.7 | 222.5 | 81.3 | 28.6 | 69.6 |
| Comparative example | Surplus | 3.0 | 0.5 | 0 | 0 | 0 | 0 | 0 | 217.5 | 220.1 | 82.4 | 29.5 | 61.0 |
Behind the research specification, those skilled in the art may appreciate that many changes of the present invention, modification, variation and other purposes and application.Do not deviate from all these changes, modification, variation and other purposes and the application of aim of the present invention and scope, all be considered to be covered by the present invention.
Claims (10)
1, a kind of SnAgCuBi series lead-free soldering tin alloy is characterized in that its composition is by weight percentage:
The Ag of 0.1-3.0%
The Cu of 0.1-1.0%
The Bi of 0.1-3.0%
The Sb of 0.01-0.1%
The Ni of 0.01-0.1%
The La of 0.005-0.05%
The P of 0.005-0.05%
And the Sn of surplus.
2, a kind of SnAgCuBi series lead-free soldering tin alloy according to claim 1 is characterized in that its composition is by weight percentage:
0.1% Ag
0.7% Cu
1.0% Bi
0.01% Sb
0.1% Ni
0.01% La
0.01% P
And the Sn of surplus.
3, a kind of SnAgCuBi series lead-free soldering tin alloy according to claim 1 is characterized in that its composition is by weight percentage:
1.0% Ag
0.5% Cu
2.0% Bi
0.05% Sb
0.05% Ni
0.01% La
0.01% P
And the Sn of surplus.
4, a kind of SnAgCuBi series lead-free soldering tin alloy according to claim 1 is characterized in that its composition is by weight percentage:
2.0% Ag
0.1% Cu
3.0% Bi
0.1% Sb
0.1% Ni
0.01% La
0.01% P
And the Sn of surplus.
5, a kind of SnAgCuBi series lead-free soldering tin alloy according to claim 1 is characterized in that its composition is by weight percentage:
2.0% Ag
0.5% Cu
1.0% Bi
0.05% Sb
0.01% Ni
0.01% La
0.01% P
And the Sn of surplus.
6, a kind of SnAgCuBi series lead-free soldering tin alloy according to claim 1 is characterized in that its composition is by weight percentage:
2.0% Ag
0.5% Cu
2.0% Bi
0.05% Sb
0.05% Ni
0.01% La
0.01% P
And the Sn of surplus.
7, a kind of SnAgCuBi series lead-free soldering tin alloy according to claim 1 is characterized in that its composition is by weight percentage:
3.0% Ag
0.5% Cu
0.1% Bi
0.01% Sb
0.01% Ni
0.01% La
0.01% P
And the Sn of surplus.
8, a kind of SnAgCuBi series lead-free soldering tin alloy according to claim 1 is characterized in that its composition is by weight percentage:
3.0% Ag
1.0% Cu
0.1% Bi
0.01% Sb
0.01% Ni
0.01% La
0.01% P
And the Sn of surplus.
9, a kind of preparation method as any described SnAgCuBi series lead-free soldering tin alloy of claim 1 to 8 is characterized in that may further comprise the steps:
(1) preparation intermediate alloy:
Frequently dispose graphite crucible in the induction melting furnace in a vacuum, raw material are put into graphite crucible in proportion, close body of heater, vacuumize, and heating in medium frequency metal to proper temperature is incubated, and is cast into corresponding alloy pig at last:
A, in a vacuum frequently in the induction melting furnace weight percent with 70: 30 prepare the Sn-Ag alloy, be warming up to 1100 ℃ and be incubated 30 minutes, the sn-ag alloy ingot is cast in the cooling of coming out of the stove;
B, in a vacuum frequently in the induction melting furnace weight percent with 70: 30 prepare the Sn-Cu alloy, be warming up to 1200 ℃ and be incubated 30 minutes, the gun-metal ingot is cast in the cooling of coming out of the stove;
C, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the Sn-Bi alloy, be warming up to 500 ℃ and be incubated 30 minutes, the sn-bi alloy ingot is cast in the cooling of coming out of the stove;
D, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the Sn-Sb alloy, be warming up to 800 ℃ and be incubated 30 minutes, the tin pewter ingot is cast in the cooling of coming out of the stove;
E, in a vacuum frequently in the induction melting furnace weight percent with 95: 5 prepare the Sn-Ni alloy, be warming up to 1600 ℃ and be incubated 30 minutes, the tin-nickel alloy ingot is cast in the cooling of coming out of the stove;
F, in a vacuum frequently in the induction melting furnace weight percent with 99: 1 prepare the Sn-La alloy, be warming up to 1000 ℃ and be incubated 30 minutes, tin lanthanum alloy ingot is cast in the cooling of coming out of the stove;
G, in a vacuum frequently in the induction melting furnace weight percent with 99: 1 prepare the Sn-P alloy, be warming up to 500 ℃ and be incubated 30 minutes, tin phosphorus alloy ingot is cast in the cooling of coming out of the stove;
(2) a, b, c, d, e, f item intermediate alloy are added not enough tin amount and carry out weight proportion, alloy material is added in the graphite crucible of medium frequency induction melting furnace heat temperature raising to 500 ℃, and be incubated 30 minutes according to the soldering alloy ratio;
(3) soldering alloy of melting is cooled to 350 ℃ and add tin phosphorus alloies the g item that meets proportioning from 500 ℃, stirs, coming out of the stove, cooling is cast into the soldering alloy rod on the tin bar machine.
