CN101055488A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN101055488A CN101055488A CN 200610060300 CN200610060300A CN101055488A CN 101055488 A CN101055488 A CN 101055488A CN 200610060300 CN200610060300 CN 200610060300 CN 200610060300 A CN200610060300 A CN 200610060300A CN 101055488 A CN101055488 A CN 101055488A
- Authority
- CN
- China
- Prior art keywords
- heat abstractor
- heating radiator
- installing plate
- plate
- arch bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat radiating device is mounted in a computer casing which is disposed with several wires. The heat radiating device includes a radiator combination and a wind-guiding cover which is disposed on the radiator combination and is formed with a wire neatening structure for neatening and binding the wires. The heat radiating device not only can radiate the heat for the heat electronic component in the computer casing, but also can neaten and bind the wires in the computer casing because the heat radiating device has a wind guiding cover with wire neatening structure.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applied to electronic component.
[background technology]
Along with more and more miniaturization of computer system, become increasingly complex, the external unit that is connected is more and more, intrasystem various lead comprises that power lead and signal wire get more and more, if these lines are let alone arbitrarily to put, one side can make in the system disorderly and unsystematic, is not easy to arrangement, can influence the flow field of system on the other hand, influence system radiating.
[summary of the invention]
In view of this, be necessary the heat abstractor that provides a kind of energy to dispel the heat and can put the computer casing inside conductor in order.
A kind of heat abstractor places a computer casing, is provided with some leads in this computer casing, and this heat abstractor comprises a heating radiator combination and a wind scooper that places this heating radiator to make up, and is formed with the structure for arranging wires of an arrangement and constraint lead on this wind scooper.
Compared with prior art, this heat abstractor not only can dispel the heat to the heat-generating electronic elements in the computer casing, and because this heat abstractor has the wind scooper of structure for arranging wires, so also can put in order and fetter the lead in the computer casing.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
[description of drawings]
Fig. 1 is the part assembly drawing of heat abstractor preferred embodiment of the present invention.
Fig. 2 is the assembly drawing of Fig. 1 different angles.
Fig. 3 is the assembly drawing of heat abstractor second embodiment of the present invention.
[embodiment]
See also Fig. 1 and Fig. 2, disclose the preferred embodiment of heat abstractor of the present invention.This heat abstractor is installed on the interior circuit board 10 of computer casing (figure does not show) in order to 12 heat-generating electronic elements such as grade of the central processing unit on it are dispelled the heat.Some power leads 20 extend on other electronic installations that are electrically connected in the housing from the power pack (figure does not show) of computer casing.This heat abstractor comprises that heating radiator combination, is installed on a fan 50 and the wind scooper 60 that heating radiator makes up a side.Wherein this fan guard 60 heating radiator combination of not only wind that fan 50 produces effectively can being led, but also have the function of reason line concurrently, can and be bound on this heat abstractor rambling power lead 20 arrangements in the computer casing.
This heating radiator aggregate erection is on circuit board 10, and it comprises that a main heating radiator 30, is installed on the additional cooler 40 on the main heating radiator 30.This main heating radiator 30 comprises that an absorber plate that contacts with central processing unit 12 32 reaches from absorber plate 32 upwardly extending some radiating fins 34.This absorber plate 32 stretches out respectively from its four corner and is provided with four lugs 320.Four fasteners 70 pass respective ledge 320 and are screwed with the backboard that places circuit board 10 back sides (figure does not show), thereby absorber plate 32 and central processing unit 12 are fitted tightly.Additional cooler 40 is an aluminium extruded type heating radiator 40, some radiating fins 44 that it comprises a base plate 42 and extends upward setting from base plate 42.This base plate 42 is parallel to absorber plate 32 and places the top of main heating radiator 30 radiating fins 34.The radiating fin 44 of additional cooler 40 relative both sides is provided with hole 440.
Pair of parallel heat pipe 80 is installed in the heating radiator combination, settings that roughly take the shape of the letter U of each heat pipe 80, and it comprises the adiabatic section 83 that an endotherm section 82, is parallel to the heat release section 84 of endotherm section 82 and connects endotherm section 82 and heat release section 84.Endotherm section 82 is folded between absorber plate 32 and radiating fin 34 bottoms, and so endotherm section 82 is connected with absorber plate 32, and the heat that absorber plate 32 absorbs can be passed to endotherm section 82 rapidly.Heat release section 84 is folded between base plate 42 and radiating fin 34 tops, and so the heat that is absorbed by endotherm section 82 can be passed to rapidly on the radiating fin 44 of the top of main heating radiator 30 radiating fins 34 and additional cooler 40 by heat release section 84.
Fan 50 is installed on that heating radiator combination is gone up and towards the leading flank of radiating fin 34,44, so that the air-flow that fan 50 is produced blows in the passage between the radiating fin 34,44.Passage extends setting along radiating fin 34,44 vertical directions.Fan 50 setting that is square, it has a top 52 and four corners 54.Wherein, top 52 is higher than the top of additional cooler 40 radiating fins 44.Each corner 54 is provided with a perforate 540.