10, the preparation method of a kind of SnAgCuBi series lead-free soldering tin alloy according to claim 9 is characterized in that mode of heating that described medium frequency induction melting furnace adopts is the induced-current heating.
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| CN104487203A (en) * | 2012-06-29 | 2015-04-01 | 播磨化成株式会社 | Solder alloy, solder paste, and electronic circuit board |
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| JP2019104029A (en) * | 2017-12-12 | 2019-06-27 | 株式会社タムラ製作所 | Lead-free solder alloy, electronic circuit mounting board and electronic control device |
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| CN111468860A (en) * | 2020-04-16 | 2020-07-31 | 深圳市博士达焊锡制品有限公司 | High-temperature tin bar and preparation method thereof |
| CN112643241A (en) * | 2020-12-10 | 2021-04-13 | 昆明理工大学 | Sn-Bi-Cu-Ag-Ni-Sb low-temperature high-mechanical-property lead-free solder alloy |
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| KR19980068127A (en) * | 1997-02-15 | 1998-10-15 | 김광호 | Lead-Free Alloys for Soldering |
| CN1570166A (en) * | 2004-05-09 | 2005-01-26 | 邓和升 | Lead free solder alloy and its preparation method |
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| CN104487203A (en) * | 2012-06-29 | 2015-04-01 | 播磨化成株式会社 | Solder alloy, solder paste, and electronic circuit board |
| TWI508812B (en) * | 2012-06-29 | 2015-11-21 | Harima Chemicals Inc | Solder alloy, solder paste and electronic circuit substrate |
| US9221129B2 (en) | 2012-06-29 | 2015-12-29 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| EP2868424A4 (en) * | 2012-06-29 | 2016-01-20 | Harima Chemicals Inc | Solder alloy, solder paste, and electronic circuit board |
| KR101624478B1 (en) | 2012-06-29 | 2016-05-25 | 하리마카세이 가부시기가이샤 | Solder alloy, solder paste, and electronic circuit board |
| CN107999993A (en) * | 2017-12-05 | 2018-05-08 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of lead-free solder for temperature controller bellows iron bottom plate solder and preparation method thereof |
| JP2019104029A (en) * | 2017-12-12 | 2019-06-27 | 株式会社タムラ製作所 | Lead-free solder alloy, electronic circuit mounting board and electronic control device |
| CN110117737A (en) * | 2019-06-10 | 2019-08-13 | 深圳市启晟新材科技有限公司 | A kind of submarine engine pedestal vibration damping liquid metal material and its processing technology |
| CN111468860A (en) * | 2020-04-16 | 2020-07-31 | 深圳市博士达焊锡制品有限公司 | High-temperature tin bar and preparation method thereof |
| CN112643241A (en) * | 2020-12-10 | 2021-04-13 | 昆明理工大学 | Sn-Bi-Cu-Ag-Ni-Sb low-temperature high-mechanical-property lead-free solder alloy |
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| CN100558500C (en) | 2009-11-11 |
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