Because fan 60 tops are higher than the heating radiator combination, wind scooper 60 can stop that the part air-flow that fan 50 produces leaks from radiator fins 44 tops, thereby the air-flow that fan 50 is produced concentrates the radiating fin 34,44 that blows to the heating radiator combination to improve the radiating efficiency of heat abstractor; In addition, be formed with arch bridge 624 on the wind scooper 60, this arch bridge 624 can be in order to the power lead 20 in the arrangement housing.During use, a bandage 15 is with mixed and disorderly power lead 20 arrangement and collect, and bandage 15 passes receiving space 625, again with the end knotting of bandage 15, draws over to one's side together and places on the installing plate 62 of this wind scooper 60 thereby bandage 15 is bound by power lead 20.
See also Fig. 3, be the second embodiment of the present invention, it discloses a heat abstractor, and heat abstractor is similar in the structure of this heat abstractor and the preferred embodiment, and difference only is that the arch bridge 626 of second embodiment has replaced the arch bridge 624 in the preferred embodiment.This arch bridge 626 has two opposite ends, and wherein an end is connected with installing plate 62, and the other end and installing plate 62 disconnect to form a breach, and power lead 20 can directly enter and be equipped in the receiving space 625 of arch bridge 626 belows from this breach.
In sum, heat abstractor of the present invention not only can dispel the heat to the heat-generating electronic elements in the computer casing, and can put and fetter power lead in disorder in the housing 20 in order, makes space in the computer casing clean, clean and tidy and be beneficial to heat radiation.
Claims (10)
1. heat abstractor, place a computer casing, be provided with some leads in this computer casing, this heat abstractor comprises a heating radiator combination and a wind scooper that places this heating radiator to make up, and it is characterized in that: the structure for arranging wires that is formed with an arrangement and constraint lead on this wind scooper.
2. heat abstractor as claimed in claim 1, it is characterized in that: described wind scooper comprises that one places the installing plate at heating radiator combination top, form an arch bridge on this installing plate, form a receiving space between the installing plate of this arch bridge and its below with arrangement and constraint lead.
3. heat abstractor as claimed in claim 2 is characterized in that: described arch bridge has two opposite ends, and described opposite end is connected with installing plate.
4. heat abstractor as claimed in claim 3 is characterized in that: a bandage passes described receiving space lead is drawn over to one's side on described heat abstractor.
5. heat abstractor as claimed in claim 2 is characterized in that: described arch bridge has two opposite ends, and wherein an opposite end is connected with installing plate, and another opposite end and installing plate disconnect to form one and supply described lead to enter the breach of receiving space.
6. heat abstractor as claimed in claim 2 is characterized in that: described heat abstractor comprises that further one is installed on the fan that heating radiator makes up a side.
7. heat abstractor as claimed in claim 6 is characterized in that: described fan top is higher than heating radiator combination top.
8. heat abstractor as claimed in claim 6 is characterized in that: described wind scooper comprises that also one is parallel to the guide plate of installing plate and the baffle plate of inclination connection plate and guide plate.
9. heat abstractor as claimed in claim 7 is characterized in that: described guide plate matches with fan.
10. as the described heat abstractor of claim 1 to 9, it is characterized in that: described heating radiator combination comprises a main heating radiator and places the additional cooler of this main heating radiator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100603004A CN101055488B (en) | 2006-04-14 | 2006-04-14 | Radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100603004A CN101055488B (en) | 2006-04-14 | 2006-04-14 | Radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101055488A true CN101055488A (en) | 2007-10-17 |
CN101055488B CN101055488B (en) | 2010-09-29 |
Family
ID=38795350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100603004A Expired - Fee Related CN101055488B (en) | 2006-04-14 | 2006-04-14 | Radiator |
Country Status (1)
Country | Link |
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CN (1) | CN101055488B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102573399A (en) * | 2010-12-28 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | Electronic device |
CN103809712B (en) * | 2012-11-12 | 2017-05-03 | 英业达科技有限公司 | Electronic device |
CN112181105A (en) * | 2020-08-28 | 2021-01-05 | 苏州浪潮智能科技有限公司 | Heat dissipation device, driving method and computer readable storage medium |
CN113745866A (en) * | 2021-08-18 | 2021-12-03 | 浪潮电子信息产业股份有限公司 | Server and modular power supply connecting mechanism thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2653571Y (en) * | 2003-11-18 | 2004-11-03 | 浩鑫股份有限公司 | Suspending type concentrator for computer host |
-
2006
- 2006-04-14 CN CN2006100603004A patent/CN101055488B/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102573399A (en) * | 2010-12-28 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | Electronic device |
CN103809712B (en) * | 2012-11-12 | 2017-05-03 | 英业达科技有限公司 | Electronic device |
CN112181105A (en) * | 2020-08-28 | 2021-01-05 | 苏州浪潮智能科技有限公司 | Heat dissipation device, driving method and computer readable storage medium |
CN113745866A (en) * | 2021-08-18 | 2021-12-03 | 浪潮电子信息产业股份有限公司 | Server and modular power supply connecting mechanism thereof |
CN113745866B (en) * | 2021-08-18 | 2023-09-01 | 浪潮电子信息产业股份有限公司 | Server and modularized power supply connecting mechanism thereof |
Also Published As
Publication number | Publication date |
---|---|
CN101055488B (en) | 2010-09-29 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100929 Termination date: 20140414 |